JP4366330B2 - Phosphor layer forming method and forming apparatus, and plasma display panel manufacturing method - Google Patents

Description

  The present invention relates to a phosphor layer forming method and apparatus, and a plasma display panel manufacturing method.

  At present, there are various self-luminous devices that emit light using a phosphor, and in particular, display devices such as CRTs, FEDs, and PDPs are being developed. These self-light-emitting devices form a light-emitting portion by forming a phosphor layer in cells arranged at a predetermined density on various substrates (here, “cell” refers to a substrate) An area having a certain range formed, which is a planar, convex or concave area). Taking a plasma display panel (PDP) as an example, a partition corresponding to an electrode pattern is formed on a substrate (back side substrate) on which an electrode (address electrode) or a dielectric layer (address protection layer) is formed. A phosphor layer is formed in the partitioned discharge cell, and the phosphor layer is formed on both the side surface of the partition wall and the bottom surface on the substrate partitioned by the partition wall.

  In forming the phosphor layer at this time, it is necessary to selectively form a pattern in accordance with the cell arrangement pattern and the coloration for each emission color. As the formation method, generally, a paste layer or a liquid phosphor layer forming material is used, and a wet printing method such as a screen printing method is adopted.

  However, in the formation of the phosphor layer by such wet printing method, the handleability of the wet phosphor layer forming material is poor, and the wet phosphor layer forming material stains the patterning member (screen plate or mask). In many cases, the phosphor layer forming material adheres to unnecessary portions by contacting the top of the substrate or the partition wall. However, once the wet phosphor layer forming material adheres, cleaning is difficult, and multicolored When the phosphors are separately applied, there is a problem that color mixing tends to occur. For this reason, when this wet printing method is used to perform multi-color coating, a drying process is performed for each color, which leads to a longer phosphor layer forming process and deteriorates productivity. It is the cause. In particular, when the cell arrangement pattern becomes high-definition, these problems will become more apparent, so the formation of the phosphor layer using the above-described wet printing method is not suitable for high-definition pattern formation. It is.

  Therefore, it is considered that the phosphor particles are used in the form of particles (or powder), and the following conventional techniques have been proposed.

  The prior arts described in the following Patent Documents 1 and 2 are those in which phosphor powder is filled in a resin layer previously formed on a substrate, and those described in the following Patent Document 1 are photosensitive on a substrate on which barrier ribs are formed. After applying the body fluid on one surface, the phosphor powder is sprayed and patterned by photolithography, and the one described in Patent Document 2 below is soft on the heat resistant substrate at room temperature or elevated temperature. A pattern made of a resin is formed, and the pattern is filled with fluorescent powder.

  The prior art described in the following Patent Documents 3 and 4 performs patterning through a mask using charged phosphor particles, and the following Patent Document 3 describes a discharge cell for a panel (substrate). A mask member formed with a transmissive portion that matches the portion to which the phosphor is applied is closely attached to the panel, and the finely powdered phosphor charged with an electrostatic coating machine is directed to the mask member. The phosphor is deposited and formed in the discharge cell corresponding to the transmission part of the mask member, and the one described in the following Patent Document 4 is the substrate after charging the phosphor powder. The phosphor layer is selectively formed on the discharge cells on the substrate through the mask with the side grounded.

Japanese Patent Laid-Open No. 5-41159 Japanese Patent Laid-Open No. 11-120908 JP 2000-268721 A JP-A-10-134717

  As described above, in the formation of the phosphor layer by the wet printing method, it is difficult to form a high-quality layer when the cell arrangement on the substrate becomes high definition. Therefore, there is a demand for a phosphor layer forming technique that can cope with the above.

  In addition, in the plasma display panel manufacturing method, when the above-described wet printing method is used to form the phosphor layer in the discharge cell, the barrier ribs formed on the substrate must be baked and completely vitrified. In this case, the phosphor layer cannot be formed in the discharge cell. This is because when the phosphor forming material such as paste is filled in the discharge cell before firing, the organic solvent penetrates into the unfired partition wall material, and later, organic components are released into the discharge cell. This is because the emitted gas causes the discharge characteristics to deteriorate. Therefore, when the wet printing method is adopted, the substrate is once baked at the time of forming the barrier ribs, and after that, the phosphor layer forming material is filled in the discharge cells and then subjected to the baking treatment again. Although it has been found that it is more reasonable to perform the baking process and the phosphor layer baking process at the same time, there is a problem in that such a simultaneous process cannot be performed for the reasons described above.

