JP4349091B2 - Printed circuit board support apparatus and printed circuit board support method - Google Patents

Description

The present invention relates to a printed circuit board support apparatus and a printed circuit board support method, and can be suitably used particularly for preventing warpage of the printed circuit board.

  Conventionally, in the inspection of a printed circuit board, Patent Document 1 describes that a backup pin arrangement position on a printed circuit board is automatically determined using mounting data (CAM data) used for automatic component mounting.

Japanese Patent Application Laid-Open No. 2004-228688 describes that the position of an electronic component is calculated from CAD data of a printed circuit board, and the backup pin is automatically arranged by controlling so that the backup pin of the printed circuit board does not interfere with the electronic component.
Japanese Patent Laid-Open No. 7-176898 JP 2003-204198 A

If the printed circuit board is warped, electronic components cannot be mounted or inspected with high accuracy. Therefore, it is important to correct the warpage of the printed circuit board.

Furthermore, in recent years, the support area for warp correction due to the high density of printed circuit boards, the importance of warp correction due to thinning of printed circuit boards, and the increase in model switching time associated with high-mix low-volume production have been regarded as problems. Tend.

  However, since the backup pin is arranged based on the CAD data in the conventional configuration, it cannot be defined on the drawing such as variations in component size and solder area dimensions, and deviations in the mounting position of the electronic component and solder printing position. There was a problem that things could not be dealt with.

Therefore, fine adjustment of the position of the backup pin using an actual printed circuit board, it requires a lot of work time to confirm, further, the confirmation work may be the back of the printed circuit board,
It was a very difficult task and had the problem of reducing the operating rate of the production line.

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional problems, and to provide a printed circuit board inspection apparatus and a method for adjusting the supporting means, which can adjust the placement of the printed circuit board supporting means with high accuracy in a short time. And

In order to solve the above-mentioned conventional problems, the printed circuit board support apparatus according to the present invention is a printed circuit board support device that corrects the warpage of the printed circuit board by supporting the printed circuit board by a supporting means when inspecting the printed circuit board. In the apparatus, the image pickup means for picking up an image of solder and mounted electronic components on at least one surface of the printed circuit board, a memory for storing image pickup data picked up by the image pickup means, and the image pickup data stored in the memory A calculation unit for extracting a mounting position of the solder and the electronic component and determining a position where the printed circuit board is supported by the support unit excluding the mounting position of the solder and the electronic component on the imaged surface; And a display unit for displaying a supporting position.

Further, the printed circuit board support method of the present invention is a printed circuit board support method for correcting warping of the printed circuit board by supporting the printed circuit board by a supporting means when inspecting the printed circuit board. The solder on one surface and the mounted electronic component are imaged, the captured image data is stored, the mounting position of the solder and the electronic component is extracted based on the stored imaging data, and based on the extracted position Non-solder and non-mounting part of electronic component are calculated, and based on the calculated calculation result, a position for supporting the printed board excluding the mounting position of the solder and electronic component on the imaged surface is determined, The position to support is displayed.

According to the printed circuit board support apparatus and the printed circuit board support method of the present invention, the optimal arrangement adjustment of the support means for correcting the warpage of the printed circuit board can be efficiently performed in a short time.

Embodiments of a printed circuit board support apparatus according to the present invention will be described below in detail with reference to the drawings.

The present invention relates to a printed circuit board support apparatus and a printed circuit board support method having a printed circuit board inspection function, but also includes a configuration in which a printed circuit board support function is added to a printed circuit board inspection apparatus or a printed circuit board support function is added to a printed circuit board manufacturing apparatus. Obviously, this can be realized as a printed circuit board support apparatus having a printed circuit board inspection function.

1 is a schematic configuration diagram of the entire printed circuit board support device according to the first embodiment of the present invention, FIG. 2 is a state diagram of the printed circuit board, FIG. 3 is a component layout diagram on the back surface of the printed circuit board, and FIG. FIG. 5 is an area diagram in which the support means can be used, FIG. 6 is an arrangement diagram of the back side of the printed circuit board where the positions of the backup pins of the support means are arranged, and FIG. 7 is a configuration diagram using a sheet map of the support means. .

