JP4228473B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method in which an electronic component is sucked by a suction nozzle of an electronic component mounting apparatus and transferred to a substrate .
[0002]
[Prior art]
In the electronic component mounting apparatus, an electronic component stored in the electronic component supply unit is picked up by a transfer head and transferred onto a substrate. The transfer head generally uses a suction nozzle that holds the electronic component by vacuum suction. Hereinafter, mounting of an electronic component by a conventional electronic component suction nozzle will be described with reference to the drawings.
[0003]
FIG. 6 is an explanatory view of an electronic component mounting operation by a conventional electronic component suction nozzle. FIG. 6A shows a relative positional relationship between the electronic component b and the suction surface a in a state where the electronic component b is sucked and held by the suction nozzle having the rectangular suction surface a in the rotary electronic component mounting apparatus. Is shown. Although the electronic component b is supplied from the parts feeder, the position and posture of the electronic component b are not always in the normal position, and misalignment occurs due to various factors.
[0004]
In this misalignment, in addition to the misalignment in the orthogonal axis direction, the position in the rotational direction in which the electronic component b as shown in FIG. 6A is inclined by an angle θ in the horizontal plane with respect to the longitudinal direction of the suction surface a. There is a gap. Such misalignment in the rotational direction includes not only the case where the electronic component b is already supplied in an inclined posture from the parts feeder, but also the accuracy of the suction nozzle itself, the position correction error due to image recognition performed at the time of pickup, etc. Caused by various factors. For this reason, prior to the transfer of the electronic component b onto the substrate, the recognition unit detects the relative position of the electronic component b with respect to the suction surface a of the suction nozzle, and the electronic component b is in the correct position based on the detection result. The electronic component b is mounted after correcting the position of the suction nozzle so as to be transferred.
[0005]
FIG. 6B shows this position correction. As a result of correcting the electronic component b so that it is in the correct posture, the suction surface a of the suction nozzle is at a position rotated by a positional deviation angle θ with respect to the orthogonal axis. . As a result, the corner of the suction surface a of the suction nozzle is in a state of protruding from the outer shape of the electronic component b. In this state, the suction nozzle holding the electronic component b mounts the electronic component b on the substrate.
[0006]
[Problems to be solved by the invention]
By the way, with the reduction in the size of electronic components, the mounting pitch at the time of mounting is also increasingly narrowed, and for example, it is required to mount electronic components having a size of about 0.6 mm at intervals of about 0.15 mm. It is coming. For this reason, if an electronic component held at a position adjacent to the already mounted component at a narrow pitch is to be mounted with the corner portion of the suction surface a of the suction nozzle protruding from the electronic component b as described above, FIG. As shown in (c), the corner portion of the suction surface a interferes with the already mounted component b ′ (see the arrow position), which may cause a displacement of the already mounted component b ′. As described above, the conventional suction nozzle for electronic components has a problem in that it causes problems such as interference with already mounted components as the size of the electronic components is reduced.
[0007]
Accordingly, an object of the present invention is to provide a method for mounting an electronic component using a suction nozzle that does not interfere with an already mounted component.
[0008]
An electronic component mounting method according to the present invention is an electronic component mounting method in which an electronic component housed in an electronic component supply unit in an electronic component mounting apparatus is picked up by a suction nozzle and transferred to a substrate. The lower end portion includes a shaft body having a rectangular cross section, an adsorption surface formed on the lower end surface of the shaft body for adsorbing electronic components, and an adsorption hole that opens to the adsorption surface and performs vacuum suction. By making the shape from which the four corners of the rectangular shaft body are removed, the sticking surface sticks out from the outer shape of the electronic component, and the position of the electronic component relative to the suction nozzle at the recognition station is reduced. detects, when mounting the electronic component by correcting the positional deviation in the mounting point of the substrate, electronic components have caused misalignment of the rotational direction relative to the suction surface for correcting the positional deviation Even if Ru is horizontally rotating the suction nozzle, and so not to cause interference with the already mounting part present adjacent the suction nozzle by removing the four corners.
