JP4337456B2 - Capacitor built-in wiring circuit board and manufacturing method thereof - Google Patents

Description

  The present invention relates to a capacitor built-in wiring circuit board in which a capacitor is incorporated in a wiring circuit board and a method of manufacturing the capacitor built-in wiring circuit board.

  Electronic devices are becoming smaller, higher density, and higher performance. And the demand for miniaturization, high density, and high speed is increasing for the wiring circuit board incorporated in the electronic device, and a wiring circuit board that satisfies these requirements is demanded.

  Conventionally, in a printed circuit board, components such as a semiconductor chip, a resistor element, a capacitor, and an inductor are surface-mounted, and the components to be mounted are reduced in size so as to cope with downsizing and higher density of the printed circuit board. .

  However, there is a limit to surface mounting alone, and further improvements in component mounting density are required, and development of wiring circuit boards with built-in components that incorporate components such as resistance elements, capacitors, and inductors is underway.

  As a technique for forming a capacitor inside a printed circuit board, Patent Document 1 reports a technique in which a dielectric layer is provided inside a printed circuit board and electrodes are formed on both surfaces of the dielectric layer.

  A method of forming a capacitor inside a printed circuit board different from this method will be described. As shown in FIG. 8A, the first electrode 2 is formed on the insulating substrate 1 together with the other wiring pattern 3, and as shown in FIG. A dielectric layer 4 is formed on the upper surface of the wiring pattern 3 by film lamination or screen printing. Then, the second electrode 5 is formed at a position facing the first electrode 2 on the upper surface of the dielectric layer 4. Therefore, the first electrode 2, a part of the dielectric layer 4, and the second electrode 5 constitute a capacitor.

  However, in the method of forming the capacitor shown in FIGS. 8A and 8B, in the process of forming the dielectric layer 4 on the upper surface of the first electrode 2 by film lamination or screen printing, the first electrode 2 Due to the presence of other wiring patterns 3 located in the periphery, the flow of the resin forming the dielectric layer 4 becomes non-uniform, and the thickness of the dielectric layer 4 on the first electrode 2 varies. In particular, the thickness variation increases at the peripheral edge of the first electrode 2. As described above, there is a problem that it is difficult to obtain the designed capacitance of the capacitor because the capacitance of the capacitor is greatly changed by the variation of the thickness of the dielectric layer 4 existing between the electrodes.

Patent Document 2 proposes a method for suppressing the thickness variation of the dielectric layer 4 existing between the electrodes. In this method, as shown in FIG. 9A, the first electrode 2 layer, the dielectric layer 4 and the second electrode 5 are all laminated on the insulating substrate 1. Thereafter, as shown in FIG. 9B, portions other than those constituting the capacitors 6 in the layer of the first electrode 2, the dielectric layer 4, and the second electrode 5 are removed by etching. By adopting such a method, the thickness of the dielectric layer 4 in each capacitor 6 can be made uniform.
JP-A-5-7063 Special Table 2002-534791

  However, in the manufacturing method shown in FIGS. 9A and 9B, after all the layers of the first electrode 2, the dielectric layer 4, and the second electrode 5 are laminated on the insulating substrate 1, unnecessary portions are formed. Since it is removed by etching, there arises a problem that the manufacturing process becomes complicated.

  8A and 8B, when a general wiring pattern 3 other than the first electrode 2 is formed on the insulating substrate 1 to improve the integration degree of the printed circuit board. After the layers of the first electrode 2, the dielectric layer 4 and the second electrode 5 are all laminated on the insulating substrate 1, the region where the general wiring pattern 3 in the layer of the first electrode 2 is to be formed is etched. Expose. Then, it is necessary to form a general wiring pattern 3 on the exposed layer of the first electrode 2. Therefore, there arises a problem that the manufacturing process is further complicated.

