JP2008258241A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of stably showing original performance by suppressing heat resistance between semiconductor modules and a radiator and also between the radiator and a cooling member. <P>SOLUTION: The semiconductor device includes: the plurality of semiconductor modules 3 where semiconductor elements are sealed with a resin and through-holes are arranged; leaf springs 4 arranged on the upper surfaces of the semiconductor modules 3; a reinforcing beam 5 arranged on the upper surfaces of the leaf springs 4; the radiator 2 formed to be larger than the size of the lower surfaces of the semiconductor modules 3 and arranged on the lower surfaces of the semiconductor modules 3; first fixtures 6 for fixing the semiconductor modules 3 to the radiator 2 by insertion into the through-holes of the semiconductor modules 3 via the reinforcing beam 5 and the leaf springs 4 from the side of the reinforcing beam 5; and a frame part 7 fixedly arranged on the surface of the radiator 2 with the semiconductor modules 3 arranged thereon, so as to enclose the outer periphery of the arrangement of the semiconductor modules 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor device including a semiconductor module mounted on a moving body such as a car, and particularly to reduce the influence of thermal stress due to heat generation.

  Conventionally, in a semiconductor device including a semiconductor module mounted on a moving body such as a car, a plurality of semiconductor modules in which semiconductor elements are sealed with a resin are juxtaposed on a heat sink. Each semiconductor module is provided with a power connection terminal, an output terminal, and a screw through hole provided in the center. The heat sink is provided with a screw hole at a position corresponding to the screw through hole of each semiconductor module. A leaf spring for pressing with a pentroof-shaped cross section is provided on the opposite side of the heat sink of each semiconductor module, and a screw through hole is provided at a position corresponding to the screw through hole of each semiconductor module. It has been. A slit is formed in the pressing plate spring so as to correspond to the position along the boundary between the semiconductor modules. When a notch slit is provided in the holding plate spring, the semiconductor module is fixed to the heat sink by screws inserted into the screw through holes of the semiconductor module from the reinforcing beam side via the reinforcing beam and the holding plate spring. When the screw tightening force is distributed to each semiconductor module.

  As a result, even if there is only one presser plate spring, the holding load is independent for each semiconductor module, so even if there is a variation in the height dimension of each semiconductor module, this can be absorbed. it can. Needless to say, a plurality of semiconductor modules are separated individually, but even if the semiconductor module is an undivided one, a screw is provided by providing a notch slit in the holding plate spring. The tightening force is distributed to each part of the semiconductor module, and a considerable effect can be expected for uniform load.

  The reinforcing beam that reinforces the presser plate spring is provided on the presser plate spring at the center along the longitudinal direction of the presser plate spring. The reinforcing beam is also provided with a screw through hole at a position corresponding to the screw through hole of each semiconductor module. Further, a load is generated (transmitted) at the boundary between the semiconductor modules on the side of the pressing plate spring of the reinforcing beam. Therefore, a protrusion is provided at a position corresponding to the boundary between the semiconductor modules. The protrusions are provided on both sides of the screw through hole. By providing protrusions on the reinforcing beam, it is possible to compensate for the load in the region where the pressing load of the semiconductor module is insufficient.

  Further, by optimizing the height dimension and position of the protrusions, variations in the height dimension of each semiconductor module can be absorbed. This is due to the fact that a protrusion is added at a desired position of the reinforcing beam and the spring effect of reinforcement. Needless to say, a plurality of semiconductor modules are individually separated, but even if the semiconductor module is a single unit that is not divided, by adding a protrusion to the desired position of the reinforcing beam, The tightening force is dispersed in a desired portion of the semiconductor module, and a considerable effect can be expected for uniform load. Furthermore, the use of a reinforcing beam provided with a projection together with a pressing plate spring provided with a notch slit makes the fixing of the semiconductor module more stable.

  In these assemblies, each semiconductor module, pressing plate spring and reinforcing beam are placed on a heat sink with each screw hole and each screw through-hole aligned and tightened to the desired load with screws. Fix the semiconductor module to the heat sink. At this time, the tightening force of the screw is dispersed by the deflection of the pressing plate spring, and a desired uniform load can be applied to each semiconductor module when the pressing plate spring is fully compressed. This is due to the fact that the cross-sectional shape of the holding plate spring is a pent roof type. Further, by using the reinforcing beam, it is possible to supplement the bending rigidity of the presser plate spring and press the presser plate spring more uniformly against each semiconductor module. In this way, a desired uniform load can be applied to each semiconductor module, and the thermal resistance between the semiconductor module and the heat sink can be lowered and stabilized (for example, see Patent Document 1).

