JP4288102B2

JP4288102B2 - Electronic component mounting equipment

Info

Publication number: JP4288102B2
Application number: JP2003134335A
Authority: JP
Inventors: 和哉三森
Original assignee: Juki Corp
Current assignee: Juki Corp
Priority date: 2003-05-13
Filing date: 2003-05-13
Publication date: 2009-07-01
Anticipated expiration: 2023-05-13
Also published as: JP2004342664A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を基板に搭載する電子部品実装装置に関するものである。
【０００２】
【従来の技術】
一般に、小型チップ部品を搭載する電子部品実装装置では、搭載ヘッドがロータリー式で、基板を保持する搭載ステーションが駆動手段によりＸ，Ｙ方向に移動可能とされている。しかしながら、より大型のＩＣ等の電子部品を基板に搭載する場合には、上記基板が移動する方式では、搭載された電子部品が基板から位置ズレを生じやすくなり不適であった。
これに対して、図５に示す電子部品実装装置は、図５に示すように、電子部品を基板Ｐに搭載する搭載ヘッド２１と、搭載ヘッド２１をＸ軸方向に移動自在に支持するとともに、搭載ヘッド２１を移動させる駆動手段を備えたＸ軸ガイド部材２２と、Ｘ軸ガイド部材２２をＹ軸方向に移動自在に支持するとともに、Ｘ軸ガイド部材２２をＹ軸方向に移動させる駆動手段を備えたＹ軸ガイド部材２３，２４と、搭載ヘッド２１の移動範囲内で基板Ｐを保持する搭載ステーション２５と、各種電子部品を保持する複数のテープフィーダ２６，２６，…が集まって一つの群とされた複数のフィーダ群２７，２７，…と、を具備する（例えば、特許文献１参照）。
そして、搭載ヘッド２１が吸着ノズル２１ａによって任意のフィーダ群２７のテープフィーダ２６から供給された電子部品を保持し、保持した電子部品の保持姿勢を補正した後に、この電子部品を搭載ステーション２５に保持された基板Ｐの所定位置に搭載するため、基板Ｐの移動を伴わず、ＩＣ等の大型の電子部品が搭載されても基板からの位置ズレは生じなかった。
【０００３】
【特許文献１】
特開平０９−１４８７９７号公報
【０００４】
【発明が解決しようとする課題】
しかしながら、特許文献１に記載の電子部品実装装置のように、搭載ヘッドがＸ方向とＹ方向とに同時に駆動する方式では、基板の駆動と搭載ヘッドの駆動との協働を行う構成と比較して、搭載時間のするートップが劣るという不都合があった。
【０００５】
本発明は、搭載された電子部品の基板からの位置ズレを抑制しつつ、作業の高速化を図ることをその目的とする。
【０００８】
【課題を解決するための手段】
請求項１記載の発明は、電子部品が搭載可能な状態で基板を保持すると共に基板を所定方向に沿って移動させる基板移動機構と、所定方向に対する直交方向に沿って並んで設けられ、基板に搭載すべき各種の電子部品を個別に供給する複数の部品供給装置と、各部品供給装置から供給される電子部品を保持すると共に基板移動機構に保持された基板に搭載する搭載ヘッドと、搭載ヘッドを直交方向に沿って移動させるＸ軸移動機構と、Ｘ軸移動機構を介して各搭載ヘッドを所定方向に移動させるＹ軸移動機構と、を備え、各種の電子部品を予め第一の分類と第二の分類とに識別可能に分類し、第一の分類の電子部品のみが基板に搭載されている段階では、搭載ヘッドをＸ軸移動機構と基板移動機構とにより保持された基板の搭載位置に位置決めし、第二の分類の電子部品が搭載されてからは、搭載ヘッドをＸ軸移動機構とＹ軸移動機構とにより保持された基板の搭載位置に位置決めする動作制御を行う動作制御手段を備える、という構成を採っている。
【０００９】
上記構成では、予め、各種の電子部品についてその分類を決めておき、且つそれを記憶する記憶手段を備え、その記憶手段を参照して、各部品供給装置から供給される電子部品はいずれの分類に属するかを判定した上で動作制御手段が上記動作制御を行っても良いし、各部品供給装置に分類を識別するマーキングや分類を記録する記録手段を付して、これらから分類を認識した上で動作制御手段が上記動作制御を行っても良い。
また、各種の電子部品について、第一と第二のいずれの分類とすべきかは、例えば、経験則や試験等を通じて、駆動される基板に対して位置ズレを生じないものは第一の分類とし、位置ズレを生じやすいものは第二の分類とすることが望ましい。
上記構成では、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して基板駆動による位置ズレを起こしやすい第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行う。
【００１０】
請求項２記載の発明は、電子部品が搭載可能な状態で基板を保持すると共に基板を所定方向に沿って移動させる基板移動機構と、所定方向に対する直交方向に沿って並んで設けられ、基板に搭載すべき各種の電子部品を個別に供給する複数の部品供給装置と、各部品供給装置から供給される電子部品を保持すると共に基板移動機構に保持された基板に搭載する搭載ヘッドと、搭載ヘッドを直交方向に沿って移動させるＸ軸移動機構と、Ｘ軸移動機構を介して各搭載ヘッドを所定方向に移動させるＹ軸移動機構と、を備え、各種の電子部品をその大きさにより第一の分類と第二の分類とに分類し、第一の分類の電子部品のみが基板に搭載されている段階では、搭載ヘッドをＸ軸移動機構と基板移動機構とにより保持された基板の搭載位置に位置決めし、第二の分類の電子部品が搭載されてからは、搭載ヘッドをＸ軸移動機構とＹ軸移動機構とにより保持された基板の搭載位置に位置決めする動作制御を行う動作制御手段を備える、という構成を採っている。
【００１１】
上記構成では、予め、各種の電子部品についてその大きさからその分類を決めておき、且つそれを記憶する記憶手段を備え、その記憶手段を参照して、各部品供給装置から供給される電子部品はいずれの分類に属するかを判定した上で動作制御手段が上記動作制御を行っても良いし、各部品供給装置に分類を識別するマーキングや分類を記録する記録手段を付して、これらから分類を認識した上で動作制御手段が上記動作制御を行っても良い。
また、搭載ヘッドが保持した電子部品に対してその大きさを検出する検出手段を設け、検出手段の出力に応じていずれの分類に属するかを判断した上で動作制御手段が上記動作制御を行っても良い。
また、各種の電子部品について、いずれの大きさで第一の分類と第二の分類とに分けるべきかは、例えば、経験則や試験等を通じて、搭載した状態で基板の移動を行うと基板に対して位置ズレを生じる大きさを決定すると共に位置ズレを生じる大きさのものを第二の分類とすることが望ましい。
上記構成では、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して基板駆動による位置ズレを起こしやすい第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行う。
【００１２】
請求項３記載の発明は、電子部品が搭載可能な状態で基板を保持すると共に基板を所定方向に沿って移動させる基板移動機構と、所定方向に対する直交方向に沿って並んで設けられ、基板に搭載すべき各種の電子部品を個別に供給する複数の部品供給装置と、各部品供給装置から供給される電子部品を保持すると共に基板移動機構に保持された基板に搭載する搭載ヘッドと、搭載ヘッドを直交方向に沿って移動させるＸ軸移動機構と、Ｘ軸移動機構を介して各搭載ヘッドを所定方向に移動させるＹ軸移動機構と、を備え、各種の電子部品をその重量により第一の分類と第二の分類とに分類し、第一の分類の電子部品のみが基板に搭載されている段階では、搭載ヘッドをＸ軸移動機構と基板移動機構とにより保持された基板の搭載位置に位置決めし、第二の分類の電子部品が搭載されてからは、搭載ヘッドをＸ軸移動機構とＹ軸移動機構とにより保持された基板の搭載位置に位置決めする動作制御を行う動作制御手段を備える、という構成を採っている。
【００１３】
上記構成では、予め、各種の電子部品についてその重量からその分類を決めておき、且つそれを記憶する記憶手段を備え、その記憶手段を参照して、各部品供給装置から供給される電子部品はいずれの分類に属するかを判定した上で動作制御手段が上記動作制御を行っても良いし、各部品供給装置に分類を識別するマーキングや分類を記録する記録手段を付して、これらから分類を認識した上で動作制御手段が上記動作制御を行っても良い。
また、搭載ヘッドが保持した電子部品に対してその重量を検出する検出手段を設け、検出手段の出力に応じていずれの分類に属するかを判断した上で動作制御手段が上記動作制御を行っても良い。
