JP4324124B2 - Cooling device, image display panel manufacturing apparatus and manufacturing method using the same - Google Patents

Description

  The present invention relates to, for example, a cooling device used for cooling after heat-treating a substrate used in the electronic / electrical device, such as an image display panel or a semiconductor device, and an image using the same The present invention relates to a display panel manufacturing apparatus and an image display panel manufacturing method. More specifically, a cooling device is provided that causes a cooling plate to face the heated substrate for the electronic / electric equipment, and absorbs radiant heat by the cooling plate to cool the substrate, an image display panel manufacturing apparatus using the cooling device, and The present invention relates to a method for manufacturing an image display panel.

  Conventionally, in a manufacturing process of an image display panel or a semiconductor, a substrate is heated and cooled under vacuum. Cooling of the heated substrate in a vacuum atmosphere is performed by absorbing radiant heat (radiant heat) from the substrate. For example, Patent Document 1 discloses that when a substrate is cooled in semiconductor manufacturing, a metal plate is provided in parallel with the substrate, and a radiant heat absorption layer is formed on a surface of the metal plate facing the substrate, thereby generating radiant heat generated from the substrate. Is absorbed by the radiation absorbing layer, and the absorbed heat is transferred to the metal plate, and this heat can be exhausted through the metal plate.

JP 7-216550 A

  However, the conventional cooling has the following problems.

  First, the temperature of the substrate subjected to cooling starts to fall from the peripheral edge, particularly the corner, where heat is radiated from the front and back surfaces and the side edge surfaces, but as the substrate size increases, Since the distance between the portion and the edge becomes large and rapid heat conduction is difficult, a large temperature difference is likely to occur between the peripheral portion where cooling is likely to proceed and the central portion where cooling is difficult. The temperature distribution accompanying this cooling causes distortion and breakage of the substrate.

  Secondly, among the substrates that need to be cooled after being heated, for example, a substrate for an image display panel (an electron source substrate or a fluorescent substrate) in an image display panel in which an electron source substrate and a phosphor substrate are arranged to face each other. In many cases, a member having a different emissivity from the substrate itself (for example, a wiring or a phosphor) is provided on a part of the surface of the substrate, such as a body substrate. Further, the substrate for the image display panel will be described as an example. Usually, the substrate is made of glass having a relatively high emissivity, and the wiring is made of a metal having a relatively low emissivity. There is a problem in that the temperature distribution tends to occur from the corner portion of the substrate to be detached and cause distortion or breakage of the substrate. In particular, when the wiring concentrates near the center of the substrate, the temperature distribution due to the first reason is further increased, which may cause the substrate to crack.

  The first object of the present invention is to make the temperature distribution generated between the central portion and the peripheral portion of the plate material easier when the heated substrate is made to face the cooling plate and the radiant heat from the substrate is absorbed and cooled. It is to be able to suppress. In addition, the second object of the present invention is that when the substrate has a different emissivity member having an emissivity different from that of the substrate on at least a part of one surface thereof, the substrate and the different emissivity member are provided. The object is to easily suppress the temperature distribution generated by the substrate due to the difference in emissivity. A third object of the present invention is to make it possible to easily suppress the temperature distribution generated on the substrate during cooling when the image display panel is heated and cooled with the substrate for the image display panel.

The present invention provides a cooling device that cools a substrate with a cooling plate facing the substrate and absorbing radiant heat from the substrate in a vacuum chamber in which the inside is maintained in a vacuum atmosphere .
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one surface of the substrate, and the substrate having the different emissivity member is radiated on a surface of the cooling plate facing the substrate. When the cooling plate is cooled with a uniform rate, the temperature distribution generated in the substrate due to the difference in emissivity between the substrate and the different emissivity member can be reduced. The coating layer has an emissivity different from that of the cooling plate. It is the cooling device characterized by being formed .

The present invention also provides a heating device for heating a substrate in a vacuum chamber in which the inside is maintained in a vacuum atmosphere, and a cooling plate facing the substrate heated by the heating device to radiate heat from the substrate. In an image display panel manufacturing apparatus including a cooling device that absorbs and cools
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one surface of the substrate, and the substrate having the different emissivity member is radiated on a surface of the cooling plate facing the substrate. If the rate was cooled with uniform cooling plate, in a pattern that can reduce the temperature distribution generated in the substrate due to the difference in emissivity of the substrate and the different emissivity member, a coating layer emissivity is different from the cooling plate The image display panel manufacturing apparatus is characterized by being formed .