Japanese Patent Laying-Open No. 2005-235992

  Conventionally, a semiconductor device is configured to dissipate heat generated in a semiconductor module to a heat sink by heat conduction. However, in order to suppress thermal resistance between the semiconductor module and the heat sink, In general, a paste-like or flexible sheet-like heat conductive member is provided between them. In addition, a cooling member using a coolant such as water or air is attached to the back surface of the heat sink (the surface opposite to the surface on which the semiconductor module is mounted), and the heat generated in the semiconductor module is finally dissipated to the outside air through the coolant. The In general, a paste-like or flexible sheet-like heat conductive member similar to that described above is provided between the heat sink and the cooling member.

  And as a fixing method of a heat sink and a cooling member, a hole is provided in the outer peripheral part of a heat sink, a screw hole corresponding to this hole is provided in a cooling member, and both are provided between both by fastening with a screw. In general, a paste-like or flexible sheet-like heat conductive member is fixed while generating and maintaining a pressure contact force for flowing or deforming. These thermal conductive members have a thermal conductivity of 1 to several W / mK, a thermal conductivity lower than that of other members constituting the heat dissipation path, and a higher thermal conductivity than air. Therefore, in order to suppress the thermal resistance of the entire heat dissipation path, the heat conductive member is pressurized by the pressure contact force between the semiconductor module and the heat sink and the pressure contact force between the heat sink and the cooling member, and the heat conductive member flows or It is necessary to reduce the thickness of the heat conductive member by deforming. Thus, since the thickness of the heat conductive member depends on the pressure contact force between the semiconductor module and the heat sink and the pressure contact force between the heat sink and the cooling member, the pressure contact force between the semiconductor module and the heat sink and between the heat sink and the cooling member is It needs to be as high as possible.

  In addition, if the thickness of the heat conductive member is not uniform, the thermal resistance of the portion where the thickness is large increases, and the performance of the semiconductor device is restricted to the portion where the thermal resistance is large. Therefore, in order for the semiconductor device to exhibit its original performance, it is necessary to make the thickness of the heat conductive member uniform. Since the uniformity of the thickness of the heat conductive member depends on the flatness of the heat sink, the flatness as high as possible is required for the heat sink. Even if sufficient flatness is ensured, if the heat sink is deformed for some reason, the flatness of the heat sink deteriorates. Factors that cause the heat sink to deform include the influence of the pressing force generated by the holding plate spring and the reinforcing beam, and the paste-like or flexible sheet-like heat conductive member provided between the heat sink and the cooling member. The influence of the reaction force at the time of pressurization, the influence of the thermal stress caused by the use environment temperature and the heat generation of the semiconductor module, and the like can be considered.

  In particular, when the heat sink is deformed due to the operating environment temperature or the heat stress caused by the heat generation of the semiconductor module, the generated thermal stress changes and the flatness changes due to the change of the operating environment temperature or the heat generation amount of the semiconductor module. The thickness of the conductive member and thus the thermal resistance changes. In other words, the original performance of the semiconductor device cannot be stably exhibited within the range of the assumed usage environment and usage status. Therefore, it is necessary to suppress the deformation of the heat sink in order for the semiconductor device to stably exhibit its original performance within the range of assumed usage environments and usage conditions. Since the deformation amount of the heat sink depends on the bending rigidity of the heat sink, the bending rigidity of the heat sink is required to be as high as possible. In the case of the conventional semiconductor device described above, if the heat sink is made a thin heat sink in order to reduce the size, weight, and cost, the bending rigidity of the heat sink is reduced. The heat sink is easily deformed by the pressing force generated by the reinforcing beam.

  In particular, the outside of the screw that secures the outermost semiconductor module is not only easily deformed because the heat sink is in a cantilevered state, but also the presser plate spring and reinforcing beam are It is easy to deform because it is in a state. In other words, it is not only difficult to secure the pressure contact force between the semiconductor module and the heat sink, but also the flatness of the heat sink is difficult to secure outside the screw that fixes the semiconductor module disposed on the outermost side. was there. Also, if the heat sink is made thin to reduce size, weight, and cost, the bending rigidity of the heat sink will decrease. The heat sink is easily deformed by a reaction force when a pressure is applied to the heat conductive member by screw fastening with the cooling member. In particular, there is a problem in that it is difficult to reduce the thickness of the heat conduction member because the displacement of the heat sink central portion where the distance from the screw fastening portion on the outer periphery of the heat sink increases is large.

