JP4307700B2 - Ultrasonic transducer - Google Patents

Ultrasonic transducer Download PDF

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Publication number
JP4307700B2
JP4307700B2 JP2000254185A JP2000254185A JP4307700B2 JP 4307700 B2 JP4307700 B2 JP 4307700B2 JP 2000254185 A JP2000254185 A JP 2000254185A JP 2000254185 A JP2000254185 A JP 2000254185A JP 4307700 B2 JP4307700 B2 JP 4307700B2
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piezoelectric element
block
rib
ultrasonic
blocks
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JP2002066456A (en
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隆弘 米澤
浩之 清村
哲也 徳永
達雄 笹岡
雅彦 橋本
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Wire Bonding (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体素子などの接合に使用されるスタッドバンプの形成やワイヤリングの形成のための超音波ホーン用の超音波振動子に関するものである。
【０００２】
【従来の技術】
従来から、ＩＣ関連のワイヤボンディング技術を応用して、金バンプをフリップチップＩＣの電極パッド部に超音波接合するスタッドバンプボンディング技術が知られている。
【０００３】
通常、ワイヤボンディングやバンプ形成には、図５に示すような、６０ＫＨｚから１２０ＫＨｚ程度の振動周波数の超音波ホーン装置が用いられている。超音波ホーン装置は、超音波振動子２１と、超音波ホーン２２と、ワイヤを挿通しＩＣチップに接合するキャピラリー２３とから構成されている。その超音波振動子２１には、図６に示すような、中空の圧電素子３１と、その前後に設けたブロック３２、３３とをボルト３４で締め上げて構成されたランジュバン型ボルト締め振動子に代表されるものが用いられている。
【０００４】
【発明が解決しようとする課題】
しかしながら、図６に示す従来の技術における超音波振動子２１は、中空の圧電素子３１と、その前後に設けたブロック３２、３３から成る半波長の長さを有する共振状態と、前後に設けたブロック間を締め上げるボルト３４の半波長の長さを有する共振状態とが合成された半波長の長さを有する共振状態を形成させなければならない。ところが、ＩＣ接合温度の低温化やファインピッチ化に対応するために、超音波振動子の高周波化が求められてくると、圧電素子３１とブロック３２、３３とボルト３４間の共振状態の形成が困難になってくるという問題がある。
【０００５】
本発明は、上記従来の問題点に鑑み、周波数の高い高周波で安定した超音波振動を実現でき、良好なボンディングが可能な超音波振動子を提供することを目的としている。
【０００６】
【課題を解決するための手段】
本発明の超音波振動子は、中空の圧電素子と、圧電素子の背面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックと、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックとを有し、圧電素子の前後に設けた各ブロックのリブ間をボルトで締結したものであり、圧電素子とその前後のブロックとが、それぞれ半波長の整数倍の長さから構成され、各ブロックのリブは超音波振動の節にあたり、その節（リブ）間を締結するボルトは共振する必要がない。したがって、圧電素子とその前後のブロックの長さを管理することで安定した振動特性を実現することができる。
【０００７】
また、圧電素子の背面と前面に設けられたブロックは導電性ブロックにて構成することができ、その場合圧電素子の背面の導電性ブロックより絶縁物を介してボルトを通すのが好ましい。
【０００８】
また、圧電素子の背面に設けたブロックのリブ中央にボルト穴を設け、圧電素子の前面に設けたブロックのリブ中央にねじ穴を設け、圧電素子の背面のブロックよりボルトを通して前面のブロックのねじ穴にねじ込み、ブロック間を締結すると、ボルトを締結するナットを不要にできる。
