JP4261943B2 - Electronic component manufacturing method and electronic component - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component manufacturing method and an electronic component, and more particularly, to an electronic component manufacturing method and an electronic component in which columnar conductors are used for electrical connection between layers to be laminated.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a multilayer wiring structure is known in which a plurality of wiring patterns are stacked and an interlayer connection portion is provided between the stacked wiring patterns to achieve a complicated wiring function.
[0003]
Various manufacturing methods for forming the structure have been proposed and disclosed. FIG. 7 is a cross-sectional explanatory view showing a conventional general interlayer connection.
[0004]
In the figure, an insulating layer 2 is formed on the lower layer side 1. The insulating layer 2 is provided with a first columnar conductor 3 serving as an interlayer connection portion so as to penetrate the insulating layer 2. A wiring pattern 4 is formed on the upper surface of the lower layer side 1 thus formed so as to achieve electrical continuity with the first columnar conductor 3.
[0005]
In the figure, for the purpose of connecting the lower layer side 1 and the upper layer side 5, a second columnar conductor 6 is formed above the first columnar conductor 3 provided on the lower layer side 1 via the wiring pattern 4. Has been. The second columnar conductor 6 is usually coated with a resist or the like so as to cover the ceiling portion of the first columnar conductor 3, or a dry film or the like is applied thereto, and a mask is formed by photoetching and plating using this mask is performed. It is formed by precipitation or the like.
[0006]
As details of forming a post that becomes a columnar conductor using such a resist, a dry film resist is laminated, and then an opening for forming a post is formed by exposure and development. And after opening part formation, the method of forming a post by electrolytic copper plating in the said opening part is known (for example, refer patent document 1).
[0007]
Also known is a method in which a resin layer not covered with a resist pattern covering the top of the columnar conductor is removed by jet scrubbing (so-called blasting) to expose the head of the columnar conductor (for example, a patent). Reference 2).
[0008]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-75063 ([0024])
[0009]
[Patent Document 2]
JP-A-10-22636 ([0012])
[0010]
[Problems to be solved by the invention]
Incidentally, the above-described conventional technique has the following problems.
[0011]
That is, as shown in FIG. 7, in the method in which the first columnar conductor 3 and the second columnar conductor 6 are overlapped, mask attachment error, mask deformation (expansion and contraction due to temperature and humidity), or substrate deformation, etc. When the mask position accuracy is reduced due to the above factors, the relative displacement between the first columnar conductor 3 and the second columnar conductor 6 occurs, and as a result, the second columnar conductor 6 is deformed as shown in FIG. There was a possibility that the increase in the resistance value and the heat dissipation characteristics via the columnar conductors were deteriorated.
[0012]
The diameter of the columnar conductor serving as the interlayer connection portion has also been reduced due to a demand for miniaturization of the electronic component, and the above-described problem due to the mask position accuracy has become more prominent.
[0013]
Here, if it is going to solve the said subject by improving the positional accuracy of a mask, management of attachment accuracy etc. will become severe, and new problems, such as a rise in management cost, will generate | occur | produce.
[0014]
As shown in FIG. 9, when the resin layer 9 that is not covered with the resist pattern 8 that covers the top of the third columnar conductor 7 is removed by jet scrubbing, if the resist pattern 8 is misaligned, The jet scrub is applied to the resin layer 9 around the third columnar conductor 7, and the resin layer 9 is dug, and there is a possibility that a gap 10 as shown in the cross-hatched portion in the figure is generated. When trying to solve such a problem by improving the positional accuracy of the mask, as described above, management of the mask mounting accuracy becomes strict and new problems such as an increase in management cost occur.
[0015]
The present invention pays attention to the above-mentioned conventional problems, and provides a method for improving the connection reliability of columnar conductors for interlayer connection without making the accuracy of conventional masks strict, and an electronic component using the method The purpose is to do.
[0016]
[Means for Solving the Problems]
The present invention provides a mask if the columnar conductor is composed of at least a lower neck portion penetrating through the insulating layer and a connection head portion having an area exceeding the cross-sectional area of the lower neck portion and making a wiring connection with the upper layer side. This is based on the knowledge that the error can be absorbed by the connecting head whose diameter is expanded from the lower neck.
[0017]
That is, the electronic component manufacturing method according to the present invention includes a plurality of wiring patterns and an insulating layer interposed between the wiring patterns, and an electrical connection between the wiring patterns by a columnar conductor penetrating the insulating layer. A method of manufacturing an electronic component to be connected, wherein after forming the columnar conductor to exceed a set height of the columnar conductor, the columnar conductor is polished from above so that the height of the columnar conductor is set to the set height. In addition, the connecting head is formed so as to exceed the cross-sectional area of the neck lower portion of the columnar conductor, and the upper layer side is connected to the enlarged connecting head.