  In addition, if the heat sink is made thin to reduce size, weight, and cost, the heat sink's bending rigidity will decrease, so the heat sink will be affected by the operating environment temperature and thermal stress caused by the heat generated by the semiconductor module. Becomes easier to deform. In addition, since the thermal stress generated changes due to changes in the usage environment temperature and the amount of heat generated in the semiconductor module, the flatness changes, so the original performance of the semiconductor device is stable within the range of the assumed usage environment and usage conditions. There was a problem that could not be demonstrated. In addition, as a material for the heat sink, copper with high thermal conductivity is often used to suppress thermal resistance, but copper is not only difficult to reduce the weight of the semiconductor device because of its large specific gravity, Since the material price is relatively high, the cost of the semiconductor device is hindered.

  In addition, when copper is used as the material of the heat sink, it is common to use a plate material that is easily available. If the machining is minimized to reduce the cost, there is almost no degree of freedom in shape. In particular, there is a problem that it is difficult to improve the shape by increasing the thickness and suppressing the increase in weight while improving the bending rigidity. In addition, since the degree of freedom of the shape is low, when supporting and fixing the control unit, it is necessary to attach a large number of members for supporting and fixing the control unit to the plate-shaped heat sink, increasing the number of parts. However, there is a problem that not only the assembly cost increases but also the assembly process becomes complicated and the productivity is lowered.

  In addition, in order to drive and control the semiconductor module, a control unit having the function is necessary, and it is necessary to examine the arrangement and support / fixing method of the control unit. Not disclosed. If the control unit is provided in the conventional semiconductor device, in order to minimize the installation area of the semiconductor device, a support unit supporting member in the form of a column is provided above the semiconductor module and fixed to the heat sink. A method of fixing the control unit to the support unit is considered to be common. However, in situations where it is subject to severe vibration, such as when it is mounted on an automobile, it is necessary to support at many points, and inevitably a large number of control unit support members are required, which increases costs and increases the number of parts. Productivity deterioration due to the increase is inevitable.

  This invention has been made to solve the above-described problems, and it is possible to reduce the size, weight, cost, and productivity by reducing the thickness of the heat sink as a heat radiating part (thinning). It is possible to suppress the thermal resistance between the semiconductor module and the heat radiating part and between the heat radiating part and the cooling member to be low, and to stably exhibit the original performance in the range of the assumed usage environment and usage conditions. An object of the present invention is to obtain a semiconductor device that can be used.

  The present invention includes one or a plurality of semiconductor modules in which a semiconductor element is sealed with resin and provided with a through hole, a plate spring disposed on the top surface of the semiconductor module, and a reinforcement disposed on the top surface of the plate spring. Inserting the semiconductor module into the through hole of the semiconductor module from the side of the reinforcing beam via the reinforcing beam and the plate spring, the beam, the heat radiation portion formed and arranged on the lower surface of the semiconductor module larger than the size of the lower surface of the semiconductor module A first fixing tool fixed to the heat radiating portion, and a frame portion disposed and fixed so as to surround an outer periphery on which the semiconductor module is disposed on a surface of the heat radiating portion on which the semiconductor module is disposed. It is a thing.

The semiconductor device according to the present invention includes one or more semiconductor modules in which a semiconductor element is sealed with resin and provided with a through hole, a plate spring disposed on the top surface of the semiconductor module, and a plate spring disposed on the top surface. A reinforcing beam formed on the lower surface of the semiconductor module and disposed on the lower surface of the semiconductor module larger than the size of the lower surface of the semiconductor module, and a through hole of the semiconductor module from the reinforcing beam side through the reinforcing beam and the plate spring. A first fixing tool that is inserted into the heat dissipation portion and fixed to the heat dissipation portion, and a frame portion that is disposed and fixed so as to surround an outer periphery on which the semiconductor module is disposed on a surface of the heat dissipation portion on which the semiconductor module is disposed. Therefore, the original performance can be stably exhibited without deformation of the heat dissipating part.

