JP3777245B2 - Ultrasonic wire bonder using compound bending vibration system - Google Patents

Ultrasonic wire bonder using compound bending vibration system Download PDF

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JP3777245B2
JP3777245B2 JP26510097A JP26510097A JP3777245B2 JP 3777245 B2 JP3777245 B2 JP 3777245B2 JP 26510097 A JP26510097 A JP 26510097A JP 26510097 A JP26510097 A JP 26510097A JP 3777245 B2 JP3777245 B2 JP 3777245B2
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capillary
composite bending
vibrator
vibration
tip
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JPH1187437A (en
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次郎丸 辻野
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次郎丸 辻野
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H01L2224/85206—Direction of oscillation
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Description

【０００１】
【発明の属する技術分野】
本発明は、集積回路（ＩＣ）や弾性表面波素子（ＳＡＷデバイス）等の接続線の接合に応用される無方向性超音波ワイヤボンダに関する。
【０００２】
【従来の技術】
従来、半導体用ワイヤボンダとしては共振周波数60KHZ の超音波ワイヤボンダが公知である。
【０００３】
その内容は、共振周波数60KHZ の縦振動の円錐状ホーン先端に設置した溶接チップが、同円錐状ホーンの縦振動で駆動されて一方向の曲げ振動を誘起し、同溶接チップ先端のワイヤと接合面に沿った方向に超音波ワイヤボンディングを実施するものである。
【０００４】
【発明が解決しようとする課題】
然しながら、従来の技術によっては、溶接チップの振動方向が１次元のため、ワイヤの長さ方向に沿ったワイヤボンディングが不可欠で、溶接チップ及び円錐ホーンの振動方向とワイヤ長さ方向が同一方向となるように位置合せする必要があった。このため、ワイヤボンディング時間に機械的な位置合せ時間が加算されて長時間となり、作業効率が低下するので、溶接チップの振動方向に影響を受けない無方向性ワイヤボンダが切望されていた。
【０００５】
本発明の課題は、高作業効率でワイヤボンディング用のキャピラリを脱着、交換可能な無方向性超音波ワイヤボンダを提供することにある。
【０００６】
【課題を解決するための手段】
本発明は、直交する２方向に振動する複合曲げ振動子によって、同振動子の振動モードを２次元的に制御し、同振動子先端にワイヤボンディング用のキャピラリを着脱することが可能なことを見出してなされたものである。
【０００７】
請求項１に記載の本発明は、２個の縦振動子及びそれらの両振動子に直交して結合した複合曲げ振動子よりなる複合曲げ振動系を用い、同複合曲げ振動子の中心部にワイヤ挿通用の穴を貫通させ、該穴の先端にワイヤボンディング用のキャピラリを着脱可能な構造とした複合曲げ振動系を用いた超音波ワイヤボンダにおいて、前記複合曲げ振動子の先端から前記キャピラリの先端までの長さを調整自在に、該キャピラリを該複合曲げ振動子の穴に着脱可能としてなるものである。
【０００９】
【作用】
２個の縦振動子に、それぞれ両振動子に対応した超音波発信器（図示せず）からの電気信号を電歪素子等に印加すると、両振動子は電気信号を音響振動に変換して共振し、両振動子に直交して結合した複合曲げ振動子を励振する。複合曲げ振動子の先端に装着されたキャピラリは、複合曲げ振動に起因する合成振動となり、その先端の振動軌跡は、リサージ図形を画き、縦振動子のそれぞれの振動振幅と位相を電気的に制御することにより、２次元的に調整可能となる。複合曲げ振動子とキャピラリは軸中心に貫通孔があり、同貫通孔にワイヤを挿通して、電気的に調整した振動モードで、複合曲げ振動子を励振すると、キャピラリ先端のワイヤが振動する。ワイヤは被溶接物と加圧状態の下でこすり合わされ、無方向性ボンディングが達成される。
【００１０】
【発明の実施の形態】
以下、本発明の実施の形態を図面に基づいて説明する。
複合曲げ振動の原理を図２に示す。
図２は、２個の縦振動子の共振周波数を同一とし、それぞれの振動振幅（ａ1及びａ2 ）と両振動子の位相差（φ）を制御したときの、複合曲げ振動子の先端の振動軌跡の数例である。
【００１１】
図２でＡ1〜Ａ5はφ＝π/2のときを表わし、それぞれ、Ａ1はａ1＝ａ、ａ2＝0、Ａ2はａ1＝ａ、ａ2＜ａ、Ａ3はａ1＝ａ2＝ａ、Ａ4はａ1＜ａ＝ａ2、Ａ5はａ1＝0、ａ2＝ａの場合のリサ−ジ図形である。同様にＡ6はφ＝0、ａ1＜ａ2、Ａ7はφ＝π、ａ1＜ａ2、Ａ8はφ＝π/4、ａ1＜ａ2、Ａ9はφ＝5π/4、ａ1＜ａ2、Ａ10はφ＝π/4、ａ1＞ａ2、Ａ11はφ＝5π/4、ａ1＞ａ2、Ａ12はφ＝0、ａ1＞ａ2、Ａ13はφ＝π、ａ1＞ａ2の場合のリサージ図形である。
【００１２】
図２より、複合曲げ振動系を用いると、同振動系駆動用の 2個の縦振動子の振動振幅と位相差を電気的に制御することにより、縦振動子の振動方向とワイヤ長さ方向を機械的に一致させること無しに、無方向性ワイヤボンディングが可能となる。
【００１３】
図３は、本発明の原理を示す。図３は、複合曲げ振動子５の先端にキャピラリ６を固定ねじ８でねじ止めにより着脱可能にした例を示す。同図の曲線は、複合曲げ振動子５の先端からキャピラリ６の先端までの長さを、最適長さに選んだ場合の、キャピラリ各点の距離（Ｌ）に対応した相対振動速度を表わす。
【００１４】
セラミックキャピラリ（外径1.6mm 、穴径0.7mm ）の場合は、縦振動子駆動周波数162.1KHZ及び514.4KHZに対して、最適突出長さは6.5mm であった。キャピラリ６は固定用ねじ（Ｍ1.6 、Ｐ0.5 ）で締結する。
【００１５】
図３で、Ｂ1 及びＢ2 は、縦振動子駆動周波数162.1KHZのときの振幅特性で、キャピラリの複合曲げ振動子への締結トルクは、それぞれ0.4kgfcm及び0.2kgfcmである。同様に、Ｂ3 及びＢ4 は縦振動子駆動周波数514.4KHZのときの振幅特性で、キャピラリの複合曲げ振動子への締結トルクはそれぞれ、0.4kgfcm及び0.3kgfcmである。
【００１６】
図３より、キャピラリの突出長さと締付トルクを調整すると、複合曲げ振動子先端（Ｌ＝0 の点）に比較して、キャピラリ先端の振動振幅は拡大され、キャピラリの摩耗の場合にも簡単に交換可能となる。
【００１７】
本発明の一実施の形態を図１に示す。同図で１及び２は、複合曲げ振動子５の駆動用の縦振動子で、両振動子１、２は複合曲げ振動子５の直方体部５Ａを含めて、一波長共振長さとなっている。３及び４は、縦振動子２の電歪素子と電極である（縦振動子１も同様の電歪素子と電極を具備するものであるが省略）。
【００１８】
６は複合曲げ振動子５に固定ねじ８で締結されたキャピラリ、７は複合曲げ振動子５とキャピラリ６の軸中心貫通孔、９及び１０は縦振動子１及び２の縦振動モード、１１及び１２はそれぞれ縦振動子１及び２によって複合曲げ振動子５に誘起された相互に直交する曲げ振動モードである。
【００１９】