The printed circuit board support apparatus and the printed circuit board support method according to the first embodiment will be described with reference to FIGS.

In FIG. 1, the printed circuit board 10 is supplied from the X direction by the conveying means 6, stops at a predetermined position below the inspection head 2, and is immediately positioned. However, when the position of the printed circuit board 10 is adjusted only by the conveying means 6, warping Δa of the printed circuit board occurs as shown in the figure.

As a countermeasure, the fixed plate 3 rises in the Z direction at almost the same timing as the position regulation, and the printed circuit board 10 is horizontally corrected by supporting the printed circuit board 10 with the correction pins 4 (backup pins) as support means. Is done. Thereafter, the electronic component 11 on the printed circuit board 10 is imaged by the inspection head 2 with respect to the component dimensions, the mounting position of the electronic component, the amount of solder, and the like, stored in the storage unit 12, and the captured image data stored in the storage unit 12. Using the calculation unit 13
The calculation result is displayed on the display unit 14.

About the printed circuit board support apparatus 1 comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

First, in FIG. 2, the front surface side 10a of the printed circuit board 10 is turned over, the back surface 10b is set up on the printed circuit board support device 1, and the back surface 10b is imaged. 11a indicates an electronic component mounted on the front surface, and 11b indicates an electronic component mounted on the back surface. To captured image by the binarization processing or the like in which the height of the rear surface 10b to the threshold, the image processing for extracting only a high portion on the back surface 10b, parts and semi-field that attached to the back surface 10b Etc. are extracted. The state of the electronic component 11 on the printed circuit board back surface 10b at that time is shown in FIG.

In FIG. 3, the actual printed circuit board 10 has a component dimension variation 11c that cannot be defined only by CAD data, a component mounting position shift 11d caused by the mounting accuracy of the electronic component mounting machine, and a solder area variation and shift 11e. Exists. They also vary depending on the setting conditions on the production line, and there are also differences due to production lots.

Therefore, in order to deal with the deviation of the mounting position of the electronic component and the variation and deviation of the solder area, the imaging data is subjected to statistical processing of the data obtained by imaging a plurality of times, so that the correction pin 4 can be optimized with high accuracy. The position can be extracted. For example, the calculation unit 13 takes the standard deviation σ of a plurality of coordinate data and calculates 3σ coordinate data based on the standard deviation σ of the plurality of coordinate data, and shifts the mounting position from the measured value. It is possible to extract a more accurate coordinate position that copes with and variations.

Next, in FIGS. 4 and 5, a mask is applied to the back surface 10 b of the printed circuit board in an area 15 where the correction pins 4 cannot be used. With a margin 17 (for example, about 2 mm) in consideration of the
As shown in FIG. 5, an area 16 where the correction pin 4 can be used is determined. And in the area | region 16, the position 4a arrange | positioned the correction pin 4 equally with respect to the back surface 10b as shown in FIG.
Decide. As an example, the position of the correction pin 4 is determined at a target position with respect to the X axis and the Y axis.
The determined pin position 4a is output at the same scale as the size of the printed circuit board 10 as shown in FIG. 7, and is output as a map 18 on the sheet, and is overlapped on the plate 3 for fixing the pin position so that the origin positions are the same. The adjustment can be facilitated by attaching the correction pin 4 after the matching. At that time, it is a precondition that the origin of the printed circuit board on the imaging data and the origin of the fixed plate 3 are the same. This is because a map representing the layout of the back pins 4 having the same size as the printed board 10 is output to the sheet 18. For this sheet 18, for example, a thin acrylic resin sheet can be used.

In this embodiment, the shape of the support means is represented by a pin shape. However, by using a block that supports the entire area where the support means for warp correction can be used, a more reliable warping of the printed circuit board is possible. Correction is possible, and determination of the optimum pin position 4a is not necessary. Generally, this block shape has a concave portion in the mask 15 in a region where there is a possibility that components and solder existing on the back surface of the printed circuit board are present, so that there is no interference with the components and solder. It is formed.