Embodiment 1 FIG.
Embodiments of the present invention will be described below. 1 is an exploded perspective view showing the configuration of the semiconductor device according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which the semiconductor device shown in FIG. 1 is assembled. In the figure, a semiconductor device 1 includes three semiconductor modules 3 in which a semiconductor element is sealed with resin and provided with a through hole, a plate spring 4 disposed on the upper surface of the semiconductor module 3, and the plate shape. As a heat radiating portion made of a metal having high thermal conductivity such as copper or aluminum formed on the lower surface of the semiconductor module 3 larger than the size of the lower surface of the semiconductor module, the reinforcing beam 5 disposed on the upper surface of the spring 4 The first fixing tool comprising the heat radiating plate 2 and a screw for fixing the semiconductor module 3 to the heat radiating plate 2 by inserting the semiconductor module 3 into the through hole of the semiconductor module 3 through the reinforcing beam 5 and the plate spring 4 from the reinforcing beam 5 side. 6 and a frame portion 7 disposed and fixed so as to surround the outer periphery of the heat sink 2 on which the semiconductor module 3 is disposed.

  The frame portion 7 is screwed and fixed to the heat radiating plate 2 by a third fixture 9 made of screws. Further, the frame portion 7 and the heat radiating plate 2 are fixed not only by the third fixture 9 but also by an adhesive applied to the interface between them. In addition, although the frame part 7 and the heat sink 2 showed the example fixed with the 3rd fixing tool 9 and an adhesive agent, you may fix only with an adhesive agent. And between the heat sink 2 and the semiconductor module 3, in order to suppress thermal resistance, the thermal conductivity is a paste-like or flexible sheet-like thermal conductive member (not shown) having a thermal conductivity of about 1 to several W / mK. Is provided. The frame part 7 can be made of a thermoplastic synthetic resin material such as ABS, PBT, or PPS, and can be made of an injection molded product. A plurality of bus bars made of metal having high conductivity such as copper are formed by insert molding (integral molding).

  The exposed portion of the bus bar forms an external terminal 8 as a conductive portion that is electrically connected to the semiconductor module 3. The external terminal 8 is connected to the terminal 32 of the semiconductor module 3 by welding to constitute a desired electric circuit. Needless to say, the connection between the external terminal 8 and the terminal 32 of the semiconductor module 3 is not limited to welding, and may be a connection method other than welding such as screwing. The cooling member that cools the semiconductor device 1 can be fixed by, for example, providing a screw hole at a position corresponding to the hole provided in the outer peripheral portion of the radiator plate 2 of the semiconductor device 1 and screwing the screw into the hole. it can. Moreover, in order to suppress the thermal resistance between the heat radiating plate 2 and the cooling member (not shown), there is a paste or flexible material having a thermal conductivity of about 1 to several W / mK between them. A sheet-like heat conductive member is provided. A control part (not shown) for driving and controlling the semiconductor module 3 is screwed to a support part 60 formed on the heat radiating plate 2 and a support part 71 formed on the frame part 7 to be fixed and supported.

  According to the semiconductor device of the first embodiment configured as described above, since the frame portion is fixed to the heat sink so as to surround the outer periphery where the semiconductor module of the heat sink is disposed, the heat sink is the frame. Even if the heat sink is thinned by the heat sink, the influence of the pressing force generated by the plate spring and the reinforcing beam, and the heat of the paste or flexible sheet provided between the heat sink and the cooling member The deformation of the heat radiating plate due to the influence of the reaction force when pressurizing the conductive member, the influence of the use environment temperature, the thermal stress caused by the heat generation of the semiconductor module, etc. is suppressed. As a result, it is possible to suppress deterioration of the flatness of the heat sink while applying a sufficient pressure contact force between the semiconductor module and the heat sink, and further due to the influence of the use environment temperature and thermal stress caused by the heat generation of the semiconductor module. It is possible to suppress deterioration of flatness of the heat sink, and consequently suppress the thermal resistance between the semiconductor module and the heat sink and between the heat sink and the cooling member, and the expected range of use environment and use situation In addition, it is possible to stably exhibit the original performance of the semiconductor device, and it is possible to reduce the size, weight, and cost by reducing the thickness of the heat sink.

  Further, since the frame portion is made of a synthetic resin material, it can be formed of an injection molded product, and a bus bar that is electrically connected to the semiconductor module can be integrally formed on the frame portion by insert molding. . Therefore, not only wiring work and connection work inside the semiconductor device are facilitated, but also a suitable shape for reinforcing the heat sink and supporting the control unit can be realized easily and relatively inexpensively. It is possible to reduce the number of points, reduce assembly costs, simplify the assembly process, and improve productivity. In addition, since the frame part and the heat radiating plate are fixed by the adhesive, or the adhesive and the third fixing tool, in order to fix the frame part and the heat radiating plate, only the adhesive is used. Uses the third fixture without using the third fixture, or when using the adhesive and the third fixture, minimizes the number of third fixtures used, reduces assembly costs, simplifies the assembly process, and produces It becomes possible to improve the performance. Furthermore, since the frame part and the heat sink can be fixed on almost all surfaces that are not partially fixed as in the case of fixing with the third fixture alone, the heat sink is deformed by the frame part. The effect of the present invention of suppression can be made more remarkable.

