JP4220462B2 - Data collection system, data collection method and program for semiconductor manufacturing apparatus - Google Patents

Description

  The present invention relates to an atypical data collection system and method in a semiconductor manufacturing apparatus, and in particular, for efficient operation of the semiconductor manufacturing apparatus, it is reliable without substantially increasing the load in the operation of the semiconductor manufacturing apparatus. The present invention relates to a data collection technique that can effectively collect data.

  Recently, most manufacturing equipment in the semiconductor industry has been put online and automatically operated. A basic configuration of a conventional semiconductor manufacturing apparatus will be described with reference to FIG.

  As shown in FIG. 1, the conventional semiconductor manufacturing apparatus basically includes a manufacturing apparatus 110 and a host 120.

  Among these, the manufacturing apparatus 110 includes a process processing apparatus that performs a predetermined semiconductor process, a measuring apparatus that measures power, gas, a line state, and the like, and a transfer apparatus that transports a wafer or the like to a subsequent process on the semiconductor manufacturing line. Etc.

  On the other hand, the host 120 is a host computer connected to the manufacturing apparatus 110. The host 120 controls the manufacturing apparatus 110 so that the manufacturing apparatus 110 can perform a predetermined semiconductor process in the semiconductor manufacturing apparatus. The host 120 is connected to a database (not shown) that stores an enormous amount of process data necessary for the manufacturing apparatus 110 to perform processes.

  The manufacturing apparatus 110 and the host 120 described above exchange information with each other according to the SECS standard (SEMI Equipment Communication Standard).

  Recently, in order to improve productivity in terms of manufacturing, it has become necessary to introduce a system that collects and analyzes various information from manufacturing equipment. There has also been an increasing demand for collection of arbitrary atypical data not specifically supported by the device. Another configuration of the conventional semiconductor manufacturing apparatus will be described with reference to FIGS.

  FIG. 2 is a block diagram showing an outline of the configuration of a conventional server data synchronization type semiconductor manufacturing apparatus. As shown in FIG. 2, the conventional semiconductor manufacturing apparatus includes a manufacturing apparatus 210, a host 220, a conversion apparatus 230, and an analysis system 240. Since such a semiconductor manufacturing apparatus synchronizes data on the host 220 side, it is called a server data synchronization type (EAP Data-Sync Type).

  The analysis system 240 is connected to the host 220 and collects data on the state of the manufacturing apparatus 210 and the like via the host 220. The data collected by the analysis system 240 includes SECS data (hereinafter referred to as “standard data”) that conforms to the SECS standard format and non-SECS data (hereinafter referred to as “atypical data”) that can be arbitrarily obtained without a specific format. Divided).

  Here, synchronization refers to the real-time property that collects all the necessary data at the earliest timing when the analysis system requests the data, and the standard and atypical data obtained at this time are the same on the time axis. This means a procedure for determining the order so that the time is reached, and a procedure for processing the fixed data and the atypical data into a unified fixed message format when the collected data is transmitted to the analysis system.

  In a conventional server data synchronization type semiconductor manufacturing apparatus, the host 220 collects standard data from the manufacturing apparatus 210, collects and synchronizes non-standard data from the conversion apparatus, and then transmits the data to the analysis system 240. The conversion device is a system different from the manufacturing device 210 or the host 220, and refers to a device that converts atypical data collected by various methods into data of a predetermined format that can be recognized by the host and transmits the data to the host 220.

  FIG. 3 is a block diagram showing an outline of the configuration of a conventional agent data synchronous semiconductor manufacturing apparatus.

  As shown in FIG. 3, another conventional semiconductor manufacturing apparatus includes a manufacturing apparatus 310, a host 320, an agent 330, and an analysis system 340. Such a semiconductor manufacturing apparatus is called an Agent Data-Sync Type because data is synchronized on the agent 330 side.

  In a conventional agent data synchronous semiconductor manufacturing apparatus, an agent 330 is provided separately from the host 320. The agent 330 collects typical data and atypical data, performs data synchronization, and transmits the data to the analysis system 340.