  According to the prior art described in Patent Document 1 described above, patterning by photolithography can cope with high definition to some extent. However, since patterning by photolithography is performed after the phosphor powder is sprayed, this patterning is performed. This makes it difficult to collect the phosphor powder sprayed on the photoconductor portion to be removed by the method, and there is a problem that the cost of the expensive phosphor powder is large and the manufacturing cost is increased. Further, in the prior art described in Patent Document 2 described above, the phosphor powder can be recovered to some extent, but a large amount of the phosphor powder adheres to a portion where the resin pattern is not formed. There is a problem that a great deal of labor is required. In addition, since these conventional techniques require a step of forming a resin layer on the substrate in advance, this step is added to the separate coating of the phosphor layer, which complicates the work and increases the processing time. There is a problem that will be prolonged.

  In addition, in those described in Patent Documents 1 and 2, an uncured resin layer is formed in the discharge cell. The phosphor layer must be formed after the firing process, and, as in the case of the wet printing method described above, the partition firing process and the phosphor layer firing process cannot be performed simultaneously to rationalize the process. .

  And according to the prior art described in Patent Documents 3 and 4 described above, it is considered that the phosphor particles are scattered by electrostatic force, but generally the phosphor particles are necessary for adsorption of electrostatic particles. A sufficient charge amount cannot be imparted, and it cannot be established as a stable technique with existing phosphor materials. In addition, in order to realize this with high accuracy, the property of charging performance different from the originally required light emission characteristics is required for the fluorescent material, which requires a great deal of cost for material development, and there is a problem with the feasibility in the first place. is there.

  Further, as in the prior art described in Patent Documents 3 and 4, when the phosphor particles charged through the mask are electrostatically adsorbed on the substrate, the phosphor particles generally have a high hardness. There is also a problem that the mask material is polished by the body particles and fine particles (metal fine particles) of the mask material are mixed into the phosphor layer, so that the light emission characteristics of the phosphor layer are greatly deteriorated.

  This invention makes it an example of a subject to cope with such a problem. That is, to provide a phosphor layer forming technology that can cope with high definition of the cell arrangement, to reduce the loss of the phosphor when forming the phosphor layer, and to reduce the manufacturing cost, the phosphor cleaning process Simplifying the process, making it possible to use existing phosphor materials and ensuring good light-emitting performance, or in the manufacture of plasma displays, the firing process at the time of barrier rib formation is performed simultaneously with the firing process at the time of phosphor layer formation. It is an object of the present invention to simplify the manufacturing process and reduce the manufacturing cost.

  In order to achieve such an object, a phosphor layer forming method and forming apparatus and a plasma display panel manufacturing method according to the present invention have the following configurations.

First, the phosphor layer forming method of the present invention is a phosphor layer forming method for forming a phosphor layer in cells arranged at a predetermined density on a substrate, and the substrate is placed on a conductive support member. And a conductive mask having an opening pattern corresponding to the selected arrangement pattern of the cells on the substrate in a non-contact and close arrangement, and the selected arrangement pattern of the cells and the opening pattern are planarly arranged. A step of positioning so as to overlap, and a voltage is applied between the conductive support member and the conductive mask so as to form a uniform electric field between the cell and the conductive mask; The phosphor layer forming material, which is formed of powder particles formed by dispersing body particles, is charged to one polarity and the voltage is applied, and the phosphor layer forming material is charged via the conductive mask. In the cell And a step of Hama, the voltage applied between the conductive supporting member and the conductive mask, as the polarity of the phosphor layer charge polarity of the forming material and the conductive mask side is the same polarity It is characterized by applying .

The phosphor layer forming apparatus of the present invention is a phosphor layer forming apparatus for forming a phosphor layer in cells arranged at a predetermined density on a substrate, and a conductive support member on which the substrate is installed; A conductive mask having an opening pattern corresponding to the selected arrangement pattern of the cells is held on the substrate in a non-contact and proximity manner so that the selected arrangement pattern of the cells and the opening pattern overlap in a plane. A mask holding / positioning means for positioning, a power supply device for applying a voltage between the conductive support member and the conductive mask so as to form a uniform electric field between the cell and the conductive mask, and a chargeable substrate The phosphor layer forming material composed of powder particles formed by dispersing phosphor particles in the material is charged to one polarity, and the charged fluorescence is applied through the conductive mask in a state where the voltage is applied. Body shape And a phosphor layer forming material supplying means for supplying the wood into the cell, the power supply, the charging polarity of the phosphor layer forming material for applying a voltage between the conductive support member and the conductive mask A voltage is applied so that the polarity on the conductive mask side is the same polarity .

