JP4238525B2 - 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置 - Google Patents

樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置 Download PDF

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Publication number
JP4238525B2
JP4238525B2 JP2002183021A JP2002183021A JP4238525B2 JP 4238525 B2 JP4238525 B2 JP 4238525B2 JP 2002183021 A JP2002183021 A JP 2002183021A JP 2002183021 A JP2002183021 A JP 2002183021A JP 4238525 B2 JP4238525 B2 JP 4238525B2
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Prior art keywords
adhesive
resin composition
film
inorganic fine
fine particles
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Expired - Fee Related
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JP2002183021A
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English (en)
Japanese (ja)
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JP2003113320A (ja
JP2003113320A5 (https=
Inventor
浩一 藤丸
宣夫 松村
利夫 吉村
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2002183021A priority Critical patent/JP4238525B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

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  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
JP2002183021A 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置 Expired - Fee Related JP4238525B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002183021A JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001206071 2001-07-06
JP2001-206071 2001-07-06
JP2002183021A JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

Publications (3)

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JP2003113320A JP2003113320A (ja) 2003-04-18
JP2003113320A5 JP2003113320A5 (https=) 2005-10-20
JP4238525B2 true JP4238525B2 (ja) 2009-03-18

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JP2002183021A Expired - Fee Related JP4238525B2 (ja) 2001-07-06 2002-06-24 樹脂組成物、半導体装置用接着剤付きフィルム、金属箔付き積層フィルム及びそれを用いた半導体装置

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JP (1) JP4238525B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5013426B2 (ja) * 2007-12-25 2012-08-29 株式会社アドマテックス 硬化性樹脂組成物及びその製造方法並びに樹脂硬化物
JP2010132894A (ja) * 2008-10-30 2010-06-17 Nitto Denko Corp 有機−無機複合物およびその製造方法
CN102264855B (zh) * 2008-12-26 2014-03-12 东洋纺织株式会社 粘合剂用树脂组合物、含有它的粘合剂、粘合片以及将粘合片作为粘合层含有的印制线路板
JP5422836B2 (ja) * 2010-03-24 2014-02-19 平岡織染株式会社 発熱性透光シートおよび発熱性透光膜屋根構造物
JP5691244B2 (ja) * 2010-05-26 2015-04-01 日立化成株式会社 フィルム状接着剤、接着シート及び半導体装置
CN114127205B (zh) * 2019-06-26 2022-10-25 三菱瓦斯化学株式会社 树脂片、覆金属箔层叠板和印刷电路板

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JP2003113320A (ja) 2003-04-18

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