Embodiment 2. FIG.
3 is an exploded perspective view showing the configuration of the semiconductor device according to the second embodiment of the present invention, FIG. 4 is a perspective view showing the assembled semiconductor device shown in FIG. 3, and FIG. 5 is the semiconductor device shown in FIG. It is a figure which expands and shows a part of structure of. In the figure, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. The second embodiment is different in that the frame portion 70 is made of a highly rigid metal. If the frame part 70 is made of a metal material, the frame part 70 has a conductive structure, and thus the bus bar cannot be integrally formed with the frame part 70 as in the first embodiment. Therefore, a terminal block constituting internal wiring and external terminals is separately provided. In the second embodiment, a support portion 72 is formed on the frame portion 70, and the control portion is fixedly disposed on the semiconductor device 1 via the support portion 72.

  Further, the frame portion 70 constitutes a reinforcing portion 73 so as to straddle the substantial center of the heat sink 2. The reinforcing portion 73 is configured in consideration of taking as large a dimension in the height direction as possible and providing high rigidity. In order to realize the complicated shape as described above while the frame portion 70 is made of a metal material, the frame portion 70 is manufactured by casting or die casting of iron, aluminum, magnesium, or the like. Similar to the first embodiment, the frame portion 70 and the heat radiating plate 2 are fixed only by the third fixing tool 9 made of screws and an adhesive or an adhesive. In addition, both ends 4a and 4b of the plate spring 4 are connected to the portions 70a and 70b of the frame portion 70 (note that the portion 70a is not shown and the formation location on the drawing is clarified, so the formation location is indicated by a broken line. And the second heat dissipating plate 2 is fastened with a second fixing tool 11 made of screws. In the second embodiment, only both ends of the plate spring 4 are fastened. However, both ends of the plate spring 4 and the reinforcing beam 5 or only both ends of the reinforcing beam 5 may be fastened. Needless to say, it is good. In the second embodiment, both ends 4a and 4b of the plate spring 4 are fastened to the heat radiating plate 2 via the portion 70b of the frame portion 7, but may be directly fastened to the frame portion 7. Good.

  According to the semiconductor device of the second embodiment configured as described above, the frame portion has a high degree of freedom in shape, as well as the same effects as those of the first embodiment. Alternatively, by using a die-cast product, it is possible to achieve a high rigidity and a suitable shape for reinforcing the heat sink and supporting the control unit easily and relatively inexpensively. In addition, since the support part for supporting the control part is provided in the frame part, and the control part is supported and fixed by the frame part, it is not necessary to attach many members for supporting and fixing the control part, and the number of parts is reduced. As a result, assembly costs can be reduced, assembly processes can be simplified, and productivity can be improved. In addition, both ends of the plate spring are fastened to the heat sink via the frame portion, and the outer side of the plate spring and the heat sink is not cantilevered than the semiconductor module disposed on the outermost side. Therefore, it is possible not only to suppress the deformation of the heat sink, but also to suppress the deformation of the plate spring, making it easy to secure the pressure contact force between the semiconductor module and the heat sink, and between the semiconductor module and the heat sink. The thermal resistance of can be further reduced.

  Moreover, when fixing the peripheral part of a heat sink to the water-cooling or air-cooling cooling member attached to the back surface of a heat sink (the surface opposite to the surface where a semiconductor module is mounted), it is a paste provided between a heat sink and a cooling member. Alternatively, a reinforcing part, which is a part of the frame part, is disposed at the approximate center of the heat radiating plate that is most easily deformed by the reaction force of the pressure contact force for flowing or deforming the flexible sheet-like heat conductive member. Therefore, even if the heat sink is made thinner, it is possible to suppress the deterioration of the flatness of the heat sink, and consequently, the thermal resistance between the heat sink and the cooling member is suppressed, and the heat sink is made smaller and lighter by making the heat sink thinner. And cost reduction.