Further, the present invention is in a vacuum atmosphere, after heating the substrate, having a board which heated the pressurized, so as to face the cooling plate on the substrate, a step of cooling by absorbing radiant heat from the substrate In the manufacturing method of the image display panel,
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one side of the substrate, and the different emissivity member is provided on the surface of the cooling plate facing the substrate as the cooling plate. when cooled with uniform cooling plate emissivity of the substrate having, in a pattern that can reduce the temperature distribution generated in the substrate due to the difference in emissivity of the substrate and the different emissivity member, emissivity and the cooling plate A method for manufacturing an image display panel, wherein a coating layer having a different coating layer is used.

  In the present specification, the emissivity refers to the ratio of the amount of radiation from a sample at the same temperature to the amount of radiation from a black body. It can be measured with a combination of a blackbody furnace and a spectroradiometer.

  According to the present invention, the cooling rate of the substrate surface can be controlled by the different emissivity region provided on the cooling plate, and the entire surface can be cooled at a substantially uniform rate. Occurrence of the temperature distribution that causes the problem can be suppressed.

  Further, according to the present invention, the cooling rate of the substrate surface can also be controlled by the different emissivity region provided on the cooling plate, so that the different emissivity member having an emissivity different from that of the substrate such as wiring is provided. Even if it is provided, the temperature distribution of the substrate caused by it can be reduced, and an image display panel with a high yield can be manufactured.

  Hereinafter, the present invention will be described in more detail with reference to the drawings, taking as an example a case where a substrate for an image display panel is a processing target.

  FIG. 1 is a schematic illustration of a heating / cooling device having a cooling device according to the present invention, which is used as a part of an image display panel manufacturing device, in a state where a substrate is heated. 2 is a schematic explanatory view showing a state where the substrate is cooled by the heating / cooling apparatus of FIG. 1, FIG. 3 is a plan view of a substrate having wiring on one side, which is an example of a processing target, and FIG. It is a figure which shows the pattern of the different emissivity area | region provided substantially corresponding to the formation area of the wiring which the board | substrate shown in FIG. 3 has.

  As shown in FIGS. 1 and 2, the heating / cooling device according to the first example is provided with a heating device 2 and a cooling device 3 separately in a vacuum chamber 1 in which the inside is maintained in a vacuum atmosphere. Therefore, a guide 4 is provided between the heating device 2 and the cooling device 3, and a drive unit 5 that moves in the vacuum chamber 1 along the guide 4 is provided. The image display panel substrate 6 to be processed is horizontally supported by a support arm 7 extending from the drive unit 5, and is transported between the heating device 2 and the cooling device 3 by the movement of the drive unit 5. It is supposed to be.

  The heating device 2 includes a pair of upper and lower plate-like heaters 8a and 8b, a reflector 9 surrounding the heaters 8a and 8b, and a shutter 10 that is opened and closed when the substrate 6 is carried in and out. . The reflector 9 and the shutter 10 are both made of a low emissivity material such as copper, and improve the heating efficiency of the substrate 6 while suppressing heat dissipation outside the heating area. Heat transfer to the substrate 6 during cooling by the cooling device 3 can be reduced.

  Heating of the substrate 6 by the heating device 2 opens the shutter 10, introduces the drive unit 5 supporting the substrate 6 into the support arm 7 into the reflector 9, and quickly closes the shutter 10, as shown in FIG. 1. The substrate 6 is positioned between the heaters 8a and 8b, and is performed by radiant heat from the heaters 8a and 8b facing the upper and lower surfaces of the substrate 6, respectively.

  The image display panel substrate 6 includes, for example, an electron source substrate provided with a plurality of electron-emitting devices and a matrix wiring for driving the electron-emitting devices, and an image by irradiation of electron beams from the electron source substrate. An image display panel in which a phosphor substrate provided with a phosphor to be formed is opposed to each other is used as the electron source substrate or the phosphor substrate. The heating is performed for the formation of wiring and electron-emitting device components, fluorescence In order to form a body, remove adhering components, etc., it is usually carried out a plurality of times until the manufacture of the image display panel is completed. Further, the substrate 6 that has been subjected to the heat treatment as described above is usually once cooled for processing in the next step.

  The substrate 6 in the heating / cooling device of this example is cooled by heating the heating device 2 as described above, and then opening the shutter 10 to bring the drive unit 5 out of the reflector 9 and promptly release the shutter 10. And the drive unit 5 supporting the substrate 6 on the support arm 7 is moved to the cooling device 3.

