JP4336718B2 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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JP4336718B2
JP4336718B2 JP2007029297A JP2007029297A JP4336718B2 JP 4336718 B2 JP4336718 B2 JP 4336718B2 JP 2007029297 A JP2007029297 A JP 2007029297A JP 2007029297 A JP2007029297 A JP 2007029297A JP 4336718 B2 JP4336718 B2 JP 4336718B2
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semiconductor module
screw
spring
plate spring
hole
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JP2008198644A (en
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治之 松尾
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

この発明は、半導体装置、特に車載用途などの移動体に搭載するインバータなどのパワーモジュールに用いられる半導体装置に関するものである。   The present invention relates to a semiconductor device, and more particularly, to a semiconductor device used in a power module such as an inverter mounted on a moving body for in-vehicle use.

従来よりパワー半導体素子を絶縁樹脂により封止したパワー半導体モジュールは知られているが、このパワー半導体モジュールを固定する手段としては、図６に示すように、
固定用ネジ２とパワー半導体モジュール１の間に押え用板状ばね６を敷設し、固定用ネジ２をパワー半導体モジュールの孔１ａと押え用板状ばね６の孔３ａに貫通させ、さらにネジ孔７ａにねじ込むことによってパワー半導体モジュール１を冷却装置７に固定するものが提案されている（特許文献１参照）。 Conventionally, a power semiconductor module in which a power semiconductor element is sealed with an insulating resin is known. As a means for fixing the power semiconductor module, as shown in FIG.
A holding plate spring 6 is laid between the fixing screw 2 and the power semiconductor module 1, and the fixing screw 2 is passed through the hole 1 a of the power semiconductor module and the hole 3 a of the holding plate spring 6. A device for fixing the power semiconductor module 1 to the cooling device 7 by screwing it into 7a has been proposed (see Patent Document 1).

特開２００４−８７５５２号公報JP 2004-87552 A

従来の半導体装置では、上記のように固定用ネジ２の先端部を冷却装置７のネジ孔７ａにネジ込んで押え用板状ばね６を固定する際、パワー半導体モジュール１に対し押え用板状ばね６がずれないよう押え用板状ばね６の回転方向の位置決めを必要としていた。
この発明は上記のような問題を解決するためになされたものである。 In the conventional semiconductor device, when the front plate spring 6 is screwed into the screw hole 7 a of the cooling device 7 to fix the presser plate spring 6 as described above, the presser plate shape with respect to the power semiconductor module 1 is fixed. In order to prevent the spring 6 from shifting, positioning of the presser plate spring 6 in the rotational direction is required.
The present invention has been made to solve the above problems.

この発明に係わる半導体装置は、半導体素子が樹脂封止され中央部にネジ貫通孔を有する半導体モジュール、この半導体モジュールの一方の面に配置され中央頂部にネジ貫通孔を有する板状ばね、上記半導体モジュールの他方の面に配置され、上記板状ばねのネジ貫通孔と上記半導体モジュールのネジ貫通孔を貫通してネジ込まれたネジで、上記半導体モジュールを固定する固定部材を備え、上記半導体モジュールと上記板状ばねの中央頂部間に、ばね反転防止用スぺ−サを介在させたものである。 A semiconductor device according to the present invention includes a semiconductor module in which a semiconductor element is resin-sealed and has a screw through hole in the center, a plate spring that is disposed on one surface of the semiconductor module and has a screw through hole in the center, and the semiconductor A fixing member that is disposed on the other surface of the module and that is screwed through the screw through hole of the plate spring and the screw through hole of the semiconductor module; And a spacer for preventing spring reversal is interposed between the central tops of the plate springs .

この発明の半導体装置によれば、押え用板状ばねのための特別な回転方向位置決めジグ、あるいは回転方向位置決め突起などを設ける必要がなくなり、したがって半導体モジュールと押え用板状ばねとの部品相互の回り止めを不要とすることができ、工作性を改善し組み立てが簡略化され工数減となる効果がある。
また、半導体モジュールと板状ばねの中央頂部間に、ばね反転防止用スぺ−サを介在させたので、板状ばねのばね反転状態の発生を防ぐことができる。 According to the semiconductor device of the present invention, there is no need to provide a special rotation direction positioning jig or a rotation direction positioning projection for the pressing plate spring, and therefore, the mutual components of the semiconductor module and the pressing plate spring can be reduced. An anti-rotation can be dispensed with, which has the effect of improving workability, simplifying assembly and reducing man-hours.
Further, since the spring reversal prevention spacer is interposed between the semiconductor module and the central top of the plate spring, the occurrence of the spring reversal state of the plate spring can be prevented.

以下、図面に基づいて、この発明の各実施の形態を説明する。
なお、各図間において、同一符号は同一あるいは相当部分を示す。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In addition, the same code | symbol shows the same or an equivalent part between each figure.