Also, the method of manufacturing a plasma display panel according to the present invention includes forming discharge cells partitioned into unfired barrier rib patterns corresponding to the electrode pattern on the substrate on which the electrode pattern is formed, and then forming the discharge cell on the substrate. A conductive mask having an opening pattern corresponding to the selected array pattern of the discharge cells is disposed in a non-contact and close proximity, and positioned so that the selected array pattern of the discharge cells and the opening pattern overlap in a plane. a step, while applying a voltage between said substrate and said side conductive portions so as to form a uniform electric field between the discharge cell and the conductive mask the conductive mask, the phosphor particles in the charged substrate The phosphor layer-forming material composed of powder particles formed by dispersion is charged to one polarity, and the phosphor is charged via the conductive mask in a state where the voltage is applied. And a step of filling a forming material within the discharge cell, the voltage applied between the conductive portion of the substrate side and the conductive mask includes a charging polarity of the phosphor layer forming material of the conductive mask side Applying the polarities to be the same polarity, and filling the selected array pattern of the discharge cells with one color phosphor layer forming material by each step , and then changing the selected array pattern After repeating the process, the other selected array pattern of the discharge cell is filled with the phosphor layer forming material of another color, and then the unfired barrier rib pattern and all the phosphors filled in the discharge cell The layer forming material is fired at the same time to form a phosphor layer in the discharge cell.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view illustrating a phosphor layer forming method according to an embodiment of the present invention. A phosphor layer forming method according to an embodiment of the present invention is a method of forming a phosphor layer in cells arranged at a predetermined density on a substrate, and includes a substrate placement step S1, a mask placement / positioning step S2, a fluorescence It has body layer formation material filling process S3. And finally, it has a firing process SL for firing the phosphor layer forming material filled in the cell. As an example of the cell here, there can be mentioned a discharge cell of a plasma display panel (a discharge cell partitioned by a partition on a back substrate), but the object of the embodiment of the present invention is particularly limited to this. is not.

  FIG. 2 is an explanatory view showing a phosphor layer forming material used in the phosphor layer forming method according to the embodiment of the present invention, and FIG. 3 is a forming apparatus for executing the phosphor layer forming method according to the embodiment of the present invention. It is explanatory drawing of. The features of the embodiment of the present invention will be described in detail with reference to these drawings.

  First, one feature of the phosphor layer forming method according to the embodiment of the present invention is that a dry-type phosphor layer forming material is used, but phosphor particles are not handled directly, but as shown in FIG. In addition, a phosphor layer forming material comprising powder particles 1 formed by dispersing phosphor particles 1B in a chargeable substrate 1A is used.

Here, the powder particle 1 has a diameter of about 10 μm, and a fluorescent material capable of obtaining a desired single color by using as a binder a chargeable substrate 1A that is relatively easily charged to one polarity by corona charging or frictional charging. It is formed by dispersing body particles 1B. As the chargeable substrate 1A, a resin material such as an acrylic resin, a polyester resin, or an epoxy resin can be used. In particular, it is preferable to use an acrylic resin in which an organic residue hardly remains after the baking treatment. As the phosphor particles 1B, an existing phosphor material can be used. By using one selected from a red phosphor, a blue phosphor, and a green phosphor, a light emitting portion in a full-color or multi-color display is formed. can do. As application examples, (Y, Gd) BO ₃ : Eu ³⁺ , Y ₂ O ₃ : Eu and the like (matrix: activator) are used as the red phosphor, and BaMgAl ₁₀ O ₁₇ : Eu is used as the blue phosphor. Examples of green phosphors such as ²⁺ and BaMgAl ₁₄ O ₂₃ : Eu ²⁺ include Zn ₂ SiO ₄ : Mn and BaAl ₁₂ O ₁₉ : Mn.

  In addition, if necessary, an appropriate amount of a charge control agent may be contained in the powder particles 1 to obtain good unipolar charging, or the surface of the powder particles 1 may be coated with a dispersant. Thus, good fluidity or charging stability may be obtained.