  In addition, when extracting components mounted on a printed circuit board by image processing, the recognition accuracy deteriorates due to the color and gloss of the target component, or the component shape that is hidden due to excessive solder or a deformed component When there is a component that is difficult to extract, such as when it takes a long time for recognition, a single component such as a rectangular parallelepiped capacitor is generally easy to recognize. Recognize by the image, associate the coordinates in the CAD data with the coordinates of the recognized part, and use the relative position on the CAD data for the coordinate data of the part that could not be extracted. And the region can be extracted.

FIG. 8 is a schematic side view of the printed circuit board support device according to the second embodiment of the present invention, FIG. 9 is a component arrangement diagram on the back surface of the printed circuit board with slits, and FIG. FIG. 11 is a B sectional view of a printed circuit board with slits, FIG. 12 is a B sectional view when the supporting means is used for the printed circuit board with slits, and FIG. is there.

With reference to FIGS. 8 to 13, a printed circuit board inspection apparatus according to the second embodiment and a method for adjusting the support means will be described.
The present embodiment has the same basic configuration as that of the first embodiment, and the electronic component 1 is formed on both surfaces of the printed circuit board 10.
1a, 11b, 11c, 11d, 11e, etc. are mounted.

  The operation and action will be described below.

First, the printed circuit board back surface 10b is imaged as in the first embodiment. In addition, in this embodiment, as shown in FIG. 8, the inspection head 2 images the step Δb, which is the relative height data of the entire surface of the printed circuit board 10c with slits. The step difference Δb is different from extracting an electronic component from the difference in height from the printed circuit board surface as in the first embodiment, and the ground plane on the printed circuit board is set as three points and the virtual plane is set as a reference plane having a height of 0. The difference from the surface is obtained.
The state of the printed circuit board at that time is shown in FIG. Both ends of the printed circuit board 10 are supported by the conveying means 6. Generally, as described in the cross section A of FIG. 10, in the printed circuit board having the slit 19, the inner printed circuit board 10d partitioned by the slit 19 is mounted as compared with the printed circuit board 10e outside the slit. Also, warping downward due to the weight of the solder, warping Δb from the uppermost point on the lower surface of the printed circuit board is significantly large. Next, FIG.
In the B cross section, the electronic component 11a (r <p) is mounted closer to the slit 19 than in the A cross section, a step Δc is generated between the slits, and the distance between the slits is q> Due to the relationship of o, a step Δd larger than Δb occurs.

In the above state, the case shown in FIG. 12 occurs when the correction pin 4 which is a support means for warp correction is used. The printed circuit board is horizontally corrected by the correction pin 4 as in the portion C. When the electronic component 11a is closer to the slit 19 than the correction pin 4 as in the portion D, a step is formed in the vicinity of the slit 19 due to its weight. Δe is generated.

With respect to this problem, in this embodiment, the step Δe can be imaged by the inspection head 2. Then, as shown in FIG. 13, the region 20 where the step is generated is extracted, and the arrangement position 4b of the correction pin 4 that is most effective for eliminating the step Δe of the printed circuit board is determined.

That is, the correction pin 4b is further disposed in the peripheral portion where the step Δe is generated to eliminate the step Δe and correct the warp of the entire printed circuit board.

As described above, in the second embodiment, the same operation as that of the first embodiment is performed, and further, a step of the printed circuit board is imaged, and the local height is determined from the height data on the entire surface of the printed circuit board. It is possible to extract the difference and determine the most effective correction pin arrangement position to eliminate the step.

In this way, by imaging the step after supporting the printed circuit board 10c with the slit with the correction pin 4, and extracting the local height difference from the height data of the entire surface of the printed circuit board,
By correcting the arrangement of the correction pins, the correction pins can be arranged effectively.

FIG. 14 is a schematic configuration diagram of a support unit mechanism unit included in the printed circuit board support device according to the third embodiment of the present invention.

With reference to FIG. 14, a printed circuit board support device of Example 3 and a method for adjusting the support means will be described. This embodiment has the same basic configuration as that of the first embodiment. The operation and action will be described below.