  However, in the conventional server data synchronization type semiconductor manufacturing apparatus shown in FIG. 2, the host 220 must further have a function of synchronizing data or events in order to synchronize data. Therefore, in the conventional server data synchronous semiconductor manufacturing apparatus, the load on the host system increases, which may adversely affect the safety of the system.

  Further, in the conventional server data synchronization type semiconductor manufacturing apparatus, since all data is collected in the host 220, the load on the network on the host 220 side increases. The load generated at this time also harms the safety of the system, and thus the manufacturing process may not operate normally. Therefore, in the conventional server data synchronization type semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus may stop and serious loss may occur.

  In the conventional server data synchronization type semiconductor manufacturing apparatus, first, the atypical data is converted into data of a predetermined format that can be recognized by the host, then transmitted to the network, and then the data or event is synchronized. Occurs. Due to the time delay that occurs at this time, there is a problem that the reliability of the atypical data is greatly reduced.

  Further, in the conventional agent data synchronous semiconductor manufacturing apparatus shown in FIG. 3, the agent 330 is used to reduce the system load on the host 320 side, but the network load on the host 320 side remains unchanged. Also, in the aspect of data synchronization, the standard data is transmitted from the manufacturing apparatus 310 to the host 320 and then to the agent 330 again. Therefore, compared with the conventional server data synchronous semiconductor manufacturing apparatus described above. The structure becomes even more vulnerable.

  As described above, the fixed data is already in accordance with the SECS standard, so it is not a big problem to collect and analyze the fixed data. However, in the case of non-standard data, it is necessary to convert it into standard data for compatibility, so synchronization between the non-standard data and the standard data becomes an important issue.

  In particular, the standard data is generated by the manufacturing apparatus and transmitted via the network, so that the generation time cannot be accurately determined. Therefore, it is very difficult to place the standard data and the non-standard data on the same time line.

  The present invention made in view of the above-described problems is a semiconductor manufacturing apparatus that collects reliable standard and atypical data synchronized in real time without substantially increasing the operation load of the semiconductor manufacturing apparatus. It is an object of the present invention to provide an atypical data collection system and data collection method.

  Furthermore, an object of the present invention is to provide a program embodied by the above object in the form of an independent product.

  In order to achieve the above-described object, according to one aspect of the present invention, a data collection system that collects atypical data from a semiconductor manufacturing apparatus via a data collection server connected to the semiconductor manufacturing apparatus, a host, and an analysis system. A processor stored in the memory; and a processor connected to the memory to execute the program; and the processor uses the program to obtain a status identifier of the atypical data necessary for the analysis of the manufacturing apparatus. Assigning, receiving a data request message from at least one of the host and the data analysis system, storing the data request message in the memory, wherein a status identifier and a collection event identifier included in the data request message are Determine whether it is defined in the manufacturing equipment, Information that cannot be handled by the manufacturing apparatus is determined as an atypical data request message, and the standard data request message is transmitted to the manufacturing apparatus in the data request message, and the atypical data request message is transmitted to the atypical data detection unit. The first standard data is received from the manufacturing apparatus, the atypical data is received from the atypical data detection unit, the atypical data is converted into second standard data, and the first standard data and the second standard data are converted. Data is synchronized and transmitted to at least one of the host and the analysis system.

  Among the terms described above, “standard data” and “first standard data” include data that conforms to the SECS standard format, and “atypical data” is data that can be obtained arbitrarily rather than a specific format. Further, the “atypical data” includes information that is not provided by the manufacturing apparatus in the present invention, and information obtained through various means such as a directly connected sensor and a programmable logic controller (PLC). In addition, among the terms described above, “second fixed data” includes data obtained by converting non-standard data into data in a predetermined format that can be recognized by a host or the like, or fixed data.

  The data collection server periodically collects the atypical data from the atypical data detection unit, and receives the maximum value, the minimum value, and the average value of the atypical data at the time when the first standard data is received. Preferably, each is calculated, and the calculated value is processed together with the non-standard data synchronized with the first standard data (for example, in the synchronized first standard data).

  The data collection server preferably samples and collects the atypical data at regular intervals between a start event and an end event.