  In the substrate installation step S1, the substrate 10 on which the cells 10A are arranged is installed on the conductive support member 11. Here, the conductive support member 11 is installed on the back side of the substrate 10 on which the cells 10A are arranged. Moreover, when the conductive portion corresponding to the cell 10A exists on the substrate 10 itself, the conductive support member 11 can be omitted.

  In the mask placement / positioning step S <b> 2, the conductive mask 12 is placed in non-contact and proximity to the substrate 10 by the mask holding / positioning means, and positioning between the conductive mask 12 and the substrate 10 is performed.

  The mask holding / positioning means includes a mask holding unit 13 that holds the conductive mask 12 and a position detection unit 14. The mask holding unit 13 can hold the conductive mask 12 by mechanical or magnetic adsorption or the like, and finely adjust the position in the plane direction (X-Y-θ direction) and the distance direction from the substrate (z direction). The position detector 14 includes a CCD camera or the like that detects the alignment between the substrate 10 and the mask 12. These may automatically adjust the mask holding unit 13 based on the result of image processing of the detection image by the position detection unit 14, or the mask holding unit 13 may be checked while checking the detection image by the position detection unit 14. It may be manually adjusted. Further, a fine position adjustment mechanism may be provided on the substrate 10 side (conductive support member 11 side).

Here, the cells 10A on the substrate 10 have an arrangement pattern arranged at a predetermined density (for example, an arrangement pattern 10A _{R in} which an R color phosphor layer is formed, and a G color phosphor layer is formed). arrangement pattern _10A G formed, arrangement pattern _10A B phosphor layers B color is formed), conductive mask 12, as shown in FIG. 4, the selected arrangement pattern of the cell 10A (e.g. arrangement pattern 10A _R ) and the opening pattern 12A. In the mask placement / positioning step S2 described above, the selected array pattern (for example, 10A _R ) of the cells 10A and the above-described opening pattern 12A are positioned so as to overlap with each other as shown in FIG. .

  After this positioning is completed, the phosphor layer forming material filling step S3 described above is executed. In this phosphor layer forming material filling step S3, a voltage is applied between the conductive support member 11 or the conductive portion of the substrate 10 corresponding to the cell 10A and the conductive mask 12, so that a single voltage is applied between the cell 10A and the conductive mask 12. In addition to forming an electric field, the phosphor layer forming material composed of the above-described powder particles 1 is charged to one polarity, and a voltage is applied to the charged phosphor layer forming material via the conductive mask 12. The cell 10A is filled.

  At this time, the power supply device 15 is connected between the conductive support member 11 or the conductive portion of the substrate 10 and the conductive mask 12. The power supply device 15 includes a DC power supply 15A, a switch 15B, and the like, and a voltage from the power supply 15A is applied so that the charging polarity of the phosphor layer forming material is the same as the polarity on the conductive mask 12 side. (As shown in the figure, when the phosphor layer forming material is negatively charged, the conductive mask 12 side is connected to the negative side of the power source 15A).

  The electric field formed here maintains a state where the applied voltage is several kilovolts and the distance between the conductive mask 12 and the substrate 10 is several mm. The relationship between the applied voltage and the interval at this time is set to a condition optimized so that the state of charge of the phosphor layer forming material becomes the best within a range where no discharge occurs in the plane.

  A phosphor layer forming material supply means 16 is provided on the conductive mask 12, and the charged phosphor layer forming material is filled into the cell 10 </ b> A through the conductive mask 12. As the phosphor layer forming material supply means 16, an accommodating portion 16 </ b> A in which the phosphor layer forming material made of the powder particles 1 is accommodated, a charging means for charging the phosphor layer forming material, and charged phosphor layer formation What comprises the discharge part 16B which discharges material on the conductive mask 12 is employable. As an example, as shown in FIG. 3, a jet type that supplies the phosphor layer forming material over a relatively wide range on the conductive mask 12, or as shown in FIG. A scanning type or the like that scans the phosphor layer forming material supply means 16 in a predetermined direction while supplying the phosphor layer forming material to the range can be adopted. As the charging means, one based on corona charging or friction charging can be adopted. In the example shown in FIG. 5, a stirrer 16 </ b> C is installed in the accommodating portion 16 </ b> A, and the powder particles 1 are frictionally charged by stirring.

