JP4361596B2 - Portable electronic devices - Google Patents

Portable electronic devices Download PDF

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Publication number
JP4361596B2
JP4361596B2 JP2008526635A JP2008526635A JP4361596B2 JP 4361596 B2 JP4361596 B2 JP 4361596B2 JP 2008526635 A JP2008526635 A JP 2008526635A JP 2008526635 A JP2008526635 A JP 2008526635A JP 4361596 B2 JP4361596 B2 JP 4361596B2
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JP
Japan
Prior art keywords
base material
frame body
portable electronic
circuit board
frame
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Expired - Fee Related
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JP2008526635A
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JPWO2008012885A1 (en
Inventor
守 吉田
文男 橋本
温雄 早川
一則 河野
一弘 小西
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H04M1/0216—Foldable in one direction, i.e. using a one degree of freedom hinge

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Telephone Set Structure (AREA)

Description

本発明は、基材に複数の電子部品が実装され、各電子部品を囲むように枠体が基材に取り付けられた回路基板を備える携帯電話などの携帯電子機器に関する。  The present invention relates to a portable electronic device such as a mobile phone including a circuit board on which a plurality of electronic components are mounted on a base material and a frame is attached to the base material so as to surround each electronic component.

例えば携帯電話等の携帯端末に収容される回路基板は、回路パターンが形成された基材と、回路パターンにハンダを介して端子部を固定することにより実装された複数の電子部品とを備えている。   For example, a circuit board accommodated in a portable terminal such as a mobile phone includes a base material on which a circuit pattern is formed, and a plurality of electronic components mounted by fixing terminal portions to the circuit pattern via solder. Yes.

また、近年では、電子部品における本体の一部を覆うとともに基材に密着する樹脂部（アンダーフィル）により電子部品の実装強度を向上させた回路基板が提案されている（特許文献１参照）。
この特許文献１は、基材に実装された複数の電子部品を一括して樹脂部により実装強度を向上させる場合にも適用可能である。
特許第３２４１６６９号公報 In recent years, a circuit board has been proposed in which the mounting strength of the electronic component is improved by a resin portion (underfill) that covers a part of the main body of the electronic component and adheres closely to the base material (see Patent Document 1).
This Patent Document 1 can also be applied to a case where a plurality of electronic components mounted on a base material are collectively improved in mounting strength by a resin portion.
Japanese Patent No. 3241669

しかしながら、携帯端末が落下した場合や、あるいは筐体に捻り・曲げ等の外力が加わった場合、枠体が基材から剥離したり、あるいは枠体から蓋部材が脱落する可能性があった。   However, when the mobile terminal falls or when an external force such as twisting or bending is applied to the housing, the frame body may be peeled off from the base material, or the lid member may fall off from the frame body.

本発明は、前述した課題を解決するためになされたもので、その目的は、基材に対する枠体の取付強度を向上できる回路基板および携帯電子機器を提供することにある。   The present invention has been made to solve the above-described problems, and an object thereof is to provide a circuit board and a portable electronic device that can improve the attachment strength of the frame to the base material.

本発明の携帯電子機器は、筐体と、前記筐体内に配置された基材と、前記基材に実装された複数の電子部品と、前記電子部品を囲むように前記基材に取り付けられた枠体と、前記枠体の外部に設けられ、前記基材と接触する接触部と、前記接触部の外端において基材に対して立ち上がる立上部と、前記枠体と前記接触部と前記立上部とにより形成された凹部とを備えるものである。
The portable electronic device of the present invention is attached to the base so as to surround the casing, the base disposed in the casing, the plurality of electronic components mounted on the base, and the electronic component A frame body, a contact portion provided outside the frame body and in contact with the base material, a rising portion that rises with respect to the base material at an outer end of the contact portion, the frame body, the contact portion, and the standing body. And a recess formed by the upper part.

上記の構成によれば、接触部により基材に対する枠体の接触面積を拡大させて基材に対する枠体の取り付け強度を向上させるとともに、基材に対する枠体の接触面積を拡大させることで、曲げ強度や捻れ強度を向上でき、さらに、接触部の外端において基材に対して立ち上がり、枠体と接触部とともに凹部を形成する立上部が、リブとしての役割も果たすことで、強度を一層向上できる。According to the above configuration, the contact portion increases the contact area of the frame body with respect to the base material by the contact portion to improve the attachment strength of the frame body with respect to the base material, and also increases the contact area of the frame body with respect to the base material. Strength and torsional strength can be improved. Further, the rising part that rises with respect to the base material at the outer end of the contact part and forms a recess together with the frame and the contact part also serves as a rib, further improving the strength. it can.

