JP4356417B2 - Copper alloy wire for electronic parts - Google Patents

Description

  The present invention relates to a copper alloy wire used for an electronic component, particularly a connector.

  As wire rods used for electronic parts, there are various copper and copper alloy wires, but brass (Cu—Zn alloy) wires are mainly used from the viewpoint of strength. Further, a phosphor bronze (Cu—Sn alloy) wire is used in part.

Among electronic components, brass wires are mainly used for connectors, and square wires are frequently used as shapes. Furthermore, as a material for a connector, a material having high strength and electrical conductivity and excellent solderability is required, and there is a copper alloy wire proposed in Patent Document 1 for improving them.
JP-A-6-17168

  However, conventional brass wires, phosphor bronze wires, or copper alloy wires proposed in Patent Document 1 have the following problems.

  First, the brass wire has relatively good strength and electrical conductivity, but has a problem that the electrical conductivity is lower than that of the copper wire, and the phosphor bronze wire has an extremely low electrical conductivity. Moreover, the copper alloy wire described in Patent Document 1 has a strength lower than that of a brass wire when the conductivity is designed to be higher than that of a brass wire, and an increase in conductivity when the strength is designed to be equal. There are few and no superiority is recognized.

  Therefore, a material that balances strength and conductivity in a balanced manner has not yet been provided as a wire for an electronic component, particularly a connector.

  Accordingly, an object of the present invention is to solve the above-described problems and provide a copper alloy wire that balances strength and conductivity in a balanced manner for electronic components, particularly connectors.

In order to achieve the above object, the copper alloy wire for electronic parts of the present invention is a copper alloy wire for electronic parts in which a coating layer made of a copper-zinc alloy is formed on the outer periphery of a core made of copper or a copper alloy , The core material is Cu-0.02-0.2 wt% Zr alloy, Cu-0.15-0.25 wt% Sn-0.15-0.25 wt% In alloy, Cu-0.15-0. with those selected from the group consisting of 70 wt% in alloy, the ratio of the cross-sectional area of the core to the total cross-sectional area (a) of the electronic component a copper alloy wire (B) (B / a) is 0. It is 15-0.6.

  Further, tin or tin-lead alloy plating can be applied to the surface of the wire.

  The zinc concentration of the copper zinc alloy can be 20 to 40% by weight.

The core material, C u-0.02 to 0.2 wt% Zr alloy, Cu-0.15 to 0.25 wt% Sn-0.15 to 0.25 wt% In alloy, Cu-0.15 to it can be 0.70 wt% Sn alloy, Cu-0.15 to 0.70 wt% In alloy, and those selected from the group consisting of C u-0.2 to 20 wt% Ag alloy.

  The tensile strength of the wire can be 600 to 800 MPa, and the conductivity of the wire can be 30 to 65% IACS.

  The shape of the wire is a square wire and can be used for a connector.

  According to the copper alloy wire for electronic parts of the present invention, it is possible to provide a wire having characteristics that strength and conductivity greatly exceed those of conventional brass wires for electronic parts, particularly connectors. For this reason, it can greatly contribute to the performance improvement of future electronic components, and its practical effect is extremely large.

  Embodiments of a copper alloy wire for electronic parts according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view showing the structure of a copper alloy wire for electronic parts of this embodiment. The copper alloy wire 1 is provided with a coating layer 5 made of a copper-zinc alloy on the outer periphery of a core material 3 made of copper or a copper alloy, and is formed into a square wire having a cross-sectional shape of 0.635 mm × 0.635 mm as a whole. Yes. The reason why the core material 3 is made of copper and a copper alloy and the coating layer 5 made of a copper zinc alloy is formed on the outer periphery of the core material 3 is to balance the strength and conductivity of the wire. That is, the electrical conductivity is increased by the copper and the copper alloy of the core material 3, and the strength is increased by the outer copper-zinc alloy. Here, the ratio (B / A) of the cross-sectional area (B) of the core material 3 to the cross-sectional area (A) of the copper alloy wire 1 needs to be 0.15 to 0.6. In this range, if less than 0.15, the cross-sectional area of the copper or copper alloy constituting the core material 3 becomes too small, and an improvement in electrical conductivity as a wire for electronic parts cannot be expected, and if it exceeds 0.6 This is because the area of the covering layer 5 becomes too small to ensure sufficient strength.

  Moreover, it is preferable that the zinc concentration of the copper zinc alloy which comprises the coating layer 5 is 20 to 40 weight%. If the zinc concentration of the copper-zinc alloy is less than 20% by weight, the effect of improving the strength by the coating layer 5 is poor, and if it exceeds 40% by weight, the wire drawing performance deteriorates and the conductivity decreases. .

  The copper alloy wire 1 of the present embodiment can be formed by inserting a copper alloy wire having a diameter of 4.0 mm into a copper zinc alloy pipe having a thickness of 1.4 mm, and repeating the wire drawing and heat treatment. .

  In the copper alloy wire 1 of the present embodiment, since the cross-sectional area of the core material 3 and the coating layer 5 is formed at a predetermined ratio, the tensile strength of the wire is 600 to 600, as will be apparent from Examples described later. 800MPa, preferably 650-750MPa, and the conductivity of the wire can be 30-65% IACS, preferably 45-55% IACS, mainly as a copper alloy wire for connectors, with a good balance of strength and conductivity It is possible to provide a wire for electronic parts that is compatible.

  Further, tin or tin-lead alloy plating can be applied to the surface of the copper alloy wire 1. Thus, the soldering operation can be easily performed.

