JP4359397B2 - オプトエレクトロニクス・アセンブリを構築する方法 - Google Patents

オプトエレクトロニクス・アセンブリを構築する方法 Download PDF

Info

Publication number
JP4359397B2
JP4359397B2 JP2000593981A JP2000593981A JP4359397B2 JP 4359397 B2 JP4359397 B2 JP 4359397B2 JP 2000593981 A JP2000593981 A JP 2000593981A JP 2000593981 A JP2000593981 A JP 2000593981A JP 4359397 B2 JP4359397 B2 JP 4359397B2
Authority
JP
Japan
Prior art keywords
flexure
optical
package
frame
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000593981A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002535695A (ja
JP2002535695A5 (https=
Inventor
バーディエル，ジャン−マルク
Original Assignee
ライトロジック・インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22861460&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4359397(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by ライトロジック・インコーポレーテッド filed Critical ライトロジック・インコーポレーテッド
Publication of JP2002535695A publication Critical patent/JP2002535695A/ja
Publication of JP2002535695A5 publication Critical patent/JP2002535695A5/ja
Application granted granted Critical
Publication of JP4359397B2 publication Critical patent/JP4359397B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
JP2000593981A 1999-01-11 2000-01-06 オプトエレクトロニクス・アセンブリを構築する方法 Expired - Fee Related JP4359397B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/229,489 US6227724B1 (en) 1999-01-11 1999-01-11 Method for constructing an optoelectronic assembly
US09/229,489 1999-01-11
PCT/US2000/000408 WO2000042464A1 (en) 1999-01-11 2000-01-06 Method for constructing an optoelectronic assembly

Publications (3)

Publication Number Publication Date
JP2002535695A JP2002535695A (ja) 2002-10-22
JP2002535695A5 JP2002535695A5 (https=) 2007-02-22
JP4359397B2 true JP4359397B2 (ja) 2009-11-04

Family

ID=22861460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000593981A Expired - Fee Related JP4359397B2 (ja) 1999-01-11 2000-01-06 オプトエレクトロニクス・アセンブリを構築する方法

Country Status (7)