  In addition, it is preferable that the data collection server updates the atypical data collected at regular intervals while sampling the atypical data at regular intervals.

  Further, it is preferable that the data collection server forcibly collects the atypical data via the atypical data detection unit.

  The data collection server preferably includes a transmission / reception module, a fixed data collection module, an atypical data collection module, and a data conversion module.

  The data collection server may further include a filtering module that selectively transmits a part of at least one of the collected first fixed data and second fixed data.

  Moreover, it is preferable that the data collection server further includes a communication switching module for directly connecting the manufacturing apparatus and the host via a communication line.

  The atypical data detection unit preferably includes at least one of a unit that detects a state variable of the manufacturing apparatus and a unit that calls the state variable stored in a memory in the manufacturing apparatus.

According to another aspect of the present invention, in a method for collecting atypical data with a data collection server connected to a semiconductor manufacturing apparatus, a host, and an analysis system, the state of atypical data necessary for the analysis of the manufacturing apparatus A procedure for assigning an identifier; a procedure for receiving a data request message from at least one of the host and the analysis system; a procedure for storing the data request message in a memory; a state identifier and a collection event identifier included in the data request message A procedure for determining whether or not information is defined in the manufacturing apparatus; a procedure for determining information that cannot be handled by the manufacturing apparatus as an atypical data request message; a standard data request message in the data request message to the manufacturing apparatus A procedure for transmitting the atypical data request message to the atypical data; Procedure to transmit to the detector; step of receiving the first type data from the manufacturing device;
A procedure for collecting atypical data from the atypical data detection unit; a procedure for converting the atypical data into second standard data; and the host and the analysis by synchronizing the first standard data and the second standard data. Transmitting to at least one of the systems.

  Further, the procedure for collecting the atypical data includes a procedure for periodically collecting the atypical data from the host; a maximum value, a minimum value, and an average value of the atypical data at the time when the first standard data is received. And calculating the calculated value with the non-standard data synchronized with the first standard data.

  Further, it is preferable that the procedure for periodically collecting the atypical data includes a procedure for sampling and collecting the atypical data at a predetermined interval between the start event and the end event.

  Further, the procedure for periodically collecting the atypical data preferably includes a procedure for updating the atypical data collected at the predetermined interval while sampling the atypical data at a constant interval. .

  The procedure for transmitting the standard data request message to the manufacturing apparatus includes a procedure for transmitting the standard data request message to the manufacturing apparatus after deleting the information not supported by the manufacturing apparatus from the data request message. It is preferable.

  In addition, it is preferable that the method further includes a procedure of canceling the work in progress if a negative response message is received from the manufacturing apparatus.

  Preferably, the method further includes a step of restoring the data request message with reference to information stored in the memory; and a step of creating a reply message by combining the first fixed data and the second fixed data. .

  Further, it is preferable to further include a procedure for directly connecting the manufacturing apparatus and the host for communication when the data collection server malfunctions or is not operating stably.

  According to still another aspect of the present invention, there is provided a program for causing a data collection server connected to a manufacturing apparatus, a host, and an analysis system to collect atypical data according to the following procedure, and for analyzing the manufacturing apparatus. A procedure for assigning a necessary atypical data state identifier, a procedure for receiving a data request message from at least one of the host and the analysis system, a procedure for storing the data request message in a memory, and the data request message A procedure for determining whether or not the state identifier and the collection event identifier included in the manufacturing apparatus are defined in the manufacturing apparatus, and after deleting information not supported by the manufacturing apparatus from the data request message, a fixed data request to the manufacturing apparatus The procedure for transmitting the message and the information not supported by the manufacturing apparatus are atypical data. A procedure for analyzing a request message; a procedure for transmitting the atypical data request message to an atypical data detection unit connected to the manufacturing apparatus; a procedure for collecting atypical data from the atypical data detection unit; A procedure for receiving first standard data from a manufacturing apparatus; a procedure for recognizing atypical data collected at the time of receiving the first standard data with atypical data synchronized with the first standard data; A procedure for converting recognized atypical data into second standard data; a procedure for synchronizing the first standard data and the second standard data and transmitting them to at least one of the host and the analysis system; Is executed.