また、各種の電子部品について、いずれの重量で第一の分類と第二の分類とに分けるべきかは、例えば、経験則や試験等を通じて、搭載した状態で基板の移動を行うと基板に対して位置ズレを生じる重量を決定すると共に位置ズレを生じる重量のものを第二の分類とすることが望ましい。
上記構成では、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して基板駆動による位置ズレを起こしやすい第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行う。
【００１４】
請求項４記載の発明は、電子部品が搭載可能な状態で基板を保持すると共に基板を所定方向に沿って移動させる基板移動機構と、所定方向に対する直交方向に沿って並んで設けられ、基板に搭載すべき各種の電子部品を個別に供給する複数の部品供給装置と、各部品供給装置から供給される電子部品を保持すると共に基板移動機構に保持された基板に搭載する搭載ヘッドと、搭載ヘッドを直交方向に沿って移動させるＸ軸移動機構と、Ｘ軸移動機構を介して各搭載ヘッドを所定方向に移動させるＹ軸移動機構と、を備え、各種の電子部品をその形状により第一の分類と第二の分類とに分類し、第一の分類に属する電子部品については、搭載ヘッドをＸ軸移動機構とＹ軸移動機構とにより保持された基板の搭載位置に位置決めし、第二の分類に属する電子部品については、搭載ヘッドをＸ軸移動機構と基板移動機構とにより保持された基板の搭載位置に位置決めする動作制御を行う動作制御手段を備える、という構成を採っている。
【００１５】
上記構成では、予め、各種の電子部品についてその形状からその分類を決めておき、且つそれを記憶する記憶手段を備え、その記憶手段を参照して、各部品供給装置から供給される電子部品はいずれの分類に属するかを判定した上で動作制御手段が上記動作制御を行っても良いし、各部品供給装置に分類を識別するマーキングや分類を記録する記録手段を付して、これらから分類を認識した上で動作制御手段が上記動作制御を行っても良い。
また、搭載ヘッドが保持した電子部品に対してその形状を検出する検出手段を設け、検出手段の出力に応じていずれの分類に属するかを判断した上で動作制御手段が上記動作制御を行っても良い。
また、各種の電子部品について、いずれの形状で第一の分類と第二の分類とに分けるべきかは、例えば、経験則や試験等を通じて、搭載した状態で基板の移動を行うと基板に対して位置ズレを生じる形状を決定すると共に位置ズレを生じる大きさのものを第二の分類とすることが望ましい。なお、位置ズレを生じやすい形状とは、一例としては、搭載した状態で基板から立設状態となるものや重心が基板から離間する形状のものが挙げられる。
上記構成では、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して基板駆動による位置ズレを起こしやすい第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行う。
【００１６】
【発明の実施の形態】
（実施の形態の全体構成）
以下、本発明の電子部品実装装置１に係る実施の形態について図面を参照して説明する。但し、発明の範囲は、図示例に限定されない。なお、以下の説明において、電子部品実装装置１の使用状態において水平である一の方向Ｘ軸方向、水平でありＸ軸方向と直交する方向をＹ軸方向というものとする。
【００１７】
図１に示すように、電子部品実装装置１は、略矩形枠状に形成されたベースフレーム２と、基板ＰをＸ軸方向に沿って前工程側から次工程側に搬送する基板搬送手段３と、電子部品が搭載可能な状態に基板Ｐを保持する搭載ステーション４と搭載ステーション４をＹ軸方向に沿って移動させるステーション移動手段５とからなる基板移動機構と、基板Ｐに搭載される各種の電子部品を個別に収納する複数の部品供給装置としてのテープフィーダ６，６，…と、各テープフィーダ６，６，…の電子部品を基板Ｐに搭載する搭載ヘッド７と、搭載ヘッド７をＸ軸方向に沿って移動させるＸ軸移動機構８と、Ｘ軸移動機構８を介して搭載ヘッド７をＹ軸方向に移動させるＹ軸移動機構９と、電子部品実装装置１の各構成の動作制御を行う動作制御手段１５０とを具備する。
【００１８】
（基板搬送手段）
基板搬送手段３は、基板Ｐを前工程側から次工程側に搬送するＸ軸方向に沿った基板搬送路３１を備える。基板搬送手段３は、基板搬送路３１の上流側に配置される上流搬送部３ａと、基板搬送路３１の下流側に配置される下流搬送部３ｂとを備える。各搬送部３ａ，３ｂには搬送ベルト（図示略）等が備えられ、例えば図１の例であれば、基板Ｐは搬送ベルトに載置された状態で左側から右側へＸ軸方向に搬送される。また、上流搬送部３ａと下流搬送部３ｂとの間には、搭載ステーション４のステーション移動手段５によるステーション搬送路５２が各搬送部３ａ，３ｂの搬送方向と直交する状態で設けられている。
【００１９】
（ステーション移動手段）
ステーション移動手段５は、搭載ステーション４をＹ軸方向に沿って移動自在に支持する支持部材５１と、支持部材５１に支持させた状態で搭載ステーション４を駆動させるステーション駆動手段（図示略）と、を具備する。
支持部材５１は、ベースフレーム２の略中央においてＹ軸方向に延在する部材であって、Ｘ軸方向に延在する基板搬送部３ａ，３ｂを略直角に横切って設けられている。支持部材５１は、搭載ステーション４を移動自在に支持すると共にＹ軸方向に沿ってその移動をガイドする機能も有する。従って、搭載ステーション４は、支持部材５１によって形成されたステーション搬送路５２に沿って移動する。
ステーション駆動手段としては、例えば、リニアモータが適用可能であり、それ以外に、サーボモータとベルトとを組み合わせた駆動手段又はサーボモータとボールネジとを組み合わせた駆動手段等が適用可能である。
ステーション駆動手段は、その駆動により搭載ステーション４をＹ軸方向に沿った方向に移動位置決めを行う。
【００２０】
（搭載ステーション）
搭載ステーション４は、基板搬送路３１に沿う位置で上流搬送部３ａによって前工程側から搬送されてきた基板Ｐを位置決めして保持し、また、搭載ステーション４は、基板搬送路３１に沿う位置で電子部品の搭載が終了した基板Ｐを下流搬送部３ｂに渡す。すなわち、基板搬送路３１とステーション搬送路５２との交差位置（基板Ｐを保持する基板保持位置）で、搭載ステーション４は、基板搬送手段３との間で基板Ｐの受け渡しを行う。なお、搭載ステーションには、基板搬送手段との間で基板Ｐの受け渡しを行うために、例えば、基板搬送手段３と同様にＸ軸方向に沿った搬送ベルトとその駆動手段からなる基板搬送機構を有する。また、搭載ステーション４が基板Ｐを保持する際には、二つの側部４ａ，４ａ間に基板Ｐをクランプして保持する。
【００２１】
（テープフィーダ）
テープフィーダ６は、ＩＣ，抵抗器，コンデンサ等の微小な（例えば、縦１．０ｍｍ×横０．５ｍｍ）電子部品を収納する部品搬送テープを備えるものである。図１（ａ）（ｂ）に示すように、所定数のテープフィーダ６，６，…はＸ軸方向に沿って略等間隔に配列されて一つの群を形成し、四つの第一〜第四フィーダ群６１〜６４を各々形成している。第一及び第二フィーダ群６１，６２並びに第三及び第四フィーダ群６３，６４は、ベースフレーム２の上面の基板搬送路３１とステーション搬送路５２とにより区画される四つの領域にそれぞれ配置されている。より詳しくは、第一フィーダ群６１は上流搬送部３ａの右側に、第二フィーダ群６２は下流搬送部３ｂの右側に、第三フィーダ群６３は上流搬送部３ａの左側に、第四フィーダ群６４は下流搬送部３ｂの左側に配置されている。すなわち、各フィーダ群６１〜６４は、互いに基板搬送路３１及びステーション搬送路５２を挟む四箇所の位置に各々配置されている。なお、各テープフィーダ６は、いずれもその電子部品受け渡し位置が基板搬送路３１に近接するようにベースフレーム２上に配設される。
【００２２】
なお、各フィーダ群６１〜６４を構成するテープフィーダ６，６，…の設置数は、適宜変更可能である。また、各フィーダ群６１〜６４を構成するテープフィーダ６，６，…の設置数を図１に示す数より少なくして更なるフィーダ群を形成し、この更なるフィーダ群を各フィーダ群６１〜６４の右側及び左側の少なくとも一方の側に配置してもよい。
【００２３】
（Ｙ軸移動機構）
Ｙ軸移動機構９は、上流搬送部３ａに跨る門型状の上流Ｙ軸ガイド部材９１と、下流搬送部３ｂに跨る門型状の下流Ｙ軸ガイド部材９２と、を備える。各Ｙ軸ガイド部材９１，９２の上部には、Ｙ軸方向に沿うガイド部９１ａ，９２ａが設けられている。
各Ｙ軸ガイド部材９１，９２はガイド部９１ａ，９２ａを介してＸ軸ガイド部材８１をＹ軸方向に沿って移動可能に支持している。
また、Ｙ軸移動機構９は、Ｘ軸ガイド部材８１をＹ軸方向に移動させるＹ軸駆動手段（図示略）を備えており、このＹ軸駆動手段が駆動されると、Ｘ軸ガイド部材８１はＹ軸方向に沿って移動する。移動の際には、Ｘ軸ガイド部材８１がＸ軸方向に対して斜めになることは無く、Ｘ軸ガイド部材８１の延在方向とＸ軸方向とは常に平行な状態を維持する。Ｙ軸駆動手段としては、例えば、サーボモータとベルトとを組み合わせた駆動手段が適用可能であり、それ以外に、サーボモータとボールネジを組み合わせた駆動手段又はリニアモータ等が適用可能である。