【０００９】
また、本発明の超音波振動子は、中空の圧電素子と、圧電素子の背面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有する導電性ブロックと、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有する導電性ブロックとを有し、さらに前面に中空の圧電素子と、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックの組み合わせを整数倍有し、端部のブロックのリブ間を、絶縁物を介してボルトで締結したものであり、圧電素子とその前後のブロックとが複数個それぞれ半波長の整数倍の長さから構成され、各ブロックのリブは超音波縦振動の節にあたり、その節（リブ）間を締結するボルトは共振する必要がない。したがって、複数個の圧電素子とその前後の複数個のブロックとの、それぞれの長さを管理することで、安定した高パワー（高振幅）の振動特性を実現することができる。
【００１０】
【発明の実施の形態】
以下、本発明の超音波振動子の各実施形態について、図１〜図４を参照して説明する。
【００１１】
（第１の実施形態）
本実施形態の超音波振動子の構成を示す図１において、超音波振動子１は、中空で、両端に電極１７、１８を有する圧電素子１１と、圧電素子１１の背面に設けられた内側中央部にリブ１２ａを持つ半波長の整数倍の長さを有する導電性のブロック１２と、圧電素子１１の前面に設けられた内側中央部にリブ１３ａを持つ半波長の整数倍の長さを有する導電性のブロック１３とを有し、圧電素子１１の前後に設けたブロック１２、１３のリブ１２ａと１３ａ間を、圧電素子１１の背面側の導電性ブロック１２より絶縁カラー１５を介してボルト１４を通し、前面側のブロック１３のリブ１３ａに当接配置したナット１６をボルト１４の先端部の雄ねじ部１４ａに螺合し、締結して構成されている。１２ｂ、１３ｂは、リブ１２ａ、１３ａの中心に形成されたボルト穴である。
【００１２】
この超音波振動子１は、図４に示すように、超音波ホーン２に取付けられ、圧電素子１１の両端電極１７、１８に超音波発振器４により超音波信号が与えられる。
【００１３】
次に、動作を説明する。中空の圧電素子１１の電極１７、１８に超音波発振器４より超音波信号が与えられると、圧電素子１１が振動を発生し、その前後に設けられた各ブロック１２、１３が共振され、超音波振動子１全体が共振状態となる。これと同時に、超音波ホーン２、キャピラリ３を含む全体が共振状態となる。
【００１４】
その際にも圧電素子１１と、その前後のブロック１２、１３がそれぞれ半波長（λ／２）の整数倍の長さに構成され、各ブロック１２、１３のリブ１２ａ、１３ａは超音波振動の節に当たり、その節間を締結するボルト１４は共振する必要がないので、圧電素子１１とその前後のブロック１２、１３の長さを管理することで安定した振動特性を実現することができる。
【００１５】
（第２の実施形態）
本実施形態の超音波振動子の構成を示す図２において、超音波振動子１は、中空で、両端に電極１７、１８を有する圧電素子１１と、圧電素子１１の背面に設けられた内側中央部にリブ１２ａを持つ半波長の整数倍の長さを有する導電性のブロック１２と、圧電素子１１の前面に設けられた内側中央部にリブ１３ａを持つ半波長の整数倍の長さを有する導電性のブロック１３とを有し、圧電素子１１の背面に設けた導電性のブロック１２のリブ１２ａの中央にボルト穴１２ｂを設け、圧電素子１１の前面に導電性のブロック１３のリブ１３ａの中央にねじ穴１３ｃを設け、圧電素子１１の背面側の導電性のブロック１２より絶縁カラー１５を介してボルト１４を通し、圧電素子１１の前面側の導電性のブロック１３のねじ穴１３ｃにねじ込み、ブロック１２、１３間を締結して構成されている。この実施形態ではブロック１３のリブ１３ａにねじ穴１３ｃを形成しているので、ナット１６が不要となる。
【００１６】
この超音波振動子１は、図４に示すように、超音波ホーン２に取付けられ、圧電素子１１の両端電極１７、１８に超音波発振器４により超音波信号が与えられる。
【００１７】
次に、動作を説明する。中空の圧電素子１１の電極１７、１８に、超音波発振器４より超音波信号が与えられると、圧電素子１１が振動を発生し、その前後に設けられた各導電性のブロック１２、１３が共振され、超音波振動子１全体が共振状態となる。これと同時に、超音波ホーン２、キャピラリ３を含む全体が共振状態となる。
【００１８】
その際にも圧電素子１１と、その前後の導電性のブロック１２、１３がそれぞれ半波長（λ／２）の整数倍の長さに構成され、各ブロック１２、１３のリブ１２ａ、１３ａは超音波振動の節に当たり、その節間を締結するボルト１４は共振する必要がないので、圧電素子１１とその前後のブロック１２、１３の長さを管理することで安定した振動特性を実現することができる。