  In addition, the process of collecting the atypical data preferably includes a process of sampling the atypical data at regular intervals between a start event and an end event, and collecting the atypical data periodically. .

  Preferably, the process of collecting the atypical data includes a process of updating the atypical data collected at the predetermined interval while sampling the atypical data at a constant interval. A computer-readable recording medium recording these programs is also provided.

  According to the present invention, typical data and atypical data can be synchronized and collected in real time without substantially changing the system configuration of an existing semiconductor manufacturing apparatus and substantially increasing the load. In addition, by expanding the function of the data collection server located between the host and the manufacturing apparatus, various functions that cannot be realized only by the existing host and the manufacturing apparatus can be effectively realized. Further, it can be easily applied to both existing devices and new devices. If the data collection system according to the present invention is applied to a semiconductor production line in conjunction with an analysis system, the productivity of the semiconductor industry can be greatly improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, when one part is connected to another part, this is not only directly connected, but also connected in the middle through another structure. Including. In the drawings, parts not related to the present invention are omitted for clarifying the features of the present invention, and the same reference numerals are given to the same parts throughout the specification.

  FIG. 4 is a block diagram showing an outline of the configuration of the data collection system of the semiconductor manufacturing apparatus according to the embodiment of the present invention. According to FIG. 4, the data collection system of the semiconductor manufacturing apparatus collects standard data and atypical data and transmits them to the analysis system without increasing the load on the operation of the semiconductor manufacturing apparatus. For this purpose, the data collection system includes a manufacturing apparatus 410, a data collection server 420, a host 430 and an analysis system 440.

  The manufacturing apparatus 410 performs a predetermined semiconductor process. For example, the semiconductor process includes a cleaning process, a thermal process, a photographic process, a sealing process, an inspection and analysis process, and the like. Therefore, the manufacturing apparatus 410 includes apparatuses such as a cleaning apparatus, a vapor deposition apparatus, a heat treatment apparatus, an exposure apparatus, a sealing apparatus, and an inspection and analysis apparatus. In addition, the manufacturing apparatus 410 provides the data collection server 420 with the standard data according to the SECS format while performing the semiconductor process. The manufacturing apparatus 410 is connected to an atypical data detection unit (not shown) that provides the data collection server 420 with atypical data that does not conform to the SECS format.

  Here, the atypical data detection unit includes means for measuring the atypical data of the manufacturing apparatus 410 and calling the atypical data stored in the memory of the manufacturing apparatus 410. For example, the atypical data detection unit includes devices such as measuring instruments and sensors that measure temperature, pressure, time, and the like. As described above, the atypical data detection unit detects atypical data that is not basically provided directly by the manufacturing apparatus by various methods such as directly contacting a sensor, a program logic controller (PLC), or the like.

  Further, the manufacturing apparatus 410 responds to the data request message from the host 430. Moreover, the manufacturing apparatus 410 measures the standard data accompanying SECS. Then, the measured standard data is transmitted to the data collection server 420. For this purpose, the manufacturing apparatus 410 may include a program logic controller (PLC), measurement means (not shown), and communication means (not shown) not shown.

  The program logic controller (PLC) is an apparatus used for automatic control and monitoring of the manufacturing apparatus 410. Such a controller controls the communication means and the measurement means, and provides the data collection server 420 with data measured in response to a message transmitted from the data collection server 420. Here, the measuring means is an apparatus that is provided in the manufacturing apparatus 410 and measures standard data such as temperature and pressure, for example. The communication means refers to a device that connects the manufacturing apparatus 410 and the data collection server 420 via an RS-232C cable, a LAN, or the like adopting the RS-232C method based on the SECS-1 protocol, for example.

  The data collection server 420 receives a data request message from the host 430 and / or the analysis system 440 by a communication method such as TCP / IP. At this time, most messages received by the data collection server 420 from the host 430 include a message requesting information directly necessary for production. Most messages received by the data collection server 420 from the analysis system 440 include a message requesting information necessary for analysis to increase production efficiency.