  The present invention has been made in view of such circumstances, and it is possible to make the thickness of the insulating layer between the electrodes uniform without complicating the manufacturing process, and to incorporate a capacitor having a designed capacity. Another object of the present invention is to provide a capacitor built-in wiring circuit board that can be integrated and that can improve the degree of integration of the contained wiring, and a method for manufacturing the capacitor built-in wiring circuit board.

  In order to solve the above problems, in the capacitor built-in wiring circuit board according to the present invention, the insulator, the first electrode provided on the surface of the insulator, and the periphery of the first electrode on the surface of the insulator are provided. And an independent pattern that is not electrically connected to the first electrode, a dielectric layer that commonly covers a surface of the dielectric layer that does not face the insulator of the first electrode and the independent pattern, and a surface that does not face the first electrode and the independent pattern of the dielectric layer. And a second electrode constituting a capacitor with the first electrode and a part of the dielectric layer.

  In the wiring circuit board with a built-in capacitor configured as described above, an independent pattern that does not conduct to the first electrode is provided around the first electrode, and the upper surface of the first electrode and the independent pattern is shared by the dielectric layer. I try to cover it. Therefore, the positional relationship between the first electrode and the independent pattern disposed around the first electrode is fixed regardless of the position of another wiring pattern formed in the vicinity of the first electrode. Therefore, a region (part) between the first electrode and the second electrode in the dielectric layer is always formed uniformly. As a result, the capacitance of the capacitor composed of the first electrode, part of the dielectric layer, and the second electrode can be controlled uniformly and accurately as designed.

  In another wiring circuit board with a built-in capacitor according to another invention, an insulator, a wiring pattern provided on the surface of the insulator, a first electrode provided on the surface of the insulator, and a surface of the insulator An independent pattern provided around the first electrode and not conducting to the first electrode; a dielectric layer covering at least a surface of the first electrode and the independent pattern not facing the insulator; and a first electrode of the dielectric layer And a second electrode which is provided on a surface which does not face the independent pattern and forms a capacitor with the first electrode and a part of the dielectric layer.

  In the capacitor built-in wiring circuit board configured as described above, a wiring pattern is provided on the surface of the insulator, in addition to the first electrode and the independent pattern constituting the capacitor. Therefore, the degree of integration of the capacitor built-in wiring circuit board can be improved.

In another invention, in the capacitor built-in wiring circuit board according to the above invention, the wiring pattern, the first electrode, and each independent pattern are made of the same material and have the same thickness.
In this way, by forming the wiring pattern, the first electrode, and each independent pattern with the same material and the same thickness, it is possible to more efficiently implement the capacitor built-in type wiring circuit board.

  In the method of manufacturing a capacitor-embedded wiring circuit board according to another invention, the first electrode and an independent pattern that is not connected to the first electrode and around the first electrode are formed on the surface of the insulator. A step of forming a dielectric layer covering the surface in common with the first electrode and a surface not facing the insulator of the independent pattern; and a surface of the dielectric layer not facing the first electrode and the independent pattern; Forming a second electrode constituting a capacitor with the first electrode and a part of the dielectric layer.

  In the method of manufacturing a capacitor built-in wiring circuit board configured as described above, the first electrode and an independent pattern that is not electrically connected to the first electrode are formed around the first electrode. A dielectric layer covering the upper surface in common is formed. Therefore, it is possible to achieve substantially the same operation and effect as the capacitor built-in wiring circuit board of the invention described above.

  In the method for manufacturing a capacitor-embedded wired circuit board according to another invention, a wiring pattern, a first electrode, and an independent pattern around the first electrode and not conducting to the first electrode are formed on the surface of the insulator. Are formed of the same material and with the same thickness, a step of forming a dielectric layer that covers the surface of the first electrode and the independent pattern on the surface that is not opposed to the insulator, and a first layer of the dielectric layer. Forming a second electrode constituting a capacitor with the first electrode and a part of the dielectric layer on a surface not facing the one electrode and the independent pattern.