図１で、駆動用振動子の金属部分及び複合曲げ振動子を、外径 7mmのアルミニウム合金（JIS A 5056 B）で構成し、複合曲げ振動子の貫通孔は穴径1.6 〜2.0mm とし、キャピラリはアルミナで外径1.6mm 、穴径0.7mm 、長さ11.1mmを使用し、キャピラリ突出長さを6.5mm として同キャピラリを固定用ねじ（Ｍ1.6 、Ｐ0.5 ）で0.4kgfcmのトルクで複合曲げ振動子に締付ける。キャピラリ先端振動速度は、複合曲げ振動子の先端振動速度に比較して、それぞれ駆動周波数162KHZのとき 2倍以上、514KHZのとき 3倍以上の高効率の相対速度が得られた（図３）。
【００２０】
また、 2個の縦振動子の振動振幅と位相差を制御することにより、キャピラリ先端の振動モードは電気的に調整可能な軌跡となり（図２）、無方向性ワイヤボンダが得られた。
【００２１】
【発明の効果】
以上詳述したように、本発明によれば、キャピラリを振動させるために複合曲げ振動系を用いたことにより、この振動系駆動用の縦振動子の振動方向とワイヤ長さ方向とを合致させることを必要とせず、複合曲げ振動子の先端からのキャピラリ長さ（Ｌ）を調整することにより同振動子の先端速度の数倍のキャピラリ先端速度を得ることが可能になり、高作業効率で、ワイヤボンディング用キャピラリを着脱、交換できる無方向性超音波ワイヤボンダを提供することができる。
【図面の簡単な説明】
【図１】 図１は、本発明の複合曲げ振動系を用いた超音波ワイヤボンダと各部の振動モードを示す模式図である。
【図２】 図２は、複合曲げ振動子先端の振動軌跡例である。
【図３】 図３は、本発明の原理を示す複合曲げ振動子へのキャピラリ取付構造と、同キャピラリ突出部の相対振動速度特性である。
【符号の説明】
１、２ 駆動用縦振動子
３ 電歪素子
４ 電極
５ 複合曲げ振動子
６ キャピラリ
７ ワイヤの貫通孔
８ キャピラリ固定ねじ
９、１０ 縦振動子１及び２の振動モード
１１、１２ 複合曲げ振動子の複合曲げ振動モード[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-directional ultrasonic wire bonder applied to the joining of connection lines such as an integrated circuit (IC) and a surface acoustic wave element (SAW device).
[0002]
[Prior art]
Conventionally, as a semiconductor for bonder is known ultrasonic bonder resonance frequency 60KH Z.
[0003]
The contents of the welding tip installed in conical horn tip of the longitudinal vibration resonance frequency 60KH Z is, it is driven by the longitudinal vibration of the conical horn induce unidirectional bending vibration, and the same welding tip end of the wire Ultrasonic wire bonding is performed in a direction along the bonding surface.
[0004]
[Problems to be solved by the invention]
However, depending on the prior art, since the vibration direction of the welding tip is one-dimensional, wire bonding along the length direction of the wire is indispensable, and the vibration direction of the welding tip and the conical horn and the wire length direction are the same direction. It was necessary to align so that For this reason, since the mechanical alignment time is added to the wire bonding time, and the work efficiency is lowered, a non-directional wire bonder that is not affected by the vibration direction of the welding tip has been desired.
[0005]
An object of the present invention is to provide a non-directional ultrasonic wire bonder in which a capillary for wire bonding can be detached and replaced with high work efficiency.
[0006]
[Means for Solving the Problems]
According to the present invention, a composite bending vibrator that vibrates in two orthogonal directions can control the vibration mode of the vibrator two-dimensionally, and a wire bonding capillary can be attached to and detached from the tip of the vibrator. It was found and made.
[0007]
The present invention according to claim 1 uses a composite bending vibration system composed of two longitudinal vibrators and a composite bending vibrator coupled orthogonally to both the vibrators, and at the center of the composite bending vibrator. In an ultrasonic wire bonder using a composite bending vibration system having a structure in which a wire insertion hole is penetrated and a wire bonding capillary is detachable at the tip of the hole, the tip of the capillary is extended from the tip of the composite bending vibrator. The capillary can be attached to and detached from the hole of the composite bending vibrator so that the length up to can be adjusted .
[0009]
[Action]