【００２４】
（Ｘ軸移動機構）
Ｘ軸移動機構８は、Ｘ軸方向に延在し搭載ヘッド７を移動自在に支持する長尺なＸ軸ガイド部材８１と、搭載ヘッド７をＸ軸方向に移動させるＸ軸駆動手段とを備える。Ｘ軸ガイド部材８１の両端は、各Ｙ軸ガイド部材９１，９２の各ガイド部９１ａ，９２ａの上部に支持されている。これにより、Ｘ軸ガイド部材８１は、上流Ｙ軸ガイド部材９１と下流Ｙ軸ガイド部材９２との上部間に架け渡され、さらに各ガイド部９１ａ，９２ａにガイドされてＹ軸方向に移動可能となる。
【００２５】
また、Ｘ軸ガイド部材８１の移動に関して、Ｘ軸ガイド部材８１には搭載ヘッド７がＸ軸方向に移動可能に支持されると共に当該移動力を付与するＸ軸駆動手段が設けられている。Ｘ軸駆動手段としては、例えば、サーボモータとベルトとを組み合わせた駆動手段やサーボモータとボールネジを組み合わせた駆動手段を使用することも可能であるが、この電子部品実装装置１では、Ｘ軸駆動手段としてリニアモータを採用している。即ち、リニアモータの固定子をＸ軸ガイド部材８１に設け、可動子を搭載ヘッド７に設けている。これにより、Ｘ軸駆動手段は、搭載ヘッド７をＸ軸方向における所定位置に位置決めすることが可能である。なお、Ｘ軸駆動手段は動作制御手段１５０により制御される。
【００２６】
（搭載ヘッド）
搭載ヘッド７は、Ｘ軸ガイド部材８１の一方の側面に移動自在に支持されている。搭載ヘッド７は、所定数の吸着ノズル７ａ，７ａ，…を備え、これら吸着ノズル７ａ，７ａ，…によって、各フィーダ群６１〜６４から電子部品を吸着し保持する。各吸着ノズル７ａは、搭載ヘッド７から着脱可能に保持されている。即ち、各吸着ノズル７ａは、各種の電子部品に応じて安定して吸着保持ができる各種のものが用意されており、ベースフレーム２上面の搭載ヘッド７の可動範囲内に図示しない各種の交換用吸着ノズル７ａの保持部が設けられており、必要に応じて交換動作が行われる。
さらに、搭載ヘッド７は、各吸着ノズル７ａ毎に個別に上下動可能に駆動するノズル昇降手段を備え、また、各吸着ノズル７ａ毎に上下方向を中心として回転させるノズル回転手段を備えている。
【００２７】
これら吸着ノズル７ａ，７ａ，…は、搭載ヘッド７に、Ｘ軸方向に沿って一列に配列されており、搭載ヘッド７の吸着ノズル７ａ，７ａ，…の列方向の配置は、互いにＹ軸方向において一致している。すなわち、搭載ヘッド７に備えられた全ての吸着ノズル７ａ，７ａ，…は、Ｘ軸方向に沿って一直線状に配置されている。なお、図１において、搭載ヘッド７の吸着ノズル７ａ，７ａ，…は一列に配置されているが、吸着ノズル７ａ数を増やして、複数列にわたって配置してもよい。
【００２８】
また、図１（ｂ）に示すように、搭載ヘッド７は基板位置認識手段としての撮像カメラ７ｂ（例えば、ＣＣＤカメラ）を各々備えている。撮像カメラ７ｂは、テープフィーダ６の電子部品受け取り入りへの位置決めのため、また、基板Ｐに設けられた位置認識用マークにより基板Ｐの位置ズレを認識するために設けられている。
【００２９】
また、搭載ヘッド７には、水平に一列に並べられた発光素子（例えば、レーザダイオード）と、発光素子に対向して一列に配置された受光素子とからなる部品姿勢認識装置２０３（図２参照）が設けられ、各吸着ノズル７ａ，７ａ，…に吸着された電子部品の姿勢（以下単に「吸着姿勢」という。）及び幅を認識する。これにより電子部品の幅が不良を示す値で検出されると、動作制御手段１５０は電子部品が形状不良品と認識し、当該電子部品を図示しない廃棄部に搬送して廃棄する。
【００３０】
また、搭載ヘッド７には不良基板認識手段としての光反射センサ２０４（図２参照）が設けられ、欠陥があり部品搭載を要しない基板Ｐに付される不良マークを認識する。この不良マークの認識により、動作制御手段１５０は、当該基板Ｐについては搭載作業を行うことなく基板搬送手段３により下流搬送部３ｂに搬送する。
【００３１】
（動作制御手段の構成）
動作制御手段１５０について図２により説明する。図２は電子部品実装装置１の制御系を示すブロック図である。まず、動作制御手段１５０の周囲の構成について説明する。
動作制御手段１５０は、Ｘ軸移動機構８のＸ軸駆動手段，Ｙ軸移動機構９のＹ軸駆動手段，搭載ヘッド７のノズル昇降手段，搭載ヘッド７のノズル回転手段，ステーション移動手段５，基板搬送手段３について、それぞれ駆動回路を介して接続され、これらの動作制御を行う。各駆動回路は、動作制御手段１５０からの制御指令信号に従って駆動させる。
【００３２】
また、動作制御手段１５０は、撮像カメラ７ｂ，部品姿勢認識装置２０３，光反射センサ２０４，設定入力手段２０５とについてそれぞれ入力回路を介して接続されている。各入力回路は、これらからの出力信号をＡ／Ｄ変換して動作制御手段１５０に入力する。
なお、設定入力手段２０５とは、例えばタッチパネルやキーボード等のような、オペレータが各種動作指令や各種の設定入力を行うための入力装置である。
【００３３】
動作制御手段１５０は、電子部品実装装置１の後述する各種機能，動作を実行させる制御プログラム又は制御データが書き込まれているＲＯＭ１５２と、制御プログラムに従って上記各構成の動作を制御するＣＰＵ１５１と、ＣＰＵ１５１の処理データ，各種動作に要する各種データを記憶するＲＡＭ１５３とを備えている。また、上記ＲＡＭ１５３には、種々のワークメモリやカウンタなどが設けられており、動作制御中のワークエリアとしても使用される。
【００３４】
また、ＲＡＭ１５３には、基板Ｐに対する搭載すべき電子部品の順番データと、各種電子部品の受け取り位置データ（各種の電子部品がいずれの位置のテープフィーダ６であるか）、各種電子部品の基板Ｐに対する搭載位置データ、各種電子部品の分類データが記憶されている。
上記各種電子部品の分類データとは、各電子部品を搭載した基板Ｐを保持する搭載ステーション４をステーション移動手段５により高速移動を行った場合に、位置ズレを生じにくいものを第一の分類とし、位置ズレを生じやすいものを第二の分類として、各種の電子部品についていずれの分類であるかを特定したデータをいう。
かかる分類データは、実測試験により予めオペレータが各種の電子部品について特定し設定入力しても良い。
また、予め位置ズレを生じやすい電子部品の大きさ又は重量の閾値を設定し、オペレータが各種の電子部品について大きさ又は重量の値を設定入力することで、自動的に各種の電子部品について分類を特定し記録するプログラムをＲＯＭ１５２に格納する共にＣＰＵ１５１はそれを実行するようにしても良い。
また、予め位置ズレを生じやすい電子部品の形状パターンを設定し、オペレータが各種の電子部品について形状パターンを設定入力することで、自動的に各種の電子部品について分類を特定し記録するプログラムをＲＯＭ１５２に格納する共にＣＰＵ１５１はそれを実行するようにしても良い。
【００３５】
また、ＲＯＭ１５２には、第一と第二のモードに従い、電子部品の搭載動作制御を行うプログラムが格納されている。
第一のモードとは、各テープフィーダ６から電子部品を保持した搭載ヘッド７に対してＹ軸移動機構９を動作させず、Ｘ軸移動機構８とステーション移動手段５との協働により基板Ｐの搭載位置に搭載ヘッド７を位置決めし、搭載を行わせる動作制御である。この第一のモードは、搭載動作の迅速化に適しており、基板Ｐに第一の分類の電子部品のみが搭載されている場合に好適である。
第二のモードとは、ステーション移動手段５が搭載ステーション４を規定位置（例えばベースフレーム２の中央）に固定して、各テープフィーダ６から電子部品を保持した搭載ヘッド７に対してＹ軸移動機構９とＸ軸移動機構８との協働により基板Ｐの搭載位置に搭載ヘッド７を位置決めし、搭載を行わせる動作制御である。この第二のモードは、基板Ｐの移動が行われないことから基板Ｐに搭載された電子部品の位置ズレを回避することができ、基板Ｐに第二の分類の電子部品が搭載されている場合に好適である。
【００３６】
また、ＲＯＭ１５２には、上記第一と第二のモードを選択する第一及び第二の選択プログラムが格納されている。
第一の選択プログラムは、設定入力手段２０５により、予めモード選択の入力設定が行われている場合は、選択されたモードに従って搭載動作を行わせる。即ち、いずれかのモードに固定した状態で電子部品の搭載動作が行われる。例えば、第一の分類の電子部品しか搭載を行わない場合には、第一のモードに固定して搭載の迅速化を図ることができ、第二の分類の電子部品の搭載頻度が高い場合には第二のモードに固定して電子部品の位置ズレを回避することができる。
第二の選択プログラムは、一つの基板に対する一連の搭載動作において、第一の分類に属する電子部品の搭載が連続する限りは第一のモードにより搭載動作を行い、最初に第二の分類に属する電子部品が搭載される段階でそれ以降第二のモードに固定して全ての電子部品が搭載完了まで搭載動作を行う。かかる選択プログラムにより、一の基板Ｐに対する搭載動作において、電子部品の搭載後の基板Ｐからの位置ズレを回避すると共に、一連の搭載動作の迅速化を図ることができる。