  The cooling device 3 is housed in the same vacuum chamber 1 as the heating device 2, and faces the upper and lower surfaces of the substrate 6 being conveyed, and has cooling plates 11 a and 11 b each having a facing surface wider than the substrate 6. It has become a preparation. The cooling plates 11a and 11b are made of a material having good thermal conductivity such as aluminum and copper, and have cooling paths 12a and 12b for circulating a cooling medium such as cooling water inside. ing.

  By the way, the substrate 6 for the image display panel, which is the processing target in this example, is an electron source substrate of the image display panel, and as shown in FIG. It has become. The substrate 6 is made of an insulating material such as glass having a high emissivity, and the wiring 13 is made of a metal such as silver whose emissivity is lower than that of the substrate 6. That is, the wiring 13 is a different emissivity member having an emissivity different from that of the substrate 6 itself. Further, the other surface of the substrate 6 is a surface with a substantially uniform emissivity from which an insulating material such as glass having a high emissivity is exposed.

  The substrate 6 heated by the heating device 2 is transported between the cooling plates 11a and 11b of the cooling device 3 by the movement of the drive unit 5 as described above, and radiant heat by the cooling plates 11a and 11b facing the upper and lower surfaces. It is cooled by absorption. The cooling plates 11a and 11b that have absorbed the radiant heat from the substrate 6 are cooled by the refrigerant flowing in the cooling paths 12a and 12b provided respectively.

  When the board | substrate 6 which has the wiring 13 which is a different emissivity member shown by FIG. 3 is cooled with the cooling plates 11a and 11b of a uniform emissivity, the different emissivity member whose emissivity is lower than another area | region While the cooling of the region where the wirings 13 are densely formed is delayed, the four corners of the substrate 6 where the surface of the glass substrate 6 having a high emissivity is widely exposed are quickly cooled. A large temperature distribution is likely to occur.

  Therefore, the surface of the cooling plate 11a, 11b facing the substrate 6 in the cooling device 3 of this example has a temperature distribution generated on the substrate 6 when the surface has a uniform emissivity, as shown in FIG. A different emissivity region 14 having a different emissivity from other regions is provided in correspondence with the formation region of the wiring 13 so as to be reduced. Specifically, the wiring 13 which is a member having a different emissivity in this example has a lower emissivity than the substrate 6 and the cooling of the formation region of the wiring 13 is delayed, so that the heat of the formation region of the wiring 13 is absorbed. In order to facilitate the cooling rate and increase the cooling rate, the different emissivity region 14 in this example is formed as a region having a higher emissivity than other regions on the surface facing the substrate 6 by applying, for example, ceramic coating. Further, as shown in FIG. 4, the different emissivity region 14 is formed in a substantially cross shape, and the four corners of the cooling plates 11a and 11b are aluminum, copper, or the like, which is the base material of the cooling plates 11a and 11b. Since the surface of the material having a high thermal conductivity but a low emissivity compared to the different emissivity region 14 is exposed, the four corners (exposed regions of the substrate 6) on the wiring 13 formation surface of the substrate 6 facing this are exposed. ) Is suppressed, and in combination with the improvement in the cooling rate of the region where the wiring 13 is formed, the occurrence of temperature distribution on the substrate 6 due to cooling is suppressed.

  In addition, when the board | substrate 6 which is a cooling object is glass like this example, since glass has the characteristic which mainly radiates | emits only the limited wavelength of 5 micrometers-20 micrometers, it is natural. However, the emissivity is the spectral emissivity ελ of 5 μ to 20 μ, which is the same wavelength range as this. The emissivity can be measured at any temperature in the range of room temperature to 400 ° C., which is the process temperature.

  The different emissivity region 14 may be formed so as to coincide with the formation region of the wiring 13 which is a different heat radiation member. However, since the peripheral portion is more easily cooled than the central portion of the substrate 6, It is preferable to form a balance smaller than the formation region.

  The above example is a case where the emissivity of the different emissivity member (the wiring 13 in the above example) is lower than that of the substrate 6, but the different emissivity member having an emissivity lower than that of the substrate 6 is provided. In the case where the temperature distribution occurs, the different emissivity region 14 can be dealt with by making the emissivity region higher than other regions.

  The different emissivity region 14 is most preferably provided on each of the cooling plates 12a and 12b facing the upper and lower surfaces (front and back surfaces) of the image display panel substrate 6, but may be only one of them. When only one of them is provided, it is preferably provided on the cooling plate 12a or 12b on the side facing the surface of the substrate 6 on which the different emissivity member is provided.

