JP4336975B2 - Laser beam processing apparatus and workpiece adsorption table - Google Patents

Laser beam processing apparatus and workpiece adsorption table Download PDF

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JP4336975B2
JP4336975B2 JP2004118999A JP2004118999A JP4336975B2 JP 4336975 B2 JP4336975 B2 JP 4336975B2 JP 2004118999 A JP2004118999 A JP 2004118999A JP 2004118999 A JP2004118999 A JP 2004118999A JP 4336975 B2 JP4336975 B2 JP 4336975B2
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博之 上野
正好 斎藤
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Seiko Epson Corp
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Description

本発明は、レーザビーム加工装置並びにワーク吸着テーブル及びその製造方法に関する。   The present invention relates to a laser beam processing apparatus, a work suction table, and a manufacturing method thereof.

レーザビーム加工は、ワークをステージに吸着して行われる。吸着方法として、ステージに形成された孔を通してワークを吸引することが知られている（特許文献１）。しかし、従来のステージでは、ワークを貫通したレーザビームがステージ表面で反射し、ワーク裏面に入り込むことがあった。あるいは、ステージの表面をハニカム形状に形成することも知られているが、その場合、強度が下がるのでステージ表面の平坦性を確保することが難しかった。
特開２００３−１６４９８８号公報 Laser beam processing is performed by attracting a workpiece onto a stage. As a suction method, it is known to suck a workpiece through a hole formed in a stage (Patent Document 1). However, in the conventional stage, the laser beam penetrating the work may be reflected by the surface of the stage and enter the back of the work. Alternatively, it is also known that the surface of the stage is formed in a honeycomb shape, but in that case, it is difficult to ensure the flatness of the stage surface because the strength is lowered.
Japanese Patent Laid-Open No. 2003-164988

本発明の目的は、強度を下げることなくレーザビームのワーク裏面への反射を減らすことにある。   An object of the present invention is to reduce the reflection of a laser beam on the work back surface without reducing the intensity.