  According to the phosphor layer forming method and the forming apparatus according to the embodiment of the present invention, the phosphor layer forming material composed of the charged powder particles 1 is supplied via the conductive mask 12 so that the fluorescence is generated. The body layer forming material moves along the electric field lines of uniform electric field formed between the cell 10A and the conductive mask 12. The electric field lines of uniform electric field formed between the conductive mask 12 and the substrate 10 kept parallel are formed at the shortest distance perpendicular to the conductive mask 12 or the substrate 10. The powder particles 1 having passed through the opening pattern 12A of the conductive mask 12 are accelerated by the force received from the electric field and jump straight into the cell 10A.

Therefore, even if the conductive mask 12 and the substrate 10 are in a non-contact state, the phosphor layer forming material that has passed through the opening pattern 12A of the conductive mask 12 is straight and the selected array pattern of the cells 10A (for example, 10A _G ), The required amount of the phosphor-forming material can be reliably filled into the cell 10A even when the arrangement pattern of the cell 10A is made high definition.

  Further, unlike the formation of the phosphor layer by the wet printing method as described above, the phosphor layer forming material can be filled in the cell 10A without using any organic solvent. Therefore, the substrate 10 is not soiled by the organic solvent, and since the conductive mask 12 and the substrate 10 are not in contact, the substrate 10 is not soiled by the phosphor layer forming material attached to the conductive mask 12.

  Even if the phosphor layer forming material adheres to unnecessary portions on the substrate 10, the phosphor layer forming material is composed of the dry powder particles 1, so that cleaning can be easily performed using its chargeability. It is possible to prevent color mixing even when the multicolor phosphor layers are separately applied. Moreover, since the fluorescent layer forming material that has been supplied onto the conductive mask 12 and not filled in the cell 10A can be easily recovered and reused, the loss of the phosphor layer forming material can be minimized. The manufacturing cost can be reduced.

  Furthermore, the phosphor particles 1B are not charged, but a phosphor layer forming material composed of powder particles 1 in which phosphor particles 1B are dispersed in a chargeable substrate 1A is used. Regardless of the performance, the powder particles 1 can be reliably and uniformly charged. Therefore, the phosphor layer 1B can be realized at a low cost by using the existing phosphor particles 1B, and a phosphor layer having a good light emission performance can be formed by using the phosphor particles 1B having good light emission characteristics. .

  Further, since the phosphor particles 1B having high hardness are covered with the chargeable substrate 1A and do not directly contact the conductive mask 12, even when the conductive mask 12 made of metal is used, for example, the metal fine particles remain in the cell. There is no inconvenience that the light emission characteristics of the phosphor layer deteriorate due to mixing in 10A.

  FIG. 6 is an explanatory diagram for explaining a method of separately coating multicolor phosphor layers by the phosphor layer forming method having the above-described steps. According to this, the phosphor layer forming material of one color is filled in the selected array pattern of the cells on the substrate 10 by the above-described steps, and then the above-described steps are repeated by changing the above-described selected array pattern. Then, the other selected array pattern of the cells in the substrate 10 is filled with the phosphor layer forming material of another color, and then all the phosphor layer forming materials filled in the cell are fired. A phosphor layer is formed in 10 cells.

That is, in filling the phosphor layer forming material of the first color, the arrangement pattern of the first color is selected from the cell arrangement on the substrate 10, and the substrate placement step S1 ₁ , mask placement / positioning step S2 ₁ , fluorescence run the body layer forming material filling step S3 _1, the filling of the next phosphor layer forming material of the second color, and replaced the conductive mask 12 to those having or different opening patterns 12A is slid, substrate 10 from the cell array by selecting the arrangement pattern of the second color, and executes the substrate setting step S1 _2, the mask placement and positioning step S2 _2, the phosphor layer forming material filling step S3 _2, phosphors of the n color the filling layer formation material, from the cell array on the substrate 10 by selecting the arrangement pattern of the n color, substrate setting step S1 _n, the mask placement and positioning step S2 _n, phosphor layer forming material filling process S3 To run. Then, after all the cell arrays are filled with the phosphor layer forming material, these phosphor layer forming materials are collectively fired (SLn) to form phosphor layers in all cells on the substrate.