First, as in the first or second embodiment, the printed circuit board is imaged by the inspection head 2, and the arrangement position of the corrective pin 4 that is most effective for eliminating the warpage is extracted and adjusted. In this embodiment, both the substrate with a slit and the substrate without a slit correspond, but in this figure, the substrate without a slit will be described as a representative. As shown in FIG. 14, the position of the optimum arrangement position 4b of the extracted correction pins 4 is obtained by having the scale 25 that is the same as the origin position of the imaging data on the fixed plate 3 on which the correction pins 4 are installed. The correction pin 4 can be adjusted more efficiently and in a short time according to the data. That is, the step Δb can be corrected efficiently.

In addition, in order to simplify the adjustment and improve the mounting accuracy, a transparent template 26 having the same outer shape printed with the imaging data of the electronic component 11 and the optimum arrangement position data 4a of the correction pin 4 is used as an alternative to the printed circuit board 10. In use, the correction pin 4 may be moved and adjusted. Then, the template is printed so that the arrangement of the imaged mounting parts and the origin position of the imaging data are the same as the template origin position, and since the transparent material is used, the correction pins 4 and the parts are arranged from the upper surface of the template. In addition, it is possible to confirm the interference with the solder, and the work efficiency can be improved.

FIG. 15 is a schematic configuration diagram of a support means mechanism unit included in the printed circuit board support device according to the fourth embodiment of the present invention.

The printed circuit board supporting device and the printed circuit board supporting means adjusting method according to the fourth embodiment will be described with reference to FIG. 15. This embodiment has the same basic configuration as that of the first embodiment.

  The operation and action will be described below.

First, as in the first or second embodiment, the printed circuit board is imaged by the inspection head 2, and the arrangement position of the correction pin 4 that is most effective for eliminating the warpage is extracted and adjusted. In this embodiment, both the substrate with a slit and the substrate without a slit correspond, but in this figure, the substrate without a slit will be described as a representative. As shown in FIG. 15, the regulation pin 31 on the fixed plate 3.
The sub-fixing plate 30 is positioned and the correction pin 4 is fixed thereon. Here, the origin position of the sub-fixed plate 30 holds a predetermined relative position with the origin of the fixed plate 3.

The printed circuit board support device 1 configured as described above is configured so that the correction pin 4 is attached to the sub-fixing plate 30.
By detaching from the main body while it is fixed on the top, the replacement work can be easily performed, and the model of the manufactured product can be switched more efficiently and in a short time. The sub-fixing plate 30 is represented by a size of four divisions as a representative, but when actually used, according to the size of the printed circuit board to be produced, if there are many small substrates, the size (for example, The working efficiency can be improved by making the size suitable for about 4 divisions) and dealing with one large substrate when there are many large substrates. At this time, in order to simplify the adjustment and improve the mounting accuracy, a scale 25 that is the same as the origin position of the imaging data may be provided on the sub fixed plate 30.

In addition, in order to simplify the adjustment and improve the mounting accuracy, a transparent template having the same outer shape printed with the imaging data of the electronic component 11 and the optimum arrangement position data 4a of the correction pin 4 is used as an alternative to the printed circuit board 10. Then, the correction pin 4 may be moved and adjusted. The template is printed so that the arrangement of the picked-up mounting parts and the origin position of the image data and the template origin position are the same, and since a transparent material is used, the support means 4 and the parts and solder are provided from the upper surface of the template. Interference can be confirmed, and work efficiency can be improved.

FIG. 16 is a schematic configuration diagram of a support means adjustment jig included in the printed circuit board support device according to the fifth embodiment of the present invention.

The adjustment method of the support means of the printed circuit board support apparatus of Example 5 is demonstrated using FIG. This embodiment has the same basic configuration as that of the first embodiment.

  The operation and action will be described below.

First, as in the first or second embodiment, the printed circuit board is imaged by the inspection head 2, and the arrangement position of the correction pin 4 that is most effective for eliminating the warpage is extracted and adjusted. In this embodiment, both the substrate with a slit and the substrate without a slit correspond, but in this figure, the substrate without a slit will be described as a representative. As in Example 4, as shown in FIG.
The sub-fixing plate 30 positioned by the restriction pin 31 is provided on the upper side, and the correction pin 4 is further fixed thereon. Here, the origin position of the sub-fixed plate 30 holds a predetermined relative position with the origin of the fixed plate 3. Then, the correction pin 4 can be detached from the main body while being fixed on the sub-fixing plate 30.