（１）本発明に係るレーザビーム加工装置は、テーパ面によって外方向に拡がるように開口する複数の貫通穴が形成されてなる、ワークを載せるためのテーブルと、
前記ワークをレーザビーム加工するために、前記テーブルに向けてレーザビームを走査照射するレーザと、
前記貫通穴を介して前記ワークを吸引するための真空ポンプと、
を有し、
前記複数の貫通穴は、平行な複数の第１の直線に沿って配列されるとともに、前記第１の直線に交差する平行な複数の第２の直線に沿って配列され、
前記テーブルの、それぞれの前記第１の直線の方向で隣り合う一対の前記貫通穴の間の第１の部分の表面は、前記テーパ面のみによって形成され、
前記テーブルの、それぞれの前記第２の直線の方向で隣り合う一対の前記貫通穴の間の第２の部分の表面は、前記テーパ面のみによって形成され、
前記テーブルの、前記第１及び第２の直線の方向以外の第３の直線の方向で隣り合う一対の前記貫通穴の間の第３の部分は、前記テーパ面の上端よりも突出して、前記ワークを載せるための平坦な上端面を有する。本発明によれば、第１及び第２の部分の表面は、テーパ面のみによって形成されるので、レーザビームは斜めに入射し斜めに反射する。したがって、レーザビームのワーク裏面への反射を減らすことができる。
（２）本発明に係るワーク吸着テーブルは、テーパ面によって外方向に拡がるように開口する複数の貫通穴が形成され、
前記複数の貫通穴は、平行な複数の第１の直線に沿って配列されるとともに、前記第１の直線に交差する平行な複数の第２の直線に沿って配列され、
前記テーブルの、それぞれの前記第１の直線の方向で隣り合う一対の前記貫通穴の間の第１の部分の表面は、前記テーパ面のみによって形成され、
前記テーブルの、それぞれの前記第２の直線の方向で隣り合う一対の前記貫通穴の間の第２の部分の表面は、前記テーパ面のみによって形成され、
前記テーブルの、前記第１及び第２の直線の方向以外の第３の直線の方向で隣り合う一対の前記貫通穴の間の第３の部分が前記テーパ面の上端よりも突出して、ワークを載せるための平坦な上端面を有する。本発明によれば、第１及び第２の部分の表面は、テーパ面のみによって形成されるので、レーザビームは斜めに入射し斜めに反射する。したがって、レーザビームのワーク裏面への反射を減らすことができる。
（３）本発明に係るワーク吸着テーブルの製造方法は、基板に複数の貫通穴を、平行な複数の第１の直線に沿って配列するとともに、前記第１の直線に交差する平行な複数の第２の直線に沿って配列して形成する穴あけ工程と、
開口が外方向に拡がるテーパ面が形成されるように、それぞれの前記貫通穴の開口端部を、テーパ状の切削部を有する回転ツールによって削る面取り工程と、
を含み、
前記回転ツールの前記切削部は、それぞれの前記第１の直線の方向で隣り合う一対の前記貫通穴の間の第１のピッチの１／２を超え、かつ、それぞれの前記第２の直線の方向で隣り合う一対の前記貫通穴の間の第２のピッチの１／２を超える半径の部分を有し、
前記面取り工程で、前記貫通穴の中心軸から、前記第１のピッチの１／２の距離を超えるとともに前記第２のピッチの１／２の距離を超えるが、前記第１及び第２の直線の方向以外の第３の直線の方向で隣り合う一対の前記貫通穴の間の第３のピッチの１／２の距離に至らないように、前記開口端部を切削する。本発明によれば、それぞれの第１の直線の方向で隣り合う一対の貫通穴に対して切削を行うと、その間の部分は、テーパ面のみからなる表面を有するようになる。また、それぞれの第２の直線の方向で隣り合う一対の貫通穴に対して切削を行うと、その間の部分は、テーパ面のみからなる表面を有するようになる。これらの部分の表面では、レーザビームは斜めに入射し斜めに反射するので、レーザビームのワーク裏面への反射を減らすことができる。そして、それぞれの第３の直線の方向で隣り合う一対の貫通穴に対して切削を行うと、その間の部分は、テーパ面の上端よりも突出してワークを載せるための平坦な上端面を有する部分として切削されずに残る。 (1) A laser beam processing apparatus according to the present invention includes a table on which a work is placed, wherein a plurality of through holes that are opened outwardly by a tapered surface are formed,
A laser for scanning and irradiating a laser beam toward the table in order to process the workpiece with a laser beam;
A vacuum pump for sucking the workpiece through the through hole;
Have
The plurality of through holes are arranged along a plurality of parallel first straight lines, and are arranged along a plurality of parallel second straight lines intersecting the first straight lines,
The surface of the first portion between the pair of through holes adjacent to each other in the direction of the first straight line of the table is formed only by the tapered surface,
The surface of the second portion between the pair of through holes adjacent to each other in the direction of the second straight line of the table is formed only by the tapered surface,
A third portion of the table between a pair of the through holes adjacent to each other in a third straight line direction other than the first and second straight line directions protrudes from an upper end of the tapered surface, and It has a flat upper end surface for placing a workpiece. According to the present invention, since the surfaces of the first and second portions are formed only by the tapered surface, the laser beam is incident obliquely and reflected obliquely. Therefore, reflection of the laser beam on the work back surface can be reduced.
(2) The work suction table according to the present invention is formed with a plurality of through holes that open outwardly by the tapered surface,
The plurality of through holes are arranged along a plurality of parallel first straight lines, and are arranged along a plurality of parallel second straight lines intersecting the first straight lines,
The surface of the first portion between the pair of through holes adjacent to each other in the direction of the first straight line of the table is formed only by the tapered surface,
The surface of the second portion between the pair of through holes adjacent to each other in the direction of the second straight line of the table is formed only by the tapered surface,
A third portion of the table between a pair of the through holes adjacent to each other in the direction of the third straight line other than the directions of the first and second straight lines protrudes from the upper end of the tapered surface, It has a flat top surface for mounting. According to the present invention, since the surfaces of the first and second portions are formed only by the tapered surface, the laser beam is incident obliquely and reflected obliquely. Therefore, reflection of the laser beam on the work back surface can be reduced.
(3) In the method for manufacturing a workpiece suction table according to the present invention, a plurality of through holes are arranged in the substrate along a plurality of parallel first straight lines, and a plurality of parallel plurality of crossing the first straight lines are arranged. Drilling steps arranged along the second straight line;
A chamfering step of shaving the opening end of each through hole with a rotary tool having a tapered cutting portion so that a tapered surface in which the opening expands outward is formed;
Including
The cutting portion of the rotary tool exceeds 1/2 of the first pitch between a pair of the through holes adjacent in the direction of the first straight line, and the second straight line A portion having a radius exceeding 1/2 of the second pitch between the pair of through holes adjacent in the direction;
In the chamfering step, the distance from the central axis of the through hole exceeds a distance of ½ of the first pitch and exceeds a distance of ½ of the second pitch. The opening end portion is cut so as not to reach a distance of ½ of the third pitch between the pair of through holes adjacent in the direction of the third straight line other than the direction of. According to the present invention, when a pair of through holes adjacent to each other in the direction of the first straight line is cut, the portion between them has a surface consisting only of a tapered surface. Moreover, when it cuts with respect to a pair of through-hole adjacent in the direction of each 2nd straight line, the part between them will have the surface which consists only of a taper surface. On the surface of these portions, the laser beam is incident obliquely and reflected obliquely, so that the reflection of the laser beam on the work back surface can be reduced. And if it cuts with respect to a pair of through-holes adjacent in the direction of each 3rd straight line, the part between will protrude from the upper end of a taper surface, and will have a flat upper end surface for mounting a workpiece | work As left uncut.