【００１９】
（第３の実施形態）
本実施形態の超音波振動子の構成を示す図３において、超音波振動子１は、中空で、両端に電極１７、１８を有する圧電素子１１ａと、圧電素子１１ａの背面に設けられた内側中央部にリブ１２ａを持つ半波長の整数倍の長さを有する導電性のブロック１２と、圧電素子１１ａの前面に設けられた内側中央部にリブ２０ａを持つ半波長の整数倍の長さを有する導電性のブロック２０を有し、さらにその前面に中空の前端に電極１９を持つ圧電素子１１ｂと、この圧電素子１１ｂの前面に設けられた内側中央部にリブ１３ａを持つ半波長の整数倍の長さを有する導電性のブロック１３の組み合わせを整数倍有し、端部の導電性のブロック１２、１３のリブ１２ａ、１３ａ間を、絶縁カラー１５を介してボルト１４とナット１６で締結して構成されている。
【００２０】
この超音波振動子１は、図４に示すように、超音波ホーン２に取付けられ、圧電素子１１ａの電極１８と、圧電素子１１ａの電極１７及び圧電素子１１ｂの電極１９との間に超音波発振器４により超音波信号が与えられる。
【００２１】
次に、動作を説明する。中空の圧電素子１１ａ、１１ｂの電極１７、１９（同電位）と電極１８に、超音波発振器４より超音波信号が与えられると、圧電素子１１ａ、１１ｂが振動を発生し、その前後に設けられた各導電性のブロック１２、１３、２０が共振され、超音波振動子１全体が共振状態となる。これと同時に、超音波ホーン２、キャピラリ３を含む全体が共振状態となる。
【００２２】
その際にも圧電素子１１ａ、１１ｂと、その前後の導電性のブロック１２、１３、２０がそれぞれ半波長（λ／２）の整数倍の長さに構成され、各ブロック１２、１３のリブ１２ａ、１３ａは超音波振動の節に当たり、その節間を締結するボルト１４は共振する必要がないので、圧電素子１１ａ、１１ｂとその前後のブロック１２、１３、２０の長さを管理することで安定した振動特性を実現することができる。
【００２３】
【発明の効果】
本発明の超音波振動子によれば、以上のように中空の圧電素子と、圧電素子の背面と前面にそれぞれ設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックを有し、両ブロックのリブ間をボルトで締結して構成しているので、ブロックのリブは超音波振動の節にあたり、その節であるリブ間を締結するボルトは共振する必要がないので、圧電素子とブロックの長さを管理することで、高い周波数の高周波領域で安定した振動特性を実現でき、この超音波振動子を用いることで良好なボンディング性能を得ることができる。
【図面の簡単な説明】
【図１】本発明の超音波振動子の第１の実施形態を示し、（ａ）は正面図、（ｂ）は縦断正面図、（ｃ）は超音波振動波形図である。
【図２】本発明の超音波振動子の第２の実施形態を示し、（ａ）は正面図、（ｂ）は縦断正面図、（ｃ）は超音波振動波形図である。
【図３】本発明の超音波振動子の第３の実施形態を示し、（ａ）は正面図、（ｂ）は縦断正面図、（ｃ）は超音波振動波形図である。
【図４】本発明の超音波振動子を適用した超音波ホーン装置を示し、（ａ）は正面図、（ｂ）は超音波振動波形図である。
【図５】従来例の超音波振動子を適用した超音波ホーン装置を示し、（ａ）は正面図、（ｂ）は超音波振動波形図である。
【図６】従来例の超音波振動子を示し、（ａ）は正面図、（ｂ）は縦断正面図、（ｃ）は超音波振動波形図である。
【符号の説明】
１ 超音波振動子
１１、１１ａ、１１ｂ 圧電素子
１２ ブロック
１２ａ リブ
１２ｂ ボルト穴
１３ ブロック
１３ａ リブ
１３ｃ ねじ穴
１４ ボルト
１５ 絶縁カラー
２０ ブロック
２０ａ リブ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an ultrasonic transducer for an ultrasonic horn for forming stud bumps and wiring used for joining semiconductor elements and the like.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a stud bump bonding technique is known in which a gold bump is ultrasonically bonded to an electrode pad portion of a flip chip IC by applying an IC-related wire bonding technique.