本発明の携帯電子機器は、前記基材と対向して配置され、凸部を有するカバー部をさらに有し、前記凸部は、前記凹部と係合する。  The portable electronic device of the present invention further includes a cover portion that is disposed to face the substrate and has a convex portion, and the convex portion engages with the concave portion.

本発明の携帯電子機器は、前記カバー部は前記筐体の一部である。  In the portable electronic device of the present invention, the cover part is a part of the housing.

本発明の携帯電子機器によれば、基材の実装面に面接触する接触部が枠体に設けられているため、基材に対する枠体の取り付け強度を向上できるという効果を有する。  According to the portable electronic device of the present invention, since the frame body is provided with the contact portion that comes into surface contact with the mounting surface of the base material, the attachment strength of the frame body to the base material can be improved.

（第１実施形態）
以下、本発明の実施形態に係る回路基板について、図面を参照して説明する。
図１に示すように、第１実施形態に係る携帯電子機器としての携帯端末１０は、上部筐体（筐体）１１と、上部筐体１１に連結部１３を介して回動自在に連結された下部筐体１２とを備え、連結部１３を介して上部筐体１１および下部筐体１２を相対的に移動させることにより、上部筐体１１および下部筐体１２が互いに積層した携帯状態と、上部筐体１１および下部筐体１２が離間配置される伸長状態（図示の状態）とを選択可能に構成されている。 (First embodiment)
Hereinafter, a circuit board according to an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, a mobile terminal 10 as a mobile electronic device according to the first embodiment is connected to an upper housing (housing) 11 and an upper housing 11 via a connecting portion 13 so as to be rotatable. A portable state in which the upper housing 11 and the lower housing 12 are stacked on each other by relatively moving the upper housing 11 and the lower housing 12 via the connecting portion 13; The extended state (state shown in the figure) in which the upper housing 11 and the lower housing 12 are spaced apart can be selected.

図２〜図４に示すように、上部筐体１１は、表カバー１４と裏カバー１５とからなり、表カバー１４および裏カバー１５間に回路基板１６が収容されている。
表カバー１４の表面１４Ａに開口部１７が形成され、開口部１７に臨むように表示部１９が配置され、表カバー１４の表面１４Ａおよび表示部１９がパネル２０（図３、４参照）で覆われている。
裏カバー１５は、樹脂製のカバー２２および金属製のカバー２３で二層に形成されている。 As shown in FIGS. 2 to 4, the upper housing 11 includes a front cover 14 and a back cover 15, and a circuit board 16 is accommodated between the front cover 14 and the back cover 15.
An opening 17 is formed on the surface 14A of the front cover 14, and a display unit 19 is disposed so as to face the opening 17. The surface 14A and the display unit 19 of the front cover 14 are covered with a panel 20 (see FIGS. 3 and 4). It has been broken.
The back cover 15 is formed in two layers with a resin cover 22 and a metal cover 23.

図１に示すように、上部筐体１１は、表示部１９の上方に受話部２１が設けられている。下部筐体１２は、表面に操作部２４および送話部２５が備えられている。
以下、本発明に係る回路基板１６を図２〜図７に基づいて説明する。 As shown in FIG. 1, the upper housing 11 is provided with a receiver unit 21 above the display unit 19. The lower housing 12 includes an operation unit 24 and a transmission unit 25 on the surface.
Hereinafter, the circuit board 16 according to the present invention will be described with reference to FIGS.

回路基板１６は、図２〜図４に示すように、基材２８と、基材２８の実装面に実装された複数の電子部品２９と、各電子部品２９を囲むように基材２８に取り付けられた枠体３０と、枠体３０の開口３１を閉鎖する蓋部材３４と、枠体３０および蓋部材３４間に介装された導電性接着剤３５（図７参照）とを備え、枠体３０の内部に充填された樹脂により樹脂部３６が形成されている。   As shown in FIGS. 2 to 4, the circuit board 16 is attached to the base material 28 so as to surround the base material 28, the plurality of electronic components 29 mounted on the mounting surface of the base material 28, and each electronic component 29. A frame body 30, a lid member 34 for closing the opening 31 of the frame body 30, and a conductive adhesive 35 (see FIG. 7) interposed between the frame body 30 and the lid member 34. A resin portion 36 is formed of a resin filled in the interior 30.