以下、本発明の実施の形態について図面を参照して説明する。図１は、本実施の形態に係るレーザビーム加工装置を示す図である。図２は、図１に示すレーザビーム加工装置のII-II線断面図である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a laser beam processing apparatus according to the present embodiment. 2 is a cross-sectional view taken along the line II-II of the laser beam processing apparatus shown in FIG.

本実施の形態で加工の対象となるワーク１０は、配線基板（例えばＴＡＢテープ）であってもよい。配線基板は、樹脂（例えばポリイミド樹脂）からなる基板と、基板に形成されている金属（例えば銅）からなる配線パターンと、を有する。   The workpiece 10 to be processed in the present embodiment may be a wiring board (for example, a TAB tape). The wiring substrate has a substrate made of resin (for example, polyimide resin) and a wiring pattern made of metal (for example, copper) formed on the substrate.

レーザビーム加工装置は、図２に示すように、レーザ１２を有する。レーザ１２から照射されるレーザビーム１４によって、ワーク１０が加工される。なお、レーザビーム１４は、ワーク１０（又はテーブル２０）に対して走査照射される。走査のため、レーザ１２及びワーク１０（又はテーブル２０）は、相対的に移動するようになっており、その移動方向はレーザビーム１４の走査方向になる。   The laser beam processing apparatus has a laser 12 as shown in FIG. The workpiece 10 is processed by the laser beam 14 emitted from the laser 12. The laser beam 14 is applied to the workpiece 10 (or the table 20) by scanning. For scanning, the laser 12 and the workpiece 10 (or the table 20) move relatively, and the moving direction is the scanning direction of the laser beam 14.

レーザビーム加工装置は、テーブル（ワーク吸着テーブル）２０を有する。図３は、テーブルの一部を拡大した平面図である。図４は、図３に示すテーブルのIV-IV線断面図である。図５は、図３に示すテーブルのＶ-Ｖ線断面図である。   The laser beam processing apparatus has a table (work suction table) 20. FIG. 3 is an enlarged plan view of a part of the table. 4 is a cross-sectional view of the table shown in FIG. 3 taken along the line IV-IV. FIG. 5 is a cross-sectional view of the table shown in FIG.

テーブル２０には、複数の貫通穴２２が形成されている。貫通穴２２は、ワーク１０を保持するために吸引を行うための吸気口である。貫通穴２２は、テーブル２０のワーク１０を載置する面からそれ以外の面に貫通している。貫通穴２２は、テーパ面２４によって外方向に拡がるように開口している。貫通穴２２がテーパ面２４によって拡がるように開口するのは、テーブル２０のワーク１０を載置する面においてである。   A plurality of through holes 22 are formed in the table 20. The through hole 22 is an intake port for performing suction to hold the workpiece 10. The through hole 22 penetrates from the surface on which the workpiece 10 of the table 20 is placed to the other surface. The through hole 22 is opened by the tapered surface 24 so as to expand outward. The through hole 22 opens so as to be expanded by the tapered surface 24 on the surface on which the work 10 of the table 20 is placed.