Country Link
US (1) US6227724B1 (https=)
EP (1) EP1151339B1 (https=)
JP (1) JP4359397B2 (https=)
AU (1) AU3692300A (https=)
CA (1) CA2358529C (https=)
DE (1) DE60022479T2 (https=)
WO (1) WO2000042464A1 (https=)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69801648T2 (de) 1998-05-25 2002-04-18 Alcatel, Paris Optoelektronisches Modul mit wenigstens einem optoelektronischen Bauelement und Verfahren zur Temperaturstabilisierung
US6511236B1 (en) * 1999-09-07 2003-01-28 Intel Corporation Optoelectronic assembly and method for fabricating the same
US6625372B1 (en) * 1999-11-15 2003-09-23 Axsun Technologies, Inc. Mounting and alignment structures for optical components
US6416937B1 (en) * 1999-11-15 2002-07-09 Axsun Technologies, Inc. Optical component installation process
US7003211B2 (en) * 1999-11-15 2006-02-21 Axsun Technologies, Inc. Optical system production system
US6483969B1 (en) * 1999-12-01 2002-11-19 The United States Of America As Represented By The Secretary Of The Army Apparatus, assembly, and method for making micro-fixtured lensed assembly for optoelectronic devices and optical fibers
WO2002018989A2 (en) * 2000-08-25 2002-03-07 Axsun Technologies, Inc. Solid-phase welded optical element attach process
JP2004522986A (ja) * 2000-10-30 2004-07-29 サンター コーポレイション チューニング可能な制御されるレーザー・アレー
US6771855B2 (en) 2000-10-30 2004-08-03 Santur Corporation Laser and fiber coupling control
AU2002245062A1 (en) * 2000-10-30 2002-07-30 Santur Corporation Laser thermal tuning
US6542659B2 (en) * 2000-12-01 2003-04-01 Axsun Technologies, Inc. Optical spectrum analyzer with beam switch array
US6791694B2 (en) * 2001-01-16 2004-09-14 Santur Corporation Tunable optical device using a scanning MEMS mirror
US6922278B2 (en) * 2001-03-30 2005-07-26 Santur Corporation Switched laser array modulation with integral electroabsorption modulator
WO2002080317A1 (en) * 2001-03-30 2002-10-10 Santur Corporation Alignment of an on chip modulator
WO2002079864A1 (en) * 2001-03-30 2002-10-10 Santur Corporation Modulator alignment for laser
US6643075B2 (en) * 2001-06-11 2003-11-04 Axsun Technologies, Inc. Reentrant-walled optical system template and process for optical system fabrication using same
US6712528B2 (en) * 2001-06-28 2004-03-30 Corning O.T.I. S.R.L. Optical bench for an opto-electronic device
US6628881B2 (en) 2001-06-28 2003-09-30 Intel Corporation Fiber carrier and method for using the same
WO2003012938A1 (en) 2001-07-27 2003-02-13 General Instrument Corporation Inexpensive analog laser module
WO2003015225A2 (en) * 2001-08-08 2003-02-20 Santur Corporation Method and system for selecting an output of a dbr array
AU2002327432A1 (en) * 2001-08-08 2003-02-24 Santur Corporation Method and system for selecting an output of a vcsel array
JP2003060281A (ja) 2001-08-14 2003-02-28 Sumitomo Electric Ind Ltd 発光モジュール及びその製造方法
US6663294B2 (en) 2001-08-29 2003-12-16 Silicon Bandwidth, Inc. Optoelectronic packaging assembly
US6603193B2 (en) 2001-09-06 2003-08-05 Silicon Bandwidth Inc. Semiconductor package
US6847115B2 (en) 2001-09-06 2005-01-25 Silicon Bandwidth Inc. Packaged semiconductor device for radio frequency shielding
US7413688B2 (en) 2001-09-17 2008-08-19 Kenneth Noddings Fabrication of optical devices and assemblies
JP2003163403A (ja) * 2001-11-29 2003-06-06 Mitsubishi Electric Corp 光素子モジュール
EP1321791A2 (en) * 2001-12-04 2003-06-25 Matsushita Electric Industrial Co., Ltd. Optical package substrate, optical device, optical module, and method for molding optical package substrate
DE10205127A1 (de) * 2002-02-07 2003-08-28 Infineon Technologies Ag Halbleiterbauteil mit Sensor- bzw. Aktoroberfläche und Verfahren zu seiner Herstellung
US6886993B2 (en) * 2002-02-14 2005-05-03 Intel Corporation Optoelectronic assembly having a flexure that supports multiple optical elements
US7430081B2 (en) * 2002-02-28 2008-09-30 Emcore Corporation Sub-micron adjustable mount for supporting a component and method
US7126078B2 (en) 2002-02-28 2006-10-24 Emcore Corporation Sub-micron adjustable mount for supporting a component and method
EP1347323A1 (en) * 2002-03-19 2003-09-24 Corning Incorporated Photonic package based on multi-functional lid
US6910780B2 (en) * 2002-04-01 2005-06-28 Santur Corporation Laser and laser signal combiner
US6821032B2 (en) * 2002-05-28 2004-11-23 Intel Corporation Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs
US6786654B2 (en) * 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device
US6862389B2 (en) * 2002-08-29 2005-03-01 Triquint Technologies Holding Co. Fiber alignment using a channel incorporating a fulcrum structure
US20040047571A1 (en) * 2002-09-06 2004-03-11 Boord Warren Timothy Hermetically sealed ferrule
US6816323B2 (en) * 2002-10-03 2004-11-09 Intel Corporation Coupling with strong lens and weak lens on flexure
US6904067B2 (en) * 2002-10-03 2005-06-07 Intel Corporation Back facet wavelength locker tuning and assembly method
US6827505B2 (en) * 2002-12-16 2004-12-07 International Business Machines Corporation Optoelectronic package structure and process for planar passive optical and optoelectronic devices
US6896422B2 (en) * 2003-02-04 2005-05-24 Intel Corporation Optoelectronic modules and methods of manufacturing the same
US6747819B1 (en) * 2003-02-25 2004-06-08 Intel Corporation Optoelectronic assembly
US20050036741A1 (en) * 2003-03-17 2005-02-17 Mark Rodighiero Method and apparatus for correcting attachment induced positional shift in a photonic package
US20040202433A1 (en) * 2003-04-10 2004-10-14 Lake Rickie C. Ferrule flexure assembly for optical modules
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
US7255494B2 (en) * 2003-05-23 2007-08-14 Intel Corporation Low-profile package for housing an optoelectronic assembly
EP1515364B1 (en) 2003-09-15 2016-04-13 Nuvotronics, LLC Device package and methods for the fabrication and testing thereof
US9612409B2 (en) * 2003-09-15 2017-04-04 Intel Corporation Hermetic sealing of optical module
US7186038B2 (en) 2003-12-29 2007-03-06 Adc Telecommunications, Inc. Telecommunications connector protective device
US6970628B2 (en) * 2004-04-15 2005-11-29 Inplane Photonics, Inc. Active optical alignment and attachment thereto of a semiconductor optical component with an optical element formed on a planar lightwave circuit
US7715456B2 (en) * 2005-10-27 2010-05-11 Limo Patentverwaltung Gmbh & Co. Kg Semiconductor laser device
JP4627087B2 (ja) * 2008-04-10 2011-02-09 株式会社リコー 光源装置と光走査装置、並びに画像形成装置
JP5583632B2 (ja) * 2011-05-13 2014-09-03 Ｎｔｔエレクトロニクス株式会社 光モジュール
CA2907165C (en) 2013-03-15 2022-08-23 Praevium Research, Inc. Tunable laser array system
CN105188540B (zh) * 2013-03-15 2019-03-08 普雷维乌姆研究公司 宽范围可调谐扫频源
US9645333B2 (en) 2014-10-17 2017-05-09 Lumentum Operations Llc Optomechanical assembly
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10574025B2 (en) * 2018-01-26 2020-02-25 Lightwave Logic Inc. Hermetic capsule and method for a monolithic photonic integrated circuit