  In the method of manufacturing a capacitor built-in wiring circuit board configured as described above, the first electrode, the independent pattern, and the wiring pattern that constitute the capacitor are formed on the surface of the insulator with the same material and with the same thickness. Therefore, the integration degree of the capacitor built-in type wiring circuit board can be improved and the manufacturing can be carried out more efficiently.

  Furthermore, in another method of manufacturing a capacitor-embedded wired circuit board according to another invention, a first electrode and an independent pattern that is not connected to the first electrode and around the first electrode are formed on the surface of the insulator. Manufacturing a first circuit board, manufacturing a second circuit board having a second electrode formed at a position corresponding to the first electrode of the first circuit board on the surface of the insulator, and The first circuit board and the second circuit board are joined to each other so that the first electrode and the second electrode face each other and between the circuit boards via a dielectric layer. Forming a capacitor with a part of the body layer and the second electrode.

  Even in the capacitor built-in wiring circuit board manufactured by bonding the first circuit board and the second circuit board in this way, an independent pattern that does not conduct to the first electrode exists around the first electrode. Accordingly, it is possible to achieve substantially the same operational effects as the capacitor built-in wiring circuit board described above.

  Thus, in the capacitor built-in wiring circuit board and the method for manufacturing a capacitor built-in wiring circuit board according to the present invention, an independent pattern that does not conduct to the first electrode is provided around the first electrode. The upper surface of the independent pattern is commonly covered with a dielectric layer.

  Therefore, the thickness of the insulator layer existing between the electrodes can be made uniform without complicating the manufacturing process, the capacitor having the capacity as designed can be incorporated, and the integration degree of the included wiring can be improved. .

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a sectional view of a capacitor built-in wiring circuit board according to a first embodiment of the present invention. First wiring patterns 11 a and 11 b are formed on the upper and lower surfaces of the insulating substrate 10. Insulating layers 12a and 12b as insulators are formed outside the first wiring patterns 11a and 11b. A plurality of second wiring patterns 15b are formed on the lower surface of the lower insulating layer 12b. A via 16 is formed between the second wiring pattern 15b and the first wiring pattern 11b to conduct between the wiring patterns 15b and 11b.

  A plurality of second wiring patterns 15a, first electrodes 13, and independent patterns 14 are formed on the upper surface of the upper insulating layer 12a. The plurality of second wiring patterns 15a, first electrodes 13, and independent patterns 14 are formed of the same conductive material and the same thickness. A via 16 is formed between the second wiring pattern 15a and the first wiring pattern 11a to connect the wiring patterns 15a and 11a.

  A dielectric layer 17 is formed on each upper surface of the plurality of second wiring patterns 15a, the first electrodes 13, and the independent patterns 14 so as to cover them in common. A second electrode 18 is formed at a position facing the first electrode 13 on the upper surface of the dielectric layer 17. Therefore, the first electrode 13, a part of the dielectric layer 17, and the second electrode 18 constitute a capacitor built in the capacitor built-in wiring circuit board.

  2 (a) and 2 (b) show the capacitor built-in wiring circuit board of FIG. 1 cut horizontally at the position where the second wiring pattern 15a, the first electrode 13 and the independent pattern 14 are formed. It is a perspective view. As shown in the respective perspective views, on the upper surface of the insulating layer 12a, a plurality of second wiring patterns 15a, one first electrode 13 having a substantially square shape, and the periphery of the first electrode 13 are provided. Arranged independent patterns 14 are formed. The independent pattern 14 is not electrically connected to the first electrode 13 and the second wiring pattern 15a.

  2A shows an example in which a plurality of independent patterns 14 are arranged around the first electrode 13, and FIG. 2B shows an example in which one independent pattern 14 is arranged around the first electrode 13. Indicates. In order to facilitate the movement of the dielectric material and to form the dielectric layer 17 having a more uniform thickness, a plurality of independent patterns 14 are formed around the first electrode 13 as shown in FIG. It is desirable to arrange and provide a gap between the independent patterns 14.