ＣＰＵ１５１は、上記ＲＯＭ１５２に格納されたプログラムに従うと共にＲＡＭ１５３に記録された各種のデータを参照しつつ、各部の動作制御を行う。
【００３７】
（電子部品実装装置の動作説明）
まず、上記第一の選択プログラムに従い第一のモードに固定された場合の動作について図３に基づいて説明する。
まず、ＣＰＵ１５１は、受け取り位置データに従ってＸ軸移動機構８及びＹ軸移動機構９の動作制御を行うことで搭載ヘッド７の所定の吸着ノズル７ａを所定のテープフィーダ６の受け取り位置に位置決めすると共にノズル昇降昇降手段の動作制御を行うことで電子部品の受け取りを行う。
次に、ＣＰＵ１５１は、搭載位置データに従ってＸ軸移動機構８及びステーション移動手段５の動作制御を行うことで、搭載ヘッド７をＸ軸方向に沿って移動すると共に搭載ステーション４をＹ軸方向に移動させ、搭載ヘッド７を基板Ｐの搭載位置に位置決めする（図３の状態）。そして、ノズル昇降手段を駆動して保持している電子部品を搭載する動作制御とを行う。
上記動作を全ての電子部品について繰り返し行う。
【００３８】
次に、上記第一の選択プログラムに従い第二のモードに固定された場合の動作について図４に基づいて説明する。
まず、ＣＰＵ１５１は、受け取り位置データに従ってＸ軸移動機構８及びＹ軸移動機構９の動作制御を行うことで搭載ヘッド７の所定の吸着ノズル７ａを所定のテープフィーダ６の受け取り位置に位置決めすると共にノズル昇降昇降手段の動作制御を行うことで電子部品の受け取りを行う。
次に、ＣＰＵ１５１は、搭載位置データに従ってＸ軸移動機構８及びＹ軸移動機構９の動作制御を行うことで、搭載ヘッド７をＸ軸方向とＹ軸方向に沿って移動させ、搭載ヘッド７を基板Ｐの搭載位置に位置決めする（図４の状態）。そして、ノズル昇降手段を駆動して保持している電子部品を搭載する動作制御とを行う。
上記動作を全ての電子部品について繰り返し行う。
【００３９】
まず、上記第二の選択プログラムに従って行われる搭載動作について図３及び図４を参照して説明する。
まず、ＣＰＵ１５１は、ＲＡＭ１５３により登載順に電子部品の各データを参照する。そして、登載順に、電子部品が第一の分類であることを示す限り、第一のモードに従って搭載動作を行う。
つまり、受け取り位置データに従ってＸ軸移動機構８及びＹ軸移動機構９を駆動して搭載ヘッド７の所定の吸着ノズル７ａを所定のテープフィーダ６の受け取り位置に位置決めすると共にノズル昇降昇降手段の動作制御を行うことで電子部品の受け取りを行う。そして、搭載位置データに従ってＸ軸移動機構８及びステーション移動手段５を駆動して、搭載ヘッド７をＸ軸方向に沿って移動すると共に搭載ステーション４をＹ軸方向に移動させ、搭載ヘッド７を基板Ｐの搭載位置に位置決めする（図３の状態）。そして、ノズル昇降手段を駆動して保持している電子部品を搭載する動作制御とを行う。
上記動作を各電子部品について繰り返し行い、第二の分類の電子部品の順番が初めて回ってきた段階で第二のモードに切り替えて搭載動作を行う。
つまり、受け取り位置データに従ってＸ軸移動機構８及びＹ軸移動機構９を駆動して搭載ヘッド７の所定の吸着ノズル７ａを所定のテープフィーダ６の受け取り位置に位置決めすると共にノズル昇降昇降手段の動作制御を行うことで電子部品の受け取りを行う。そして、搭載位置データに従ってＸ軸移動機構８及びＹ軸移動機構９を駆動して、搭載ヘッド７をＸ軸方向とＹ軸方向に沿って移動させ、搭載ヘッド７を基板Ｐの搭載位置に位置決めする（図４の状態）。そして、ノズル昇降手段を駆動して保持している電子部品を搭載する動作制御とを行う。
その後は、当該基板Ｐの搭載が完了するまで、例え、途中で第一の分類の電子部品の搭載が行われる場合であっても第二のモードを維持し、繰り返し搭載動作を行う。
【００４０】
このように、電子部品実装装置１は、、第一の分類に属する電子部品のみが基板Ｐに搭載されている間は、ステーション移動手段５の駆動とＸ軸移動機構８の駆動により迅速な搭載を行い、基板Ｐに対して位置ズレを起こしやすい第二の分類の電子部品が基板Ｐに搭載されてからは、Ｘ軸移動機構８とＹ軸駆動手段９の駆動により電子部品の位置ズレを生じない搭載を行うことで保持位置のズレを回避するため、各種の電子部品を順次搭載する全体的な搭載作業について搭載不良を抑制しつつも作業の高速化を図ることが可能となる。
【００４１】
（その他）
上記動作制御手段１５０においては、各種の電子部品の分類を予めデータで設定入力するか、電子部品の大きさ，重量又は形状データにより分類を行う構成としたが、搭載ヘッド７に電子部品の大きさ，重量又は形状を検出する手段を設け、その検出結果により分類を行う構成としても良い。
例えば、電子部品の重量を検出するには、吸着ノズル７ａを介して重量センサを設けるか或いは吸着ノズル７ａを弾性支持して吸着時の弾性変位量により検出しても良い。
また、電子部品の大きさを検出するには、前述した部品姿勢認識装置２０３により検出された幅を用いても良いし、撮像カメラ７ｂによる受け取り直前の電子部品の撮像データにより大きさの検出を行っても良い。
さらに、電子部品の形状を検出するには、撮像カメラ７ｂによる受け取り直前の電子部品の撮像データを画像処理し、予め設定された特徴的形状パターンを備えるか否かにより識別しても良い。
そして、上記いずれかの検出を行うことで、各電子部品の受け取りの際に、当該電子部品がいずれの分類に属するかをＣＰＵ１５１にて判断し、その後の搭載動作をいずれのモードとするかを決定する処理を行っても良い。
【００４２】
【発明の効果】
請求項１記載の発明は、高速搭載に対応する第一のモードと電子部品の位置ズレを回避する第二のモードとを選択可能であるため、少なくとも基板上で位置ズレを生じやすい電子部品が搭載されるまでは第一のモードにより部品搭載を行うことで作業の迅速化を図り、位置ズレを生じやすい電子部品が搭載された後には第二のモードにより部品搭載を行うことで電子部品の位置ズレを回避することが可能となる。従って、電子部品の基板からの位置ズレを効果的に抑制しつつ搭載作業の迅速化を図ることが可能となる。
【００４３】
請求項２記載の発明は、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して位置ズレを起こしやすい第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行うことで保持位置のズレによる搭載不良を抑制するため、各種の電子部品を順次搭載する全体的な搭載作業について搭載不良を抑制しつつも作業の高速化を図ることが可能となる。
【００４４】
請求項３記載の発明は、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して位置ズレを起こしやすい大型の第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行うことで保持位置のズレによる搭載不良を抑制するため、各種の電子部品を順次搭載する全体的な搭載作業について搭載不良を抑制しつつも作業の高速化を図ることが可能となる。
【００４５】
請求項４記載の発明は、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して位置ズレを起こしやすい重量のある第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行うことで保持位置のズレによる搭載不良を抑制するため、各種の電子部品を順次搭載する全体的な搭載作業について搭載不良を抑制しつつも作業の高速化を図ることが可能となる。
【００４６】
請求項５記載の発明は、第一の分類に属する電子部品のみが基板に搭載されている間は、基板の駆動と搭載ヘッドの駆動により迅速な搭載を行い、基板に対して位置ズレを起こしやすい形状の第二の分類の電子部品が基板に搭載されてからは、搭載ヘッドのみの駆動により電子部品の位置ズレを生じない搭載を行うことで保持位置のズレによる搭載不良を抑制するため、各種の電子部品を順次搭載する全体的な搭載作業について搭載不良を抑制しつつも作業の高速化を図ることが可能となる。
【図面の簡単な説明】
【図１】図１（ａ）は実施の形態たる電子部品実装装置の斜視図を示し、図１（ｂ）はその平面図を示す。
【図２】電子部品実装装置の制御系を示すブロック図である。
【図３】第一のモードによる搭載動作の説明図である。
【図４】第二のモードによる搭載動作の説明図である。
【図５】従来の電子部品実装装置を示す斜視図である。
【符号の説明】
１電子部品実装装置
３基板搬送手段
４搭載ステーション（基板移動機構）
５ステーション移動手段（基板移動機構）
６テープフィーダ（部品供給装置）
７搭載ヘッド
７ａ吸着ノズル
８Ｘ軸移動機構
９Ｙ軸移動機構
１５０動作制御手段
２０２撮像カメラ
２０３部品姿勢認識装置
Ｐ基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.