実施の形態１．
図１はこの発明の実施の形態１である半導体装置要部の構成を示す斜視図、図２は、図１の斜視断面図である。 Embodiment 1 FIG.
1 is a perspective view showing a configuration of a main part of a semiconductor device according to Embodiment 1 of the present invention, and FIG. 2 is a perspective sectional view of FIG.

以下、図１、２に基づいて実施の形態１を説明する。
図１において、樹脂により封止された半導体素子で構成された半導体モジュール１には、その中央部に取付具としての取付ネジ部材である固定用ネジ２を貫通させるためのネジ貫通孔１aが設けられ、さらに、半導体モジュール１の表面すなわち上面には、押えばね部材である板状ばね３が重合され、その外周縁部が全周にわたり半導体モジュール１の上面に当接している。
この板状ばね３は、皿状（円錐形状）の弾性部材によって形成され、その中央頂部に半導体モジュール１のネジ貫通孔１aに対応してネジ貫通孔３aが設けられ、半導体モジュールの各辺より短小な直径の円錐形状のものである。
半導体モジュール１は、図６の従来例と同様に、ネジ貫通孔１ａとネジ貫通孔３ａを貫通してネジ孔７ａにネジ込まれた固定用ネジ２の締結により、半導体モジュール１の下方に配設された固定部材（例えば冷却用放熱部材としての冷却装置。図６の７参照）に固定される。すなわち、この固定部材７（図６参照）に対する半導体モジュール１の固定は、固定ネジ頭部の、板状ばね３上面に加えられる圧力による弾性的な圧接で行われる。
上記のごとく、板状ばね３を半導体モジュールの各辺より短小な直径の円錐形状にしたので、板状ばね３の組み付け時に、板状ばね３が半導体モジュールの周辺より出っ張ることがなく、したがって回転方向の位置決めは何ら考慮する必要はなく、固定用ネジ２をネジ貫通孔１ａ、ネジ貫通孔３ａに貫通させ締め付けを行えば組み付けは完了する。 The first embodiment will be described below with reference to FIGS.
In FIG. 1, a semiconductor module 1 composed of a semiconductor element sealed with a resin is provided with a screw through hole 1a for allowing a fixing screw 2 as a mounting screw member as a mounting tool to pass through a central portion thereof. Further, a plate spring 3 as a pressing spring member is superposed on the surface, that is, the upper surface of the semiconductor module 1, and its outer peripheral edge is in contact with the upper surface of the semiconductor module 1 over the entire circumference.
The plate-like spring 3 is formed by a plate-like (conical) elastic member, and a screw through hole 3a corresponding to the screw through hole 1a of the semiconductor module 1 is provided at the central top of the plate spring 3 from each side of the semiconductor module. It has a conical shape with a short diameter.
As in the conventional example of FIG. 6, the semiconductor module 1 is arranged below the semiconductor module 1 by fastening the fixing screw 2 that passes through the screw through hole 1a and the screw through hole 3a and is screwed into the screw hole 7a. It is fixed to a fixed member (for example, a cooling device as a cooling heat dissipating member; see 7 in FIG. 6). That is, the semiconductor module 1 is fixed to the fixing member 7 (see FIG. 6) by elastic pressure contact with the pressure applied to the upper surface of the plate spring 3 at the head of the fixing screw.
As described above, since the plate spring 3 has a conical shape with a diameter shorter than each side of the semiconductor module, the plate spring 3 does not protrude from the periphery of the semiconductor module when the plate spring 3 is assembled. There is no need to consider the positioning in the direction, and the assembly is completed when the fixing screw 2 is passed through the screw through hole 1a and the screw through hole 3a and tightened.

実施の形態２．
図３は、板状ばね３の反転現象を示す斜視断面図、図４は、この発明による実施の形態２における半導体装置要部の構成を示す斜視断面図である。
以下、図３、４に基づいて実施の形態２を説明する。
実施の形態１による組み付けの際、板状ばね３の特性である全圧縮時のばね反転現象によって、図３に示すようなばね反転の状態が発生するおそれがある。このような状態になると板状ばね本来の押え力が発生せずばね機能が満足できなくなる。そこで、この実施の形態２では、板状ばね３を全圧縮させず、すなわち反転現象を発生せしめず所定の力量を発生させるために、半導体モジュール１と板状ばね３の中央頂部間に、ばね反転防止用スぺ−サ４を介在させ、板状ばね３の全圧縮を回避しつつ所望の力量を得るようにしている。
このように構成したので、板状ばね３のばね反転状態の発生を防ぐことができる。 Embodiment 2. FIG.
FIG. 3 is a perspective sectional view showing the inversion phenomenon of the plate spring 3, and FIG. 4 is a perspective sectional view showing the configuration of the main part of the semiconductor device according to the second embodiment of the present invention.
The second embodiment will be described below with reference to FIGS.
When assembled according to the first embodiment, a spring reversal state as shown in FIG. 3 may occur due to the spring reversal phenomenon during full compression, which is a characteristic of the plate spring 3. In such a state, the original pressing force of the plate spring is not generated and the spring function cannot be satisfied. Therefore, in the second embodiment, in order to generate a predetermined amount of force without causing the plate spring 3 to be fully compressed, i.e., not causing a reversal phenomenon, a spring is provided between the central top of the semiconductor module 1 and the plate spring 3. A spacer 4 for preventing reversal is interposed to obtain a desired force amount while avoiding total compression of the plate spring 3.
Since it comprised in this way, generation | occurrence | production of the spring reversal state of the plate-like spring 3 can be prevented.