枠体３０は、図５に示すように、一例として、略矩形状に形成された壁部３８と、壁部３８の上端部３８Ａ（図６、図７も参照）に設けられた上折曲部３９と、壁部３８の基端部３８Ｂ（図６、図７も参照）に設けられた下折曲部（接触部）４１と、下折曲部４１の外端部４１Ａに設けられた立上部４２とを有している。   As shown in FIG. 5, the frame 30 has, as an example, a wall portion 38 formed in a substantially rectangular shape, and an upper bent portion provided on an upper end portion 38 </ b> A (see also FIGS. 6 and 7) of the wall portion 38. Part 39, a lower bent part (contact part) 41 provided at a base end part 38B of the wall part 38 (see also FIGS. 6 and 7), and an outer end part 41A of the lower bent part 41. And an upright portion 42.

壁部３８は、互いに対向する一対の縦側壁３８Ｃ，３８Ｄと、一対の縦側壁３８Ｃ，３８Ｄの一端側に設けられた一方の横側壁３８Ｅと、一対の縦側壁３８Ｃ，３８Ｄの他端側に設けられた他方の横側壁３８Ｆとで略矩形状に形成されている。   The wall portion 38 includes a pair of vertical side walls 38C and 38D facing each other, one horizontal side wall 38E provided on one end side of the pair of vertical side walls 38C and 38D, and the other end side of the pair of vertical side walls 38C and 38D. The other side wall 38F provided is formed in a substantially rectangular shape.

一対の縦側壁３８Ｃ，３８Ｄの基端部３８Ｂおよび一対の横側壁３８Ｅ，３８Ｆの基端部３８Ｂは、それぞれ基材２８に当接されている。
一対の縦側壁３８Ｃ，３８Ｄの基端部３８Ｂおよび一対の横側壁３８Ｅ，３８Ｆの基端部３８Ｂは、すなわち壁部３８の基端部３８Ｂである。 The base end portions 38B of the pair of vertical side walls 38C and 38D and the base end portions 38B of the pair of horizontal side walls 38E and 38F are in contact with the base material 28, respectively.
The base end portions 38B of the pair of vertical side walls 38C and 38D and the base end portions 38B of the pair of horizontal side walls 38E and 38F are the base end portions 38B of the wall portion 38.

一対の縦側壁３８Ｃ，３８Ｄおよび一対の横側壁３８Ｅ，３８Ｆには、それぞれ一定間隔をおいて突部４４が設けられている。
突部４４は、図７に示すように、枠体３０の外部に向けて突出された部位である。
縦側壁３８Ｃ，３８Ｄおよび横側壁３８Ｅ，３８Ｆに突部４４を設けた理由については後述する。 The pair of vertical side walls 38C and 38D and the pair of horizontal side walls 38E and 38F are provided with protrusions 44 at regular intervals.
As shown in FIG. 7, the protruding portion 44 is a portion protruding toward the outside of the frame body 30.
The reason why the protrusions 44 are provided on the vertical side walls 38C and 38D and the horizontal side walls 38E and 38F will be described later.

上折曲部３９は、壁部３８の上端部３８Ａ全周に設けられている。この上折曲部３９は、図７に示すように、上端部３８Ａから枠体３０の内部に向けて基材２８と平行に張り出されている。   The upper bent portion 39 is provided around the upper end portion 38 </ b> A of the wall portion 38. As shown in FIG. 7, the upper bent portion 39 projects from the upper end portion 38 </ b> A toward the inside of the frame body 30 in parallel with the base material 28.

下折曲部４１は、壁部３８のうち、一対の縦側壁３８Ｃ，３８Ｄの基端部３８Ｂに設けられている。この下折曲部４１は、図７に示すように、基端部３８Ｂから枠体３０の外部に向けて基材２８の実装面に沿うように張り出されている。   The lower bent part 41 is provided in the base end part 38B of a pair of vertical side wall 38C, 38D among the wall parts 38. As shown in FIG. As shown in FIG. 7, the lower bent portion 41 protrudes from the base end portion 38 </ b> B toward the outside of the frame body 30 along the mounting surface of the base material 28.

下折曲部４１を基材２８の実装面に沿うように設けることで、下折曲部４１が基材２８の実装面に対して面接触する接触部となっている。
これにより、基材２８に対する枠体３０の接触面積を拡大させて、基材２８に対する枠体３０の取付強度を向上できる。
さらに、基材２８に対する枠体３０の接触面積を拡大させることで、曲げ強度やねじれ強度を向上できる。 By providing the lower bent portion 41 along the mounting surface of the base material 28, the lower bent portion 41 is a contact portion that makes surface contact with the mounting surface of the base material 28.
Thereby, the contact area of the frame 30 with respect to the base material 28 can be expanded, and the attachment strength of the frame 30 with respect to the base material 28 can be improved.
Furthermore, the bending strength and the torsional strength can be improved by increasing the contact area of the frame 30 with the base material 28.