  In the capacitor built-in wiring circuit board according to the first embodiment configured as described above, as shown in FIGS. 2A and 2B, a plurality of second wiring patterns are formed on the upper surface of the upper insulating layer 12a. 15 a, one first electrode 13, and an independent pattern 14 that is not electrically connected to the first electrode 13, and the upper surfaces of the second wiring pattern 15 a, the first electrode 13, and the independent pattern 14 are commonly covered with a dielectric layer 17. I am doing so.

  Therefore, the positional relationship between the first electrode 13 and the independent pattern 14 disposed around the first electrode 13 is the position of each of the other second wiring patterns 15 a formed in the vicinity of the first electrode 13. Regardless of whether it is fixed or not.

  Therefore, a region (part) sandwiched between the first electrode 13 and the second electrode 18 in the dielectric layer 17 is formed uniformly. Furthermore, the independent pattern 14 is not electrically connected to the first electrode 13 and the second wiring pattern 15a. As a result, the capacitance of the capacitor formed by the first electrode 13, a part of the dielectric layer 17, and the second electrode 18 can be controlled uniformly and accurately as designed.

  A plurality of types of capacitors according to the first embodiment in which the independent pattern 14 is formed around the first electrode 13 shown in FIG. 1 and various second wiring patterns 15 a are formed around the first electrode 13. The fluctuation (variation) of the capacitor capacity between the built-in wiring circuit boards is about 5% as compared with the fluctuation (variation) of the capacitor capacity between the built-in wiring circuit boards where the independent pattern 14 is not formed at all. It was confirmed experimentally that the degree can be suppressed.

  Further, the plurality of second wiring patterns 15a, the first electrodes 13, and the independent patterns 14 are formed of the same conductive material and the same thickness on the upper surface of the same insulating layer 12a. Therefore, the degree of integration of the capacitor built-in wiring circuit board can be improved. Furthermore, the capacitor built-in wiring circuit board can be manufactured more efficiently.

(Second Embodiment)
FIG. 3 is a cross-sectional view of a capacitor built-in wiring circuit board according to a second embodiment of the present invention. The same parts as those in the capacitor built-in wiring circuit board according to the first embodiment shown in FIG.

  In the capacitor built-in wiring circuit board according to the second embodiment, the dielectric layer 17 is not formed on the upper surface of the second wiring pattern 15a, but is formed only on the upper surfaces of the first electrode 13 and the independent pattern 14. It is.

  Also in the capacitor built-in wiring circuit board of the second embodiment configured as described above, the independent pattern 14 is formed around the first electrode 13, so that the capacitor built-in wiring of the first embodiment described above is used. It is possible to achieve almost the same effect as the circuit board.

(Third embodiment)
4 and 5 are manufacturing process diagrams showing a method of manufacturing a capacitor built-in wiring circuit board according to the third embodiment of the present invention. In the third embodiment, a manufacturing method by the build-up method of the capacitor built-in wiring circuit board of the first embodiment shown in FIG. 1 will be described.

  First, conductor layers 20a and 20b made of copper foil are formed on both surfaces of the insulating substrate 10 to manufacture a double-sided copper-clad laminate (FIG. 4 (a)).

  On the conductor layers 20a and 20b of the double-sided copper-clad laminate, a dry film resist having a thickness of 15 μm is laminated and coated at 110 ° C. and 3 kg / cm using a laminator. Next, the resist pattern 21a, 21b is formed by exposing on the conditions of the exposure amount of 55 mJ, and developing with 1% sodium carbonate aqueous solution (FIG.4 (b)).

  Next, the resist patterns 21a and 21b are used as a mask to perform an etching process using a ferric chloride solution, and then the resist patterns 21a and 21b are removed with a 5% aqueous sodium hydroxide solution. First wiring patterns 11a and 11b are formed on the upper and lower surfaces, respectively (FIG. 4C).