[0003]
Usually, an ultrasonic horn device having a vibration frequency of about 60 KHz to 120 KHz as shown in FIG. 5 is used for wire bonding or bump formation. The ultrasonic horn device includes an ultrasonic transducer 21, an ultrasonic horn 22, and a capillary 23 that is inserted through a wire and joined to an IC chip. As shown in FIG. 6, the ultrasonic vibrator 21 is a Langevin bolt tightening vibrator configured by tightening a hollow piezoelectric element 31 and blocks 32 and 33 provided before and after the bolt with a bolt 34. Representatives are used.
[0004]
[Problems to be solved by the invention]
However, the ultrasonic transducer 21 in the prior art shown in FIG. 6 is provided at the front and rear, and has a half-wavelength resonance state consisting of a hollow piezoelectric element 31 and blocks 32 and 33 provided at the front and rear thereof. A resonance state having a half-wavelength must be formed by combining a resonance state having a half-wavelength length of the bolt 34 tightening between the blocks. However, when a higher frequency of the ultrasonic vibrator is required in order to cope with the lowering of the IC bonding temperature and the fine pitch, formation of a resonance state between the piezoelectric element 31, the blocks 32, 33, and the bolt 34 is formed. There is a problem that it becomes difficult.
[0005]
In view of the above-described conventional problems, an object of the present invention is to provide an ultrasonic vibrator capable of realizing high-frequency and high-frequency stable ultrasonic vibration and capable of good bonding.
[0006]
[Means for Solving the Problems]
The ultrasonic transducer according to the present invention is provided with a hollow piezoelectric element, a block having a rib with an inner central portion provided on the back surface of the piezoelectric element and having a length that is an integral multiple of a half wavelength, and a front surface of the piezoelectric element. In addition, a block having a length of an integral multiple of a half wavelength with a rib at the inner center portion is fastened with bolts between the ribs of each block provided before and after the piezoelectric element. These blocks are each composed of a length that is an integral multiple of a half wavelength, and the ribs of each block correspond to nodes of ultrasonic vibration, and the bolts that fasten between the nodes (ribs) do not need to resonate. Therefore, stable vibration characteristics can be realized by managing the lengths of the piezoelectric element and the blocks before and after the piezoelectric element.
[0007]
Further, the blocks provided on the back surface and the front surface of the piezoelectric element can be constituted by a conductive block. In this case, it is preferable to pass a bolt through an insulator from the conductive block on the back surface of the piezoelectric element.
[0008]
Also, a bolt hole is provided in the center of the rib of the block provided on the back surface of the piezoelectric element, a screw hole is provided in the center of the rib of the block provided on the front surface of the piezoelectric element, and the screw on the front block is passed through the bolt from the block on the back surface of the piezoelectric element. When the screws are screwed into the holes and the blocks are fastened, nuts for fastening the bolts can be eliminated.
[0009]
Further, the ultrasonic transducer of the present invention includes a hollow piezoelectric element, a conductive block having a length of an integral multiple of a half wavelength having a rib at an inner central portion provided on the back surface of the piezoelectric element, and a piezoelectric element. A conductive block having an integral multiple of a half wavelength with a rib at the inner central portion provided on the front surface, a hollow piezoelectric element on the front surface, and an inner central portion provided on the front surface of the piezoelectric element A combination of blocks having a length that is an integral multiple of a half wavelength with ribs is an integral multiple, and the ribs of the end block are fastened with bolts via an insulator, and the piezoelectric element and its front and back A plurality of blocks each have a length that is an integral multiple of a half wavelength, and the ribs of each block correspond to nodes of ultrasonic longitudinal vibration, and the bolts that fasten between the nodes (ribs) do not need to resonate. Therefore, by managing the lengths of the plurality of piezoelectric elements and the plurality of blocks before and after the piezoelectric elements, stable high power (high amplitude) vibration characteristics can be realized.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the ultrasonic transducer of the present invention will be described with reference to FIGS.