  When it is desired to further reduce the emissivity of a region other than the different emissivity region 14 on the surface of the cooling plates 12a and 12b facing the substrate 6, the emissivity can be lowered by polishing the region.

  By the way, the substrate 6 for an image display panel is subjected to heating and cooling processes in various states during the manufacturing process of the image display panel. For example, when manufacturing the electron source substrate or the phosphor substrate, it is referred to as baking for removing adhesive components in the state of the substrate 6 alone before providing the electron-emitting device, the wiring 13, the phosphor, and the like. It is cooled after receiving the heat treatment. The state of the substrate 6 alone is a state in which the emissivity is substantially uniform on both the front and back surfaces. When the substrate 6 is alone, the cooling plate 12a, 12b has a circular shape as shown in FIG. 5 or an ellipse shape as shown in FIG. It is preferable to provide the different emissivity region 14 having a high emissivity. By doing so, it is possible to promote the cooling of the central portion of the substrate 6 where the cooling is delayed compared to the peripheral portion of the substrate 6 that is easily cooled due to the wide heat radiation surface, and the temperature generated in the substrate 6 due to the cooling. Distribution can be suppressed. The circular different emissivity region 14 is suitable when the substrate 6 is substantially square, and the elliptical different emissivity region 14 is suitable when the substrate 6 is rectangular.

  Further, when the image display panel substrate 6 is the electron source substrate, the substrate may be subjected to processing in a state where a spacer (not shown) such as glass protrudes in the formation region of the wiring 13 together with the wiring 13. is there. Since this spacer is thin and has a very small heat capacity, it is cooled rapidly during cooling. Therefore, when the spacer is rapidly cooled and the temperature difference from the substrate 6 becomes large, the spacer is likely to crack due to the difference in thermal expansion.

  Therefore, in the cooling of the substrate 6 for an image display panel in which the spacers are provided on the substrate 6 together with the wirings 13 as described above, the different emissivity region having a high emissivity provided substantially corresponding to the formation region of the wirings 13. 14 is not the cooling plate 11a facing the surface of the substrate 6 provided with the wiring 13 and the spacer, but the cooling plate 11b facing the back surface of the substrate 6, and the cooling plate 11a has a different emissivity region having a high emissivity. It is preferable not to have 14.

  Next, a second example of the heating / cooling device having the cooling device according to the present invention, which is used as a part of the image display panel manufacturing device, will be described with reference to FIG.

  The heating / cooling device according to this example is an integrated unit of the heating device 2 and the cooling device 3 shown in FIGS. 1 and 2, and a vacuum chamber having a shutter 70 for taking in and out the substrate 6 for an image display panel. 71, support pins 72 for supporting the substrate 6 substantially horizontally, cooling plates 73a and 73b respectively provided at positions facing the upper and lower surfaces of the substrate 6 supported by the support pins 72, and the substrate 6 And cooling plates 73a and 73b are provided with wire or rod heaters 74a and 74b arranged in parallel with a space between them. The cooling plates 73a and 73b have cooling paths 75a and 75b, respectively.

  The cooling plates 73a and 73b in the present example have different emissivity regions 14 (see FIGS. 4 to 6) according to the state of the substrate 6, similarly to the cooling plates 11a and 11b in the first example. It has become.

  Heating in the heating / cooling apparatus of this example is performed by opening the shutter 70 and supporting the substrate 6 on the support pins 72 between the heaters 74a and 74b (between the cooling plates 73a and 73b) and then closing the shutter 70. This is done by actuating 74. In addition, the heated substrate 6 is cooled without stopping the substrate 6 by stopping the heaters 74a and 74b and flowing the refrigerant through the cooling paths 75a and 75b, as described in the first example. This is performed while suppressing the temperature distribution of the substrate 6 in the different emissivity region 14 (see FIGS. 4 to 6) provided on the plates 73a and 73b. It is preferable that the heaters 74a and 74b have a circular cross section and be as thin as possible so as not to hinder absorption of the radiant heat from the substrate 6 by the cooling plates 73a and 73b as much as possible during this cooling.