  Note that the number of layers of the first wiring patterns 11a and 11b formed on the upper and lower surfaces of the insulating substrate 10 is not particularly limited to one, and can be applied to any number of layers.

Next, the substrate on which the first wiring patterns 11a and 11b are formed on the upper and lower surfaces is dried in an oven at 120 ° C., and then a thermosetting insulating material is applied to both surfaces of the substrate at 130 ° C. using a vacuum laminator. For 30 seconds and 3 kg / cm ² , and cured by heating at 160 ° C. for 1 hour to form insulating layers 12a and 12b as insulators. Then, via holes 22a and 22b with a diameter of 80 μm are processed in the conductive path portions of the first wiring patterns 11a and 11b in the insulating layers 12a and 12b by using laser processing. For laser processing, a carbon dioxide laser, UV-YAG laser, or excimer laser can be used (FIG. 4D).

  Next, the insulating layers 12a and 12b and the via holes 22a and 22b are roughened, provided with catalyst nuclei, and activated, and then the insulating layers 12a and 12b and via holes 22a are formed by electroless copper plating or the like. , 22b is formed, electrolytic copper plating is performed using the plating base layer as a cathode, and conductor layers 23a, 23b having a predetermined thickness of about 10 μm are formed on the insulating layers 12a, 12b, via holes 22a, 22b. A via 16 filled with a conductor is formed (FIG. 4E).

  Next, a dry film resist having a thickness of 15 μm is laminated on the upper conductor layer 23a using a laminator. A resist pattern 24a corresponding to the second wiring pattern 15a, the first electrode 13, and the independent pattern 14 is formed by performing exposure and development in a photolithography process. Similarly, a dry film resist having a thickness of 15 μm is laminated on the lower conductor layer 23b using a laminator. A resist pattern 24b corresponding to the second wiring pattern 15b is formed by performing exposure and development in a photolithography process (FIG. 4F).

  Using the resist patterns 24a and 24b as masks, the conductor layers 23a and 23b are etched with ferric chloride, and then the resist patterns 24a and 24b are stripped and removed with a 5% aqueous sodium hydroxide solution to form a second wiring. The pattern 15a, the first electrode 13, the independent pattern 14, and the second wiring pattern 15b are formed (FIG. 5G).

  Here, the case where the wiring pattern is formed by the subtractive method has been described, but the wiring pattern can also be formed by the semi-additive method.

Next, the substrate on which the second wiring pattern 15a, the first electrode 13, the independent pattern 14, and the second wiring pattern 15b are formed is washed with pure water, dried in an oven at 120 ° C., and then thermosetting. The dielectric material is formed on the upper surface of the second wiring pattern 15a, the first electrode 13, and the independent pattern 14 by film lamination or screen printing, and cured by heating at 190 ° C. for 1 hour to form the dielectric layer 17. To do. Subsequently, a second electrode 18 is formed by screen-printing a conductive paste at a position facing the first electrode 13 on the upper surface of the dielectric layer 17 (FIG. 5H).
In this way, the capacitor built-in wiring circuit board shown in FIG. 1 is manufactured.

  In the method of manufacturing the wired circuit board with a built-in capacitor according to the third embodiment having such a configuration, a plurality of second wiring patterns 15a, a first electrode 13, and a periphery of the first electrode 13 are formed on the insulating layer 12a. An independent pattern 14 that is not electrically connected to the first electrode is formed, and a dielectric 17 layer that covers the upper surface of the second wiring pattern 15a, the first electrode 13, and the independent pattern 14 in common is formed. Therefore, the capacitor built-in wiring circuit board manufactured by this manufacturing method can exhibit substantially the same operation and effect as the capacitor built-in wiring circuit board of the first embodiment shown in FIG.

