JPH1187437A - Ultrasonic wire bonder using composite bend vibration system - Google Patents
Ultrasonic wire bonder using composite bend vibration systemInfo
- Publication number
- JPH1187437A JPH1187437A JP9265100A JP26510097A JPH1187437A JP H1187437 A JPH1187437 A JP H1187437A JP 9265100 A JP9265100 A JP 9265100A JP 26510097 A JP26510097 A JP 26510097A JP H1187437 A JPH1187437 A JP H1187437A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- vibration
- vibrator
- tip
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
- H01L2224/85206—Direction of oscillation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、集積回路(IC)
や弾性表面波素子(SAWデバイス)等の接続線の接合
に応用される無方向性超音波ワイヤボンダに関する。The present invention relates to an integrated circuit (IC).
The present invention relates to a non-directional ultrasonic wire bonder applied to joining of connection lines such as surface acoustic wave devices (SAW devices) and the like.
【0002】[0002]
【従来の技術】従来、半導体用ワイヤボンダとしては共
振周波数60KHZ の超音波ワイヤボンダが公知である。Conventionally, as a semiconductor for bonder is known ultrasonic bonder resonance frequency 60KH Z.
【0003】その内容は、共振周波数60KHZ の縦振動の
円錐状ホーン先端に設置した溶接チップが、同円錐状ホ
ーンの縦振動で駆動されて一方向の曲げ振動を誘起し、
同溶接チップ先端のワイヤと接合面に沿った方向に超音
波ワイヤボンディングを実施するものである。[0003] the contents of the welding tip installed in conical horn tip of the longitudinal vibration resonance frequency 60KH Z is, is driven by the longitudinal vibration of the conical horn induce unidirectional bending vibration,
The ultrasonic wire bonding is performed in a direction along the bonding surface with the wire at the tip of the welding tip.
【0004】[0004]
【発明が解決しようとする課題】然しながら、従来の技
術によっては、溶接チップの振動方向が1次元のため、
ワイヤの長さ方向に沿ったワイヤボンディングが不可欠
で、溶接チップ及び円錐ホーンの振動方向とワイヤ長さ
方向が同一方向となるように位置合せする必要があっ
た。このため、ワイヤボンディング時間に機械的な位置
合せ時間が加算されて長時間となり、作業効率が低下す
るので、溶接チップの振動方向に影響を受けない無方向
性ワイヤボンダが切望されていた。However, according to the prior art, since the vibration direction of the welding tip is one-dimensional,
Wire bonding along the length direction of the wire is indispensable, and it is necessary to position the welding tip and the conical horn so that the vibration direction and the wire length direction are the same. For this reason, the mechanical alignment time is added to the wire bonding time, resulting in a long time, and the work efficiency is reduced. Therefore, a non-directional wire bonder that is not affected by the vibration direction of the welding tip has been desired.
【0005】本発明の課題は、高作業効率でワイヤボン
ディング用のキャピラリを脱着、交換可能な無方向性超
音波ワイヤボンダを提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a non-directional ultrasonic wire bonder in which a capillary for wire bonding can be detached and replaced with high working efficiency.
【0006】[0006]
【課題を解決するための手段】本発明は、直交する2方
向に振動する複合曲げ振動子によって、同振動子の振動
モードを2次元的に制御し、同振動子先端にワイヤボン
ディング用のキャピラリを着脱することが可能なことを
見出してなされたものである。According to the present invention, a compound bending vibrator vibrating in two orthogonal directions controls a vibration mode of the vibrator two-dimensionally, and a capillary for wire bonding is provided at the tip of the vibrator. It has been found out that it is possible to attach and detach the same.
【0007】請求項1に記載の本発明は、2個の縦振動
子及びそれらの両振動子に直交して結合した複合曲げ振
動子よりなる複合曲げ振動系を用い、同複合曲げ振動子
の中心部にワイヤ挿通用の穴を貫通させ、該穴の先端に
ワイヤボンディング用のキャピラリを着脱可能な構造と
したものである。The present invention according to claim 1 uses a composite bending vibration system comprising two longitudinal vibrators and a composite bending vibrator which is orthogonally coupled to both of these vibrators. A hole for wire insertion is made to penetrate the center, and a capillary for wire bonding can be attached to and detached from the tip of the hole.