立上部４２は、下折曲部４１の外端部４１Ａの全域に設けられている。
この立上部４２は、下折曲部４１の外端部４１Ａから、基材２８の厚み方向に沿って離れる方向に立ち上がるように設けられている。
これにより、図３、図４に示すように、立上部４２に、上部筐体１１を構成する表カバー１４の溝部１４Ｂを係合することで、立上部４２、すなわち枠体３０に表カバー１４を一体化することが可能になり、強度の向上が図れる。
なお、立上部４２と溝部１４Ｂとを係合させるにあたっては、溝部１４Ｂ内に立上部４２が圧入されるように係合してもよく、あるいは溝部１４Ｂ内に立上部４２が空隙を介して緩目に挿入されるように係合してもよい。 The upright portion 42 is provided over the entire outer end portion 41 </ b> A of the lower bent portion 41.
The raised portion 42 is provided so as to rise from the outer end portion 41 </ b> A of the lower bent portion 41 in a direction away from the thickness direction of the base material 28.
As a result, as shown in FIGS. 3 and 4, by engaging the groove portion 14 </ b> B of the front cover 14 constituting the upper housing 11 with the upright portion 42, the front cover 14 is engaged with the upright portion 42, that is, the frame 30. Can be integrated, and the strength can be improved.
In engaging the raised portion 42 and the groove portion 14B, the raised portion 42 may be engaged so that the raised portion 42 is press-fitted into the groove portion 14B, or the raised portion 42 is loosened through the gap in the groove portion 14B. You may engage so that it may be inserted in eyes.

また、立上部４２に、枠体３０に積層される表示部１９（図１参照）を係合することで、強度の向上が図れる。
さらに、立上部４２は、リブとしての役割も果たすことで、強度を一層向上させることができる。
加えて、立上部４２に、表カバー１４を係合することで、枠体３０に対する表カバー１４の位置合わせが容易におこなえる。
また、本明細書中において、壁部３８と下折曲部４１と立上部４２とにより形成される領域を凹部とする。 Further, the display portion 19 (see FIG. 1) stacked on the frame body 30 is engaged with the upright portion 42, whereby the strength can be improved.
Furthermore, the upright part 42 can further improve strength by serving as a rib.
In addition, the front cover 14 can be easily aligned with the frame body 30 by engaging the front cover 14 with the upright portion 42.
Further, in this specification, a region formed by the wall portion 38, the lower bent portion 41, and the raised portion 42 is defined as a concave portion.

図５に示すように、枠体３０には蓋部材３４が被さられている。蓋部材３４は、枠体３０より一回り大きな矩形状に形成された側壁４６と、側壁４６の上端部４６Ａに設けられた蓋本体４７とを有している。
側壁４６には、一定間隔をおいて開口部４８が形成されている。開口部４８は、蓋部材３４が枠体３０に被せられたとき、前述した突部４４に係止する（図７参照）。
具体的には、蓋部材３４を枠体３０に被せた際に、開口部４８が突部４４に嵌合され、開口部４８が突部４４に係止する。 As shown in FIG. 5, the frame body 30 is covered with a lid member 34. The lid member 34 includes a side wall 46 that is formed in a rectangular shape that is slightly larger than the frame body 30, and a lid body 47 that is provided on the upper end portion 46 </ b> A of the side wall 46.
Openings 48 are formed in the side wall 46 at regular intervals. The opening 48 is locked to the protrusion 44 described above when the lid member 34 is put on the frame 30 (see FIG. 7).
Specifically, when the lid member 34 is put on the frame body 30, the opening 48 is fitted into the protrusion 44, and the opening 48 is locked to the protrusion 44.

蓋本体４７は、蓋本体４７の任意の個所に、蓋部材３４の内部に向けて（すなわち、枠体の内部に受けて）突出された円筒状の突起部５０を複数有している。
図７に示すように、突起部５０は、円筒状に形成された垂下部５１と、垂下部５１の下端部５１Ａに外部に向けて張り出された張出部５２とを有している。 The lid body 47 has a plurality of cylindrical protrusions 50 that protrude toward the inside of the lid member 34 (that is, received inside the frame body) at an arbitrary position of the lid body 47.
As shown in FIG. 7, the protrusion 50 has a hanging portion 51 formed in a cylindrical shape and a protruding portion 52 that protrudes outward from a lower end portion 51 </ b> A of the hanging portion 51.