When an electrical signal from an ultrasonic transmitter (not shown) corresponding to both vibrators is applied to the two longitudinal vibrators to an electrostrictive element or the like, both vibrators convert the electrical signals into acoustic vibrations. A composite bending vibrator that resonates and is coupled orthogonally to both vibrators is excited. The capillary attached to the tip of the composite bending vibrator becomes a composite vibration caused by the composite bending vibration, and the vibration trajectory of the tip draws a resurge figure and electrically controls the vibration amplitude and phase of each longitudinal vibrator. By doing so, it becomes possible to adjust two-dimensionally. The composite bending vibrator and the capillary have a through hole at the axial center, and when the composite bending vibrator is excited in an electrically adjusted vibration mode by inserting a wire through the through hole, the wire at the tip of the capillary vibrates. The wire is rubbed with the work piece under pressure to achieve non-directional bonding.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
The principle of composite bending vibration is shown in FIG .
FIG. 2 shows the tip of the composite bending vibrator when the resonance frequencies of the two longitudinal vibrators are the same, and the vibration amplitudes (a 1 and a 2 ) and the phase difference (φ) between the two vibrators are controlled. These are several examples of vibration trajectories.
[0011]
It represents time in FIG. 2 A1 to A5 is the φ = π / 2, respectively, A1 is a 1 = a, a 2 = 0, A2 is a 1 = a, a 2 < a, A3 is a 1 = a 2 = A, A4 is a resurrection figure when a 1 <a = a 2 and A 5 is a 1 = 0 and a 2 = a. Similarly, A6 is φ = 0, a 1 <a 2 , A7 is φ = π, a 1 <a 2 , A8 is φ = π / 4, a 1 <a 2 , A9 is φ = 5π / 4, a 1 <a 2 ,A10wafai=pai/4,a 1> a 2, A11 is φ = 5π / 4, a 1 > a 2, A12 is φ = 0, a 1> a 2, A13 is phi = [pi, it is a litharge figure in the case of a 1> a 2.
[0012]
As shown in FIG. 2, when a composite bending vibration system is used, the vibration amplitude and the wire length direction of the longitudinal vibrator are controlled by electrically controlling the vibration amplitude and phase difference of the two longitudinal vibrators for driving the vibration system. Non-directional wire bonding is possible without mechanically matching the two.
[0013]
FIG. 3 illustrates the principle of the present invention. FIG. 3 shows an example in which the capillary 6 is detachably attached to the distal end of the composite bending vibrator 5 with a fixing screw 8. The curve in the figure represents the relative vibration speed corresponding to the distance (L) of each capillary point when the length from the tip of the composite bending vibrator 5 to the tip of the capillary 6 is selected as the optimum length.
[0014]
In the case of a ceramic capillary (outer diameter 1.6 mm, hole diameter 0.7 mm), the optimum protrusion length was 6.5 mm for the longitudinal vibrator drive frequencies of 162.1 KH Z and 514.4 KH Z. The capillary 6 is fastened with a fixing screw (M1.6, P0.5).
[0015]
In Figure 3, the B1 and B2, the amplitude characteristic when the longitudinal transducer drive frequency 162.1KH Z, the fastening torque to the composite bending transducer of the capillary, respectively 0.4kgfcm and 0.2Kgfcm. Likewise, B3 and B4 in amplitude characteristic when the longitudinal transducer drive frequency 514.4KH Z, the fastening torque to the composite bending transducer of the capillary, respectively, a 0.4kgfcm and 0.3Kgfcm.
[0016]
As shown in FIG. 3, when the capillary protrusion length and tightening torque are adjusted, the vibration amplitude at the capillary tip is larger than that at the tip of the composite bending vibrator (point of L = 0). Can be replaced.