  According to such a phosphor layer forming method, since a dry type phosphor layer forming material that does not use any organic solvent is used, the filling of the phosphor layer forming material from the first color to the nth color is performed for each color. Can be carried out continuously without a drying step. In addition, after the multicolor phosphor layer forming material is filled, the phosphor layer can be formed in the cell by a single baking process. As a result, the processing time required for forming the multicolor phosphor layer can be significantly shortened, so that the productivity can be improved and the manufacturing cost can be reduced.

  FIG. 7 is an explanatory diagram for explaining a method of manufacturing a plasma display panel that employs the phosphor layer forming method described above to form RGB phosphor layers in discharge cells formed on a substrate (back substrate). It is.

In the formation of the back side substrate of the plasma display panel, the electrode pattern 20 (address electrode) is formed on the substrate 10, the dielectric layer 21 (address protection layer) is formed thereon, and then the electrode pattern 20 is formed. A partition wall material layer is formed on the substrate 10, and an unfired partition wall pattern 22A corresponding to the electrode pattern 20 is formed by a patterning process in a partition formation method such as a sandblast method, a lift-off method, or a photosensitive partition wall formation method. As a result, discharge cells 10S _R , 10S _G , and 10S _B partitioned into unfired barrier rib patterns 22A are formed.

Then, after the substrate holding formation step S1 ₁ and the mask placement and positioning step S2 ₁ described above, as shown in FIG. 7 (a), positioning the opening pattern 12A of conductive mask 12 in the arrangement pattern of the discharge cell 10S _R after, in the state in which was turned 15B of the power supply 15 for applying a voltage between the conductive mask 12 and the substrate 10 side of the conductive portions, and execute the phosphor layer forming material filling step S3 ₁ described above, it is selected filling the phosphor layer forming material of R color discharge cell 10S in _R according to the arrangement pattern.

In the illustrated example, by applying a voltage between the electrode pattern 20 of the conductive mask 12 with a selected discharge cell 10S _R, discharge cells 10S phosphor layers of R color in the substrate 10 is formed _An electric field is intensively formed around the _R arrangement pattern. Thereby, it is possible to further reduce the scattering of the phosphor layer forming material, thereby reliably filling the phosphor layer forming material only in a desired discharge cell 10S in _R.

Next, as shown in FIG. (B), through the substrate setting step S1 ₂ and mask placement and positioning step S2 ₂ described above, positioning the opening pattern 12A of conductive mask 12 in the arrangement pattern of the discharge cell 10S _G Thereafter, the phosphor layer forming material filling step S < _b > 32 is performed with the switch 15 </ _b > B of the power supply device 15 for applying a voltage between the conductive mask 12 and the conductive portion on the substrate 10 side being selected. filling the phosphor layer forming material of the G color in the discharge cell 10S _G according to sequence pattern.

Furthermore, as shown in FIG. (C), after positioning through the substrate setting step S1 ₃ and the mask placement and positioning step S2 ₃ described above, the opening pattern 12A of conductive mask 12 in the arrangement pattern of the discharge cell 10S _B , in a state of switched on 15B of the power supply 15 for applying a voltage between the conductive mask 12 and the substrate 10 side of the conductive portions, and execute the phosphor layer forming material filling step S3 ₃ described above, is selected filling the phosphor layer formation material B color discharge cell 10S in _B according to the arrangement pattern.

Through the above steps, as shown in FIG. 4D, R, G and B phosphor layers are formed in all of the discharge cells 10S _R , 10S _G and 10S _B partitioned by the unfired barrier rib pattern 22A. The material is filled according to the arrangement pattern of each color. Then, after this state is formed, all the phosphor layer forming materials filled in the unfired barrier rib pattern 22A and the discharge cells 10S _R , 10S _G , and 10S _B are fired at the same time, as shown in FIG. As shown in the figure, the R phosphor layer 23R, the G phosphor layer 23G, and the B phosphor layer 23B are disposed in the discharge cells 10S _R , 10S _G , and 10S _B partitioned by the fired barrier rib pattern 22. Form each one.