垂下部５１は、蓋本体４７から基材２８の厚み方向に沿って基材２８に向かうように突出されている。
張出部５２は、基材２８の面方向に沿うように張り出されている。
すなわち、垂下部５１および張出部５２は、断面が略Ｌ字状に連結され、樹脂部３６に埋設されている。垂下部５１および張出部５２を断面が略Ｌ字状に形成することで、突起部５０を樹脂部３６から抜けにくい形状にできる。
このような突起部５０は、例えば蓋部材３４にバーリング加工を施した後、バーリングの先端部にカーリング加工を施すことによりカールフランジを形成する製造方法を例示できる。 The hanging portion 51 protrudes from the lid main body 47 along the thickness direction of the base material 28 toward the base material 28.
The overhanging portion 52 is overhanging along the surface direction of the base material 28.
That is, the hanging portion 51 and the overhanging portion 52 are connected in a substantially L shape in cross section and are embedded in the resin portion 36. By forming the hanging portion 51 and the overhanging portion 52 in a substantially L-shaped cross section, the protruding portion 50 can be formed in a shape that is difficult to be removed from the resin portion 36.
Such a protrusion 50 can be exemplified by a manufacturing method in which a curling flange is formed by burring the lid member 34 and then curling the tip of the burring.

蓋部材３４に略Ｌ字状の突起部５０を設け、突起部５０を樹脂部３６に埋設させることで、枠体３０内に充填された樹脂が硬化する際に、樹脂が収縮して突起部５０が樹脂部３６により枠体３０側に引っ張られる。   By providing a substantially L-shaped protrusion 50 on the lid member 34 and embedding the protrusion 50 in the resin portion 36, the resin contracts when the resin filled in the frame 30 is cured. 50 is pulled toward the frame 30 by the resin portion 36.

これにより、蓋部材３４が枠体３０側に引っ張られるので、蓋部材３４を樹脂部３６の収縮に追従させて枠体３０に密着させることが可能になる。
このように、蓋部材３４を枠体３０に密着させることで、枠体３０に対する蓋部材３４の取付強度を向上させ、さらにシールド性を向上できる。
さらに、枠体３０および蓋部材３４が導電性接着剤３５を介して接続されることで、シールド性の一層の向上が図れる。
また、他の効果として、突起部を樹脂部に埋没させることにより、基材，枠体，蓋部材，樹脂部を一体化でき、これにより回路基板の剛体化に向けた相乗効果が得られる。 Thereby, since the lid member 34 is pulled toward the frame body 30, the lid member 34 can be brought into close contact with the frame body 30 by following the contraction of the resin portion 36.
In this way, by attaching the lid member 34 to the frame body 30, the attachment strength of the lid member 34 to the frame body 30 can be improved, and the shielding performance can be further improved.
Furthermore, since the frame 30 and the lid member 34 are connected via the conductive adhesive 35, the shielding property can be further improved.
Further, as another effect, by embedding the protruding portion in the resin portion, the base material, the frame body, the lid member, and the resin portion can be integrated, thereby obtaining a synergistic effect for making the circuit board rigid.

（第２実施形態）
つぎに、第２実施形態の回路基板６０を図８に基づいて説明する。
図８に示す第２実施形態の回路基板６０は、樹脂部３６の上面３６Ａに導電性接着剤６１が塗布されたもので、その他の構成は第１実施形態の回路基板１６と同じである。
導電性接着剤６１は、第１実施形態の導電性接着剤３５と同じ接着剤である。
回路基板６０は、樹脂部３６の上面３６Ａに導電性接着剤６１を塗布することで、シールド性の一層の向上が図れる。 (Second Embodiment)
Next, the circuit board 60 of the second embodiment will be described with reference to FIG.
The circuit board 60 of the second embodiment shown in FIG. 8 is obtained by applying a conductive adhesive 61 to the upper surface 36A of the resin portion 36, and the other configuration is the same as that of the circuit board 16 of the first embodiment.
The conductive adhesive 61 is the same adhesive as the conductive adhesive 35 of the first embodiment.
The circuit board 60 can further improve the shielding property by applying the conductive adhesive 61 to the upper surface 36 </ b> A of the resin portion 36.