  The data collection server 420 collects standard data while communicating with the manufacturing apparatus 410 and collects atypical data while communicating with the atypical data detection unit connected to the manufacturing apparatus 410. Then, the data collection server 420 accepts requests from the host 430 and the analysis system 440, and transmits necessary data to each of them. At this time, the data collection server 420 can transmit / receive data to / from the host 430 and the analysis system 440 after adding or removing an arbitrary message to the collected fixed data and atypical data by the filter function.

  The host 430 controls the manufacturing apparatus 410 so that the manufacturing apparatus 410 can perform a semiconductor process. At this time, the host 430 exchanges mutual information with the manufacturing apparatus 410 according to the SECS standard. In this embodiment, the host 430 does not substantially collect atypical data, and therefore does not include a function for synchronizing the standard data and the atypical data.

  Further, the host 430 is connected to a database in which a large amount of process data necessary for the manufacturing apparatus 410 to perform a semiconductor process is stored. Here, the host 430 can be realized by a host device or a host computer connected to the manufacturing apparatus 410 in order to operate at least one of the semiconductor manufacturing apparatuses 410. Further, the analysis system 440 receives the state of the manufacturing apparatus 410 and various data measured by the manufacturing apparatus 410 from the data collection server 420.

  The data collection system described above can be said to be an inter data-sync type system (Inter Data-Sync Type System) when compared with a conventional device server data synchronization type system or agent data synchronization type system.

  Meanwhile, the data collection system may further include a user interface, an operator interface, and the like. Here, the user interface includes a computer device for an operator or an analyst to analyze data necessary for the process and the cause of the abnormality in the facility. The operator interface includes a computer device that allows an operator to check the process data stored in the host database and advance the semiconductor process.

  According to the embodiment of the present invention described above, when monitoring the state of the semiconductor manufacturing facility and collecting necessary standard and atypical data, the load is not substantially increased on the network of the semiconductor manufacturing facility. Therefore, the semiconductor manufacturing facility can be stably maintained and operated.

  Thus, the present invention provides a system that not only collects regular data, but also collects atypical data that is collected in synchronization with the collected regular data in real time. That is, when an analysis system is introduced for efficient operation of a semiconductor manufacturing facility, the data collection system according to the present invention does not increase the load in the operation of the existing semiconductor manufacturing facility, and is synchronized in real time. Reliable regular and atypical data can be collected effectively.

  Next, the synchronization method of the data collection server will be described in detail. 5a and 5b are diagrams illustrating a data synchronization method of the data collection system illustrated in FIG.

  First, as shown in FIG. 5a, a data collection system according to an embodiment of the present invention samples and collects atypical data at regular intervals within a predetermined time. Specifically, the data collection server 420 makes inquiries Q1 to Q5 to the atypical data detection unit connected to the manufacturing apparatus at regular time intervals between the start event time T1 and the end event time T2. Sampling routine data. When the data collection server 420 receives the standard data from the manufacturing apparatus 410, the data collection server 420 calculates the maximum value, the minimum value, and the average value for the sampled atypical data, and synchronizes these values of the atypical data with the standard data. Processing is performed, and both the standard data and the atypical data are transmitted to the analysis system 440.

  Next, as shown in FIG. 5b, the data collection system according to an embodiment of the present invention updates the data sampled at a constant time interval while sampling the atypical data at a predetermined time interval, Collect data. Specifically, the data collection server 420 makes inquiries Q1 to Q7 to the atypical data detection unit connected to the manufacturing apparatus 410 at regular time intervals, and samples the atypical data at regular time intervals T1, T2, The data sampled at T3 is updated to collect atypical data. Then, when receiving the standard data from the manufacturing apparatus 410, the data collection server 420 calculates the maximum value, the minimum value, and the average value for the sampled atypical data, and synchronizes these values of the atypical data with the standard data. Then, both standard data and atypical data are transmitted to the analysis system.

  With the configuration described above, the data collection system according to an embodiment of the present invention collects atypical data in real time, and directly transmits the collected atypical data to the analysis system in synchronization with the standard data. Therefore, according to the present invention, it is possible to effectively collect reliable data without increasing the operation load of the semiconductor manufacturing facility. In addition, the data collection system according to the present invention can be effectively used when it is necessary to detect an overheat or overload condition such as temperature and pressure.