In addition, in this embodiment, as shown in FIG. 16, a support means adjusting jig 40 is provided separately from the printed board inspection apparatus 1. In the jig configuration, the sub fixing plate 30 is positioned by the setting pins 42 on the base plate 41. Further, a support stand 43 is fixed on the base plate 41, and the printed circuit board 10 is positioned by the setting pins 42 thereon.
At this time, the relative relationship between the origin position of the printed circuit board 10 and the origin position of the sub-fixing plate 30 is
The assembly is adjusted so as to be the same as the relative relationship in the inspection apparatus 1 shown in FIG. In this state, the correction pin 4 is not interfered with the electronic component 11 mounted on the back surface of the printed circuit board 10.
Is fixed on the sub-fixing plate 30. After completing the above adjustment, the fixing plate 3 of the main body 1
The straightening pin 4 is removed from the main body while being fixed on the sub-fixing plate 30.
Attach the sub-plate 30 fixed at the optimum position.

  The position of the correction pin 4 is adjusted without lowering the operation of the machine 1 by the printed circuit board inspection apparatus 1 and the support means adjustment jig 40 configured as described above, and remains fixed on the sub fixing plate 30. By attaching and detaching to the main body in a state, it is easily exchanged, and the model of the manufactured product can be switched more efficiently and in a short time.

In addition, in order to simplify the adjustment and improve the mounting accuracy, a transparent template having the same outer shape printed with the imaging data of the electronic component 11 and the optimum arrangement position data 4a of the correction pin 4 is used as an alternative to the printed circuit board 10. Then, the correction pin 4 may be moved and adjusted. The template is printed so that the arrangement of the picked-up mounting parts and the origin position of the image data and the template origin position are the same, and since a transparent material is used, the support means 4 and the parts and solder are provided from the upper surface of the template. Interference can be confirmed, and work efficiency can be improved.

A printed circuit board support apparatus and a printed circuit board support method according to the present invention include a printed circuit board inspection apparatus, a manufacturing apparatus, a semiconductor component, and a video panel that are required to perform optimal arrangement adjustment of an object support means in a short time and efficiently. It can also be used for other inspection equipment.

The schematic block diagram of the whole printed circuit board support apparatus in Example 1 of this invention. The state figure of the printed circuit board in Example 1 of this invention Component layout of the back side of the printed circuit board in Example 1 of the present invention In the first embodiment of the present invention, a region diagram in which the support means cannot be used Area diagram in which support means can be used in Embodiment 1 of the present invention In Example 1 of this invention, the position of the backup pin of the support means is arranged and the layout of the back side of the printed circuit board In the first embodiment of the present invention, a configuration diagram using a sheet map of support means The schematic side view for showing the level | step difference of the printed circuit board in the printed circuit board support apparatus in Example 2 of this invention Component arrangement diagram of back side of printed circuit board with slit in Example 2 of the present invention A sectional view of a printed circuit board with slits in Example 2 of the present invention. B sectional drawing of the printed circuit board with a slit in Example 2 of this invention B sectional drawing at the time of using a support means in the printed circuit board with a slit in Example 2 of this invention Arrangement drawing of back side of printed circuit board with slit in Example 2 of the present invention with supporting means arranged The schematic block diagram of the support means mechanism part which the printed circuit board support apparatus has in Example 3 of this invention. The schematic block diagram of the support means mechanism part which the printed circuit board support apparatus has in Example 4 of this invention. The schematic block diagram of the support means adjustment jig which the printed circuit board support apparatus has in Example 5 of this invention. Side view showing backup pin automatic placement of conventional printed circuit board support device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus of printed circuit board 2 Inspection head 3 Fixed plate 4 Support means (correction pin)
4a Arrangement Position of Supporting Unit Arranged in Example 1 4b Arrangement Position of Supporting Unit Arranged in Example 2 5 Horizontal Driving Unit 6 Conveying Unit 7 Vertical Driving Unit 10 Printed Circuit Board 10a Surface of Printed Circuit Board 10b Back Surface of Printed Circuit Board 10c Printed circuit board with slit 10d Inner printed circuit board partitioned by slit 10e Outer printed circuit board partitioned by slit 11 Electronic component 11a Electronic component mounted on the surface of the printed circuit board 11b Mounted on the back surface of the printed circuit board Electronic component 11c Electronic component with different dimensions 11d Electronic component with misalignment 11e Electronic component with solder area variation or misalignment 12 Storage means 13 Calculation means 14 Display means 15 Area where support means cannot be used 16 Area where support means can be used 17 Margin 18 Sheet map 19 Slit (Drilling groove)
20 Stepped Area 25 Scale 26 Template 30 Sub Fixing Plate 31 Adjusting Pin 40 Adjusting Jig 41 Base Plate 42 Correcting Pin 43 Printed Circuit Board Support Stand Δa Printed Circuit Board Warp Δb Warped of A Section of Printed Circuit Board with Slit Δc Slit Steps between slits at the B section of the printed circuit board with a Δd Warp at the B section of the printed circuit board with a slit Δe Steps between the slits at the B section of the printed circuit board with a slit after using the support means o A section Distance between slits in p p Distance between slit in section A and closest mounting part q Distance between slits in section B r Distance between slit in section B and closest mounting part