つぎに、第１実施形態、第２実施形態の立上部４２および下折曲部４１の変形例１〜４を図９〜図１２に基づいて説明する。
図９に示す変形例１は、立上部４２を下折曲部４１の全域に設けないで、下折曲部４１の一部に設けたものである。
図１０に示す変形例２は、立上部４２および下折曲部４１を縦側壁３８Ｃ全域に設けないで、縦側壁３８Ｃの一部に設けたものである。 Next, modified examples 1 to 4 of the upright portion 42 and the lower bent portion 41 of the first embodiment and the second embodiment will be described with reference to FIGS. 9 to 12.
In Modification 1 shown in FIG. 9, the upright portion 42 is not provided in the entire area of the lower bent portion 41, but is provided in a part of the lower bent portion 41.
In the second modification shown in FIG. 10, the upright portion 42 and the lower bent portion 41 are not provided in the entire length of the vertical side wall 38C, but are provided in a part of the vertical side wall 38C.

図１１に示す変形例３は、立上部４２を設けないで、下折曲部４１のみを設けたものである。
図１２に示す変形例４は、立上部４２を設けないで、下折曲部４１のみを設けたもので、下折曲部４１を縦側壁３８Ｃ全域に設けないで、縦側壁３８Ｃの一部に設けたものである。 In Modification 3 shown in FIG. 11, only the lower bent portion 41 is provided without providing the rising portion 42.
In Modification 4 shown in FIG. 12, only the lower bent portion 41 is provided without providing the rising portion 42, and the lower bent portion 41 is not provided over the entire vertical side wall 38C, and a part of the vertical side wall 38C. Is provided.

変形例１〜４によれば、第１、第２の実施形態の回路基板１６，６０と同様の効果が得られる。   According to the first to fourth modifications, the same effects as those of the circuit boards 16 and 60 of the first and second embodiments can be obtained.

つぎに、第１実施形態、第２実施形態の突起部５０の変形例５〜８を図１３〜図１６に基づいて説明する。
図１３に示す変形例５は、第１実施形態、第２実施形態の突起部５０に代えて突起部６５を設けたものである。
突起部６５は、蓋本体４７から基材２８の厚み方向に沿って基材２８に向かうように突出された板状の垂下部６５Ａと、垂下部６５Ａの下端部から基材２８の面方向に沿うように張り出された張出部６５Ｂとを有している。
垂下部６５Ａおよび張出部６５Ｂは、樹脂部３６から抜けにくい略Ｌ字状に形成されている。 Next, modified examples 5 to 8 of the protrusion 50 according to the first embodiment and the second embodiment will be described with reference to FIGS.
Modification 5 shown in FIG. 13 is provided with a protrusion 65 instead of the protrusion 50 of the first embodiment and the second embodiment.
The projecting portion 65 includes a plate-like hanging portion 65A that protrudes from the lid main body 47 along the thickness direction of the base material 28 toward the base material 28, and a lower end portion of the hanging portion 65A in the surface direction of the base material 28. And a projecting portion 65B projecting along.
The hanging portion 65A and the overhanging portion 65B are formed in a substantially L shape that is difficult to come off from the resin portion 36.

図１４に示す変形例６は、第１実施形態、第２実施形態の突起部５０に代えて突起部６６を設けたものである。
突起部６６は、蓋本体４７から基材２８の厚み方向に沿って基材２８に斜めに向かうように突出された板状の垂下部６５Ａと、垂下部６５Ａの下端部から垂下部６５Ａに対して反対方向に向けて斜めに突出された板状の張出部６５Ｂとを有している。
垂下部６５Ａおよび張出部６５Ｂは、樹脂部３６から抜けにくい略ヘ字状に形成されている。 Modification 6 shown in FIG. 14 is provided with a protruding portion 66 instead of the protruding portion 50 of the first and second embodiments.
The projecting portion 66 has a plate-like hanging portion 65A that protrudes obliquely from the lid main body 47 along the thickness direction of the base material 28 toward the base material 28, and a lower end portion of the hanging portion 65A from the bottom portion 65A. And a plate-like projecting portion 65B protruding obliquely in the opposite direction.
The hanging part 65A and the overhanging part 65B are formed in a substantially square shape that is difficult to come off from the resin part 36.