[0002]
[Prior art]
In general, in an electronic component mounting apparatus for mounting small chip components, a mounting head is a rotary type, and a mounting station for holding a substrate can be moved in X and Y directions by a driving means. However, when an electronic component such as a larger IC is mounted on a substrate, the method of moving the substrate is not suitable because the mounted electronic component is likely to be displaced from the substrate.
On the other hand, as shown in FIG. 5, the electronic component mounting apparatus shown in FIG. 5 mounts the electronic component on the substrate P, and supports the mounting head 21 movably in the X-axis direction. An X-axis guide member 22 provided with a drive means for moving the mounting head 21 and a drive means for supporting the X-axis guide member 22 so as to be movable in the Y-axis direction and moving the X-axis guide member 22 in the Y-axis direction. A group of Y-axis guide members 23, 24 provided, a mounting station 25 for holding the substrate P within the movement range of the mounting head 21, and a plurality of tape feeders 26, 26,. A plurality of feeder groups 27, 27,... (For example, see Patent Document 1).
The mounting head 21 holds the electronic component supplied from the tape feeder 26 of the arbitrary feeder group 27 by the suction nozzle 21a, corrects the holding posture of the held electronic component, and then holds the electronic component in the mounting station 25. Since the substrate P is mounted at a predetermined position, the substrate P is not moved, and even when a large-sized electronic component such as an IC is mounted, there is no displacement from the substrate.
[0003]
[Patent Document 1]
JP 09-148797 A
[0004]
[Problems to be solved by the invention]
However, as in the electronic component mounting apparatus described in Patent Document 1, the method in which the mounting head is driven simultaneously in the X direction and the Y direction is compared with a configuration in which the driving of the substrate and the driving of the mounting head are performed in cooperation. And there was the inconvenience that the mounting time was inferior.
[0005]
An object of the present invention is to increase the operation speed while suppressing displacement of a mounted electronic component from a substrate.
[0008]
[Means for Solving the Problems]
Claim 1The described invention is provided with a substrate moving mechanism that holds a substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction, and is arranged side by side along a direction orthogonal to the predetermined direction, and should be mounted on the substrate A plurality of component supply devices that individually supply various electronic components, a mounting head that holds the electronic components supplied from each component supply device and is mounted on the substrate held by the substrate moving mechanism, and the mounting head in the orthogonal direction An X-axis movement mechanism that moves the head along the X-axis movement mechanism, and a Y-axis movement mechanism that moves each mounting head in a predetermined direction via the X-axis movement mechanism. In the stage where only the electronic components of the first classification are mounted on the substrate, the mounting head is positioned at the mounting position of the substrate held by the X-axis moving mechanism and the substrate moving mechanism. The second After the electronic component of this class is mounted, it is configured to include an operation control means for performing operation control for positioning the mounting head at the mounting position of the substrate held by the X-axis moving mechanism and the Y-axis moving mechanism. ing.
[0009]
In the above configuration, the classification of various electronic components is determined in advance, and storage means for storing the electronic components is provided. With reference to the storage means, the electronic components supplied from each component supply apparatus can be classified into any classification. The operation control means may perform the above-mentioned operation control after determining whether it belongs to the above, or a marking means for identifying the classification and a recording means for recording the classification are attached to each component supply device, and the classification is recognized from these. The operation control means may perform the above operation control.
In addition, for each type of electronic component, the first classification or the second classification is, for example, those that do not cause positional displacement with respect to the driven board through empirical rules and tests. It is desirable to classify those that are likely to cause positional deviation as the second classification.
In the above configuration, while only the electronic components belonging to the first category are mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, and the substrate is likely to be displaced by the substrate driving. After the electronic component of the second classification is mounted on the substrate, mounting is performed without causing a positional shift of the electronic component by driving only the mounting head.
[0010]
  Claim 2The described invention is provided with a substrate moving mechanism that holds a substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction, and is arranged side by side along a direction orthogonal to the predetermined direction, and should be mounted on the substrate A plurality of component supply devices that individually supply various electronic components, a mounting head that holds the electronic components supplied from each component supply device and is mounted on the substrate held by the substrate moving mechanism, and the mounting head in the orthogonal direction And an Y-axis moving mechanism for moving each mounting head in a predetermined direction via the X-axis moving mechanism, and various electronic components are classified into a first classification according to their sizes. In the stage where only the electronic components of the first classification are mounted on the substrate, the mounting head is positioned at the mounting position of the substrate held by the X-axis moving mechanism and the substrate moving mechanism. , After the electronic components of the second category are mounted, the configuration includes an operation control means for performing operation control for positioning the mounting head at the mounting position of the substrate held by the X-axis moving mechanism and the Y-axis moving mechanism. Adopted.
[0011]
In the above-described configuration, the electronic components supplied from each component supply apparatus with reference to the storage means are provided with the storage means for determining the classification of various electronic components in advance based on their sizes and storing them. The operation control means may perform the above-described operation control after determining which class it belongs to, and each component supply apparatus is provided with a marking means for identifying the classification and a recording means for recording the classification. The operation control means may perform the operation control after recognizing the classification.
In addition, a detection means for detecting the size of the electronic component held by the mounting head is provided, and the operation control means performs the above-described operation control after determining which class it belongs to according to the output of the detection means. May be.
In addition, for each type of electronic component, which size should be divided into the first classification and the second classification depends on, for example, the rule of thumb, testing, etc. On the other hand, it is desirable to determine the magnitude of the positional deviation and to classify the magnitude of the positional deviation as the second classification.
In the above configuration, while only the electronic components belonging to the first category are mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, and the substrate is likely to be displaced by the substrate driving. After the electronic component of the second classification is mounted on the substrate, mounting is performed without causing a positional shift of the electronic component by driving only the mounting head.
[0012]
  Claim 3The described invention is provided with a substrate moving mechanism that holds a substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction, and is arranged side by side along a direction orthogonal to the predetermined direction, and should be mounted on the substrate A plurality of component supply devices that individually supply various electronic components, a mounting head that holds the electronic components supplied from each component supply device and is mounted on the substrate held by the substrate moving mechanism, and the mounting head in the orthogonal direction An X-axis movement mechanism that moves the head along the X-axis movement mechanism, and a Y-axis movement mechanism that moves each mounting head in a predetermined direction via the X-axis movement mechanism. In the stage where only the electronic component of the first classification is mounted on the substrate, the mounting head is positioned at the mounting position of the substrate held by the X-axis moving mechanism and the substrate moving mechanism, First After the electronic component of this class is mounted, it is configured to include an operation control means for performing operation control for positioning the mounting head at the mounting position of the substrate held by the X-axis moving mechanism and the Y-axis moving mechanism. ing.
[0013]
In the above-described configuration, the electronic components supplied from each component supply device with reference to the storage means are determined in advance by determining the classification of the various electronic components from their weights and storing them. The operation control means may perform the above-described operation control after determining which class it belongs to, and each component supply device is provided with a marking means for identifying the classification and a recording means for recording the classification, and the classification is made based on these. The motion control means may perform the motion control after recognizing the above.
In addition, a detecting means for detecting the weight of the electronic component held by the mounting head is provided, and the operation control means performs the above-described operation control after determining which class it belongs to according to the output of the detecting means. Also good.
In addition, for each type of electronic component, the weight to be divided into the first classification and the second classification is based on, for example, empirical rules and tests, etc. Therefore, it is desirable to determine the weight that causes the positional deviation and to classify the weight that causes the positional deviation as the second classification.
In the above configuration, while only the electronic components belonging to the first category are mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, and the substrate is likely to be displaced by the substrate driving. After the electronic component of the second classification is mounted on the substrate, mounting is performed without causing a positional shift of the electronic component by driving only the mounting head.
[0014]
  Claim 4The described invention is provided with a substrate moving mechanism that holds a substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction, and is arranged side by side along a direction orthogonal to the predetermined direction, and should be mounted on the substrate A plurality of component supply devices that individually supply various electronic components, a mounting head that holds the electronic components supplied from each component supply device and is mounted on the substrate held by the substrate moving mechanism, and the mounting head in the orthogonal direction An X-axis moving mechanism that moves the head along the X-axis moving mechanism, and a Y-axis moving mechanism that moves each mounting head in a predetermined direction via the X-axis moving mechanism. For electronic components belonging to the second category and belonging to the first category, the mounting head is positioned at the mounting position of the substrate held by the X-axis moving mechanism and the Y-axis moving mechanism, and belongs to the second category Electric The parts, adopts a configuration that includes an operation control means for controlling the operation of positioning the mounting head to the mounting position of the substrate held by the X-axis moving mechanism and the substrate transfer mechanism.
[0015]
In the above-described configuration, the electronic components supplied from each component supply device with reference to the storage means are determined by classifying various electronic components in advance from their shapes and storing them. The operation control means may perform the above-described operation control after determining which class it belongs to, and each component supply device is provided with a marking means for identifying the classification and a recording means for recording the classification, and the classification is made based on these. The motion control means may perform the motion control after recognizing the above.
In addition, a detecting means for detecting the shape of the electronic component held by the mounting head is provided, and the operation control means performs the above-described operation control after determining which class it belongs to according to the output of the detecting means. Also good.