[0009]
According to the present invention, the cross-section of the suction surface that sucks the electronic component is made the shape from which the four corners of the rectangular shaft body are removed, thereby reducing the protrusion of the suction surface from the outer shape of the electronic component. When the electronic station detects a positional deviation of the electronic component relative to the suction nozzle at the recognition station and corrects the positional deviation and mounts the electronic component on the mounting point of the substrate, the electronic component is rotated in the rotational direction with respect to the suction surface. have misaligned even if the suction nozzle in order to correct the positional deviation Ru is horizontally rotated, the already mounting part present adjacent the suction nozzle by removing the four corner portions Since interference is prevented from occurring, it is possible to mount the electronic component while reducing the protrusion of the corner portion of the suction surface of the nozzle from the electronic component and preventing interference with an adjacent mounted component during mounting.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of a rotary head of the electronic component mounting apparatus, and FIG. 3 is a side view of the rotary head of the electronic component mounting apparatus. 4 (a) is a side view of the suction nozzle of the electronic component mounting apparatus, FIG. 4 (b) is a plan view of the suction surface of the suction nozzle of the electronic component mounting apparatus, and FIG. 5 is a view of the suction nozzle of the electronic component mounting apparatus. It is explanatory drawing of an electronic component adsorption state.
[0011]
First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a large number of parts feeders 2 for supplying electronic components are arranged in parallel in the electronic component supply unit 1. The parts feeder 2 is mounted on a feeder base (not shown) and moves in the lateral direction by rotating the feed screw 3.
[0012]
A rotary head 4 is disposed on the front side of the supply unit 1. The rotary head 4 is index-rotated around the main axis O, and a plurality of transfer heads 5 are provided on the circumference thereof. The transfer head 5 includes a plurality of suction nozzles 6 (see FIG. 2), and the transfer head 5 moves up and down in a state where the transfer head 5 is located at the pickup position P of the electronic component. Pick up parts. At this time, a desired electronic component can be picked up by laterally moving the parts feeder 2 with the feed screw 3.
[0013]
The electronic components picked up at the pick-up position sequentially move in the direction of arrow a by the index rotation of the rotary head 4. Then, while being positioned above the camera 7a of the recognition station, an image is taken from below the camera 7a, and a positional deviation is detected. A movable table 8 for positioning the substrate 9 is disposed on the front side of the rotary head 4, and the transfer head 5 moved from the recognition station 7 reaches the mounting position M on the substrate 9, and moves up and down there. Thus, the electronic component is mounted on the substrate 9.
[0014]
Next, the rotary head 4 and the transfer head 5 will be described with reference to FIGS. As shown in FIG. 2, the transfer head 5 is disposed on a circumference around the main axis O of the rotary head 4. The transfer head 5 is rotated around its axis (head rotation center) by a motor 10 to select a plurality (four in this example) of suction nozzles 6 provided on the circumference, and the lower end of the suction nozzle 6. The angle of the electronic component vacuum-adsorbed on the part is corrected in the horizontal rotation direction.
[0015]
FIG. 3 is a cross-sectional view taken along the line AA of FIG. 1. In FIG. 3, the transfer head 5 is mounted on the outer periphery of the rotary head 4 via an elevating mechanism 15. The parts feeder 2 is located below the transfer head 5 located at the pickup position P. When the suction nozzle 6 is lowered at the pickup position P, the suction nozzle 6 picks up the electronic component 11 from the parts feeder 2. To do. Further, below the transfer head 5 located at the mounting position M is a mounting point of the substrate 9 held by the movable table 8, and the suction nozzle 6 holding the electronic component 11 is lowered at this position, The electronic component 11 is mounted on the mounting point of the substrate 9.
[0016]
Next, the suction nozzle 6 attached to the transfer head 5 will be described with reference to FIG. As shown in FIG. 4A, the suction nozzle 6 is formed by forming a shaft body 6c having a rectangular cross section at the lower end portion of a columnar portion 6a that is inserted into the reflection plate 6b. The reflecting plate 6b is used for recognizing and transmitting the electronic component held on the lower end surface of the shaft body 6c by reflecting the illumination light emitted from below when the electronic component is recognized. The lower end surface of the shaft body 6c is a suction surface 6d that contacts and holds the electronic component, and a suction hole 6e is provided in the suction surface 6d. The suction hole 6e is connected to a vacuum suction means (not shown) via a suction inner hole formed inside the cylindrical portion 6a. By sucking the suction part 6e by vacuum suction, the electronic component is sucked to the suction surface 6d. To do. The shape of the suction surface 6d is a shape obtained by removing the four corners C of the rectangle showing the outer shape of the shaft body 6c as shown in FIG.