図１５に示す変形例７は、第１実施形態、第２実施形態の突起部５０に代えて突起部６７を設けたものである。
突起部６７は、蓋本体４７から基材２８の厚み方向に沿って基材２８に向かうように突出された板状の垂下部６７Ａと、垂下部６７Ａの下端部から基材２８に対して斜め上方に張り出された張出部６７Ｂとを有している。
垂下部６７Ａおよび張出部６７Ｂは、樹脂部３６から抜けにくい略Ｖ字状に形成されている。 Modification 7 shown in FIG. 15 is provided with a protrusion 67 instead of the protrusion 50 of the first and second embodiments.
The projecting portion 67 is inclined with respect to the base material 28 from a plate-like hanging portion 67A that protrudes from the lid main body 47 along the thickness direction of the base material 28 toward the base material 28, and a lower end portion of the hanging portion 67A. And an overhanging portion 67B protruding upward.
The hanging portion 67A and the overhanging portion 67B are formed in a substantially V shape that is difficult to come off from the resin portion 36.

図１６に示す変形例８は、第１実施形態、第２実施形態の突起部５０に代えて突起部６８を設けたものである。
突起部６８は、蓋本体４７から基材２８の厚み方向に沿って基材２８に向かうように突出された板状の垂下部６８Ａと、垂下部６８Ａの下端部から基材２８の面方向に沿うように両方に張り出された張出部６８Ｂとを有している。
垂下部６８Ａおよび張出部６８Ｂは、樹脂部３６から抜けにくい略Ｔ字状に形成されている。 A modification 8 shown in FIG. 16 is provided with a protrusion 68 instead of the protrusion 50 of the first and second embodiments.
The projecting portion 68 includes a plate-like hanging portion 68A that protrudes from the lid main body 47 along the thickness direction of the substrate 28 toward the substrate 28, and a lower end portion of the hanging portion 68A in the surface direction of the substrate 28. A projecting portion 68B projecting on both sides is provided.
The hanging portion 68A and the overhanging portion 68B are formed in a substantially T shape that is difficult to come off from the resin portion 36.

変形例５〜８によれば、第１実施形態、第２実施形態の回路基板１６，６０と同様の効果が得られる。   According to the modifications 5 to 8, the same effects as those of the circuit boards 16 and 60 of the first embodiment and the second embodiment can be obtained.

なお、前述した第１実施形態〜第２実施形態では、下折曲部４１を枠体３０の外部に向けて張り出した例について説明したが、これに限らないで、下折曲部４１を枠体３０の内部に向けて張り出すことも可能である。
また、下折曲部４１を、壁部３８のうち、一対の縦側壁３８Ｃ，３８Ｄに設けた例について説明したが、これに限らないで、壁部３８の全周に設けることも可能である。 In the first embodiment to the second embodiment described above, the example in which the lower bent portion 41 protrudes toward the outside of the frame body 30 has been described. However, the present invention is not limited thereto, and the lower bent portion 41 is framed. It is also possible to project toward the inside of the body 30.
Moreover, although the example which provided the lower bending part 41 in a pair of vertical side wall 38C, 38D among the wall parts 38 was demonstrated, it is not restricted to this, It is also possible to provide in the perimeter of the wall part 38. .

また、前述した第１実施形態〜第２実施形態において例示した枠体３０、蓋部材３４、樹脂部３６、突起部５０などの形状や構成は、これに限定するものではなく、適宜変更が可能である。   In addition, the shapes and configurations of the frame body 30, the lid member 34, the resin portion 36, the protruding portion 50, and the like exemplified in the first to second embodiments described above are not limited to this, and can be changed as appropriate. It is.

本発明は、基材に複数の電子部品が実装され、各電子部品を囲むように枠体が基材に取り付けられた回路基板を備える携帯電子機器への適用に好適である。  The present invention is suitable for application to a portable electronic device including a circuit board in which a plurality of electronic components are mounted on a base material and a frame is attached to the base material so as to surround each electronic component.