Embodiment 3 FIG.
6 is an exploded perspective view showing the configuration of the semiconductor device according to the third embodiment of the present invention, and FIG. 7 is a perspective view showing a state in which the semiconductor device shown in FIG. 3 is assembled. In the figure, the same parts as those in the above embodiments are denoted by the same reference numerals, and description thereof is omitted. The third embodiment is different in that the frame portion and the heat radiating plate are formed by integral molding and configured as a single base member 12. In order to suppress thermal resistance, the base member 12 is required to have high rigidity and thermal conductivity. Moreover, it is necessary to realize a complicated shape as in the frame part 70 of the second embodiment described above. Therefore, in the third embodiment, the base member 12 is manufactured by die casting of a metal material such as aluminum or magnesium.

  A general aluminum die-cast material (for example, ADC12) has a thermal conductivity of 90 to 100 W / mK, but in recent years, an aluminum die-cast material having a thermal conductivity of around 170 W / mK is available. Therefore, the present embodiment 3 can also be applied to products that require low thermal resistance. Further, the frame portion and the heat radiating plate are formed by integral molding, and even in the case of a single base member 12, the center of the base member 12 is pasty or flexible provided between the base member 12 and the cooling member. The sheet-like heat conductive member is most easily deformed by the reaction force of the pressure contact force for flowing or deforming. Therefore, also in the third embodiment, the reinforcing portion 121 is disposed so as to straddle the substantial center of the base member 12 as in the second embodiment described above.

  According to the semiconductor device of the third embodiment configured as described above, the frame portion and the heat radiating plate are integrally formed as a base member, as well as the same effects as those of the respective embodiments described above. By doing so, not only the number of parts is reduced, the number of members for fixing the frame part and the heat sink is reduced, and the assembly process is simplified, but the frame part and the heat sink are integrated into a single part called a base member. Thus, higher rigidity can be realized, and the effect of the present invention of suppressing deformation of the heat radiating plate becomes more remarkable.

It is a disassembled perspective view which shows the structure of the semiconductor device in Embodiment 1 of this invention. FIG. 2 is a perspective view showing an assembled state of the semiconductor device shown in FIG. 1. It is a disassembled perspective view which shows the structure of the semiconductor device in Embodiment 2 of this invention. FIG. 4 is a perspective view showing an assembled state of the semiconductor device shown in FIG. 3. FIG. 5 is a partially enlarged perspective view showing a portion of the semiconductor device shown in FIG. 4. It is a disassembled perspective view which shows the structure of the semiconductor device in Embodiment 3 of this invention. FIG. 7 is a perspective view illustrating an assembled state of the semiconductor device illustrated in FIG. 6.

Explanation of symbols

1 semiconductor device, 2 heat sink, 3 semiconductor module, 4 plate spring, 5 reinforcing beam,
6 first fixture, 7, 70 frame portion, 8 external terminal, 9 third fixture,
11 Second fixture, 12 Base member, 32 Terminal, 72 Support part,
73,121 Reinforcement part.

Claims (8)

One or a plurality of semiconductor modules in which a semiconductor element is sealed with resin and provided with a through hole, a plate spring disposed on the upper surface of the semiconductor module, and a reinforcing beam disposed on the upper surface of the plate spring. A heat radiating portion formed and disposed on the lower surface of the semiconductor module larger than the size of the lower surface of the semiconductor module, and the semiconductor module from the reinforcing beam side through the reinforcing beam and the plate spring. A first fixing tool that is inserted into the through hole and fixed to the heat radiating portion, and a surface of the heat radiating portion on the surface on which the semiconductor module is disposed so as to surround an outer periphery on which the semiconductor module is disposed. A semiconductor device comprising: a fixed frame portion. The semiconductor device according to claim 1, wherein the frame portion includes a reinforcing portion configured to straddle a substantial center on the heat radiating portion. 3. The semiconductor according to claim 1, wherein the frame portion is made of a synthetic resin material, and a conductive portion electrically connected to the semiconductor module is formed by insert molding. apparatus. The semiconductor device according to claim 1, wherein the frame portion is made of a metal material. The second fixing device that is fixed to the frame portion or to the heat dissipation portion via the frame portion, at both ends of at least one of the plate spring or the reinforcing beam. The semiconductor device according to claim 1. 6. The semiconductor device according to claim 1, wherein the frame portion is fixed to the heat radiating portion with an adhesive or an adhesive and a third fixture. 6. The semiconductor device according to claim 1, wherein the frame part and the heat dissipation part are formed by integral molding. 8. The semiconductor device according to claim 1, wherein a control unit for driving and controlling the semiconductor module is fixed to the frame unit.

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