【0008】請求項2に記載の本発明は、請求項1に記
載の本発明において更に、前記複合曲げ振動子の先端か
ら前記キャピラリの先端までの長さを調整自在に、該キ
ャピラリを該複合曲げ振動子の穴に着脱可能としてなる
ものである。According to a second aspect of the present invention, in the first aspect of the present invention, the capillary is further combined with the composite bending oscillator such that the length from the tip of the composite bending oscillator to the tip of the capillary is adjustable. It can be attached to and detached from the hole of the bending oscillator.
【0009】[0009]
【作用】2個の縦振動子に、それぞれ両振動子に対応し
た超音波発信器(図示せず)からの電気信号を電歪素子
等に印加すると、両振動子は電気信号を音響振動に変換
して共振し、両振動子に直交して結合した複合曲げ振動
子を励振する。複合曲げ振動子の先端に装着されたキャ
ピラリは、複合曲げ振動に起因する合成振動となり、そ
の先端の振動軌跡は、リサージ図形を画き、縦振動子の
それぞれの振動振幅と位相を電気的に制御することによ
り、2次元的に調整可能となる。複合曲げ振動子とキャ
ピラリは軸中心に貫通孔があり、同貫通孔にワイヤを挿
通して、電気的に調整した振動モードで、複合曲げ振動
子を励振すると、キャピラリ先端のワイヤが振動する。
ワイヤは被溶接物と加圧状態の下でこすり合わされ、無
方向性ボンディングが達成される。When an electric signal from an ultrasonic transmitter (not shown) corresponding to each of the two vibrators is applied to an electrostrictive element or the like, the two vibrators convert the electric signals into acoustic vibrations. It converts and resonates, and excites a composite bending oscillator that is orthogonally coupled to both oscillators. The capillary attached to the tip of the composite bending oscillator becomes a synthetic vibration caused by the composite bending vibration, and the vibration trajectory at the tip draws a litharge figure and electrically controls the vibration amplitude and phase of each of the vertical oscillators By doing so, two-dimensional adjustment is possible. The compound bending vibrator and the capillary have a through hole at the center of the axis. When a wire is inserted into the through hole and the compound bending vibrator is excited in an electrically adjusted vibration mode, the wire at the tip of the capillary vibrates.
The wire is rubbed under pressure with the workpiece to achieve non-directional bonding.
【0010】[0010]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。本発明の原理を図2及び図3に示
す。図2は、2個の縦振動子の共振周波数を同一とし、
それぞれの振動振幅(a1及びa2 )と両振動子の位相
差(φ)を制御したときの、複合曲げ振動子の先端の振
動軌跡の数例である。Embodiments of the present invention will be described below with reference to the drawings. The principle of the present invention is shown in FIGS. FIG. 2 assumes that the resonance frequencies of the two longitudinal vibrators are the same,
Upon controlling the respective vibration amplitude (a 1 and a 2) and the phase difference between both transducers (phi), a few of the vibration locus of the tip of the composite bending transducer.
【0011】同図でA1 〜A5 はφ=π/2のときを表わ
し、それぞれ、A1 はa1 =a、a2 =0 、A2 はa1
=a、a2 <a、A3 はa1 =a2 =a、A4 はa1 <
a=a2 、A5 はa1 =0 、a2 =aの場合のリサ−ジ
図形である。同様にA6 はφ=0 、a1 <a2 、A7 は
φ=π、a1 <a2 、A8 はφ=π/4、a1 <a2 、A
9 はφ= 5π/4、a1 <a2 、A10はφ=π/4、a1 >
a2 、A11はφ= 5π/4、a1 >a2 、A12はφ=0 、
a1 >a2 、A13はφ=π、a1 >a2 の場合のリサー
ジ図形である。[0011] A1 to A5 in the figure represents the case of φ = π / 2, respectively, A1 is a 1 = a, a 2 = 0, A2 is a 1
= A, a 2 <a, A 3 is a 1 = a 2 = a, A 4 is a 1 <
a = a 2 and A5 are the resurgery figures when a 1 = 0 and a 2 = a. Similarly A6 is φ = 0, a 1 <a 2, A7 is φ = π, a 1 <a 2, A8 is φ = π / 4, a 1 <a 2, A
9 φ = 5π / 4, a 1 <a 2 ,A10wafai=pai/4,a 1>
a 2, A11 is φ = 5π / 4, a 1 > a 2, A12 is φ = 0,
a 1> a 2, A13 is phi = [pi, which is litharge figure in the case of a 1> a 2.