  Furthermore, in the manufacturing method of the third embodiment, the first electrode 13, the independent pattern 14, and the plurality of second wiring patterns 15a constituting the capacitor are formed on the upper surface of the insulating layer 12a with the same material and the same thickness. is doing. Therefore, the degree of integration of the capacitor built-in wiring circuit board can be improved, the number of manufacturing steps can be reduced, and the manufacturing can be performed more efficiently.

(Fourth embodiment)
6 and 7 are manufacturing process diagrams showing a method of manufacturing a capacitor built-in wiring circuit board according to the fourth embodiment of the present invention.

First, conductor layers 30a and 30b made of copper foil are formed on both surfaces of the insulating substrate 10 to manufacture a double-sided copper-clad laminate (FIG. 6 (a)).
A dry film resist (photosensitive layer) is formed on the conductor layers 30a and 30b of the double-sided copper-clad laminate by a method such as bonding a dry film, and a series of patterning processes such as exposure and development are performed to form a resist pattern. 31a and 31b are formed (FIG. 6B).

  Next, using the resist patterns 31a and 31b on both sides as a mask, the conductor layers 30a and 30b are etched, and after the etching process, the resist patterns 31a and 31b are removed with a dedicated stripping solution, and both surfaces of the insulating substrate 10 are removed. A second circuit board 33a having a plurality of wiring patterns 32a and 32b formed thereon is manufactured. In this case, the second electrode 18 constituting one of the electrodes of the capacitor is simultaneously formed on a part of the wiring pattern 32b on the lower side of the second circuit board 33a (FIG. 6 (c1)).

  Similarly, a first circuit in which a plurality of wiring patterns 32a, a single first electrode 13, and an independent pattern 14 are formed on the upper surface of the insulating substrate 10, and a plurality of wiring patterns 32b are formed on the lower surface of the insulating substrate 10. The substrate 33b is manufactured. In this case, the first electrode 13 formed on the upper side of the first circuit board 33b is opposed to the second electrode 18 described above and constitutes the other electrode of the capacitor (FIG. 6 (c2)).

  Similarly, a third circuit board 33c having a plurality of wiring patterns 32a and 32b formed on both surfaces of the insulating substrate 10 is manufactured (FIG. 6 (c3)).

  Next, pretreatment such as blackening treatment is performed on the second, first, and third circuit boards 33a, 33b, and 33c. A dielectric material for forming the dielectric layer 17 is sandwiched between the second circuit board 33a and the first circuit board 33b, and a prepreg (insulation) is provided between the first circuit board 33b and the third circuit board 33c. Sheet) 34, and a copper foil 35a is stacked on the upper side of the second circuit board 33a via the prepreg 34, and a copper foil 35b is further stacked on the lower side of the third circuit board 33c via the prepreg 34. . And these are pressurized and the multilayer circuit board 36 is produced. As a result, in the multilayer circuit board 36, the first electrode 13, the second electrode 18, and a part of the dielectric layer 17 constitute a capacitor. (FIG. 6 (d)).

Next, a through hole 37 is formed at a predetermined position of the multilayer circuit board 36. Subsequently, a series of processes such as electroless copper plating, resist pattern formation, electrolytic copper plating, resist peeling, and etching treatment are performed on the copper foils 35a and 35b on both sides to form outer layer patterns 38a and 38b. (FIG. 7 (e)).
Subsequently, the via 16 is formed by filling the through hole 37 with a conductor to obtain the final capacitor-embedded wiring circuit board (FIG. 7F).
As described above, also in the method of manufacturing the capacitor built-in wiring circuit board according to the fourth embodiment in which the second circuit board 33a, the first circuit board 33b, and the third circuit board 33c are joined, the periphery of the first electrode 13 There is an independent pattern 14 that is not electrically connected to the first electrode 13. The second electrode 18 faces the first electrode 13 through the dielectric layer 17. Accordingly, it is possible to achieve substantially the same operation and effect as the method for manufacturing a capacitor built-in wiring circuit board according to the third embodiment described above.

