JP4349752B2 - ポリッシング方法 - Google Patents
ポリッシング方法 Download PDFInfo
- Publication number
- JP4349752B2 JP4349752B2 JP2001009536A JP2001009536A JP4349752B2 JP 4349752 B2 JP4349752 B2 JP 4349752B2 JP 2001009536 A JP2001009536 A JP 2001009536A JP 2001009536 A JP2001009536 A JP 2001009536A JP 4349752 B2 JP4349752 B2 JP 4349752B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- dresser
- polished
- dressing
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001009536A JP4349752B2 (ja) | 2000-10-24 | 2001-01-17 | ポリッシング方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-324290 | 2000-10-24 | ||
JP2000324290 | 2000-10-24 | ||
JP2001009536A JP4349752B2 (ja) | 2000-10-24 | 2001-01-17 | ポリッシング方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002200552A JP2002200552A (ja) | 2002-07-16 |
JP2002200552A5 JP2002200552A5 (hu) | 2006-06-15 |
JP4349752B2 true JP4349752B2 (ja) | 2009-10-21 |
Family
ID=26602669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001009536A Expired - Lifetime JP4349752B2 (ja) | 2000-10-24 | 2001-01-17 | ポリッシング方法 |
Country Status (1)
Country | Link |
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JP (1) | JP4349752B2 (hu) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20040040101A (ko) * | 2002-11-06 | 2004-05-12 | 동부전자 주식회사 | 드레서 구동용 스위프 모터를 갖는 화학기계연마장치 |
JP4658182B2 (ja) * | 2007-11-28 | 2011-03-23 | 株式会社荏原製作所 | 研磨パッドのプロファイル測定方法 |
JP5898420B2 (ja) * | 2011-06-08 | 2016-04-06 | 株式会社荏原製作所 | 研磨パッドのコンディショニング方法及び装置 |
JP5964262B2 (ja) * | 2013-02-25 | 2016-08-03 | 株式会社荏原製作所 | 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置 |
JP6613470B2 (ja) * | 2015-05-29 | 2019-12-04 | グローバルウェーハズ カンパニー リミテッド | 多結晶仕上げを有する半導体ウエハを処理する方法 |
JP7160725B2 (ja) * | 2019-03-06 | 2022-10-25 | 株式会社荏原製作所 | 基板処理装置 |
JP7181818B2 (ja) * | 2019-03-08 | 2022-12-01 | 株式会社荏原製作所 | 光触媒を用いた基板処理装置および基板処理方法 |
-
2001
- 2001-01-17 JP JP2001009536A patent/JP4349752B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2002200552A (ja) | 2002-07-16 |
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