  Further, in such a firing treatment step, the chargeable base material 1A of the phosphor layer forming material is once melted to give an appropriate flow property and adhere to the entire side surface of the partition wall pattern 22A with an appropriate thickness. When the phosphor particles are filled in the discharge cell alone as in the prior art, such a flowability cannot be imparted to the phosphor layer forming material in the firing process, so the side walls of the barrier ribs can be evenly distributed. A phosphor layer cannot be formed. When the firing process is further advanced, all of the components of the chargeable substrate 1A as a binder are evaporated, and finally only the phosphor particles 1B alone are applied to the entire side surface of the partition wall and the bottom surface of the discharge cell by van Desworth force. It will adhere uniformly.

According to the manufacturing method of the plasma display panel, because it uses a phosphor layer-forming material of a powder particles 1 without using an organic solvent, the unfired barrier rib pattern 22A discharge cell 10S partitioned by _R, Even if the phosphor layer forming material is filled in 10S _G and 10S _B , the organic solvent does not soak into the partition material. Therefore, even if the phosphor layer forming material is filled before firing the barrier rib material, and the unfired barrier rib pattern and the phosphor layer forming material are fired at the same time, the released gas is released from the barrier ribs into the discharge cell. It does not occur. Therefore, the barrier rib forming step and the phosphor layer forming step can be performed continuously, and the firing process can be completed only once, the processing time can be greatly shortened, and the productivity is improved. Manufacturing costs can be reduced.

  As described above, according to the embodiment of the present invention, it is possible to solve the problems of the prior art and to form a phosphor layer corresponding to high definition of the cell arrangement. In particular, since the patterning utilizing the action of the electric field formed between the substrate 10 and the conductive mask 12 can be performed via the non-contact conductive mask 12, a necessary amount can be surely obtained even for a miniaturized cell. The phosphor layer forming material can be filled.

  The advantages of the embodiments of the present invention compared to the prior art are listed as follows.

  (1) Since the phosphor layer forming material made of the dry powder particles 1 is filled directly into the cell 10A of the substrate 10 through the non-contact conductive mask 12, the substrate 10 The portion other than the cell is hardly stained with the phosphor layer forming material, and can be easily cleaned even when it is stained, so that the problem of color mixing in the case of performing multi-color coating is unlikely to occur.

  (2) Since the powder particles 1 are formed by covering the phosphor particles 1B having high hardness with the chargeable substrate 1A, the phosphor particles 1B are not in direct contact with the conductive mask 12, and the mask is polished. Therefore, there is no problem of deterioration of the light emission characteristics due to the mixing of metal fine particles.

  (3) By using the phosphor layer forming material composed of dry powder particles 1, when performing multi-color coating, a drying process for each color is unnecessary as in the case of the wet printing method. Multicolor painting can be performed continuously. Thus, the phosphor layer can be formed in a short time, and productivity can be improved.

  (4) A uniform electric field is formed between the conductive mask 12 and the cell 10A, and the charged powder particles 1 are supplied into the cell 10A along the electric field. The phosphor layer forming material can be reliably filled. Further, since the phosphor layer forming material supplied onto the conductive mask 12 can be easily recovered by utilizing its chargeability, expensive phosphors are not wasted.

  (5) By adopting an existing phosphor and dispersing the phosphor particles 1B in the chargeable substrate 1A, it is possible to form the powder particles 1 with good chargeability. Do not need. Since the phosphor itself does not require charging performance, the phosphor can be freely selected and a phosphor having good light emission characteristics can be employed.

  (6) When manufacturing the plasma display panel, the baking treatment of the barrier rib material and the baking treatment of the phosphor layer forming material can be performed at the same time, so that the manufacturing time from the barrier rib formation to the phosphor layer formation is greatly reduced. This can improve productivity and reduce manufacturing costs.

It is explanatory drawing explaining the fluorescent substance layer forming method which concerns on one Embodiment of this invention. It is explanatory drawing which shows the fluorescent substance layer forming material used for the fluorescent substance layer forming method which concerns on embodiment of this invention. It is explanatory drawing of the formation apparatus which performs the fluorescent substance layer forming method which concerns on embodiment of this invention. It is explanatory drawing explaining the cell arrangement | positioning / positioning process of the fluorescent substance layer forming method which concerns on one Embodiment of this invention. It is explanatory drawing of the formation apparatus which performs the fluorescent substance layer forming method which concerns on embodiment of this invention. It is explanatory drawing explaining the method of separately coating a multicolor fluorescent substance layer with the fluorescent substance layer forming method which concerns on one Embodiment of this invention. It is explanatory drawing explaining the manufacturing method of the plasma display panel which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Powder particle 1A Chargeable base material 1B Phosphor particle 10 Substrate 10A Cell 10A _R , 10A _G , 10A _B Arrangement pattern 10S _R , 10S _G , 10S _B Discharge cell 11 Conductive support member 12 Conductive mask 12A Opening pattern 13 Mask holding unit 14 Position detection unit 15 Power supply device 15A Power supply 15B Switch 16 Phosphor layer forming material supply means 16A Storage unit 16B Discharge unit 16C Stirrer 20 Electrode pattern 21 Dielectric layer 22A, 22 Partition pattern 23R, 23G, 23B Phosphor layer