[0011]
(First embodiment)
In FIG. 1 showing the configuration of the ultrasonic transducer of the present embodiment, the ultrasonic transducer 1 is hollow and includes a piezoelectric element 11 having electrodes 17 and 18 at both ends, and an inner center provided on the back surface of the piezoelectric element 11. The conductive block 12 having a length that is an integral multiple of a half wavelength having a rib 12a at the portion, and the length that is an integral multiple of a half wavelength having a rib 13a at the inner central portion provided on the front surface of the piezoelectric element 11 A conductive block 13, and between the ribs 12 a and 13 a of the blocks 12 and 13 provided before and after the piezoelectric element 11, a bolt 14 via an insulating collar 15 from the conductive block 12 on the back side of the piezoelectric element 11. The nut 16 disposed in contact with the rib 13a of the block 13 on the front side is threadedly engaged with the male threaded portion 14a at the tip of the bolt 14 and fastened. 12b and 13b are bolt holes formed at the centers of the ribs 12a and 13a.
[0012]
As shown in FIG. 4, the ultrasonic vibrator 1 is attached to an ultrasonic horn 2, and an ultrasonic signal is given to the both end electrodes 17 and 18 of the piezoelectric element 11 by the ultrasonic oscillator 4.
[0013]
Next, the operation will be described. When an ultrasonic signal is applied from the ultrasonic oscillator 4 to the electrodes 17 and 18 of the hollow piezoelectric element 11, the piezoelectric element 11 generates vibration, and the blocks 12 and 13 provided before and after the vibration are resonated. The entire vibrator 1 is in a resonance state. At the same time, the whole including the ultrasonic horn 2 and the capillary 3 is in a resonance state.
[0014]
Also in this case, the piezoelectric element 11 and the blocks 12 and 13 before and after the piezoelectric element 11 are each configured to have an integral multiple of a half wavelength (λ / 2), and the ribs 12a and 13a of the blocks 12 and 13 are subjected to ultrasonic vibration. Since the bolts 14 that hit between the nodes do not need to resonate, stable vibration characteristics can be realized by managing the lengths of the piezoelectric element 11 and the blocks 12 and 13 before and after the bolt.
[0015]
(Second Embodiment)
In FIG. 2 showing the configuration of the ultrasonic transducer of this embodiment, the ultrasonic transducer 1 is hollow and has a piezoelectric element 11 having electrodes 17 and 18 at both ends, and an inner center provided on the back surface of the piezoelectric element 11. The conductive block 12 having a length that is an integral multiple of a half wavelength having a rib 12a at the portion, and the length that is an integral multiple of a half wavelength having a rib 13a at the inner central portion provided on the front surface of the piezoelectric element 11 A bolt hole 12b is provided in the center of the rib 12a of the conductive block 12 provided on the back surface of the piezoelectric element 11, and the rib 13a of the conductive block 13 is provided on the front surface of the piezoelectric element 11. A screw hole 13c is provided at the center, and a bolt 14 is passed through an insulating collar 15 from a conductive block 12 on the back side of the piezoelectric element 11, and screwed into a screw hole 13c in the conductive block 13 on the front side of the piezoelectric element 11. It is constructed by fastening between blocks 12 and 13. In this embodiment, since the screw hole 13c is formed in the rib 13a of the block 13, the nut 16 becomes unnecessary.
[0016]
As shown in FIG. 4, the ultrasonic vibrator 1 is attached to an ultrasonic horn 2, and an ultrasonic signal is given to the both end electrodes 17 and 18 of the piezoelectric element 11 by the ultrasonic oscillator 4.
[0017]
Next, the operation will be described. When an ultrasonic signal is applied from the ultrasonic oscillator 4 to the electrodes 17 and 18 of the hollow piezoelectric element 11, the piezoelectric element 11 generates vibration, and the conductive blocks 12 and 13 provided before and after the resonance resonate. Then, the entire ultrasonic transducer 1 is in a resonance state. At the same time, the whole including the ultrasonic horn 2 and the capillary 3 is in a resonance state.