[0017]
FIG. 5A shows the relative positional relationship between the electronic component 11 and the suction surface 6 d in a state where the electronic component 11 is sucked by the suction nozzle 6. (A) shows a state in which the electronic component 11 is attracted without positional displacement, and (B) shows a state in which the electronic component 11 is attracted in a posture in which the positional displacement in the rotational direction remains generated. In any case, since the shape of the suction surface 6d is a shape obtained by removing the corner from the rectangle, the protrusion of the suction surface from the outer shape of the electronic component 11 is reduced.
[0018]
The electronic component mounting apparatus is configured as described above. Next, the operation will be described. In FIG. 1, the electronic component 11 is first sucked by the suction nozzle 6 at the pickup position P. Next, the transfer head 5 to which the suction nozzle 6 holding the electronic component 11 belongs is sequentially moved by the index rotation, and the electronic component 11 is recognized by the component recognition station 7. Here, a positional shift of the electronic component 11 with respect to the suction nozzle 6 is detected.
[0019]
Thereafter, the transfer head 5 moves to the mounting position M, where the electronic component 11 held by the suction nozzle 6 is moved to the mounting point of the substrate 9 after correcting the positional deviation detected by the recognition station 7. To be installed. At this time, as shown in FIG. 5B, when the electronic component 11 is mounted at a position adjacent to the already mounted component 11 ′ at a sandwich pitch, the electronic component 11 is positioned in the rotational direction with respect to the suction surface 6d. Even when there is a shift, the shape of the suction surface 6d is set as described above, so that there is no interference between the already mounted component 11 ′ and the suction nozzle 6 that are adjacent to each other. Therefore, it is possible to perform electronic component mounting without mounting defects.
[0020]
In the present embodiment, an electronic component mounting apparatus having a rotary head that performs index rotation is shown as an example, but the present invention is not limited to this, and other types of electronic component transfer mechanisms are provided. The present invention can be applied even to an electronic component mounting apparatus provided.
[0021]
According to the present invention, since the cross section of the suction surface for sucking the electronic component is formed by removing the four corners of the rectangular shaft body, the protrusion of the suction surface from the outer shape of the electronic component is reduced. In the recognition station, when the positional deviation of the electronic component relative to the suction nozzle is detected, and the electronic component is mounted on the mounting point of the substrate by correcting this positional deviation, the electronic component is positioned in the rotational direction with respect to the suction surface. interference have deviated even when the suction nozzle in order to correct the positional deviation Ru is horizontally rotated, the already mounting part present adjacent by removing the four corner portions and the suction nozzle Therefore, it is possible to reduce the protrusion of the corner part of the suction surface of the nozzle from the electronic component. Therefore, the protruding corner part interferes with the adjacent already mounted parts during mounting. It is possible to carry out the implementation of the electronic components while preventing.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a rotary head of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4A is a side view of a suction head of an electronic component mounting apparatus according to an embodiment of the present invention; and FIG. 4B is an electronic view of an embodiment of the present invention. Fig. 5 is a plan view of a suction surface of a suction nozzle of a component mounting apparatus. Fig. 5 is an explanatory diagram of an electronic component suction state by a suction nozzle of an electronic component mounting apparatus according to an embodiment of the present invention. Explanation of mounting operation of electronic parts by using [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Supply part 2 Parts feeder 4 Rotary head 5 Transfer head 6 Suction nozzle 6c Shaft body 6d Suction hole 6e Suction surface 7 Recognition station 8 Movable table 9 Substrate

Claims (1)

An electronic component mounting method for picking up an electronic component housed in an electronic component supply unit with a suction nozzle and transferring it to a substrate in an electronic component mounting apparatus, wherein the lower end portion of the suction nozzle has a rectangular cross section A suction surface that is formed on the lower end surface of the shaft body and sucks an electronic component; and an suction hole that opens to the suction surface and vacuum-sucks the shape of the suction surface. The shape with the corners removed removes the sticking surface from the outer shape of the electronic component, and the misalignment of the electronic component with respect to the suction nozzle is detected at the recognition station to correct this misalignment. place to when mounting the electronic component on the mounting point of the substrate, Ru is horizontally rotating the suction nozzle to the electronic component is not misaligned in the rotational direction relative to the suction surface to correct the positional deviation Te Even a mounting method of the electronic component, characterized in that the interference between the already mounted portion and the suction nozzle lies adjacent by removing the four corners was prevented occur.

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