Sectional drawing which shows schematic structure of the wiring circuit board with a built-in capacitor concerning 1st Embodiment of this invention. The perspective view which cuts horizontally and shows the capacitor built-in type wiring circuit board concerning the 1st embodiment. Sectional drawing which shows schematic structure of the wiring circuit board with a built-in capacitor concerning 2nd Embodiment of this invention. Manufacturing process diagram showing a manufacturing method of a capacitor built-in wiring circuit board according to a third embodiment of the present invention. Similarly, a manufacturing process diagram showing a method for manufacturing a capacitor built-in wiring circuit board according to the third embodiment. Manufacturing process figure which shows the manufacturing method of the wiring circuit board with a built-in capacitor concerning 4th Embodiment of this invention. Similarly, a manufacturing process diagram showing a method of manufacturing a wiring circuit board with a built-in capacitor according to the fourth embodiment. The figure which shows the manufacturing method of the conventional wiring circuit board with a built-in capacitor The figure which similarly shows the manufacturing method of the conventional wiring circuit board with a built-in capacitor

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Insulating substrate, 11a, 11b ... 1st wiring pattern, 12a, 12b ... Insulating layer, 13 ... 1st electrode, 14 ... Independent pattern, 15a, 15b ... 2nd wiring pattern, 16 ... Via, 17 ... Dielectric Body layer, 18 ... second electrode, 20a, 20b, 23a, 23b, 30a, 30b ... conductor layer, 21a, 21b, 24a, 24b, 31a, 31b ... resist pattern, 22a, 22b ... via holes, 32a, 32b ... Wiring pattern, 33a ... Second circuit board, 33a ... First circuit board, 33c ... Third circuit board, 34 ... Pre-preg, 35a, 35b ... Copper foil, 38a, 38b ... Outer layer pattern, 36 ... Multi-layer circuit Substrate, 37 ... through hole

Claims (4)

An insulator;
A wiring pattern provided on the surface of this insulator,
A first electrode provided on a surface of the insulator;
An independent pattern provided at a fixed position around the first electrode on the surface of the insulator and not conducting with the first electrode;
A wiring pattern that is provided on a surface of the insulator and is not electrically connected to the first electrode and the wiring pattern;
A dielectric layer covering at least the surface of the first electrode and the independent pattern that does not face the insulator;
The dielectric layer is provided on a surface not facing the first electrode and the independent pattern, and includes a second electrode constituting a capacitor with the first electrode and a part of the dielectric layer. Capacitor built-in wiring circuit board. The wiring pattern, the first electrode and each independently pattern is composed of the same material, and a capacitor-containing wiring circuit board according to claim 1, characterized in that it is formed in the same thickness. On the surface of the insulator, a wiring pattern, a first electrode, an independent pattern that is not connected to the first electrode at a fixed position around the first electrode, and a wiring that does not connect to the first electrode and the independent pattern Forming a pattern with the same material and the same thickness;
Forming a dielectric layer covering the surface of the first electrode and the independent pattern that does not face the insulator in common;
Forming a second electrode constituting a capacitor with the first electrode and a part of the dielectric layer on a surface of the dielectric layer not facing the first electrode and the independent pattern. A method of manufacturing a capacitor built-in wiring circuit board. A first circuit in which a first electrode, an independent pattern around the first electrode and not conducting with the first electrode, and a wiring pattern not conducting with the first electrode and the independent pattern are formed on the surface of the insulator. Manufacturing a substrate;
Producing a second circuit board having a second electrode formed at a position corresponding to the first electrode of the first circuit board on the surface of the insulator;
The manufactured first circuit board and second circuit board are joined together with a dielectric layer between the circuit boards so that the first electrode and the second electrode face each other. And a step of forming a capacitor with the first electrode, a part of the dielectric layer, and the second electrode.

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