  FIG. 6 is a block diagram showing the configuration of the data collection server of the data collection system shown in FIG. According to FIG. 6, the data collection server 420 includes a memory system 421 and at least one central processing unit (CPU) 422, an input device 427, and a communication device 429 that are connected to the memory system 421 and operate at high speed.

  The central processing unit 422 includes an ALU (Arithmetic Logic Unit) 424 for performing calculations, a register 426 for temporarily storing data and instructions, and a controller 428 for controlling the operation of the data collection server 420. The central processing unit 422 is a digital power source manufactured by Alpha, MIPS Technology, NEC, IDT, Siemens and other MIPS, Intel, Cyrix, AMD and Nexten, etc. and Motorola. It includes at least one of processors having various architectures such as a PC.

  The memory system 421 generally includes a high-speed main memory 423 using a storage medium such as a RAM (Random Access Memory) and a ROM (Read Only Memory), a floppy disk, a hard disk, a magnetic tape, a CD-ROM, a flash memory, and the like. Including an auxiliary memory 425 as a storage medium suitable for long-term storage, and a device for storing data using electrical, magnetic, optical, or other storage media. The main memory 423 can include a video RAM used when displaying an image using a display device.

  The input device 427 includes a keyboard, a mouse, and the like. The mouse may include, for example, a physical transducer such as a touch screen or a microphone. The communication device 429 includes a communication interface or a wireless transmission / reception interface for communicating with a manufacturing apparatus, a host, an analysis system, and the like.

  FIG. 7 is a functional block diagram showing a module configuration of the data collection server shown in FIG. Referring to FIG. 7, the data collection server includes a transmission / reception processing module 741 for processing wired and wireless communication between a manufacturing apparatus, a host, an analysis system, and the like, and a fixed data collection module 743 for collecting fixed data from the manufacturing apparatus. Atypical data collection module 745 that collects atypical data from the atypical data detection unit connected to the manufacturing apparatus, and converts the collected atypical data into data of a predetermined format or standard data that can be recognized by the host or analysis system A data conversion module 747 that processes data collected from the manufacturing apparatus and the atypical data detection unit and selectively transmits the data to a host and / or an analysis system. The overall configuration of the data collection server through these application modules 741, 743, 745, 747, 749 is as follows.

  The data collection server can use various OSs as the OS (Operating System) of the system. Such an OS provides a high level command to an application program interface (API) 700 to control the operation of each application module 740.

  The data collection server identifies a corresponding application module according to a high level command instruction word provided from the API 700, decodes the high level command instruction word, and provides a decoded instruction word to the corresponding application module. A word processing unit 710 is included. The application module control unit 720 controls the operation of the application module 740 according to the instruction word provided from the high level instruction word processing unit 710. In other words, the high-level instruction word processing unit 710 identifies whether or not the application module 740 exists based on the high-level instruction word provided through the API 700, and when the application module 740 exists, It is decoded with a command word that can be recognized by the 740 and transmitted to the mapping unit or message transmission is controlled. The application module control unit 720 includes mapping units 721, 723, 725, 727, and 729 for each application module, and interface units 722, 724, 726, 728, and 730, respectively.

  The transmission / reception processing module mapping unit 721 receives the data request message of the host and the analysis system, transmits the standard data and / or the atypical data to the host or the analysis system or the like via the network, and transmits the standard data and the atypical data. In order to collect, it communicates with a manufacturing apparatus and the atypical data detection part connected to this manufacturing apparatus. The transmission / reception processing module mapping unit 721 receives the high-level instruction word from the high-level instruction word processing unit 710, maps it to a device level instruction word that can be processed by the transmission / reception processing module 741, and passes it through the transmission / reception processing module interface unit 722. To the transmission / reception processing module 741. The transmission / reception processing module 741 may include a physical transmission interface for direct communication connection between the manufacturing apparatus and the host, if necessary. In such a case, the physical transmission interface includes a communication switching interface such as a switch.