[0018]
Also in this case, the piezoelectric element 11 and the conductive blocks 12 and 13 before and after the piezoelectric element 11 are each configured to have an integral multiple of a half wavelength (λ / 2), and the ribs 12a and 13a of the blocks 12 and 13 are super-long. Since the bolt 14 that fastens between the nodes does not need to resonate at the node of the sonic vibration, the stable vibration characteristics can be realized by managing the lengths of the piezoelectric element 11 and the blocks 12 and 13 before and after the bolt. it can.
[0019]
(Third embodiment)
In FIG. 3 showing the configuration of the ultrasonic transducer of this embodiment, the ultrasonic transducer 1 is a hollow piezoelectric element 11a having electrodes 17 and 18 at both ends, and an inner center provided on the back surface of the piezoelectric element 11a. The conductive block 12 having a length that is an integral multiple of a half wavelength having a rib 12a in the portion and the length that is an integral multiple of a half wavelength having a rib 20a at the inner central portion provided on the front surface of the piezoelectric element 11a. A piezoelectric element 11b having a conductive block 20 and having an electrode 19 at the front end of the hollow on the front surface thereof, and an integral multiple of a half wavelength having a rib 13a at the inner central portion provided on the front surface of the piezoelectric element 11b. The combination of the conductive blocks 13 having a length is an integral multiple, and the ribs 12a and 13a of the conductive blocks 12 and 13 at the ends are fastened with bolts 14 and nuts 16 via the insulating collars 15. Composed To have.
[0020]
As shown in FIG. 4, the ultrasonic transducer 1 is attached to an ultrasonic horn 2, and an ultrasonic wave is provided between the electrode 18 of the piezoelectric element 11a and the electrode 17 of the piezoelectric element 11a and the electrode 19 of the piezoelectric element 11b. An ultrasonic signal is given by the oscillator 4.
[0021]
Next, the operation will be described. When an ultrasonic signal is applied from the ultrasonic oscillator 4 to the electrodes 17 and 19 (same potential) and the electrodes 18 of the hollow piezoelectric elements 11a and 11b, the piezoelectric elements 11a and 11b generate vibrations and are provided before and after the vibration. In addition, the conductive blocks 12, 13, and 20 are resonated, and the entire ultrasonic transducer 1 is in a resonance state. At the same time, the whole including the ultrasonic horn 2 and the capillary 3 is in a resonance state.
[0022]
Also in this case, the piezoelectric elements 11a and 11b and the conductive blocks 12, 13, and 20 before and after the piezoelectric elements 11a and 11b are each configured to have an integral multiple of a half wavelength (λ / 2), and the ribs 12a of the blocks 12 and 13 are formed. , 13a corresponds to a node of ultrasonic vibration, and the bolt 14 that fastens between the nodes does not need to resonate. Therefore, the length of the piezoelectric elements 11a, 11b and the blocks 12, 13, 20 before and after the piezoelectric elements 11a, 11b can be controlled stably. Vibration characteristics can be realized.
[0023]
【The invention's effect】
According to the ultrasonic transducer of the present invention, as described above, a hollow piezoelectric element, and a block having a length of an integral multiple of a half wavelength having ribs at inner central portions provided on the back surface and the front surface of the piezoelectric element, respectively. Since the ribs of both blocks are fastened with bolts, the ribs of the blocks hit the nodes of ultrasonic vibration, and the bolts that fasten the ribs that are the nodes do not need to resonate. By managing the lengths of the piezoelectric element and the block, stable vibration characteristics can be realized in a high frequency region of a high frequency, and good bonding performance can be obtained by using this ultrasonic vibrator.
[Brief description of the drawings]
1A and 1B show a first embodiment of an ultrasonic transducer according to the present invention, where FIG. 1A is a front view, FIG. 1B is a longitudinal front view, and FIG. 1C is an ultrasonic vibration waveform diagram;
2A and 2B show a second embodiment of the ultrasonic transducer of the present invention, in which FIG. 2A is a front view, FIG. 2B is a longitudinal front view, and FIG. 2C is an ultrasonic vibration waveform diagram;
3A and 3B show a third embodiment of an ultrasonic transducer according to the present invention, in which FIG. 3A is a front view, FIG. 3B is a longitudinal front view, and FIG. 3C is an ultrasonic vibration waveform diagram;
4A and 4B show an ultrasonic horn device to which the ultrasonic vibrator of the present invention is applied, wherein FIG. 4A is a front view and FIG. 4B is an ultrasonic vibration waveform diagram.
