JP4349752B2 - ポリッシング方法 - Google Patents

ポリッシング方法 Download PDF

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Publication number
JP4349752B2
JP4349752B2 JP2001009536A JP2001009536A JP4349752B2 JP 4349752 B2 JP4349752 B2 JP 4349752B2 JP 2001009536 A JP2001009536 A JP 2001009536A JP 2001009536 A JP2001009536 A JP 2001009536A JP 4349752 B2 JP4349752 B2 JP 4349752B2
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JP
Japan
Prior art keywords
polishing
dresser
polished
dressing
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001009536A
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English (en)
Japanese (ja)
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JP2002200552A (ja
JP2002200552A5 (hu
Inventor
聡 岡村
英夫 相澤
真 赤木
克彦 徳重
尚典 松尾
学 辻村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2001009536A priority Critical patent/JP4349752B2/ja
Publication of JP2002200552A publication Critical patent/JP2002200552A/ja
Publication of JP2002200552A5 publication Critical patent/JP2002200552A5/ja
Application granted granted Critical
Publication of JP4349752B2 publication Critical patent/JP4349752B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001009536A 2000-10-24 2001-01-17 ポリッシング方法 Expired - Lifetime JP4349752B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001009536A JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-324290 2000-10-24
JP2000324290 2000-10-24
JP2001009536A JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

Publications (3)

Publication Number Publication Date
JP2002200552A JP2002200552A (ja) 2002-07-16
JP2002200552A5 JP2002200552A5 (hu) 2006-06-15
JP4349752B2 true JP4349752B2 (ja) 2009-10-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001009536A Expired - Lifetime JP4349752B2 (ja) 2000-10-24 2001-01-17 ポリッシング方法

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JP (1) JP4349752B2 (hu)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040040101A (ko) * 2002-11-06 2004-05-12 동부전자 주식회사 드레서 구동용 스위프 모터를 갖는 화학기계연마장치
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
JP5898420B2 (ja) * 2011-06-08 2016-04-06 株式会社荏原製作所 研磨パッドのコンディショニング方法及び装置
JP5964262B2 (ja) * 2013-02-25 2016-08-03 株式会社荏原製作所 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
JP6613470B2 (ja) * 2015-05-29 2019-12-04 グローバルウェーハズ カンパニー リミテッド 多結晶仕上げを有する半導体ウエハを処理する方法
JP7160725B2 (ja) * 2019-03-06 2022-10-25 株式会社荏原製作所 基板処理装置
JP7181818B2 (ja) * 2019-03-08 2022-12-01 株式会社荏原製作所 光触媒を用いた基板処理装置および基板処理方法

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Publication number Publication date
JP2002200552A (ja) 2002-07-16

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