In addition, for each type of electronic component, which shape should be divided into the first classification and the second classification depends on, for example, the rule of thumb, testing, etc. It is desirable to determine the shape that causes the positional deviation and to classify the size that causes the positional deviation as the second classification. Note that examples of the shape that is likely to cause a positional shift include a shape that is erected from the substrate in a mounted state and a shape that has a center of gravity spaced from the substrate.
In the above configuration, while only the electronic components belonging to the first category are mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, and the substrate is likely to be displaced by the substrate driving. After the electronic component of the second classification is mounted on the substrate, mounting is performed without causing a positional shift of the electronic component by driving only the mounting head.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
(Overall configuration of the embodiment)
Hereinafter, an embodiment according to an electronic component mounting apparatus 1 of the present invention will be described with reference to the drawings. However, the scope of the invention is not limited to the illustrated examples. In the following description, one direction X-axis direction that is horizontal in the usage state of the electronic component mounting apparatus 1 and a direction that is horizontal and orthogonal to the X-axis direction are referred to as Y-axis direction.
[0017]
As shown in FIG. 1, the electronic component mounting apparatus 1 includes a base frame 2 formed in a substantially rectangular frame shape, and a substrate transport unit 3 that transports the substrate P from the previous process side to the next process side along the X-axis direction. A substrate moving mechanism including a mounting station 4 that holds the substrate P in a state where electronic components can be mounted, and a station moving unit 5 that moves the mounting station 4 along the Y-axis direction, and various types of devices mounted on the substrate P. As a plurality of component feeders for individually storing the electronic components, a mounting head 7 for mounting the electronic components of the tape feeders 6, 6,. Operation of each component of the X-axis moving mechanism 8 that moves along the X-axis direction, the Y-axis moving mechanism 9 that moves the mounting head 7 in the Y-axis direction via the X-axis moving mechanism 8, and the electronic component mounting apparatus 1 Operation control hand to control ; And a 150.
[0018]
(Substrate transport means)
The substrate transport unit 3 includes a substrate transport path 31 along the X-axis direction for transporting the substrate P from the previous process side to the next process side. The substrate transport unit 3 includes an upstream transport unit 3 a disposed on the upstream side of the substrate transport path 31 and a downstream transport unit 3 b disposed on the downstream side of the substrate transport path 31. Each of the transport units 3a and 3b includes a transport belt (not shown). For example, in the example of FIG. 1, the substrate P is transported in the X-axis direction from the left side to the right side while being placed on the transport belt. The Further, a station transport path 52 by the station moving means 5 of the mounting station 4 is provided between the upstream transport unit 3a and the downstream transport unit 3b in a state orthogonal to the transport direction of the transport units 3a and 3b.
[0019]
(Station moving means)
The station moving means 5 includes a support member 51 that supports the mounting station 4 movably along the Y-axis direction, station driving means (not shown) that drives the mounting station 4 while being supported by the support member 51, It comprises.
The support member 51 is a member extending in the Y-axis direction at the approximate center of the base frame 2, and is provided across the substrate transport portions 3 a and 3 b extending in the X-axis direction at a substantially right angle. The support member 51 has a function of supporting the mounting station 4 movably and guiding the movement along the Y-axis direction. Accordingly, the mounting station 4 moves along the station conveyance path 52 formed by the support member 51.
As the station driving means, for example, a linear motor can be applied, and besides that, a driving means combining a servo motor and a belt or a driving means combining a servo motor and a ball screw can be applied.
The station driving means moves and positions the mounting station 4 in the direction along the Y-axis direction by driving.
[0020]
(Installed station)
The mounting station 4 positions and holds the substrate P transported from the previous process side by the upstream transport unit 3 a at a position along the substrate transport path 31, and the mounting station 4 is positioned at a position along the substrate transport path 31. The substrate P on which the electronic component has been mounted is transferred to the downstream transport unit 3b. That is, the mounting station 4 delivers the substrate P to and from the substrate transport means 3 at the intersection position of the substrate transport path 31 and the station transport path 52 (substrate holding position for holding the substrate P). In addition, in order to transfer the substrate P to and from the substrate transport unit, the mounting station includes, for example, a substrate transport mechanism including a transport belt along the X-axis direction and a driving unit thereof in the same manner as the substrate transport unit 3. Have. When the mounting station 4 holds the substrate P, the substrate P is clamped and held between the two side portions 4a and 4a.
[0021]
(Tape feeder)
The tape feeder 6 includes a component transport tape for storing minute (for example, 1.0 mm in length × 0.5 mm in width) electronic components such as an IC, a resistor, and a capacitor. As shown in FIGS. 1A and 1B, a predetermined number of tape feeders 6, 6,... Are arranged at substantially equal intervals along the X-axis direction to form one group, Four feeder groups 61 to 64 are formed. The first and second feeder groups 61 and 62 and the third and fourth feeder groups 63 and 64 are respectively arranged in four areas defined by the substrate transport path 31 and the station transport path 52 on the upper surface of the base frame 2. ing. More specifically, the first feeder group 61 is on the right side of the upstream conveyance unit 3a, the second feeder group 62 is on the right side of the downstream conveyance unit 3b, the third feeder group 63 is on the left side of the upstream conveyance unit 3a, and the fourth feeder group. 64 is arrange | positioned at the left side of the downstream conveyance part 3b. That is, each of the feeder groups 61 to 64 is disposed at four positions sandwiching the substrate transport path 31 and the station transport path 52 from each other. Each of the tape feeders 6 is disposed on the base frame 2 so that the electronic component delivery position is close to the substrate transport path 31.
[0022]
In addition, the installation number of the tape feeders 6, 6, ... which comprise each feeder group 61-64 can be changed suitably. Further, the number of installed tape feeders 6, 6,... Constituting each feeder group 61 to 64 is made smaller than the number shown in FIG. 1 to form a further feeder group, and this further feeder group is divided into each feeder group 61 to 61. It may be arranged on at least one of the right side and the left side of 64.
[0023]
(Y-axis moving mechanism)
The Y-axis moving mechanism 9 includes a portal-shaped upstream Y-axis guide member 91 straddling the upstream transport unit 3a and a portal-shaped downstream Y-axis guide member 92 straddling the downstream transport unit 3b. Guide portions 91a and 92a along the Y-axis direction are provided on the upper portions of the Y-axis guide members 91 and 92, respectively.
Each Y-axis guide member 91, 92 supports the X-axis guide member 81 through the guide portions 91a, 92a so as to be movable along the Y-axis direction.
The Y-axis moving mechanism 9 includes Y-axis driving means (not shown) that moves the X-axis guide member 81 in the Y-axis direction. When the Y-axis driving means is driven, the X-axis guide member 81 is driven. Moves along the Y-axis direction. During the movement, the X-axis guide member 81 is not inclined with respect to the X-axis direction, and the extending direction of the X-axis guide member 81 and the X-axis direction are always maintained in a parallel state. As the Y-axis drive means, for example, a drive means combining a servo motor and a belt can be applied, and in addition, a drive means combining a servo motor and a ball screw, a linear motor, or the like is applicable.
[0024]
(X-axis movement mechanism)
The X-axis moving mechanism 8 includes a long X-axis guide member 81 that extends in the X-axis direction and movably supports the mounting head 7, and X-axis driving means that moves the mounting head 7 in the X-axis direction. . Both ends of the X-axis guide member 81 are supported on the upper portions of the guide portions 91a and 92a of the Y-axis guide members 91 and 92, respectively. As a result, the X-axis guide member 81 is bridged between the upper portions of the upstream Y-axis guide member 91 and the downstream Y-axis guide member 92, and is further guided by the guide portions 91a and 92a so as to be movable in the Y-axis direction. Become.
[0025]
Regarding the movement of the X-axis guide member 81, the X-axis guide member 81 is provided with an X-axis drive unit that supports the mounting head 7 so as to be movable in the X-axis direction and applies the moving force. As the X-axis driving means, for example, a driving means that combines a servo motor and a belt or a driving means that combines a servo motor and a ball screw can be used. A linear motor is adopted as means. That is, the linear motor stator is provided on the X-axis guide member 81, and the mover is provided on the mounting head 7. As a result, the X-axis drive means can position the mounting head 7 at a predetermined position in the X-axis direction. The X-axis driving means is controlled by the operation control means 150.
[0026]
(Installation head)
The mounting head 7 is movably supported on one side surface of the X-axis guide member 81. The mounting head 7 includes a predetermined number of suction nozzles 7a, 7a,... And sucks and holds electronic components from the feeder groups 61 to 64 by the suction nozzles 7a, 7a,. Each suction nozzle 7a is detachably held from the mounting head 7. That is, each suction nozzle 7a is prepared with various types capable of stably holding suction according to various electronic components, and various replacements (not shown) are within the movable range of the mounting head 7 on the upper surface of the base frame 2. A holding portion for the suction nozzle 7a is provided, and an exchange operation is performed as necessary.
Further, the mounting head 7 is provided with a nozzle lifting / lowering means that is individually driven so as to be vertically movable for each suction nozzle 7a, and is provided with a nozzle rotating means for rotating the suction nozzle 7a about the vertical direction.