実施の形態３．
図５は、この発明による実施の形態３における半導体装置要部の構成を示す斜視断面図である。
以下、図５に基づいて実施の形態３を説明する。
実施の形態２では、板状ばね３と反転防止用スぺ−サ４とは別々の部材で構成したが、実施の形態３は、この２者（板状ばね３と反転防止用スぺ−サ４）を図５に示すように一体成形し、一体部品５としたものである。
このように２者を一体部品５とすることにより作業性がさらに改善される。 Embodiment 3 FIG.
FIG. 5 is a perspective sectional view showing the structure of the main part of the semiconductor device according to the third embodiment of the present invention.
The third embodiment will be described below with reference to FIG.
In the second embodiment, the plate spring 3 and the reversal prevention spacer 4 are constituted by separate members. However, the third embodiment (the plate spring 3 and the reversal prevention spacer 4). As shown in FIG. 5, the support 4) is integrally molded to form an integrated part 5.
Thus, workability | operativity is further improved by making two persons into the integral component 5. FIG.

この発明による実施の形態１における構成を示す斜視図である。It is a perspective view which shows the structure in Embodiment 1 by this invention. この発明による実施の形態１における構成を示す斜視断面図である。It is a perspective sectional view showing the composition in Embodiment 1 by this invention. この発明による実施の形態２における、ばね反転現象を示す斜視断面図である。It is a perspective sectional view showing a spring reversal phenomenon in Embodiment 2 by this invention. この発明による実施の形態２における構成を示す斜視断面図である。It is a perspective sectional view which shows the structure in Embodiment 2 by this invention. この発明による実施の形態３における構成を示す斜視断面図である。It is a perspective sectional view showing the composition in Embodiment 3 by this invention. 従来例の構成を示す斜視図である。It is a perspective view which shows the structure of a prior art example.

符号の説明Explanation of symbols

１ 半導体モジュール ２ 固定用ネジ
３ 板状ばね ４ 反転防止用スペーサ
５ 板状ばね
１ａ、３ａ ネジ貫通孔 ７ 固定部材（放熱・冷却装置）。 DESCRIPTION OF SYMBOLS 1 Semiconductor module 2 Fixing screw 3 Plate spring 4 Inversion prevention spacer 5 Plate spring 1a, 3a Screw through-hole 7 Fixing member (heat dissipation / cooling device).

Claims (2)

半導体素子が樹脂封止され中央部にネジ貫通孔を有する半導体モジュール、この半導体モジュールの一方の面に配置され中央頂部にネジ貫通孔を有する板状ばね、上記半導体モジュールの他方の面に配置され、上記板状ばねのネジ貫通孔と上記半導体モジュールのネジ貫通孔を貫通してネジ込まれたネジで、上記半導体モジュールを固定する固定部材を備え、上記半導体モジュールと上記板状ばねの中央頂部間に、ばね反転防止用スぺ−サを介在させたことを特徴とする半導体装置。 A semiconductor module in which a semiconductor element is resin-sealed and has a screw through hole in the central part, a plate-like spring having a screw through hole in one central surface of the semiconductor module and the other surface of the semiconductor module. A fixing member for fixing the semiconductor module by a screw threaded through the screw through hole of the plate spring and the screw through hole of the semiconductor module; and a central top of the semiconductor module and the plate spring A semiconductor device characterized by interposing a spacer for preventing spring reversal therebetween . 上記ばね反転防止用スぺ−サは、上記板状ばねと−体に成形したことを特徴とする請求項１記載の半導体装置。 2. The semiconductor device according to claim 1 , wherein the spring reversal prevention spacer is formed into a body with the plate spring .
JP2007029297A 2007-02-08 2007-02-08 Semiconductor device Active JP4336718B2 (en)

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Publication number Priority date Publication date Assignee Title
JP2011035265A (en) * 2009-08-04 2011-02-17 Mitsubishi Electric Corp Semiconductor device
JP2013089711A (en) * 2011-10-17 2013-05-13 Mitsubishi Electric Corp Semiconductor device
JP2014033119A (en) * 2012-08-06 2014-02-20 Mitsubishi Electric Corp Semiconductor device
JP2013118423A (en) * 2013-03-21 2013-06-13 Mitsubishi Electric Corp Semiconductor device
JP6065973B2 (en) 2013-05-09 2017-01-25 三菱電機株式会社 Semiconductor module
JP5754528B2 (en) * 2014-03-19 2015-07-29 三菱電機株式会社 Semiconductor device

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