複数の貫通穴２２は、複数行複数列で配列されており、並進性を有するように（並進格子状に）配列されてもよい。複数の貫通穴２２は、平行な複数の第１の直線Ｌ１に沿って配列されている。複数の貫通穴２２は、第１の直線Ｌ１に交差する（例えば直交する）平行な複数の第２の直線Ｌ２に沿って配列されている。複数の貫通穴２２は、第１及び第２の直線Ｌ１，Ｌ２に交差する平行な複数の第３の直線Ｌ３に沿って配列されている。第１及び第２の直線Ｌ１，Ｌ２は、レーザビーム１４の走査方向の基準となるＸ，Ｙ軸であってもよい。 The plurality of through holes 22 are arranged in a plurality of rows and a plurality of columns, and may be arranged so as to have translational properties (in a translational lattice pattern). A plurality of through-holes 22 are arranged along a first straight line L 1 of the parallel multiple. A plurality of through holes 22, crossing the first straight line L 1 (e.g., perpendicular) are arranged along a second straight line L 2 of a plurality of parallel. The plurality of through holes 22 are arranged along a plurality of parallel third straight lines L 3 intersecting the first and second straight lines L 1 and L 2 . The first and second straight lines L 1 and L 2 may be X and Y axes that serve as a reference in the scanning direction of the laser beam 14.

テーブル２０の、第１の直線Ｌ１の方向で隣り合う一対の貫通穴２２の間の第１の部分２６の表面は、テーパ面２４のみによって形成されている。テーブル２０の、それぞれの第２の直線Ｌ２の方向で隣り合う一対の貫通穴２２の間の第２の部分２８の表面は、テーパ面２４のみによって形成されている。 The surface of the first portion 26 between the pair of through holes 22 adjacent to each other in the direction of the first straight line L 1 of the table 20 is formed only by the tapered surface 24. The surface of the second portion 28 between the pair of through holes 22 adjacent to each other in the direction of the second straight line L < b > 2 of the table 20 is formed only by the tapered surface 24.

図４に示すように、レーザビーム１４が第１及び第２の直線Ｌ１，Ｌ２に沿って走査された場合、レーザビーム１４がワーク１０を貫通してテーブル２０に当たっても、第１及び第２の部分２６，２８の表面は、テーパ面２４のみによって形成されるので、レーザビーム１４は斜めに入射し斜めに反射する。したがって、レーザビーム１４のワーク１０裏面への反射を減らすことができる。テーパ面２４の傾斜角度が、テーブル２０に対して垂直に入射したレーザビーム１４がテーパ面２４で反射して、貫通穴２２のさらに深い位置に進行する程度の角度（図４参照）であれば、レーザビーム１４のワーク１０裏面への反射をなくすことができる。 As shown in FIG. 4, when the laser beam 14 is scanned along the first and second straight lines L 1 and L 2 , the first and second laser beams 14 pass through the workpiece 10 and hit the table 20. Since the surfaces of the second portions 26 and 28 are formed only by the tapered surface 24, the laser beam 14 is incident obliquely and reflected obliquely. Therefore, reflection of the laser beam 14 on the back surface of the workpiece 10 can be reduced. If the inclination angle of the tapered surface 24 is such that the laser beam 14 incident perpendicularly to the table 20 is reflected by the tapered surface 24 and travels to a deeper position of the through hole 22 (see FIG. 4). The reflection of the laser beam 14 on the back surface of the workpiece 10 can be eliminated.

テーブル２０の、第１及び第２の直線Ｌ１，Ｌ２の方向以外の（すなわち第１及び第２の直線Ｌ１，Ｌ２に交差する）第３の直線Ｌ３の方向で隣り合う一対の貫通穴２２の間の第３の部分３０は、テーパ面２４の上端よりも突出している。また、第３の部分３０は平坦な上端面を有する。全ての第３の部分３０の上端面が同一平面に含まれている。こうすることで、第３の部分３０によってワーク１０を載せるための平面を確保することができる。 Table 20, first and second straight lines L 1, L direction other than 2 (lines L 1 i.e. the first and second, crossing the L 2) adjacent pairs in the third direction of the straight line L 3 The third portion 30 between the through holes 22 protrudes from the upper end of the tapered surface 24. The third portion 30 has a flat upper end surface. The upper end surfaces of all the third portions 30 are included in the same plane. By doing so, a plane for placing the workpiece 10 can be secured by the third portion 30.

図２に示すように、テーブル２０のワーク１０を載せる面とは反対側には、凹部３２が形成されていてもよい。凹部３２は、複数の貫通穴２２を囲む領域がその外側の領域よりも窪むように形成されている。   As shown in FIG. 2, a recess 32 may be formed on the side of the table 20 opposite to the surface on which the workpiece 10 is placed. The concave portion 32 is formed so that the region surrounding the plurality of through holes 22 is depressed more than the outer region.

テーブル２０は、位置決め治具４０上に載せられる。位置決め治具４０は、テーブル２０の位置を調整できるようになっている。位置決め治具４０には穴４０が形成されている。穴４０は、吸引のための通気口となる。位置決め治具４０に凹部３２を向けて、かつ、穴４０が凹部３２内に位置するように、位置決め治具４０上にテーブル２０が配置される。こうすることで、凹部３２と位置決め治具４０との間に穴４０と連通する空間４４が形成され、空間４４を介して、貫通穴２２からの吸引を行うことができる。位置決め治具４０は、台４６上に載せられる。台４６は、図示しないステージに固定されていてもよく、ステージに設けられたアクチュエータによって移動（例えばＸＹ軸に沿った二次元移動）ができるようになっていてもよい。   The table 20 is placed on the positioning jig 40. The positioning jig 40 can adjust the position of the table 20. A hole 40 is formed in the positioning jig 40. The hole 40 becomes a vent for suction. The table 20 is arranged on the positioning jig 40 so that the concave portion 32 faces the positioning jig 40 and the hole 40 is positioned in the concave portion 32. By doing so, a space 44 communicating with the hole 40 is formed between the recess 32 and the positioning jig 40, and suction from the through hole 22 can be performed through the space 44. The positioning jig 40 is placed on the table 46. The stage 46 may be fixed to a stage (not shown), and may be movable (for example, two-dimensionally moved along the XY axes) by an actuator provided on the stage.

テーブル２０の上方には、ワーク押え４８が配置される。ワーク押え４８には、開口５０が形成されている。テーブル２０とワーク押え４８の間にワーク１０を挟み込み、開口５０の内側で、レーザビーム加工が行われる。   A work presser 48 is disposed above the table 20. An opening 50 is formed in the work retainer 48. The workpiece 10 is sandwiched between the table 20 and the workpiece presser 48, and laser beam machining is performed inside the opening 50.

レーザビーム加工装置は、真空ポンプ５２を有する。真空ポンプ５２は、貫通穴２２を介した吸引を行ってワーク１０をテーブル２０に吸着するためのものである。また、真空ポンプ５２によって、ワーク１０を加工（切断等）して生じるカスも吸引される。   The laser beam processing apparatus has a vacuum pump 52. The vacuum pump 52 is for sucking the workpiece 10 to the table 20 by performing suction through the through hole 22. Further, the vacuum pump 52 also sucks waste generated by processing (cutting or the like) the workpiece 10.

レーザビーム加工装置は、他の真空ポンプ５４を有してもよい。真空ポンプ５４は、ノズル５６に接続されており、ワーク１０をレーザビーム加工したときに生じるガスを吸引するためのものである。   The laser beam processing apparatus may have another vacuum pump 54. The vacuum pump 54 is connected to the nozzle 56 and is for sucking a gas generated when the workpiece 10 is laser beam processed.

図６は、本発明の実施の形態に係るワーク吸着テーブルの製造方法を説明する図である。図７は、図６に示す製造途中のワーク吸着テーブルのVII-VII線断面図である。   FIG. 6 is a diagram for explaining a method of manufacturing a workpiece suction table according to the embodiment of the present invention. FIG. 7 is a cross-sectional view taken along line VII-VII of the workpiece suction table shown in FIG.

ワーク吸着テーブルの製造には、基板６０を使用する。基板６０は、金属板であってもよいし、プラスチック（例えば樹脂）板であってもよい。基板６０は、少なくとも一方の面が平坦になっており、この平坦な面の一部（第３の部分３０）が、ワーク１０の載置面となる。   The substrate 60 is used for manufacturing the work suction table. The substrate 60 may be a metal plate or a plastic (for example, resin) plate. At least one surface of the substrate 60 is flat, and a part of the flat surface (third portion 30) serves as a mounting surface for the workpiece 10.

ワーク吸着テーブルの製造方法は、基板６０に複数の貫通穴６２を形成する穴あけ工程を含む。複数の貫通穴６２は、平行な複数の第１の直線Ｌ１に沿って配列して形成する。複数の貫通穴６２は、第１の直線Ｌ１に交差する（例えば直交する）平行な複数の第２の直線Ｌ２に沿って配列して形成する。複数の貫通穴２２は、第１及び第２の直線Ｌ１，Ｌ２に交差する平行な複数の第３の直線Ｌ３に沿って配列して形成する。 The method for manufacturing the work suction table includes a drilling step of forming a plurality of through holes 62 in the substrate 60. A plurality of through holes 62 are formed and arranged along a first straight line L 1 of a plurality of parallel. A plurality of through holes 62, crossing the first straight line L 1 (e.g., perpendicular) to form aligned along a second straight line L 2 of a plurality of parallel. The plurality of through holes 22 are formed by being arranged along a plurality of parallel third straight lines L 3 intersecting the first and second straight lines L 1 and L 2 .

複数の貫通穴６２は、第１の直線Ｌ１に沿って、同じ第１のピッチＰ１で配列されている。複数の貫通穴６２は、第２の直線Ｌ２に沿って、同じ第２のピッチＰ２で配列されている。複数の貫通穴６２は、第３の直線Ｌ３に沿って、同じ第３のピッチＰ３で配列されている。第１及び第２のピッチＰ１，Ｐ２は同じであってもよい。第３のピッチＰ３は、第１及び第２のピッチＰ１，Ｐ２よりも大きい。貫通穴６２から上述した貫通穴２２を形成するので、貫通穴６２の配列については貫通穴２２の配列の内容が該当し、貫通穴２２の配列については貫通穴６２の配列の内容が該当する。 The plurality of through holes 62 are arranged at the same first pitch P 1 along the first straight line L 1 . The plurality of through holes 62 are arranged at the same second pitch P 2 along the second straight line L 2 . A plurality of through-holes 62, along a third straight line L 3, are arranged in the same third pitch P 3. The first and second pitches P 1 and P 2 may be the same. The third pitch P 3 is larger than the first and second pitches P 1 and P 2 . Since the above-described through hole 22 is formed from the through hole 62, the arrangement of the through hole 62 corresponds to the arrangement of the through hole 62, and the arrangement of the through hole 62 corresponds to the arrangement of the through hole 22.

ワーク吸着テーブルの製造方法は、貫通穴６２の開口端部６４を削るための面取り工程を含む。面取り工程は、テーパ状の切削部７２を有する回転ツール７０を使用して行う。切削部７２によってテーパ面２４を形成する。テーパ面２４の詳細は上述した通りである。   The manufacturing method of the work suction table includes a chamfering process for cutting the opening end portion 64 of the through hole 62. The chamfering process is performed using a rotating tool 70 having a tapered cutting portion 72. The tapered surface 24 is formed by the cutting portion 72. The details of the tapered surface 24 are as described above.

図６に示すように、切削部７２は、第１の直線Ｌ１の方向で隣り合う一対の貫通穴６２の間の第１のピッチＰ１の１／２を超える半径の部分を有する。切削部７２は、第２の直線Ｌ２の方向で隣り合う一対の貫通穴６２の間の第２のピッチＰ２の１／２を超える半径の部分を有する。 As shown in FIG. 6, the cutting portion 72 has a portion with a radius exceeding 1/2 of the first pitch P 1 between a pair of through holes 62 adjacent in the direction of the first straight line L 1 . The cutting part 72 has a part with a radius exceeding 1/2 of the second pitch P 2 between the pair of through holes 62 adjacent in the direction of the second straight line L 2 .

開口端部６４の切削は、貫通穴６２の中心軸から、第１のピッチＰ１の１／２の距離を超えるように行う。開口端部６４の切削は、貫通穴６２の中心軸から、第２のピッチＰ２の１／２の距離を超えるように行う。ただし、開口端部６４の切削は、第１及び第２の直線Ｌ１，Ｌ２の方向以外の第３の直線Ｌ３の方向で隣り合う一対の貫通穴６２の間の第３のピッチＰ３の１／２の距離に至らないように行う。 The opening end portion 64 is cut so as to exceed a distance of ½ of the first pitch P 1 from the central axis of the through hole 62. The cutting of the open end 64 is performed so as to exceed a distance of ½ of the second pitch P 2 from the central axis of the through hole 62. However, the cutting of the open end 64 is performed by the third pitch P between the pair of through holes 62 adjacent in the direction of the third straight line L 3 other than the directions of the first and second straight lines L 1 and L 2. 3. Do not reach a distance of 1/2 of 3 .

本実施の形態によれば、それぞれの第１の直線Ｌ１の方向で隣り合う一対の貫通穴６２に対して切削を行うと、その間の第１の部分２６は、テーパ面２４のみからなる表面を有するようになる。また、それぞれの第２の直線Ｌ２の方向で隣り合う一対の貫通穴６２に対して切削を行うと、その間の第２の部分２８は、テーパ面２４のみからなる表面を有するようになる。第１及び第２の部分２６，２８の表面では、レーザビーム１４は斜めに入射し斜めに反射するので、レーザビーム１４のワーク１０裏面への反射を減らすことができる。そして、それぞれの第３の直線Ｌ３の方向で隣り合う一対の貫通穴６２に対して切削を行うと、その間の第３の部分３０は、テーパ面２４の上端よりも突出してワーク１０を載せるための平坦な上端面を有する部分として切削されずに残る。 According to this embodiment, when cutting the pair of through holes 62 adjacent to each other in each of the first direction of the straight line L 1, the first portion 26 therebetween is made of only the tapered surface 24 surface Will have. Further, when cutting is performed on a pair of through holes 62 adjacent in the direction of each second straight line L 2 , the second portion 28 between them has a surface composed only of the tapered surface 24. Since the laser beam 14 is incident obliquely and reflected obliquely on the surfaces of the first and second portions 26 and 28, reflection of the laser beam 14 on the back surface of the workpiece 10 can be reduced. And when it cuts with respect to a pair of through-hole 62 adjacent in the direction of each 3rd straight line L3, the 3rd part 30 in the meantime protrudes rather than the upper end of the taper surface 24, and mounts the workpiece | work 10. Therefore, it remains without being cut as a portion having a flat upper end surface.

本発明は、上述した実施の形態に限定されるものではなく、種々の変形が可能である。例えば、本発明は、実施の形態で説明した構成と実質的に同一の構成（例えば、機能、方法及び結果が同一の構成、あるいは目的及び結果が同一の構成）を含む。また、本発明は、実施の形態で説明した構成の本質的でない部分を置き換えた構成を含む。また、本発明は、実施の形態で説明した構成と同一の作用効果を奏する構成又は同一の目的を達成することができる構成を含む。また、本発明は、実施の形態で説明した構成に公知技術を付加した構成を含む。さらに、本発明は、実施の形態で説明した技術的事項のいずれかを限定的に除外したものであってもよい。あるいは、本発明は、上述した実施の形態から公知技術を限定的に除外したものであってもよい。   The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment. Furthermore, the present invention may be one that excludes any of the technical matters described in the embodiments in a limited manner. Alternatively, the present invention may be one in which known techniques are limitedly excluded from the above-described embodiments.

図１は、本実施の形態に係るレーザビーム加工装置を示す図である。FIG. 1 is a diagram showing a laser beam processing apparatus according to the present embodiment. 図２は、図１に示すレーザビーム加工装置のII-II線断面図である。2 is a cross-sectional view taken along the line II-II of the laser beam processing apparatus shown in FIG. 図３は、テーブルの一部を拡大した平面図である。FIG. 3 is an enlarged plan view of a part of the table. 図４は、図３に示すテーブルのIV-IV線断面図である。4 is a cross-sectional view of the table shown in FIG. 3 taken along the line IV-IV. 図５は、図３に示すテーブルのＶ-Ｖ線断面図である。FIG. 5 is a cross-sectional view of the table shown in FIG. 図６は、本発明の実施の形態に係るワーク吸着テーブルの製造方法を説明する図である。FIG. 6 is a diagram for explaining a method of manufacturing a workpiece suction table according to the embodiment of the present invention. 図７は、図６に示す製造途中のワーク吸着テーブルのVII-VII線断面図である。FIG. 7 is a cross-sectional view taken along line VII-VII of the workpiece suction table shown in FIG.