  The fixed data collection module mapping unit 723 receives the data request message from the host and / or the analysis system, stores it in the memory system, analyzes the data request message, and collects the fixed data from the manufacturing apparatus. For this purpose, the standard data collection module mapping unit 723 receives a high-level command word for collecting standard data from the high-level command word processing unit 710 and maps it to a device level command word that can be recognized by the standard data collection module 743. Then, it is provided to the fixed data collection module 743 via the fixed data collection module interface unit 724.

  The atypical data collection module mapping unit 725 determines whether or not the data request message from the host and / or the analysis system includes information that is not defined for the analysis of the manufacturing apparatus, and manufactures based on the determination result. This is a part for collecting atypical data from an atypical data detection unit connected to the apparatus. For this, the atypical data collection module mapping unit 725 accepts a high-level command word for collecting atypical data from the high-level command word processing unit 710 and can recognize a device level command word that can be recognized by the atypical data collection module 745. And providing it to the atypical data collection module 745 via the atypical data collection module interface unit 726.

  The data conversion module mapping unit 727 converts the atypical data collected from the atypical data detection unit connected to the manufacturing apparatus into data of a predetermined format or standard data that can be recognized by the host or the analysis system. For this purpose, the data conversion module mapping unit 727 receives from the high-level command word processing unit 710 a high-level command word for converting atypical data into predetermined format data or standard data, and the data conversion module 747 recognizes it. This is mapped to a device level instruction word that can be provided, and provided to the data conversion module 747 via the data conversion module interface unit 728.

  Filter processing module mapping unit 729 selects data deemed unnecessary or required to be transmitted when transmitting data collected from the manufacturing apparatus and the atypical data detection unit to the host or analysis system. Process. For this, the filtering module mapping unit 729 receives from the high-level command word processing unit 710 a high-level command word for selectively transmitting the collected or generated data to the host and / or analysis system. Then, it is mapped to a device level instruction word that can be recognized by the filter processing module 749, and provided to the filter processing module 749 via the filter processing module interface unit 730. In such a configuration, for example, when a host or an analysis system requests data in units of blocks from a manufacturing apparatus or atypical data, unnecessary data included in the data is removed, or collected or generated data is stored in the host and By selectively transmitting the data to the analysis system, it is possible to prevent the network load from increasing and prevent the production line from deteriorating in stability.

  As described above, in the data collection system according to the embodiment of the present invention, another data collection server is provided between the host and the manufacturing apparatus, and communication between the host and the manufacturing apparatus is relayed by the data collection server. At the same time, it is configured to collect fixed data, collect non-standard data, convert data, and synchronize data. Therefore, according to the present invention, regular data and atypical data can be collected in real time without a large time difference, so that the problem of data synchronization can be solved. Further, since no change is required for the host side, the problem of the system load generated from the conventional semiconductor manufacturing facility can be solved. Further, data collected in cooperation with the internal data synchronization type structure is selected (filtering), and control is performed so that unnecessary analysis data is not transmitted to the host or the analysis system. As a result, the problem of an increase in network load occurring in a conventional semiconductor manufacturing facility can be solved.

  Next, the flow of signals in the data collection system will be described with reference to FIG. Most semiconductor manufacturing facilities use a generic model for communication and control of manufacturing equipment (GEM) protocol that describes the format and meaning of messages exchanged between a host or analysis system and manufacturing equipment. Therefore, an analysis system that supports GEM collects data according to the GEM protocol. However, if the manufacturing apparatus does not support the GEM protocol or atypical data exists, another process for supporting GEM is performed. I need. In this embodiment, a processing method that can be used in such a case is presented.

  In the data collection system according to an embodiment of the present invention, the host and / or the analysis system defines necessary information as a status identifier (SVID: Status Variable ID) according to the GEM protocol via the data collection server, and a plurality of states. The identifiers (SVID) are managed together as a report identifier (RPTID: Report ID). Then, the host and / or the analysis system defines and manages it as a collection event identifier (CEID) that notifies the manufacturing apparatus of an event such as an emergency. Here, the collected event identifier (CEID) is usually an identifier that defines an event that is not requested by the host. To this end, the data collection system also defines a message convention that can exchange messages for performing the aforementioned functions through the analysis system. Of the standard messages defined in GEM, some items related to data synchronization in the data collection server are shown in FIG.