5A and 5B show an ultrasonic horn device to which a conventional ultrasonic vibrator is applied, in which FIG. 5A is a front view and FIG. 5B is an ultrasonic vibration waveform diagram.
6A and 6B show a conventional ultrasonic transducer, in which FIG. 6A is a front view, FIG. 6B is a longitudinal front view, and FIG. 6C is an ultrasonic vibration waveform diagram.
[Explanation of symbols]
1 Ultrasonic vibrator 11, 11a, 11b Piezoelectric element 12 Block 12a Rib 12b Bolt hole 13 Block 13a Rib 13c Screw hole 14 Bolt 15 Insulating collar 20 Block 20a Rib

Claims (4)

中空の圧電素子と、圧電素子の背面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックと、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックとを有し、圧電素子の前後に設けた各ブロックのリブ間をボルトで締結したことを特徴とする超音波振動子。A hollow piezoelectric element, a block having a length that is an integral multiple of a half wavelength having a rib at the inner central portion provided on the back surface of the piezoelectric element, and a half having a rib at the inner central portion provided on the front surface of the piezoelectric element. An ultrasonic transducer comprising: a block having a length that is an integral multiple of the wavelength; and a rib between each block provided before and after the piezoelectric element is fastened with a bolt. 圧電素子の背面と前面に設けられたブロックが導電性ブロックから成り、圧電素子の背面の導電性ブロックより絶縁物を介してボルトを通したことを特徴とする請求項１記載の超音波振動子。2. The ultrasonic transducer according to claim 1, wherein the blocks provided on the back surface and the front surface of the piezoelectric element are made of a conductive block, and a bolt is passed through the insulator from the conductive block on the back surface of the piezoelectric element. . 圧電素子の背面に設けたブロックのリブ中央にボルト穴を設け、圧電素子の前面に設けたブロックのリブ中央にねじ穴を設け、圧電素子の背面のブロックよりボルトを通して前面のブロックのねじ穴にねじ込み、ブロック間を締結したことを特徴とする請求項１又は２に記載の超音波振動子。A bolt hole is provided in the center of the rib of the block provided on the back surface of the piezoelectric element, a screw hole is provided in the center of the rib of the block provided on the front surface of the piezoelectric element, and the screw hole of the front block is passed through the bolt from the block on the back surface of the piezoelectric element. The ultrasonic transducer according to claim 1, wherein the screws are screwed and the blocks are fastened. 中空の圧電素子と、圧電素子の背面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有する導電性ブロックと、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有する導電性ブロックとを有し、さらに前面に中空の圧電素子と、圧電素子の前面に設けられた内側中央部にリブを持つ半波長の整数倍の長さを有するブロックの組み合わせを整数倍有し、端部のブロックのリブ間を、絶縁物を介してボルトで締結したことを特徴とする超音波振動子。A hollow piezoelectric element, a conductive block having a length that is an integral multiple of a half wavelength with a rib at the inner central portion provided on the back surface of the piezoelectric element, and a rib at the inner central portion provided on the front surface of the piezoelectric element. A conductive block having a length that is an integral multiple of the half-wavelength, a hollow piezoelectric element on the front surface, and a length that is an integral multiple of half-wavelength having a rib in the inner central portion provided on the front surface of the piezoelectric element. An ultrasonic vibrator characterized by having an integral multiple of combinations of blocks having a length and fastening between the ribs of the block at the end with a bolt via an insulator.
JP2000254185A 2000-08-24 2000-08-24 Ultrasonic transducer Expired - Fee Related JP4307700B2 (en)

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JP2007288289A (en) * 2006-04-13 2007-11-01 Honda Electronic Co Ltd Ultrasonic transducer and ultrasonic cleaner
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