Claims (12)

In inspecting the printed circuit board, by supporting the printed circuit board by support means, in the printed circuit board support device for correcting the warp of the printed circuit board,
Imaging means for imaging solder and mounted electronic components on at least one surface of the printed circuit board, a memory for storing imaging data imaged by the imaging means, and the solder and electronics based on the imaging data stored in the memory A calculation unit for extracting a mounting position of the component and determining a position where the printed circuit board is supported by the supporting unit excluding the mounting position of the solder and the electronic component on the imaged surface; and a position supported by the printed circuit board And a display unit for displaying the printed circuit board. The extraction of the mounting positions of solder and electronic components on the printed circuit board in the arithmetic unit is determined by calculating imaging data obtained by imaging the printed circuit board by calculating the height from a predetermined reference plane in the arithmetic unit. The printed circuit board support device according to claim 1, wherein the printed circuit board support device is performed. 3. The printed circuit board support apparatus according to claim 2, wherein the image data obtained by performing the imaging of the imaging unit a plurality of times is statistically processed to determine a position to be supported by the support unit. A step formed between the substrate surfaces located on both sides of the slit of the printed board having the slit supported by the support means is detected from imaging data obtained by imaging the printed board having the slit, and a peripheral portion of the step The printed circuit board support apparatus according to claim 2, wherein a position of the support means to support the printed circuit board is determined. The said support means has a fixed plate which installs the correction pin which should support the said printed circuit board, and has a scale of the plane coordinate corresponding to the said printed circuit board on the said fixed plate. Printed circuit board support device. 6. The printed circuit board support device according to claim 5, wherein the coordinate origin of the scale is the same as the coordinate origin of the imaged data of the printed circuit board. The printed circuit board support device according to claim 5, wherein the fixing plate on which the correction pin is installed is detachable. In inspecting the printed circuit board, by supporting the printed circuit board by a support means, in the printed circuit board support method of correcting the warp of the printed circuit board,
The solder and electronic components mounted on at least one surface of the printed circuit board are imaged, the captured image data is stored, the mounting positions of the solder and electronic components are extracted based on the stored imaging data, and the extracted data is extracted. A position for supporting the printed circuit board excluding the mounting position of the solder and electronic component on the imaged surface based on the calculated calculation result based on the calculated calculation result A printed circuit board support method, wherein: The extraction of the mounting positions of solder and electronic components on the printed circuit board in the arithmetic unit is determined by calculating imaging data obtained by imaging the printed circuit board by calculating the height from a predetermined reference plane in the arithmetic unit. The printed circuit board support method according to claim 8, wherein the printed circuit board support method is performed. The said support means has a fixed plate in which the correction pin which should support the said printed circuit board is installed, and has a scale of the plane coordinate corresponding to the said printed circuit board on the said fixed plate. Printed circuit board support method. The printed circuit board support method according to claim 8, wherein the support means is detachable. The mounting position of the solder and the electronic component on the printed circuit board is extracted by statistically processing image data obtained by imaging the printed circuit board a plurality of times to determine a position to be supported by the support means. The printed circuit board support method according to claim 8.

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