【0012】図2より、複合曲げ振動系を用いると、同
振動系駆動用の 2個の縦振動子の振動振幅と位相差を電
気的に制御することにより、縦振動子の振動方向とワイ
ヤ長さ方向を機械的に一致させること無しに、無方向性
ワイヤボンディングが可能となる。FIG. 2 shows that when the composite bending vibration system is used, the vibration direction and the wire direction of the longitudinal vibration are controlled by electrically controlling the vibration amplitude and phase difference of the two longitudinal vibrations for driving the vibration system. Non-directional wire bonding is possible without mechanically matching the length directions.
【0013】図3は、複合曲げ振動子5の先端にキャピ
ラリ6を固定ねじ8でねじ止めにより着脱可能にした例
を示す。同図の曲線は、複合曲げ振動子5の先端からキ
ャピラリ6の先端までの長さを、最適長さに選んだ場合
の、キャピラリ各点の距離(L)に対応した相対振動速
度を表わす。FIG. 3 shows an example in which a capillary 6 is detachably attached to the tip of a composite bending oscillator 5 by screwing with a fixing screw 8. The curve in the figure represents the relative vibration speed corresponding to the distance (L) between each point of the capillary when the length from the tip of the composite bending oscillator 5 to the tip of the capillary 6 is selected to be the optimum length.
【0014】セラミックキャピラリ(外径1.6mm 、穴径
0.7mm )の場合は、縦振動子駆動周波数162.1KHZ及び51
4.4KHZに対して、最適突出長さは6.5mm であった。キャ
ピラリ6は固定用ねじ(M1.6 、P0.5 )で締結する。Ceramic capillary (outer diameter 1.6 mm, hole diameter
0.7mm), the vertical oscillator drive frequency 162.1KH Z and 51
For 4.4KH Z , the optimum protrusion length was 6.5mm. The capillary 6 is fastened with fixing screws (M1.6, P0.5).
【0015】図3で、B1 及びB2 は、縦振動子駆動周
波数162.1KHZのときの振幅特性で、キャピラリの複合曲
げ振動子への締結トルクは、それぞれ0.4kgfcm及び0.2k
gfcmである。同様に、B3 及びB4 は縦振動子駆動周波
数514.4KHZのときの振幅特性で、キャピラリの複合曲げ
振動子への締結トルクはそれぞれ、0.4kgfcm及び0.3kgf
cmである。[0015] In FIG. 3, the B1 and B2, the amplitude characteristic when the longitudinal transducer drive frequency 162.1KH Z, the fastening torque to the composite bending transducer of the capillary, respectively 0.4kgfcm and 0.2k
gfcm. Likewise, B3 and B4 in amplitude characteristic when the longitudinal transducer drive frequency 514.4KH Z, respectively fastening torque to the composite bending transducer of the capillary, 0.4Kgfcm and 0.3kgf
cm.
【0016】図3より、キャピラリの突出長さと締付ト
ルクを調整すると、複合曲げ振動子先端(L=0 の点)
に比較して、キャピラリ先端の振動振幅は拡大され、キ
ャピラリの摩耗の場合にも簡単に交換可能となる。From FIG. 3, when the projecting length of the capillary and the tightening torque are adjusted, the tip of the composite bending oscillator (point L = 0) is obtained.
As compared with the above, the vibration amplitude at the tip of the capillary is enlarged, so that the capillary can be easily replaced even when it is worn.
【0017】本発明の一実施の形態を図1に示す。同図
で1及び2は、複合曲げ振動子5の駆動用の縦振動子
で、両振動子1、2は複合曲げ振動子5の直方体部5A
を含めて、一波長共振長さとなっている。3及び4は、
縦振動子2の電歪素子と電極である(縦振動子1も同様
の電歪素子と電極を具備するものであるが省略)。FIG. 1 shows an embodiment of the present invention. In the figure, reference numerals 1 and 2 denote vertical oscillators for driving the composite bending oscillator 5, and both oscillators 1 and 2 are rectangular parallelepiped portions 5A of the composite bending oscillator 5.
And one wavelength resonance length. 3 and 4 are
These are the electrostrictive element and the electrode of the vertical vibrator 2 (the vertical vibrator 1 includes the same electrostrictive element and electrode, but is omitted).