[0018]
As another method of manufacturing an electronic component, a plurality of wiring patterns and an insulating layer interposed between the wiring patterns are provided, and electrical connection between the wiring patterns is performed by a columnar conductor penetrating the insulating layer. The columnar conductor is formed so as to exceed the set height of the columnar conductor, and the columnar conductor is polished from above to reduce the height of the columnar conductor to the set height. And forming an insulating layer so as to fill the columnar conductor, and overlapping the connection head that has been expanded in diameter. By forming an opening in the layer region, the connecting head was exposed and the upper layer side was connected.
[0019]
The electronic component according to the present invention is an electronic component in which a plurality of wiring patterns and insulating layers covering the wiring patterns are arranged at least in the thickness direction, and the interior of the wiring pattern located between the insulating layers is between The connection is made with densely formed columnar conductors, and a connection head is provided on the columnar conductor so as to exceed at least the neck lower cross-sectional area, and the upper layer side is connected to the expanded connection head. .
[0020]
According to the said structure, the said columnar conductor is first formed so that the height of the columnar conductor set beforehand may be exceeded. Thereafter, if the columnar conductor is polished from above the columnar conductor, the total height of the columnar conductor follows the preset columnar conductor height, and the diameter of the head of the polished columnar conductor is Expanding. Since the connecting head is formed by polishing, when viewed from above, the area is such that the area of the lower neck is included in the area (that is, the lower part of the neck is within the projected area of the connecting head). Projection area included).
[0021]
In this way, if the connection head having an enlarged diameter is formed on the head of the columnar conductor, the wiring pattern and the columnar conductor located in the upper layer are connected to the connection head having an enlarged diameter. Connection reliability can be ensured against displacement of the mask or the like.
[0022]
In addition to the above action, after forming the columnar conductor, the columnar conductor is filled with an insulating layer, and then the insulating layer located above the connection head is removed to provide an opening for connection with the upper layer side. Even in the case where the insulating layer is formed, since the diameter of the connecting head in the columnar conductor is set to be large, the restriction on the position where the opening is formed is eased as described above, and the wiring pattern and columnar conductor located in the upper layer are relaxed. Since the connection is made to the connection head exposed from the opening, connection reliability can be ensured.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method for manufacturing an electronic component and an electronic component according to the present invention will be described in detail with reference to the drawings.
[0024]
FIG. 1 is an enlarged cross-sectional view of an electronic component using the manufacturing method according to the present embodiment.
[0025]
As shown in the figure, in electronic component 20 manufactured using the method for manufacturing an electronic component according to the present embodiment, a plurality of layers are formed in the thickness direction, and a plurality of columnar conductors (to serve as interlayer connection portions). 22A and 22B are stacked so as to connect these layers (in the present embodiment, two to three stages). An insulating layer 24 is interposed around the columnar conductors 22A, 22B, and 22C so as to provide an insulating action around the columnar conductors 22A, 22B, and 22C and the wiring pattern 26.
[0026]
By the way, the columnar conductors 22A, 22B, and 22C have connection heads 28A, 28B, and 28C (not shown) for connection to the upper layer side, and below the connection heads 28A, 28B, and 28C. It is comprised by the neck lower part 30A, 30B, 30C which is located. Note that the columnar conductors 22A, 22B, and 22C described above are only different in position and have the same shape. Therefore, the shape will be described based on the columnar conductor 22A.
[0027]
As described above, the columnar conductor 22A includes the connection head portion 28A and the neck lower portion 30A located immediately below the connection head portion 28A. Here, the diameter of the connection head 28A is enlarged so as to exceed the cross-sectional area of the neck lower portion 30A, and the projection surface of the neck lower portion 30A is included in the projection surface of the connection head 28A. The positional relationship is as follows. Further, the area of the connecting head 28A may be set as appropriate according to the accuracy of the formation position of the columnar conductor on the upper layer side to be connected while at least exceeding the neck lower portion 30A.
[0028]
A method for manufacturing the electronic component 20 configured as described above will be described below.
[0029]
In order to apply the manufacturing method according to this embodiment to form the above-described columnar conductor, first, as shown in FIG. 2A, a dry film 34 is bonded to the upper side of the wiring pattern 32, and then photoetching is performed. Thus, an opening 36 is formed on the surface of the dry film 34. In addition, the thickness (A dimension in the figure) of the dry film 34 is set lower than the height of the columnar conductor set in advance.
[0030]
Then, as shown in FIG. 2 (2), plating (hatched portion in the figure) is deposited in the opening 36 using the wiring pattern 32 as an electrode, and then the upper side of the dry film 34 is shown in FIG. 3 (3). The plating is naturally grown so as to rise from the surface. The height of the plating that rises from the upper surface of the dry film 34 (B dimension in the figure) is grown until it exceeds the height of the columnar conductor set in advance.