  A Cu-0.19Sn-0.2In alloy is used as the core material 3 of the copper alloy wire 1 shown in FIG. 1, a Cu-30Zn alloy is used as the coating layer 5, and a Cu-0.19Sn-0.2In alloy having a diameter of 4.0 mm is used. The wire was inserted into a Cu-30Zn alloy pipe having a thickness of 1.4 mm, and wire drawing and heat treatment were repeated to produce a 0.635 mm × 0.635 mm square wire. All the units of the alloy composition are% by weight.

  An alloy having the same composition as that of Example 1 is used as the core material 3 and the covering layer 5, and a Cu-0.19Sn-0.2In alloy wire having a diameter of 4.0 mm is inserted into a Cu-30Zn pipe having a thickness of 1.0 mm. By repeating the wire drawing and heat treatment, a square wire of 0.635 mm × 0.635 mm was produced.

  An alloy having the same composition as that of Example 1 is used as the core material 3 and the coating layer 5, and a Cu-0.19Sn-0.2In alloy wire having a diameter of 4.0 mm is inserted into a Cu-30Zn pipe having a thickness of 0.6 mm. Then, the wire drawing and heat treatment were repeated to produce a 0.635 mm × 0.635 mm square wire.

Comparative Example 1

  An alloy having the same composition as that of Example 1 is used as the core material 3 and the coating layer 5, and a Cu-0.19Sn-0.2In alloy wire having a diameter of 4.0 mm is inserted into a Cu-30Zn pipe having a thickness of 4.0 mm. By repeating the wire drawing and heat treatment, a square wire of 0.635 mm × 0.635 mm was produced.

Comparative Example 2

  An alloy having the same composition as that of Example 1 is used as the core material 3 and the covering layer 5, and a Cu-0.19Sn-0.2In alloy wire having a diameter of 4.0 mm is inserted into a Cu-30Zn pipe having a thickness of 0.5 mm. By repeating the wire drawing and heat treatment, a square wire of 0.635 mm × 0.635 mm was produced.

  Wire drawing and heat treatment were repeated for a Cu-30Zn alloy (brass) to produce a 0.635 mm × 0.635 mm square wire.

  Examples 1-3, Comparative Examples 1 and 2, Composition of copper alloy wire in conventional example, ratio (B / A) of core material cross-sectional area (B) to total cross-sectional area (A), tensile strength, conductivity The measurement results are also shown in Table 1.

表１より明らかなように、実施例１〜３の銅合金線材は、引張強さが従来例の黄銅線とほぼ同等以上であり、かつ導電率が６０〜１００％増加していることがわかる。一方、比較例１の銅合金線材は、全断面積に対する心材の断面積比が小さすぎるため、従来の黄銅線と比較して導電率の増加が認められない。また、比較例２の銅合金線材は全断面積に対する心材の断面積比が大きいため、導電率は増加するものの強度が黄銅線を大きく下回ってしまう。以上のことより、全断面積（Ａ）に対する心材の断面積（Ｂ）の比率（Ｂ/Ａ）を０．１５〜０．６の範囲とすることにより、電子部品用線材として、従来にはない強度と導電率の双方がバランス良く兼ね備わった材料を見出すことができた。

As is clear from Table 1, the copper alloy wires of Examples 1 to 3 have a tensile strength almost equal to or higher than that of the brass wire of the conventional example, and the conductivity is increased by 60 to 100%. . On the other hand, since the copper alloy wire of Comparative Example 1 has a cross-sectional area ratio of the core material with respect to the total cross-sectional area that is too small, an increase in conductivity is not recognized as compared with the conventional brass wire. Moreover, since the copper alloy wire of the comparative example 2 has a large cross-sectional area ratio of the core material with respect to the total cross-sectional area, although the conductivity is increased, the strength is greatly lower than that of the brass wire. From the above, by setting the ratio (B / A) of the cross-sectional area (B) of the core material to the total cross-sectional area (A) in the range of 0.15 to 0.6, We were able to find a material that has a good balance of both strength and conductivity.

It is a cross-sectional view which shows the structure of the copper alloy wire for electronic components of this embodiment.

Explanation of symbols

1 Copper alloy wire 3 Core material 5 Coating layer

Claims (5)

A copper alloy wire for electronic parts in which a coating layer made of a copper-zinc alloy is formed on the outer periphery of a core made of copper or a copper alloy,
The core material is Cu-0.02-0.2 wt% Zr alloy, Cu-0.15-0.25 wt% Sn-0.15-0.25 wt% In alloy, Cu-0.15-0 .70 with those selected from the group consisting of by weight% in alloy, the ratio of the cross-sectional area of the core to the total cross-sectional area (a) of the electronic component a copper alloy wire (B) (B / a) is 0 A copper alloy wire for electronic parts, characterized by being 15 to 0.6. 2. The copper alloy wire for electronic parts according to claim 1, wherein the surface of the wire is further plated with tin or tin-lead alloy. The copper alloy wire for electronic parts according to claim 1, wherein the zinc concentration in the coating layer is 20 to 40% by weight. The tensile strength of the said wire is 600-800 MPa, and the electrical conductivity of a wire is 30-65% IACS, The copper alloy wire for electronic components of any one of the Claims 1 thru | or 3 characterized by the above-mentioned. The shape of the said wire is a square wire, It uses for a connector, The copper alloy wire for electronic components of any one of the Claims 1 thru | or 4 characterized by the above-mentioned.

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