[0017]
An embodiment of the present invention is shown in FIG. In the figure, 1 and 2 are longitudinal vibrators for driving the composite bending vibrator 5, and both vibrators 1 and 2 have a single-wavelength resonance length including the rectangular parallelepiped portion 5 A of the composite bending vibrator 5. . Reference numerals 3 and 4 denote electrostrictive elements and electrodes of the longitudinal vibrator 2 (the longitudinal vibrator 1 includes similar electrostrictive elements and electrodes, but is omitted).
[0018]
6 is a capillary fastened to the composite bending vibrator 5 with a fixing screw 8, 7 is an axial center through hole of the composite bending vibrator 5 and capillary 6, 9 and 10 are longitudinal vibration modes of the longitudinal vibrators 1 and 2, 11 and Reference numeral 12 denotes bending vibration modes orthogonal to each other induced in the composite bending vibrator 5 by the longitudinal vibrators 1 and 2, respectively.
[0019]
In Fig. 1, the metal part of the driving vibrator and the composite bending vibrator are made of an aluminum alloy (JIS A 5056 B) with an outer diameter of 7 mm, and the through hole of the composite bending vibrator has a hole diameter of 1.6 to 2.0 mm. The capillary is made of alumina with an outer diameter of 1.6 mm, a hole diameter of 0.7 mm, and a length of 11.1 mm. The capillary protruding length is 6.5 mm, and the capillary is fixed with a screw (M1.6, P0.5) with a torque of 0.4 kgfcm. Tighten to the composite bending vibrator with. Compared to the tip vibration speed of the composite bending vibrator, the capillary tip vibration speed was more than twice as high as the driving frequency of 162KH Z , and three times more efficient relative speed at 514KH Z (Fig. 3). ).
[0020]
In addition, by controlling the vibration amplitude and phase difference of the two longitudinal vibrators, the vibration mode of the capillary tip became an electrically adjustable locus (FIG. 2), and a non-directional wire bonder was obtained.
[0021]
【The invention's effect】
As described above in detail, according to the present invention, by using the composite bending vibration system to vibrate the capillary, the vibration direction of the longitudinal vibrator for driving the vibration system matches the wire length direction. Therefore, by adjusting the capillary length (L) from the tip of the composite bending vibrator, it becomes possible to obtain a capillary tip speed several times the tip speed of the vibrator, and with high work efficiency. Further, it is possible to provide a non-directional ultrasonic wire bonder in which a wire bonding capillary can be attached / detached / replaced.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing an ultrasonic wire bonder using a composite bending vibration system of the present invention and vibration modes of each part.
FIG. 2 is an example of a vibration locus at the tip of a composite bending vibrator.
FIG. 3 shows a structure for attaching a capillary to a composite bending vibrator showing the principle of the present invention and a relative vibration velocity characteristic of the protruding portion of the capillary.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 2 Drive longitudinal vibrator 3 Electrostrictive element 4 Electrode 5 Composite bending vibrator 6 Capillary 7 Wire through-hole 8 Capillary fixing screw 9, 10 Vibration modes 11 and 12 of the longitudinal vibrators 1 and 2 of the composite bending vibrator Compound bending vibration mode