[0031]
After the plating is grown to the height of the columnar conductor set in advance as described above and the columnar conductor 38 is formed, as shown in FIG. 3 (1), the grindstone 40 serving as a polishing means is brought into contact with the upper end portion of the columnar conductor 38. Thus, the height of the columnar conductor 38 is set to a preset height (C dimension in the figure). Further, when the grinding stone 40 is brought into contact with the upper end portion of the columnar conductor 38 and polishing is performed, a part of the upper end portion of the columnar conductor 38 moves to the plating peripheral portion on the dry film 34 and overlies outside the plating peripheral portion. The hang part 42 is formed. FIG. 2B shows a state in which the columnar conductor 38 has been polished.
[0032]
After the polishing is completed by the above process, the columnar conductor 38 having the connection head portion 44 and the neck lower portion 46 can be formed by removing the dry film 34 as shown in FIG. .
[0033]
The effect of the columnar conductor 38 formed through such a procedure will be described below.
[0034]
FIG. 4 is a cross-sectional explanatory view showing a step of forming an opening in the upper part of the columnar conductor covered with the insulating layer. As shown in FIG. 1A, after the columnar conductors 38 are filled with an insulating layer 48, a mask 52 is formed at a location excluding the formation region of the openings 50. After the mask 52 is formed, a jet scrub process is performed from above, and the insulating layer 48 located above the connection head 44 is removed. Here, the columnar conductor 38 is formed with a connection head 44 having an enlarged diameter. Therefore, even if the opening 50 is offset to the left side as shown in FIG. The region of the opening 50 does not overlap the insulating layer 48, and the connection head 44 can be reliably exposed at the bottom of the opening 50. Further, even if the opening 50 is enlarged due to a mask formation error as shown in FIG. 3C, the connection head 44 can be exposed at the bottom of the opening 50 as in FIG.
[0035]
In the above-described embodiment, the columnar conductor having the connection head and the neck lower part is formed by spontaneously growing the plating from the dry film surface. However, the present invention is not limited to this form. For example, it is possible to form the columnar conductor according to the present invention by using the following method in which the connecting head and the neck lower part are formed by superposing two layers of dry films.
[0036]
In order to form a columnar conductor by applying another manufacturing method according to the present embodiment, first, as shown in FIG. 5 (1), first and second dry films are formed on the already formed wiring pattern 54. 56 and 58 are bonded together, and then a photoetching process is performed to form a pilot hole 60 corresponding to the cross-sectional shape of the neck lower part of the columnar conductor in the first and second dry films 56 and 58. The thicknesses of the first and second dry films 56 and 58 may be set as follows. That is, the thickness (dimension D in the drawing) of the first dry film 56 is set at least lower than the height of the columnar conductor to be formed, and the thickness of the second dry film 58 is the first and second dry films. When 56 and 58 are stacked (dimension E in the figure), the dimension is set so as to exceed the height of the columnar conductor. In the case of carrying out this embodiment, for example, the first dry film 56 is made of a material that can be peeled off by a solvent-based stripping solution, and the second dry film 58 is made of an alkali-based peel. It is preferable that the material that can be peeled with the liquid can be peeled selectively. Thus, if the materials of the first and second dry films 56 and 58 are made different so that they cannot be peeled off by the same stripping solution, the boundary between these dry films can be clarified. In the present embodiment, the first and second dry films 56 and 58 are used. However, the first and second dry films 56 and 58 are not limited thereto. For example, instead of the first and second dry films 56 and 58, Different resists that cannot be stripped with the same stripping solution may be applied.
[0037]
Thereafter, as shown in FIG. 2 (2), the wiring pattern 54 is used as an electrode, plating is deposited in the pilot hole 60, the metal is filled up to the vicinity of the upper end of the second dry film 58, and the columnar conductor 62 is formed. As shown in FIG. 3C, the second dry film 58 is removed, and the upper end portion of the columnar conductor 62 is exposed.
[0038]
After the upper end portion of the columnar conductor 62 is exposed by removing the second dry film 58 as described above, a grindstone 64 serving as a polishing means is brought into contact with the upper end portion of the columnar conductor 62 as shown in FIG. The height of the columnar conductors 62 is set to a predetermined height (C dimension in the figure). When the grinding stone 64 is brought into contact with the upper end portion of the columnar conductor 62 and polishing is performed, a part of the upper end portion of the columnar conductor 62 moves to the upper surface side of the first dry film 56 to form an overhang portion 66. FIG. 2B shows the state in which the columnar conductor 62 has been polished.