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548700B2 (https=) 1973-01-30 1980-12-08
US4114177A (en) 1975-05-01 1978-09-12 Bell Telephone Laboratories, Incorporated Optically coupled device with diffusely reflecting enclosure
US4119363A (en) 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
US4357072A (en) 1978-01-28 1982-11-02 Plessey Handel Und Investments Ag Sealing optical fibres into packages
CA1108899A (en) 1978-08-17 1981-09-15 Rca Limited Light detector housing for fiber optic applications
EP0168820A3 (de) * 1984-07-19 1987-01-14 Siemens Aktiengesellschaft Justiervorrichtung für Lichtwellenleiter
ATE50864T1 (de) * 1985-10-16 1990-03-15 British Telecomm Fabry-perot-interferometer.
FR2606890B1 (fr) * 1986-11-18 1989-06-30 Lyonnaise Transmiss Optiques Dispositif de deplacement de l'extremite d'une fibre optique suivant deux axes orthogonaux
WO1989008374A1 (fr) 1988-02-26 1989-09-08 Fujitsu Limited Support de montage de composants optiques et de composants de circuits electriques et procede de production
JPH02187712A (ja) * 1989-01-17 1990-07-23 Fujitsu Ltd 光フィイバの調整固定方法
GB2229856B (en) * 1989-03-31 1993-04-21 Stc Plc Electro-optic transducer assembly
US4926545A (en) 1989-05-17 1990-05-22 At&T Bell Laboratories Method of manufacturing optical assemblies
KR920010947B1 (ko) * 1989-05-24 1992-12-24 가부시끼가이샤 히다찌세이사꾸쇼 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더
GB8923135D0 (en) * 1989-10-13 1989-11-29 Bt & D Technologies Ltd Mounting optical components
JP3067151B2 (ja) 1990-03-13 2000-07-17 日本電気株式会社 光電気変換素子サブキャリア
US5163108A (en) 1990-07-11 1992-11-10 Gte Laboratories Incorporated Method and device for passive alignment of diode lasers and optical fibers
US5119448A (en) 1990-09-21 1992-06-02 Tacan Corporation Modular micro-optical systems and method of making such systems
FR2668267B1 (fr) * 1990-10-19 1992-12-11 Thomson Hybrides Procede d'alignement des axes optiques d'une fibre et d'un composant optoelectronique, et dispositif obtenu par ce procede.
FR2690996A1 (fr) * 1992-05-07 1993-11-12 Thomson Hybrides Dispositif d'alignement optique entre un composant optoélectronique et un composant optique, et procédé d'alignement.
US5569958A (en) 1994-05-26 1996-10-29 Cts Corporation Electrically conductive, hermetic vias and their use in high temperature chip packages
US5641984A (en) 1994-08-19 1997-06-24 General Electric Company Hermetically sealed radiation imager
EP0708347A1 (en) * 1994-10-21 1996-04-24 Hewlett-Packard GmbH Apparatus for adjustment, attenuating device, coupling device and filtering device
EP0739494B1 (de) 1994-11-15 2002-05-15 Leica Geosystems AG Mechanisches befestigungssystem für ein modular gefasstes mikrooptisches element
GB2296101B (en) * 1994-12-12 1998-04-01 Northern Telecom Ltd Optically coupling optical fibres to injection lasers
US5553180A (en) 1995-01-17 1996-09-03 Molex Incorporated Adapter assembly for fiber optic connectors

Also Published As

Publication number Publication date
US6227724B1 (en) 2001-05-08
DE60022479D1 (de) 2005-10-13
EP1151339A1 (en) 2001-11-07
WO2000042464A1 (en) 2000-07-20
EP1151339B1 (en) 2005-09-07
DE60022479T2 (de) 2006-06-08
EP1151339A4 (en) 2003-05-02
CA2358529C (en) 2008-03-25
JP2002535695A (ja) 2002-10-22
AU3692300A (en) 2000-08-01
CA2358529A1 (en) 2000-07-20

Similar Documents

Publication Publication Date Title
JP4359397B2 (ja) オプトエレクトロニクス・アセンブリを構築する方法
JP4290893B2 (ja) オプトエレクトロニクス・アセンブリ
US10495830B2 (en) Optical fiber alignment device
KR100468130B1 (ko) 광전자 어셈블리 및 그 제조 방법
US6786627B2 (en) Light generating module
US7176436B2 (en) Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
JP2005257879A (ja) 光モジュール及びその製造方法並びに保護部材及び電気配線付き保護部材
US7223629B2 (en) Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
US20050129372A1 (en) Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
US6603093B2 (en) Method for alignment of optical components using laser welding
US7201521B2 (en) Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
US6850144B1 (en) Coil for use on a substrate
JPH10117043A (ja) 発光素子

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061227

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081104

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090204

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090304

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090331

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090630

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090728

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090810

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120814

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130814

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees