KR101216966B1 - Supporting apparatus for working of film - Google Patents

Abstract

Supporting device for film processing to prevent film from being irradiated directly to the work table at the bottom when hole is made by using laser to minimize the contact area with the lower surface of the film while protecting the work table. Is introduced.
The above device is arranged between the film F and the work table 5, which requires laser processing, to support the film F from below while preventing the work table 5 from being damaged by the laser during processing. Part 100;
One body (B) is supported to prevent the laser from contacting the work table 5 while supporting the film F, and to minimize the contact area with the lower surface of the film F so that the film F processing is performed. A mesh-shaped mesh part 200 formed of a structure in which a cross section of the sieve 220 in the periphery forming the 210 becomes narrower toward the top; Including,
The point where the sieve 220 intersects at the edge of the base part 100 and the mesh part 200 so that the film F is in close contact with the upper surface of the base part 100 during laser processing to increase accuracy. Each of the plurality of vacuum holes 120 in communication with the vacuum device 30 is formed.

Description

Supporting device for film processing {SUPPORTING APPARATUS FOR WORKING OF FILM}

The present invention relates to a film processing support device, and more particularly, when a hole is made into a film by using a laser, the film is contacted with the lower surface of the film while protecting the work table by preventing the laser from being directly irradiated to the work table below. It relates to a film processing support for minimizing the area so that film processing is performed effectively.

A printed circuit board (PCB) is a film type in which many parts of various types are packed on a flat plate made of phenol resin or epoxy resin and the circuits connecting the parts are compacted and fixed on the surface of the resin flat plate. It is a circuit board.

Printed circuit board is made by attaching thin plate such as copper to one side of phenol resin insulation board or epoxy resin insulation board and then etching according to the wiring pattern of the circuit (corroding and removing only the circuit on the wire) to compose the necessary circuit and attach the parts. It is manufactured by drilling holes for mounting, and it is classified into single-sided board, double-sided board, and multi-layered board according to the number of wiring circuit surface, and the number of layers is used for high precision products.

Single-sided printed circuit boards mainly use phenolic discs as substrates, and are used for products with relatively complicated circuits such as radios, telephones, and simple measuring instruments. Double-sided printed circuit boards mainly use epoxy resin discs. Used for products with relatively complex circuits. In addition, multilayer printed circuit boards are used in high-precision devices such as 32-bit or more computers, electronic switchboards, and high-performance communication devices.

On the other hand, in the case where circuit boards such as automation devices and camcorders need to be moved, and when the circuit boards are required to be inserted and internally configured, flexible boards made to respond to the flexibility of the boards themselves without changing the design may be used. Used.

Recently, as electronic devices become smaller and more complicated, FPCBs are used a lot and precise hole processing is required on the flexible substrates. In general, flexible substrates are made of copper clad laminate (CCL). As mentioned above, what coated the cross section with copper foil and what coated both surfaces with copper foil are used.

A hole is generally called a micro via hole. A via hole is a hole that penetrates a substrate. The hole is connected to another layer without inserting a hole and a part for connecting the conductor and the conductor by inserting a part. There is a hole for connection.

Conventionally, an apparatus for processing a film as shown in FIG. 1 is proposed as an apparatus for processing holes in a thin film such as a printed circuit board (typically CCL).

Referring to FIG. 1, a conventional film processing apparatus is provided with a laser unit 1 for processing holes in a film, and on one side of the laser unit 1, a film is wound in a roll shape and then wound to a processing speed. Unwinding roll (2) for releasing the at a constant speed is installed.

In addition, a winding roll 3 for rewinding the film unwound from the unwinding roll 2 into a roll form is installed on the other side of the laser unit 1, wherein the unwinding roll 3 is provided with the unwinding roll 2. It is installed at a predetermined distance from the opposite position.

The film provided from the unwinding roll 2 passes through a plurality of feed rollers 4 and rewinds to the take-up roll 3, wherein the laser unit 1 is interposed between the feed rollers 4. A work table 5 is provided to support the film when machining the hole on the back plate).

Therefore, the laser unit 1 irradiates a laser on the film F placed on the work table 5 to process the necessary holes, and when the processing is completed, the feed roller is operated so that the film is processed. It is wound on the take-up roll (3).

By the way, in order to process the hole in the film (F) inevitably the laser 1 must pass through the film, a problem occurs that the work table (5) is damaged.

That is, when the high energy density of the laser is applied to the worktable 5, a burr is generated on the surface of the worktable 5, which adversely affects the flatness. When the flatness of the worktable becomes poor, the film is stable. As a result, the film processing becomes poor due to poor adhesion.

For reference, when processing by using a laser, the processed part is accompanied by high heat and pressure, so that a large impact is applied to the film, so the film must be stably in close contact with the worktable. Especially in the case of micro machining using laser, the work area becomes very small, so the flatness of the worktable is most important.

Therefore, conventionally, as shown in FIG. 2, the nonwoven fabric 10 is inserted between the film F and the work table 5 to prevent the laser from directly contacting the work table when a hole is formed in the film.

However, the conventional processing method as shown in FIG. 2 uses a nonwoven fabric, which makes it difficult to maintain flatness due to its elasticity and uneven surface, and also prevents the film from flowing due to the laser pressure generated during processing. The processing quality is lowered and the accuracy of the processing position is lowered, and thus there is a problem that it is particularly difficult to use for fine processing.

In addition, since the nonwoven fabric is also damaged after processing, there is an inconvenience that frequent replacement of the nonwoven fabric.

The present invention is to solve the problems as described above, the object is to prevent the flow of the film while preventing the laser basically touches the worktable when processing the film using the laser to increase the processing quality and precision to fine processing To make it possible.

In order to solve the above object,

A first embodiment of the present invention, the base portion disposed between the film and the work table that needs laser processing to support the film from the bottom while preventing the work table from being damaged by the laser during processing; It is formed in an area excluding the edge of the base portion to provide a film processing receiving apparatus comprising a; a mesh portion to uniformly support the lower portion of the film in the form of a net.
As the cross section of the sieve surrounding the periphery forming one body goes upward, the laser beam is prevented from touching the worktable while supporting the film, and the film processing is performed by minimizing the contact area with the film lower surface. Mesh-shaped mesh portion made of a narrowing structure; Including,

In the laser processing, a plurality of vacuum holes are formed in communication with the vacuum device at each of the points where the sieves intersect at the edges of the base and the mesh part so that the film is in close contact with the upper surface of the base part to increase accuracy.

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On the other hand, the second embodiment of the present invention is disposed between the film and the work table that requires laser processing base portion for supporting the film from the bottom while preventing the work table from being damaged by the laser during processing; It provides a film processing receiving apparatus comprising a; protrusions formed to protrude upwards while being spaced apart from each other by a predetermined interval apart from the edge of the base portion to uniformly support the lower portion of the film.
A protrusion formed in a shape of a square pyramid protruding upward while being spaced apart from each other by a predetermined interval in an area except the edge of the base part to uniformly support the lower part of the film; Including,
In order to remove foreign substances generated during laser processing, a dust collecting space is formed at the lower portion of the protrusion, and a dust collecting nipple for connecting to a dust collector is provided at one side of the dust collecting space, and the dust collecting space is disposed between the protrusions. A dust collecting hole communicating with the

In the laser processing, a plurality of vacuum holes communicating with a vacuum device are formed at the edge of the base part so that the film is in close contact with the upper surface of the base part to increase accuracy, and the vacuum hole is formed in at least one of the protrusions. It is done.

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In addition, the dust collecting hole is characterized in that formed between the projections arranged in a diagonal direction.

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According to the present invention, it is possible to prevent the work table from being damaged by the laser when machining holes in the film by using a laser, and in particular, by effectively collecting dust and other matters generated during processing, the film processing quality and precision are excellent. have.

1 is a block diagram showing a conventional film processing apparatus,
2 is a cross-sectional view showing a conventional film processing method using a nonwoven fabric;
3 is a plan view showing a first embodiment of the present invention;
4 is a side cross-sectional view of a first embodiment of the present invention;
5 is a plan view showing a second embodiment of the present invention;
Figure 6 is a side sectional view of a second embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 are plan and side cross-sectional views showing a first embodiment of the present invention. First, a first embodiment of the present invention will be described with reference to FIGS. 3 and 4.

For reference, the first and second embodiments according to the present invention are disposed between the film F and the work table 5 that require laser processing so that the laser beam does not touch the work table 5 during processing. The present invention relates to a supporting apparatus for film processing that prevents damage to the work table 5 by supporting the film F at the bottom thereof so that processing can be performed precisely and easily. The laser processing herein uses a laser beam. To process the hole in the film or to cut the film.

According to the present invention, the supporting apparatus for film processing is presented in two embodiments, which will first be described with reference to the first embodiment of the present invention.

The first embodiment of the present invention largely comprises a base portion 100, and a mesh portion 200.

The base portion 100 is a part forming the overall appearance of the present invention is installed on the work table (5) so that the upper surface of the base portion 100 is in contact with the lower surface of the film (F).

That is, the base part 100 is disposed between the film F and the work table 5 to support the film F from below while preventing the work table 5 from being damaged by a laser during processing. Will be

In addition, the mesh part 200 is formed in the remaining area except for the edge of the base part 100, and is a part that uniformly supports and supports the lower portion of the film F in a net form.

The reason why the mesh portion 200 is formed in a net shape is that the laser penetrates through the film F and reaches the bottom thereof when the hole is processed by irradiating a laser on the film F. At this time, the laser does not touch well. This is because it is best to minimize the contact area with the lower surface of the film (F) in order to effectively support the film (F) while preventing the laser from touching well.

Thus, as shown in FIG. 4, the mesh unit 200 preferably has a structure in which a cross section of a sieve 220 around the periphery thereof becomes narrower toward the top to form one body 210.

That is, the sieve 220 of the mesh unit 200 is preferably formed to have a cross section of a triangular or trapezoidal shape. When the structure is formed as such, the lower surface of the film F and the film F are stably supported. Since the contact area of the film can be minimized, the laser can be processed to a stable and excellent quality when processing holes in the film (F).

Meanwhile, as shown in FIG. 4, the base part 100 has a dust collecting space 110 formed below the mesh 200, and at one side of the dust collecting space 110, the apparatus of the present invention. It is preferable that a dust collecting nipple 111 to be connected to the dust collector 20 provided separately from is formed.

When processing the film (F) by using a laser, foreign matter or dust that may be dropped out of the film (F) may occur, such foreign matter must be effectively removed to stick to the film (F) or the apparatus according to the present invention. The processing quality is excellent.

Accordingly, a dust collecting space 110 is formed at an inner lower portion of the base 100, and the dust collecting space 110 is connected to the dust collector 20 to collect foreign substances generated during laser processing. Foreign matters generated during processing are introduced into the dust collecting space 110 through the body 210 of the mesh unit 200 and then pass through the dust collecting nipple 111 to enter the dust collector 20.

3 and 4, it is preferable that a plurality of vacuum holes 120 are formed at the edge of the base part 100 in communication with the vacuum device 30 provided separately from the device of the present invention. However, the vacuum hole 120 is configured to increase the precision by making the film (F) in close contact with the upper surface of the base portion 100 during processing.

The vacuum hole 120 may be formed only at the edge of the base part 100, but more preferably, in order for the film F to be in close contact with the sieve 220 at the mesh part 200. The vacuum hole 120 may be formed.

Therefore, the negative pressure formed in the vacuum device 30 affects the vacuum holes 120 so that the lower surface of the film F is vacuum-pressured to the upper surface of the base portion 100 and the upper surface of the mesh portion 200. To be adsorbed.

In addition, when the processing of the film (F) is finished, the film (F) has to be transferred, so that the vacuum pressure applied by the vacuum device 30 should be released. Of course, as long as the vacuum pressure is released, the film F is freed from the base part 100 and the mesh part 200 so that there is no problem in conveying at all, but more preferably, a predetermined compression is performed through the vacuum hole 120. Air is good.

Therefore, it is preferable to use the vacuum device 30 that is provided with not only a vacuum pressure but also compressed air, and when the compressed air is supplied through the vacuum device 30 after the end of the processing, the film F according to the present invention. It is easily separated from the device, and the transfer of the film F becomes easier.

On the other hand, with reference to Figures 5 and 6 will be described a second embodiment according to the present invention.

The second embodiment of the present invention includes a base part 100 and a protrusion part 300.

Since the base part 100 is the same as the first embodiment of the present invention, a separate description is omitted here and only the protrusion part 300 will be described.

The protrusion part 300 is formed to protrude upward while being spaced apart from each other at predetermined intervals except for the edge of the base part 100 to uniformly support the lower portion of the film (F).

Unlike the mesh part 200 described above, the protrusion part 300 is not connected to each other but is formed to maintain a constant distance in the horizontal direction on the base part 100, so that the contact area with the film F is further reduced. Is less likely to reach compared to the mesh portion 200.

Here, it is important that the top height of the protrusion part 300 is set to be the same as the edge of the base part 100 so that the entire upper surface thereof is kept flat.

The protrusion part 300 is not particularly limited in shape, but preferably, as shown in the drawing, the upper part may be formed in a quadrangular pyramid shape having a quadrangular shape so as to stably support the film F, but is not limited thereto. The upper end of the protrusion 300 may be a square pyramid shape ending in the form of a vertex.

In addition, although not shown in the drawings, the protrusion part 300 may have a cone shape in which an upper end ends in a vertex shape, and may have a circular cone shape in which an upper surface thereof has a circular shape.

Meanwhile, a dust collecting space 110 is formed at the bottom of the protrusion part 300 in the base part 100, and a dust collecting nipple 111 is connected to the dust collector 20 at one side of the dust collecting space 110. Is provided, it is preferable that the dust collecting hole 400 is in communication with the dust collecting space 110 between the protrusions 300 is formed.

The reason why the dust collecting space 110 and the dust collecting nipple 111 are described above is omitted. However, in the second embodiment of the present invention, the dust collecting hole 400 should be provided separately. In the case of the mesh unit 200, the body 210 naturally occurs during processing in place of the function of the dust collecting hole 400. Although foreign matters may be introduced into the dust collecting space 110 through the body 210, in the second embodiment of the present invention, foreign matters may be provided only when a separate dust collecting hole 400 is provided between the protrusions 300. It may flow into the dust collecting space 110.

Here, although the dust collecting hole 400 may be formed between the protrusions 300 arranged in the horizontal or vertical direction, a problem may arise between the dust collecting holes 400 and the protrusions 300. More preferably, the dust collecting hole 400 may be formed between the protrusions 300 arranged in the diagonal direction as shown in FIG. 5.

In addition, it is preferable that a plurality of vacuum holes 120 are formed at the edge of the base part 100 to communicate with the vacuum device 30 provided separately from the device of the present invention. The vacuum hole 120 may facilitate the adsorption and separation of the film F because not only the vacuum pressure acting on the vacuum device 30 but also the compressed air may also act.

On the other hand, in the second embodiment of the present invention, since the vacuum hole 120 is formed only at the edge of the base portion 100, the film F is the remaining area except the edge of the base portion 100, that is, the protrusion portion 300 ) May occur and may not be in close contact with the formed area.

Therefore, as shown in FIG. 5, it is preferable that the vacuum hole 120 is additionally formed in at least one of the plurality of protrusions 300.

The most stable adsorption of the film F is to allow the vacuum hole 120 to be formed in all of the protrusions 300, but since this increases the contact area with the film, the vacuum as shown in FIG. The hole 120 is preferably formed to the minimum in the range that the film is not lifted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the invention is not limited to the disclosed exemplary embodiments. It is to be understood that the invention is not limited thereto.

100: base 110: dust collecting space
111: dust collecting nipple 120: vacuum hole
200: mesh portion 210: body
220: sieve 300: protrusion
400: dust collecting hole

Claims (10)

A base portion 100 disposed between the film F requiring the laser processing and the work table 5 to support the film F from below while preventing the work table 5 from being damaged by the laser during processing;
One body (B) is supported to prevent the laser from contacting the work table 5 while supporting the film F, and to minimize the contact area with the lower surface of the film F so that the film F processing is performed. A mesh-shaped mesh part 200 formed of a structure in which a cross section of the sieve 220 in the periphery forming the 210 becomes narrower toward the top; Including,
The point where the sieve 220 intersects at the edge of the base part 100 and the mesh part 200 so that the film F is in close contact with the upper surface of the base part 100 during laser processing to increase accuracy. Support device for film processing, characterized in that formed in each of a plurality of vacuum holes 120 in communication with the vacuum device (30). delete The dust collecting space 110 is formed at the lower portion of the mesh unit 200 in the base unit 100, and the dust collecting unit is connected to the dust collector 20 at one side of the dust collecting space 110. Nipples (111) is provided support for film processing. delete A base portion 100 disposed between the film F requiring the laser processing and the work table 5 to support the film F from below while preventing the work table 5 from being damaged by the laser during processing;
Protruding portion 300 is formed in the form of a square pyramid protruding upwards at regular intervals apart from the edge of the base portion 100 while being mutually spaced apart to uniformly support the lower portion of the film (F); Including,
In order to remove foreign substances generated during laser processing, a dust collecting space 110 is formed at the lower portion of the protrusion part 300 in the base part 100, and a dust collector 20 is disposed at one side of the dust collecting space 110. A dust collecting nipple 111 is provided to be connected, and a dust collecting hole 400 communicating with the dust collecting space 110 is formed between the protrusions 300.
A plurality of vacuum holes 120 are in communication with the vacuum device 30 at the edge of the base portion 100 so that the film (F) is in close contact with the upper surface of the base portion 100 to increase the precision during laser processing It is formed, the support for the film processing, characterized in that the vacuum hole 120 is formed in at least one of the protrusions (300). delete delete The method according to claim 5, wherein the dust collecting hole 400 is a film processing support device, characterized in that formed between the projections 300 disposed in a diagonal direction.
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