  The present invention is not limited to the substrate 6 taken up in the above-described example, that is, glass. For example, even if the main material to be cooled is not glass but ceramic such as SiC, the spectral emissivity ελ is close to a characteristic that is relatively constant at all wavelengths. can do. However, in that case, the total emissivity ε is used as the emissivity, not the spectral emissivity ελ with a limited wavelength. That is, the emissivity in the present invention is the spectral emissivity ελ or the total emissivity ε depending on the characteristics of the cooling target. In addition, the measurement is performed at a temperature suitable for the process.

It is a typical explanatory view in the state where the substrate is heated showing the 1st example of the heating and cooling device which has a cooling device concerning the present invention used as a part of a manufacturing device of an image display panel. It is typical explanatory drawing which shows the state which is cooling the board | substrate with the heating / cooling apparatus of FIG. It is a top view of the board | substrate which has wiring on the single side | surface which is an example of a process target. It is a figure which shows the pattern of the different emissivity area | region provided substantially corresponding to the formation area of the wiring which the board | substrate shown in FIG. 3 has. It is a figure which shows the other pattern of a different emissivity area | region. It is a figure which shows the other pattern of a different emissivity area | region. It is typical explanatory drawing which shows the 2nd example of the heating and cooling device which has a cooling device based on this invention used as a part of manufacturing apparatus of an image display panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vacuum chamber 2 Heating device 3 Cooling device 4 Guide 5 Drive unit 6 Substrate 7 Support arm 8a, 8b Heater 9 Reflector 10 Shutter 11a, 11b Cooling plate 12a, 12b Cooling path 13 Wiring (different emissivity member)
14 Different Emissivity Area 70 Shutter 71 Vacuum Chamber 72 Support Pin 73a, 73b Cooling Plate 74a, 74b Heater 75a, 75b Cooling Path

Claims (7)

In a cooling device that cools a substrate by facing a cooling plate in a vacuum chamber in which the inside is maintained in a vacuum atmosphere and absorbs radiant heat from the substrate,
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one surface of the substrate, and the substrate having the different emissivity member is radiated on a surface of the cooling plate facing the substrate. When the cooling plate is cooled with a uniform rate, the temperature distribution generated in the substrate due to the difference in emissivity between the substrate and the different emissivity member can be reduced. The coating layer has an emissivity different from that of the cooling plate. A cooling device characterized by being formed . Inside the vacuum chamber where the inside is maintained in a vacuum atmosphere, a heating device that heats the substrate, and a cooling plate that faces the substrate heated by the heating device, absorbs radiant heat from the substrate and cools it. In an image display panel manufacturing apparatus comprising a cooling device,
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one surface of the substrate, and the substrate having the different emissivity member is radiated on a surface of the cooling plate facing the substrate. If the rate was cooled with uniform cooling plate, in a pattern that can reduce the temperature distribution generated in the substrate due to the difference in emissivity of the substrate and the different emissivity member, a coating layer emissivity is different from the cooling plate An apparatus for manufacturing an image display panel, which is formed . The different emissivity member is a wire emissivity is lower than the substrate formed on one surface of said substrate, said coating layer, than the cooling plate is provided in a pattern corresponding to a formation region of schematic the wiring the image display panel manufacturing apparatus according to claim 2, wherein the emissivity is high. On one surface of the substrate on which the wiring is formed, the are spacer with wiring is projected, the cooling plate, wherein the coating layer is provided, characterized in that it is located on the other side of the substrate The apparatus for manufacturing an image display panel according to claim 3 . In a vacuum atmosphere, after heating the substrate, a board which heated the pressurized, so as to face the cooling plate on the substrate, method of manufacturing an image display panel having a step of cooling by absorbing radiant heat from the substrate In
A different emissivity member having an emissivity different from that of the substrate is provided on at least a part of one side of the substrate, and the different emissivity member is provided on the surface of the cooling plate facing the substrate as the cooling plate. when cooled with uniform cooling plate emissivity of the substrate having, in a pattern that can reduce the temperature distribution generated in the substrate due to the difference in emissivity of the substrate and the different emissivity member, emissivity and the cooling plate A method for producing an image display panel, wherein a coating layer having a different coating layer is used. The different emissivity member, than the substrate formed on one surface of the substrate is lower wiring emissivity, the coating layer is provided in a pattern corresponding to a formation region of schematic the wiring from the cooling plate The method of manufacturing an image display panel according to claim 5 , wherein emissivity is high . On one surface of the substrate on which the wiring is formed, the wiring and the spacer is projected with, claims a cooling plate, wherein the coating layer is provided, characterized in that is positioned on the other surface of the substrate 6. A method for producing an image display panel according to 6 .

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