【0018】6は複合曲げ振動子5に固定ねじ8で締結
されたキャピラリ、7は複合曲げ振動子5とキャピラリ
6の軸中心貫通孔、9及び10は縦振動子1及び2の縦
振動モード、11及び12はそれぞれ縦振動子1及び2
によって複合曲げ振動子5に誘起された相互に直交する
曲げ振動モードである。Reference numeral 6 denotes a capillary fastened to the composite bending oscillator 5 by a fixing screw 8, reference numeral 7 denotes an axial center hole of the composite bending oscillator 5 and the capillary 6, and reference numerals 9 and 10 denote longitudinal vibration modes of the vertical oscillators 1 and 2. , 11 and 12 are longitudinal oscillators 1 and 2 respectively.
And the bending vibration modes induced in the composite bending vibrator 5 at right angles to each other.
【0019】図1で、駆動用振動子の金属部分及び複合
曲げ振動子を、外径 7mmのアルミニウム合金(JIS A 50
56 B)で構成し、複合曲げ振動子の貫通孔は穴径1.6 〜
2.0mm とし、キャピラリはアルミナで外径1.6mm 、穴径
0.7mm 、長さ11.1mmを使用し、キャピラリ突出長さを6.
5mm として同キャピラリを固定用ねじ(M1.6 、P0.5
)で0.4kgfcmのトルクで複合曲げ振動子に締付ける。
キャピラリ先端振動速度は、複合曲げ振動子の先端振動
速度に比較して、それぞれ駆動周波数162KHZのとき 2倍
以上、514KHZのとき 3倍以上の高効率の相対速度が得ら
れた(図3)。In FIG. 1, the metal part of the driving vibrator and the composite bending vibrator are made of an aluminum alloy (JIS A 50) having an outer diameter of 7 mm.
56B), the through hole of the composite bending oscillator has a hole diameter of 1.6 to
2.0mm, capillary is alumina 1.6mm in outer diameter, hole diameter
Use 0.7mm, 11.1mm length and 6.
Screws for fixing the capillary as 5mm (M1.6, P0.5
) And tighten it to the combined bending oscillator with a torque of 0.4 kgfcm.
As compared to the tip vibration speed of the composite bending vibrator, the tip vibration speed of the capillary was at least twice as high at the driving frequency of 162 KH Z , and at least three times as high at 514 KH Z (Fig. 3). ).
【0020】また、 2個の縦振動子の振動振幅と位相差
を制御することにより、キャピラリ先端の振動モードは
電気的に調整可能な軌跡となり(図2)、無方向性ワイ
ヤボンダが得られた。Further, by controlling the vibration amplitude and the phase difference between the two vertical vibrators, the vibration mode at the tip of the capillary becomes an electrically adjustable trajectory (FIG. 2), and a non-directional wire bonder is obtained. .
【0021】[0021]
【発明の効果】以上詳述したように、本発明によれば、
キャピラリを振動させるために複合曲げ振動系を用いた
ことにより、この振動系駆動用の縦振動子の振動方向と
ワイヤ長さ方向とを合致させることを必要とせず、高作
業効率で、ワイヤボンディング用キャピラリを着脱、交
換できる無方向性超音波ワイヤボンダを提供することが
できる。As described in detail above, according to the present invention,
By using a compound bending vibration system to vibrate the capillary, it is not necessary to match the vibration direction of the vertical vibrator for driving this vibration system with the wire length direction, and high work efficiency and wire bonding A non-directional ultrasonic wire bonder capable of attaching, detaching, and replacing the capillary can be provided.
【図1】図1は、本発明の複合曲げ振動系を用いた超音
波ワイヤボンダと各部の振動モードを示す模式図であ
る。FIG. 1 is a schematic diagram showing an ultrasonic wire bonder using a composite bending vibration system of the present invention and vibration modes of respective parts.
【図2】図2は、本発明の原理を示す複合曲げ振動子先
端の振動軌跡例である。FIG. 2 is an example of a vibration trajectory at the tip of a composite bending vibrator showing the principle of the present invention.
【図3】図3は、複合曲げ振動子へのキャピラリ取付構
造と、同キャピラリ突出部の相対振動速度特性である。FIG. 3 is a diagram showing a structure of attaching a capillary to a composite bending vibrator and a relative vibration velocity characteristic of the capillary protrusion.