Claims (1)

２個の縦振動子及びそれらの両振動子に直交して結合した複合曲げ振動子よりなる複合曲げ振動系を用い、同複合曲げ振動子の中心部にワイヤ挿通用の穴を貫通させ、該穴の先端にワイヤボンディング用のキャピラリを着脱可能な構造とした複合曲げ振動系を用いた超音波ワイヤボンダにおいて、
前記複合曲げ振動子の先端から前記キャピラリの先端までの長さを調整自在に、該キャピラリを該複合曲げ振動子の穴に着脱可能としてなることを特徴とする複合曲げ振動系を用いた超音波ワイヤボンダ。 Using a composite bending vibration system consisting of two longitudinal vibrators and a composite bending vibrator coupled perpendicularly to both of them, a wire insertion hole is passed through the center of the composite bending vibrator, In an ultrasonic wire bonder using a composite bending vibration system in which a capillary for wire bonding can be attached and detached at the tip of the hole ,
Ultrasonic wave using a composite bending vibration system characterized in that the length from the tip of the composite bending vibrator to the tip of the capillary is adjustable, and the capillary can be attached to and detached from the hole of the composite bending vibrator. Wire bonder.
JP26510097A 1997-09-12 1997-09-12 Ultrasonic wire bonder using compound bending vibration system Expired - Lifetime JP3777245B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26510097A JP3777245B2 (en) 1997-09-12 1997-09-12 Ultrasonic wire bonder using compound bending vibration system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26510097A JP3777245B2 (en) 1997-09-12 1997-09-12 Ultrasonic wire bonder using compound bending vibration system

Publications (2)

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JPH1187437A JPH1187437A (en) 1999-03-30
JP3777245B2 true JP3777245B2 (en) 2006-05-24

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261122A (en) * 2001-02-28 2002-09-13 Shibuya Kogyo Co Ltd Bonding apparatus
AU2003273586A1 (en) 2003-09-29 2005-04-14 Asahi E.M.S Co., Ltd. Large capacity ultrasonic composite vibration device
JP2005142537A (en) * 2003-10-15 2005-06-02 Bondotekku:Kk Longitudinal vibration bonding method and device
DE102014100817A1 (en) * 2014-01-24 2015-07-30 Herrmann Ultraschalltechnik Gmbh & Co. Kg converter unit
CN107042198B (en) * 2017-01-18 2019-05-31 皮钧 A kind of two dimensional ultrasonic vibration processing unit (plant) based on guide wire

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