Claims (5)

A phosphor layer forming method for forming a phosphor layer in cells arranged at a predetermined density on a substrate,
Installing the substrate on a conductive support member;
A conductive mask having an opening pattern corresponding to the selected arrangement pattern of the cells is disposed on the substrate in a non-contact and close proximity so that the selected arrangement pattern of the cells and the opening pattern overlap in a plane. Positioning, and
A voltage is applied between the conductive support member and the conductive mask so as to form a uniform electric field between the cell and the conductive mask , and phosphor particles are dispersed in the chargeable substrate. Charging the phosphor layer forming material into the cell via the conductive mask in a state where the phosphor layer forming material made of the powder particles is charged to one polarity and the voltage is applied. It has a door,
The voltage applied between the conductive support member and the conductive mask is applied so that the charging polarity of the phosphor layer forming material is the same as the polarity on the conductive mask side. A method for forming a phosphor layer. By filling the selected array pattern of the cells with one color phosphor layer forming material in each step, and then repeating each step by changing the selected array pattern, other selected cells in the cell are selected. Forming a phosphor layer in the cell by filling the array pattern with a phosphor layer forming material of another color and then firing all the phosphor layer forming materials filled in the cell. The method for forming a phosphor layer according to claim 1 . A phosphor layer forming apparatus for forming a phosphor layer in cells arranged at a predetermined density on a substrate,
A conductive support member on which the substrate is installed;
A conductive mask having an opening pattern corresponding to the selected array pattern of the cells is held on the substrate in a non-contact and proximity manner so that the selected array pattern of the cells and the opening pattern overlap in a plane. Mask holding / positioning means for positioning;
A power supply device for applying a voltage between the conductive support member and the conductive mask so as to form a uniform electric field between the cell and the conductive mask;
A phosphor layer forming material composed of powder particles formed by dispersing phosphor particles in a chargeable substrate is charged to one polarity, and charged with the voltage applied through the conductive mask. the phosphor layer forming material that includes a phosphor layer forming material supplying means for supplying into said cell,
The power supply device that applies a voltage between the conductive support member and the conductive mask applies a voltage so that the charging polarity of the phosphor layer forming material is the same as the polarity of the conductive mask. A phosphor layer forming apparatus characterized by the above. A discharge cell partitioned into an unfired barrier rib pattern corresponding to the electrode pattern is formed on the substrate on which the electrode pattern is formed, and then corresponds to the selected array pattern of the discharge cells on the substrate. and a conductive mask having an opening pattern contactless and proximity arrangement, the opening pattern and the selected arrangement pattern of the discharge cell is positioned so as to overlap in plan view process,
A voltage is applied between the conductive portion on the substrate side and the conductive mask so as to form a uniform electric field between the discharge cell and the conductive mask , and phosphor particles are dispersed in the chargeable substrate. The phosphor layer forming material made of the formed powder particles is charged to one polarity, and the charged phosphor layer forming material is put into the discharge cell through the conductive mask in a state where the voltage is applied. and a step of filling,
The voltage applied between the conductive part on the substrate side and the conductive mask is applied so that the charging polarity of the phosphor layer forming material and the polarity on the conductive mask side are the same polarity,
In addition, the selected array pattern of the discharge cells in each step is filled with a phosphor layer forming material of one color, and then the selected steps are repeated to change the selected array pattern. After filling the selected array pattern with the phosphor layer forming material of another color, the phosphor layer forming material filled in the unfired barrier rib pattern and the discharge cell is simultaneously fired, and the discharge A method of manufacturing a plasma display panel, comprising forming a phosphor layer in a cell. 5. The method of manufacturing a plasma display panel according to claim 4 , wherein the voltage is applied between the electrode pattern on the substrate and the conductive mask.

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