1、2 駆動用縦振動子 3 電歪素子 4 電極 5 複合曲げ振動子 6 キャピラリ 7 ワイヤの貫通孔 8 キャピラリ固定ねじ 9、10 縦振動子1及び2の振動モード 11、12 複合曲げ振動子の複合曲げ振動モード Reference numerals 1 and 2 Driving longitudinal vibrator 3 Electrostrictive element 4 Electrode 5 Composite bending vibrator 6 Capillary 7 Wire through hole 8 Capillary fixing screw 9, 10 Vibration mode of longitudinal vibrators 1 and 2 11, 12 Combination bending vibrator Complex bending vibration mode
Claims (2)
直交して結合した複合曲げ振動子よりなる複合曲げ振動
系を用い、同複合曲げ振動子の中心部にワイヤ挿通用の
穴を貫通させ、該穴の先端にワイヤボンディング用のキ
ャピラリを着脱可能な構造としたことを特徴とする複合
曲げ振動系を用いた超音波ワイヤボンダ。1. A composite bending vibration system comprising two longitudinal vibration elements and a composite bending element orthogonally coupled to both of these elements, and a hole for inserting a wire in the center of the composite bending element. An ultrasonic wire bonder using a composite bending vibration system, wherein a wire bonding capillary is detachably attached to the tip of the hole.
ピラリの先端までの長さを調整自在に、該キャピラリを
該複合曲げ振動子の穴に着脱可能としてなる請求項1記
載の複合曲げ振動系を用いた超音波ワイヤボンダ。2. The composite bending vibration system according to claim 1, wherein said capillary is detachable from a hole of said composite bending oscillator so that a length from a tip of said composite bending oscillator to a tip of said capillary is adjustable. Ultrasonic wire bonder using.
Priority Applications (1)
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JP26510097A JP3777245B2 (en) | 1997-09-12 | 1997-09-12 | Ultrasonic wire bonder using compound bending vibration system |
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JP26510097A JP3777245B2 (en) | 1997-09-12 | 1997-09-12 | Ultrasonic wire bonder using compound bending vibration system |
Publications (2)
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JPH1187437A true JPH1187437A (en) | 1999-03-30 |
JP3777245B2 JP3777245B2 (en) | 2006-05-24 |
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Cited By (5)
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---|---|---|---|---|
JP2002261122A (en) * | 2001-02-28 | 2002-09-13 | Shibuya Kogyo Co Ltd | Bonding apparatus |
JP2005142537A (en) * | 2003-10-15 | 2005-06-02 | Bondotekku:Kk | Longitudinal vibration bonding method and device |
US7474036B2 (en) | 2003-09-29 | 2009-01-06 | Jiromaru Tsujino | High-capacity ultrasonic composite oscillating device |
WO2015110347A1 (en) * | 2014-01-24 | 2015-07-30 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Converter unit |
CN107042198A (en) * | 2017-01-18 | 2017-08-15 | 皮钧 | A kind of two dimensional ultrasonic vibration processing unit (plant) based on guide wire |
-
1997
- 1997-09-12 JP JP26510097A patent/JP3777245B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261122A (en) * | 2001-02-28 | 2002-09-13 | Shibuya Kogyo Co Ltd | Bonding apparatus |
US7474036B2 (en) | 2003-09-29 | 2009-01-06 | Jiromaru Tsujino | High-capacity ultrasonic composite oscillating device |
JP2005142537A (en) * | 2003-10-15 | 2005-06-02 | Bondotekku:Kk | Longitudinal vibration bonding method and device |
WO2015110347A1 (en) * | 2014-01-24 | 2015-07-30 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Converter unit |
JP2017504301A (en) * | 2014-01-24 | 2017-02-02 | ヘルマン ウルトラシャルテクニーク ゲーエムベーハー ウント コー.カーゲーHerrmann Ultraschalltechnik Gmbh & Co.Kg | Converter unit |
US10220413B2 (en) | 2014-01-24 | 2019-03-05 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Converter unit |
CN107042198A (en) * | 2017-01-18 | 2017-08-15 | 皮钧 | A kind of two dimensional ultrasonic vibration processing unit (plant) based on guide wire |
CN107042198B (en) * | 2017-01-18 | 2019-05-31 | 皮钧 | A kind of two dimensional ultrasonic vibration processing unit (plant) based on guide wire |
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