[0039]
After the columnar conductor 62 is polished, the columnar conductor 40 including the connection head 68 and the neck lower portion 70 is formed by removing the first dry film 56 as shown in FIG. can do.
[0040]
【The invention's effect】
As described above, according to the present invention, a plurality of wiring patterns and an insulating layer interposed between the wiring patterns are provided, and electrical connection between the wiring patterns is performed by a columnar conductor penetrating the insulating layer. A method of manufacturing an electronic component, comprising: forming the columnar conductor so as to exceed a set height of the columnar conductor, and then polishing the columnar conductor from above to set the height of the columnar conductor to the set height. And connecting the upper layer side to the enlarged diameter connecting head so as to exceed the cross-sectional area of the lower part of the neck of the columnar conductor. Without being strict, it is possible to improve the connection reliability of the columnar conductors that make the interlayer connection.
[Brief description of the drawings]
FIG. 1 is an enlarged cross-sectional view of an electronic component using a manufacturing method according to an embodiment.
FIG. 2 is an explanatory cross-sectional view showing a method of forming a columnar conductor according to the present embodiment.
FIG. 3 is an explanatory cross-sectional view showing a method of forming a columnar conductor according to the present embodiment.
FIG. 4 is an explanatory cross-sectional view showing a step of forming an opening in the upper part of a columnar conductor covered with an insulating layer.
FIG. 5 is an explanatory cross-sectional view showing another method of forming a columnar conductor according to the present embodiment.
FIG. 6 is an explanatory cross-sectional view showing another method for forming a columnar conductor according to the present embodiment.
FIG. 7 is an explanatory cross-sectional view showing a conventional general interlayer connection portion.
FIG. 8 is an explanatory cross-sectional view showing a state in which a relative displacement between the first columnar conductor and the second columnar conductor has occurred.
FIG. 9 is an explanatory cross-sectional view showing a state in which a resin layer not covered with a resist pattern is removed by a jet scrub process.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ......... Lower layer side 2 ......... Insulating layer 3 ......... First columnar conductor 4 ......... Wiring pattern 5 ......... Upper layer side 6 ......... Second columnar conductor 7 ......... Third columnar conductor 8 ... …… Resist pattern 9 ……… Resin layer 10 ………… Void 20 ………… Electronic components 22A, 22B, 22C ……… Columnar conductor 24 ……… Insulating layer 26 ………… Wiring patterns 28A, 28B, 28C …… ... Connecting heads 30A, 30B, 30C ......... Lower neck 32 ......... Wiring pattern 34 ......... Dry film 36 ......... Opening 38 ......... Columnar conductor 40 ...... Whetstone 42 ......... Overhang 44 ......... Connecting head 46 ......... Lower neck 48 ......... Insulating layer 50 ......... Opening 52 ......... Mask 54 ......... Wiring pattern 56 ......... First dry film 58 ......... Second Dry film 60 ......... Preliminary hole 62 ......... Columnar conductor 64 ......... Whetstone 66 ...... overhang portion 68 ......... connection head 70 ......... neck lower

Claims (4)

A method of manufacturing an electronic component comprising a plurality of wiring patterns and an insulating layer interposed between the wiring patterns, and electrically connecting the wiring patterns with a columnar conductor penetrating the insulating layer,
Forming the columnar conductor to exceed the set height of the columnar conductor;
By polishing the columnar conductor from above with a rotating grindstone, the height of the columnar conductor is made equal to the set height, and by polishing, a part of the columnar conductor is moved to the side from the columnar conductor. Forming an overhang portion projecting over to form a connection head that only exceeds the neck lower cross-sectional area of the columnar conductor,
An electronic component manufacturing method comprising connecting an upper layer side electrode to the connection head.   After the connection head is formed, the insulating layer is formed so that the columnar conductor is embedded, and the connection head is exposed by forming an opening in the insulating layer region overlapping the connection head. 2. The method of manufacturing an electronic component according to claim 1, wherein the upper layer side electrode is connected.   The columnar conductor has a region projecting outward of the columnar conductor at the head of the columnar conductor when the columnar conductor is formed to exceed the set height. Manufacturing method of electronic components. An electronic component in which a plurality of wiring patterns and insulating layers covering the wiring patterns are arranged in the thickness direction,
A wiring pattern located across the insulating layer;
A columnar conductor in which the inside connecting each of the wiring patterns arranged across the insulating layer is formed densely, and
The columnar conductor has a connecting head having a cross-sectional area exceeding the cross-sectional area of the main body of the columnar conductor;
The diameter-enlarged portion of the connecting head has an area in which a part of the columnar conductor is extended when the upper surface of the columnar conductor is polished with a rotating grindstone .

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