[0027]
These suction nozzles 7a, 7a,... Are arranged in a line along the X-axis direction on the mounting head 7, and the arrangement of the suction nozzles 7a, 7a,. Are consistent. That is, all the suction nozzles 7a, 7a,... Provided in the mounting head 7 are arranged in a straight line along the X-axis direction. 1, the suction nozzles 7a, 7a,... Of the mounting head 7 are arranged in a row, but the number of suction nozzles 7a may be increased and arranged over a plurality of rows.
[0028]
Further, as shown in FIG. 1B, the mounting head 7 includes an imaging camera 7b (for example, a CCD camera) as a substrate position recognition unit. The imaging camera 7b is provided for positioning the tape feeder 6 to receive the electronic component, and for recognizing the positional deviation of the substrate P by the position recognition mark provided on the substrate P.
[0029]
In addition, the mounting head 7 includes a component posture recognition device 203 (see FIG. 2) that includes light emitting elements (for example, laser diodes) arranged in a row horizontally and light receiving elements arranged in a row so as to face the light emitting elements. ) And the posture (hereinafter simply referred to as “suction posture”) and width of the electronic component sucked by each suction nozzle 7a, 7a,. Accordingly, when the width of the electronic component is detected as a value indicating a defect, the operation control unit 150 recognizes the electronic component as a defective shape product, and transports the electronic component to a discard unit (not shown) and discards it.
[0030]
Further, the mounting head 7 is provided with a light reflection sensor 204 (see FIG. 2) as a defective substrate recognition means, and recognizes a defective mark attached to the substrate P that is defective and does not require component mounting. By recognizing this defect mark, the operation control means 150 transports the substrate P to the downstream transport section 3b by the substrate transport means 3 without performing a mounting operation.
[0031]
(Configuration of operation control means)
The operation control means 150 will be described with reference to FIG. FIG. 2 is a block diagram showing a control system of the electronic component mounting apparatus 1. First, the configuration around the operation control means 150 will be described.
The operation control means 150 includes an X-axis driving means for the X-axis moving mechanism 8, a Y-axis driving means for the Y-axis moving mechanism 9, a nozzle lifting / lowering means for the mounting head 7, a nozzle rotating means for the mounting head 7, a station moving means 5, and a substrate. About the conveyance means 3, it connects through a drive circuit, respectively, and performs these operation control. Each drive circuit is driven in accordance with a control command signal from the operation control means 150.
[0032]
Further, the operation control means 150 is connected to the imaging camera 7b, the component posture recognition device 203, the light reflection sensor 204, and the setting input means 205 via input circuits. Each input circuit A / D converts the output signals from these and inputs them to the operation control means 150.
The setting input unit 205 is an input device for an operator to input various operation commands and various settings, such as a touch panel and a keyboard.
[0033]
The operation control means 150 includes a ROM 152 in which a control program or control data for executing various functions and operations described later of the electronic component mounting apparatus 1 are written, a CPU 151 that controls the operation of each of the above components in accordance with the control program, and a CPU 151 A RAM 153 is provided for storing processing data and various data required for various operations. The RAM 153 is provided with various work memories and counters, and is also used as a work area during operation control.
[0034]
Further, the RAM 153 stores the order data of the electronic components to be mounted on the substrate P, the receiving position data of various electronic components (which position the various electronic components are the tape feeders 6), and the substrate P of the various electronic components. Mounting position data and classification data of various electronic components are stored.
The above-mentioned classification data of various electronic components is the first classification when the mounting station 4 holding the substrate P on which each electronic component is mounted is moved at a high speed by the station moving means 5 so that the positional deviation is less likely to occur. Data that specifies which class of various electronic components is classified as the second class is likely to cause misalignment.
Such classification data may be specified and input by an operator in advance for various electronic components by an actual measurement test.
In addition, the size or weight threshold of electronic components that are likely to be misaligned is set in advance, and the operator automatically sets the size or weight value for various electronic components, thereby automatically classifying the various electronic components. A program for specifying and recording the information may be stored in the ROM 152 and the CPU 151 may execute it.
A ROM 152 is a program that automatically sets and records the classification of various types of electronic components by setting in advance the shape patterns of the electronic components that are likely to cause misalignment, and the operator setting and inputting the shape patterns for the various types of electronic components. And the CPU 151 may execute it.
[0035]
The ROM 152 stores a program for controlling the mounting operation of the electronic component according to the first and second modes.
In the first mode, the Y-axis moving mechanism 9 is not operated with respect to the mounting head 7 holding the electronic component from each tape feeder 6, and the substrate P is cooperated by the X-axis moving mechanism 8 and the station moving means 5. This is an operation control for positioning the mounting head 7 at the mounting position of and mounting the head. This first mode is suitable for speeding up the mounting operation, and is suitable when only the first category of electronic components is mounted on the substrate P.
In the second mode, the station moving means 5 fixes the mounting station 4 at a specified position (for example, the center of the base frame 2) and moves the Y-axis relative to the mounting head 7 holding the electronic components from each tape feeder 6. This is an operation control in which the mounting head 7 is positioned at the mounting position of the substrate P by the cooperation of the mechanism 9 and the X-axis moving mechanism 8 to perform mounting. In the second mode, since the substrate P is not moved, it is possible to avoid the displacement of the electronic components mounted on the substrate P, and the second category of electronic components is mounted on the substrate P. It is suitable for the case.
[0036]
The ROM 152 stores first and second selection programs for selecting the first and second modes.
The first selection program causes the mounting operation to be performed according to the selected mode when the setting input unit 205 has previously performed input selection for mode selection. That is, the electronic component mounting operation is performed in a fixed state in any mode. For example, when mounting only the electronic component of the first category, it is possible to speed up the mounting by fixing to the first mode, and when the mounting frequency of the electronic component of the second category is high Can be fixed in the second mode to avoid displacement of the electronic component.
The second selection program performs the mounting operation in the first mode as long as the electronic components belonging to the first classification are continuously mounted in a series of mounting operations on one board, and first belongs to the second classification. After the electronic components are mounted, the second mode is fixed thereafter, and the mounting operation is performed until all the electronic components are mounted. With this selection program, in the mounting operation on one substrate P, it is possible to avoid positional deviation from the substrate P after mounting the electronic component and to speed up the series of mounting operations.
The CPU 151 controls the operation of each unit according to the program stored in the ROM 152 and referring to various data recorded in the RAM 153.
[0037]
(Explanation of operation of electronic component mounting device)
First, the operation when the mode is fixed to the first mode according to the first selection program will be described with reference to FIG.
First, the CPU 151 controls the operation of the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 according to the receiving position data, thereby positioning the predetermined suction nozzle 7a of the mounting head 7 at the receiving position of the predetermined tape feeder 6 and the nozzle. Electronic parts are received by controlling the operation of the lifting and lowering means.
Next, the CPU 151 controls the operation of the X-axis moving mechanism 8 and the station moving means 5 according to the mounting position data, thereby moving the mounting head 7 along the X-axis direction and moving the mounting station 4 in the Y-axis direction. Then, the mounting head 7 is positioned at the mounting position of the substrate P (state shown in FIG. 3). Then, the operation control for mounting the electronic component holding and driving the nozzle raising / lowering means is performed.
The above operation is repeated for all electronic components.
[0038]
Next, an operation when the mode is fixed to the second mode according to the first selection program will be described with reference to FIG.
First, the CPU 151 controls the operation of the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 according to the receiving position data, thereby positioning the predetermined suction nozzle 7a of the mounting head 7 at the receiving position of the predetermined tape feeder 6 and the nozzle. Electronic parts are received by controlling the operation of the lifting and lowering means.
Next, the CPU 151 controls the operation of the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 according to the mounting position data, thereby moving the mounting head 7 along the X-axis direction and the Y-axis direction, and moving the mounting head 7. The substrate P is positioned at the mounting position (state shown in FIG. 4). Then, the operation control for mounting the electronic component holding and driving the nozzle raising / lowering means is performed.
The above operation is repeated for all electronic components.
[0039]
First, the mounting operation performed according to the second selection program will be described with reference to FIGS.
First, the CPU 151 refers to each data of the electronic component by the RAM 153 in the order of placement. And as long as it shows that an electronic component is a 1st classification in order of mounting, mounting operation | movement is performed according to 1st mode.
That is, the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 are driven according to the receiving position data to position the predetermined suction nozzle 7a of the mounting head 7 at the receiving position of the predetermined tape feeder 6 and to control the operation of the nozzle lifting / lowering means. To receive electronic components. Then, the X-axis moving mechanism 8 and the station moving means 5 are driven according to the mounting position data to move the mounting head 7 along the X-axis direction and move the mounting station 4 in the Y-axis direction. Positioning at the mounting position of P (state of FIG. 3). Then, the operation control for mounting the electronic component holding and driving the nozzle raising / lowering means is performed.
The above operation is repeated for each electronic component, and the mounting operation is performed by switching to the second mode when the order of the electronic components of the second classification has been turned for the first time.
That is, the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 are driven according to the receiving position data to position the predetermined suction nozzle 7a of the mounting head 7 at the receiving position of the predetermined tape feeder 6 and to control the operation of the nozzle lifting / lowering means. To receive electronic components. Then, the X-axis moving mechanism 8 and the Y-axis moving mechanism 9 are driven according to the mounting position data, the mounting head 7 is moved along the X-axis direction and the Y-axis direction, and the mounting head 7 is positioned at the mounting position of the substrate P. (State of FIG. 4). Then, the operation control for mounting the electronic component holding and driving the nozzle raising / lowering means is performed.