符号の説明Explanation of symbols

１０…ワーク １２…レーザ １４…レーザビーム ２０…テーブル ２２…貫通穴 ２４…テーパ面 ２６…第１の部分 ２８…第２の部分 ３０…第３の部分 ３２…凹部 ４０…位置決め治具 ４４…空間 ４６…台 ４８…ワーク押え ５０…開口 ５２…真空ポンプ ５４…真空ポンプ ５６…ノズル ６０…基板 ６２…貫通穴 ６４…開口端部 ７０…回転ツール ７２…切削部   DESCRIPTION OF SYMBOLS 10 ... Work 12 ... Laser 14 ... Laser beam 20 ... Table 22 ... Through-hole 24 ... Tapered surface 26 ... 1st part 28 ... 2nd part 30 ... 3rd part 32 ... Recess 40 ... Positioning jig 44 ... Space 46 ... Stand 48 ... Workpiece presser 50 ... Opening 52 ... Vacuum pump 54 ... Vacuum pump 56 ... Nozzle 60 ... Substrate 62 ... Through hole 64 ... Open end 70 ... Rotating tool 72 ... Cutting part

Claims (2)

テーパ面によって外方向に拡がる開口端部を有して開口する複数の貫通穴が形成されてなる、ワークを載せるためのテーブルと、
前記ワークをレーザビーム加工するために、前記テーブルに向けてレーザビームを走査照射するレーザと、
前記貫通穴を介して前記ワークを吸引するための真空ポンプと、
を有し、
前記開口端部は、第１の直線の方向で隣り合う前記貫通穴の間の第１のピッチの１／２の距離を超えるるとともに、前記第１の直線と直交する第２の直線の方向で隣り合う前記貫通穴の間の第２のピッチの１／２の距離を超えるが、前記第１及び第２の直線の方向以外の第３の直線の方向で隣り合う前記貫通穴の間の第３のピッチの１／２の距離に至らないように形成されるレーザビーム加工装置。 A table on which a work is placed, in which a plurality of through-holes having an opening end portion extending outward by a tapered surface is formed;
A laser for scanning and irradiating a laser beam toward the table in order to process the workpiece with a laser beam;
A vacuum pump for sucking the workpiece through the through hole;
Have
The opening end portion exceeds the distance of ½ of the first pitch between the adjacent through holes in the direction of the first straight line, and the direction of the second straight line orthogonal to the first straight line The distance between the through holes adjacent to each other in the direction of the third straight line other than the direction of the first and second straight lines is greater than a distance of ½ of the second pitch between the through holes adjacent to each other. A laser beam processing apparatus formed so as not to reach a distance of ½ of the third pitch . テーパ面によって外方向に拡がる開口端部を有して開口する複数の貫通穴が形成され、
前記開口端部は、第１の直線の方向で隣り合う前記貫通穴の間の第１のピッチの１／２の距離を超えるるとともに、前記第１の直線と直交する第２の直線の方向で隣り合う前記貫通穴の間の第２のピッチの１／２の距離を超えるが、前記第１及び第２の直線の方向以外の第３の直線の方向で隣り合う前記貫通穴の間の第３のピッチの１／２の距離に至らないように形成されるワーク吸着テーブル。 A plurality of through-holes having an opening end portion extending outwardly by the tapered surface are formed,
The opening end portion exceeds the distance of ½ of the first pitch between the adjacent through holes in the direction of the first straight line, and the direction of the second straight line orthogonal to the first straight line The distance between the through holes adjacent to each other in the direction of the third straight line other than the direction of the first and second straight lines is greater than a distance of ½ of the second pitch between the through holes adjacent to each other. A workpiece suction table formed so as not to reach a distance of ½ of the third pitch .
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