本発明に係る回路基板（第１実施形態）を備えた携帯電子機器を示す斜視図である。It is a perspective view which shows the portable electronic device provided with the circuit board (1st Embodiment) which concerns on this invention. 図１のＡ−Ａ線断面図である。It is the sectional view on the AA line of FIG. 図１のＢ−Ｂ線に沿った分解断面図である。FIG. 2 is an exploded cross-sectional view along the line BB in FIG. 1. 図１のＢ−Ｂ線断面図である。It is the BB sectional view taken on the line of FIG. 第１実施形態に係る回路基板の枠体および蓋部材を示す分解斜視図である。It is a disassembled perspective view which shows the frame and cover member of the circuit board which concern on 1st Embodiment. 図５のＣ部拡大図である。It is the C section enlarged view of FIG. 第１実施形態に係る回路基板を示す断面図である。It is sectional drawing which shows the circuit board which concerns on 1st Embodiment. 本発明に係る回路基板（第２実施形態）を示す断面図である。It is sectional drawing which shows the circuit board (2nd Embodiment) which concerns on this invention. 本発明に係る回路基板の変形例１を示す斜視図である。It is a perspective view which shows the modification 1 of the circuit board based on this invention. 本発明に係る回路基板の変形例２を示す斜視図である。It is a perspective view which shows the modification 2 of the circuit board based on this invention. 本発明に係る回路基板の変形例３を示す斜視図である。It is a perspective view which shows the modification 3 of the circuit board based on this invention. 本発明に係る回路基板の変形例４を示す斜視図である。It is a perspective view which shows the modification 4 of the circuit board based on this invention. 本発明に係る回路基板の変形例５を示す斜視図である。It is a perspective view which shows the modification 5 of the circuit board based on this invention. 本発明に係る回路基板の変形例６を示す斜視図である。It is a perspective view which shows the modification 6 of the circuit board based on this invention. 本発明に係る回路基板の変形例７を示す斜視図である。It is a perspective view which shows the modification 7 of the circuit board based on this invention. 本発明に係る回路基板の変形例８を示す斜視図である。It is a perspective view which shows the modification 8 of the circuit board based on this invention.

符号の説明Explanation of symbols

１０ 携帯端末（携帯電子機器）
１６，６０ 回路基板
２８ 基材
２９ 電子部品
３０ 枠体
３１ 枠体の開口
３４ 蓋部材
３６ 樹脂部
３６Ａ 樹脂部の上面
３８ 枠体の壁部
３８Ｂ 基端部
４１ 下折曲部（接触部）
４２ 立上部
６１ 導電性接着剤 10 Mobile devices (mobile electronic devices)
16, 60 Circuit board 28 Base material 29 Electronic component 30 Frame body 31 Frame opening 34 Lid member 36 Resin portion 36A Resin portion upper surface 38 Frame body wall portion 38B Base end portion 41 Lower bent portion (contact portion)
42 Upright 61 Conductive Adhesive

Claims (3)

筐体と、  A housing,
前記筐体内に配置された基材と、  A substrate disposed in the housing;
前記基材に実装された複数の電子部品と、  A plurality of electronic components mounted on the substrate;
前記電子部品を囲むように前記基材に取り付けられた枠体と、  A frame attached to the substrate so as to surround the electronic component;
前記枠体の外部に設けられ、前記基材と接触する接触部と、  A contact portion provided outside the frame and in contact with the substrate;
前記接触部の外端において基材に対して立ち上がる立上部と、  An upright portion that rises with respect to the substrate at the outer end of the contact portion;
前記枠体と前記接触部と前記立上部とにより形成された凹部と、  A recess formed by the frame, the contact portion, and the upright portion;
を備えた携帯電子機器。Portable electronic device with 請求項１に記載の携帯電子機器であって、  The portable electronic device according to claim 1,
前記基材と対向して配置され、凸部を有するカバー部をさらに有し、  It further has a cover part which is arranged facing the base material and has a convex part,
前記凸部は、前記凹部と係合する携帯電子機器。  The convex portion is a portable electronic device that engages with the concave portion. 請求項２に記載の携帯電子機器であって、  The portable electronic device according to claim 2,
前記カバー部は前記筐体の一部である携帯電子機器。  The cover unit is a portable electronic device that is a part of the housing.
JP2008526635A 2006-07-26 2006-07-26 Portable electronic devices Expired - Fee Related JP4361596B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/314809 WO2008012885A1 (en) 2006-07-26 2006-07-26 Circuit board and portable electronic apparatus

Related Child Applications (1)

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JP4983653B2 (en) * 2008-03-04 2012-07-25 株式会社デンソー Electronic circuit equipment
JP5173788B2 (en) * 2008-12-24 2013-04-03 新電元工業株式会社 Electronic circuit device and method for manufacturing electronic circuit device

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JPH07297563A (en) * 1994-04-28 1995-11-10 Matsushita Electric Ind Co Ltd Electronic part
JPH08167677A (en) * 1994-12-14 1996-06-25 Hitachi Ltd Semiconductor module
JP4020662B2 (en) * 2002-03-06 2007-12-12 富士通テン株式会社 Waterproof case for electronic equipment and on-vehicle radar device provided with waterproof case for electronic equipment
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