After that, until the mounting of the board P is completed, the second mode is maintained and the mounting operation is repeatedly performed even if the mounting of the electronic component of the first classification is performed on the way.
[0040]
As described above, the electronic component mounting apparatus 1 can be quickly mounted by driving the station moving means 5 and the X-axis moving mechanism 8 while only the electronic components belonging to the first category are mounted on the board P. After the second class of electronic components that are likely to be displaced with respect to the substrate P are mounted on the substrate P, the electronic components are displaced by driving the X-axis moving mechanism 8 and the Y-axis driving means 9. In order to avoid the shift of the holding position by performing the mounting that does not occur, it is possible to speed up the operation while suppressing mounting defects in the overall mounting operation of sequentially mounting various electronic components.
[0041]
(Other)
In the operation control means 150, the classification of various electronic components is set and inputted in advance as data, or the classification is performed based on the size, weight or shape data of the electronic components. A means for detecting the weight or shape may be provided, and the classification may be performed based on the detection result.
For example, in order to detect the weight of the electronic component, a weight sensor may be provided via the suction nozzle 7a, or the suction nozzle 7a may be elastically supported and detected by an elastic displacement amount during suction.
Further, in order to detect the size of the electronic component, the width detected by the component posture recognition device 203 described above may be used, or the size may be detected by the imaging data of the electronic component immediately before reception by the imaging camera 7b. You can go.
Further, in order to detect the shape of the electronic component, the imaging data of the electronic component immediately before reception by the imaging camera 7b may be subjected to image processing, and identification may be performed based on whether or not a predetermined characteristic shape pattern is provided.
Then, by performing one of the above detections, upon receipt of each electronic component, the CPU 151 determines which classification the electronic component belongs to, and which mode is the subsequent mounting operation. You may perform the process to determine.
[0042]
【The invention's effect】
According to the first aspect of the present invention, since the first mode corresponding to high-speed mounting and the second mode for avoiding the positional deviation of the electronic component can be selected, at least an electronic component that is likely to cause a positional deviation on the substrate is provided. Until it is mounted, the parts are mounted in the first mode to speed up the work. After the electronic parts that are likely to be misaligned are mounted, the parts are mounted in the second mode. A positional shift can be avoided. Therefore, it is possible to speed up the mounting operation while effectively suppressing the displacement of the electronic component from the substrate.
[0043]
According to the second aspect of the invention, while only the electronic component belonging to the first category is mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, thereby causing a positional shift with respect to the substrate. In order to suppress mounting defects due to misalignment of the holding position by mounting the electronic component of the second category, which is easy to mount, on the board, the mounting of the electronic component does not cause displacement by driving only the mounting head. It is possible to increase the speed of the overall mounting operation for sequentially mounting electronic components while suppressing mounting defects.
[0044]
According to the third aspect of the present invention, while only the electronic component belonging to the first category is mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, thereby causing a positional shift with respect to the substrate. In order to suppress mounting defects due to displacement of the holding position by mounting electronic components that do not cause positional displacement by driving only the mounting head after large-scale second-class electronic components that are easy to mount are mounted on the board, It is possible to increase the speed of the overall mounting operation for sequentially mounting various electronic components while suppressing defective mounting.
[0045]
In the invention according to claim 4, while only the electronic component belonging to the first category is mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, thereby causing a positional shift with respect to the substrate. In order to suppress mounting defects due to misalignment of the holding position by mounting the electronic components of the second category with easy weights on the board by mounting only the mounting head so that the electronic components do not shift. As a result, it is possible to speed up the operation while suppressing the mounting failure of the entire mounting operation of sequentially mounting various electronic components.
[0046]
According to the fifth aspect of the present invention, while only the electronic component belonging to the first category is mounted on the substrate, the substrate is quickly mounted by driving the substrate and the mounting head, thereby causing a positional shift with respect to the substrate. In order to suppress mounting failure due to displacement of the holding position by mounting the electronic component of the second category of easy shape on the board by performing mounting without causing positional displacement of the electronic component by driving only the mounting head, It is possible to increase the speed of the overall mounting operation for sequentially mounting various electronic components while suppressing defective mounting.
[Brief description of the drawings]
FIG. 1A shows a perspective view of an electronic component mounting apparatus according to an embodiment, and FIG. 1B shows a plan view thereof.
FIG. 2 is a block diagram showing a control system of the electronic component mounting apparatus.
FIG. 3 is an explanatory diagram of a mounting operation in a first mode.
FIG. 4 is an explanatory diagram of a mounting operation in a second mode.
FIG. 5 is a perspective view showing a conventional electronic component mounting apparatus.
[Explanation of symbols]
1 Electronic component mounting equipment
3 Substrate transfer means
4 Loading station (substrate movement mechanism)
5 Station moving means (substrate moving mechanism)
6 Tape feeder (part supply device)
7 Mounted head
7a Suction nozzle
8 X axis movement mechanism
9 Y-axis movement mechanism
150 Operation control means
202 Imaging camera
203 Component posture recognition device
P substrate

Claims

A substrate moving mechanism that holds the substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction;
A plurality of component supply devices that are provided side by side along a direction orthogonal to the predetermined direction and individually supply various electronic components to be mounted on the substrate;
A mounting head for holding the electronic component supplied from each of the component supply devices and mounting the electronic component on the substrate held by the substrate moving mechanism;
An X-axis moving mechanism for moving the mounting head along the orthogonal direction;
A Y-axis movement mechanism that moves the mounting heads in the predetermined direction via the X-axis movement mechanism,
Classifying the various electronic components in advance so as to be identifiable into a first classification and a second classification,
In the stage where only the electronic component of the first classification is mounted on the substrate, the mounting head is positioned at the mounting position of the held substrate by the X-axis moving mechanism and the substrate moving mechanism,
After the electronic component of the second classification is mounted, operation control means for performing operation control for positioning the mounting head at the mounting position of the held substrate by the X-axis moving mechanism and the Y-axis moving mechanism. An electronic component mounting apparatus comprising the electronic component mounting apparatus.

A substrate moving mechanism that holds the substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction;
A plurality of component supply devices that are provided side by side along a direction orthogonal to the predetermined direction and individually supply various electronic components to be mounted on the substrate;
A mounting head for holding the electronic component supplied from each of the component supply devices and mounting the electronic component on the substrate held by the substrate moving mechanism;
An X-axis moving mechanism for moving the mounting head along the orthogonal direction;
A Y-axis movement mechanism that moves the mounting heads in the predetermined direction via the X-axis movement mechanism,
The various electronic components are classified into a first classification and a second classification according to their sizes,
In the stage where only the electronic component of the first classification is mounted on the substrate, the mounting head is positioned at the mounting position of the held substrate by the X-axis moving mechanism and the substrate moving mechanism,
After the electronic component of the second classification is mounted, operation control means for performing operation control for positioning the mounting head at the mounting position of the held substrate by the X-axis moving mechanism and the Y-axis moving mechanism. An electronic component mounting apparatus comprising the electronic component mounting apparatus.

A substrate moving mechanism that holds the substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction;
A plurality of component supply devices that are provided side by side along a direction orthogonal to the predetermined direction and individually supply various electronic components to be mounted on the substrate;
A mounting head for holding the electronic component supplied from each of the component supply devices and mounting the electronic component on the substrate held by the substrate moving mechanism;
An X-axis moving mechanism for moving the mounting head along the orthogonal direction;
A Y-axis movement mechanism that moves the mounting heads in the predetermined direction via the X-axis movement mechanism,
The various electronic components are classified into a first classification and a second classification according to their weight,
In the stage where only the electronic component of the first classification is mounted on the substrate, the mounting head is positioned at the mounting position of the held substrate by the X-axis moving mechanism and the substrate moving mechanism,
After the electronic component of the second classification is mounted, operation control means for performing operation control for positioning the mounting head at the mounting position of the held substrate by the X-axis moving mechanism and the Y-axis moving mechanism. An electronic component mounting apparatus comprising the electronic component mounting apparatus.

A substrate moving mechanism that holds the substrate in a state where electronic components can be mounted and moves the substrate along a predetermined direction;
A plurality of component supply devices that are provided side by side along a direction orthogonal to the predetermined direction and individually supply various electronic components to be mounted on the substrate;
A mounting head for holding the electronic component supplied from each of the component supply devices and mounting the electronic component on the substrate held by the substrate moving mechanism;
An X-axis moving mechanism for moving the mounting head along the orthogonal direction;
A Y-axis movement mechanism that moves the mounting heads in the predetermined direction via the X-axis movement mechanism,
The various electronic parts are classified into a first classification and a second classification according to their shapes,
In the stage where only the electronic component of the first classification is mounted on the substrate, the mounting head is positioned at the mounting position of the held substrate by the X-axis moving mechanism and the substrate moving mechanism,
After the electronic component of the second classification is mounted, operation control means for performing operation control for positioning the mounting head at the mounting position of the held substrate by the X-axis moving mechanism and the Y-axis moving mechanism. An electronic component mounting apparatus comprising the electronic component mounting apparatus.