  FIG. 8 is a diagram illustrating a signal flow in the data collection system according to the embodiment of the present invention. According to FIG. 8, the S1F3 message and the S1F4 message indicate a message for making an inquiry to the manufacturing apparatus regarding the state identifier (SVID) selected by the host or the analysis system, and a message for the manufacturing apparatus to respond to this message. For example, in the S1F3 message and the S1F4 message described above, the temperature of the first chamber 1 in the semiconductor manufacturing apparatus is defined as the state identifier number 1, and the pressure of the second chamber 2 is defined as the state identifier number 4. Then, when the host investigates the temperature of the chamber 1 and the pressure of the chamber 2, the host writes the status identifiers 1 and 4 in the S1F3 message and transmits them to the manufacturing apparatus. The manufacturing apparatus includes the information about the temperature of the chamber 1 and the pressure of the chamber 2 in the S1F4 message and transmits it to the host or the analysis system.

  The S2F23 message indicates a message that issues a tracking command to periodically report various status identifiers (SVID) to the manufacturing equipment. The S2F24 message indicates a message in which the manufacturing apparatus responds to the S2F24 message. Such S2F23 message and S2F24 message are used when it is difficult to collect the value of the state identifier (SVID) by the S1F3 message and the S1F4 message. For example, the host sends a command to detect and transmit the status identifier (SVID) 1, 2, 3, 4 to the manufacturing apparatus 1000 times at 1 second intervals by the S2F23 message, and the manufacturing apparatus responds to the S2F23 message. Respond with S2F24 message.

  The S2F33 message indicates a message for newly defining or deleting a report identifier (RPTID) by collecting various status identifiers (SVID) in the manufacturing apparatus. The S2F34 message indicates a message that the manufacturing apparatus responds to the S2F33 message.

  The S2F35 message indicates a message in which various report identifiers (RPTID) are combined into a collection event identifier (CEID) or an existing combination is released. The S2F36 message indicates a message that the manufacturing apparatus responds to the S2F35 message.

  The S2F37 message indicates a message for setting the collection event identifier (CEID) to an enabled state or a disabled state. The S2F38 message indicates a message that the manufacturing apparatus responds to the previous message.

  That is, the host can define the report identifier (RPTID) belonging to the collection event identifier (CEID) and the state identifier (SVID) belonging to the report identifier (RPTID) when reporting the event of the manufacturing apparatus. At this time, the collected event identifier (CEID) is transmitted by combining a plurality of state identifiers (SVID) existing when the event occurs. Such a combined state identifier (SVID) is referred to as an identifier (RPTID).

  A message in which a host collectively defines a plurality of status identifiers (SVID) as a report identifier (RPTID) or deletes a report identifier (RPTID) is an S2F33 message, and a response message from the manufacturing apparatus is an S2F34 message. A message that combines and separates a plurality of report identifiers (RPTID) into a collected event identifier (CEID) is an S2F35 message, and a response message from the manufacturing apparatus is an S2F36 message. When the host needs or does not need to report a specific collection event identifier (CEID) in the S2F37 message, a message for enabling or disabling a specific event is the S2F37 message. The response message of the manufacturing apparatus to is the S2F38 message.

  The S6F2 message indicates a message for periodically reporting a status variable (SV) or a status identifier (SVID) for the tracking command. The S6F1 message indicates a message that the manufacturing apparatus reports to the S6F2 message. Show. For example, the S6F1 message is a message that causes the manufacturing apparatus to increase the value of the state identifier (SVID) to the host in response to the tracking command of the host, and the S6F2 message is a message that the host responds to the S6F1 message of the manufacturing apparatus.

  The S6F12 message indicates a message for the manufacturing apparatus to report an event having a specific collection event identifier (CEID). The S6F11 message indicates a message that the manufacturing apparatus reports in response to the S6F12 message. Such S6F12 message and S6F11 message are used when it is necessary to report a certain incident to the host in the manufacturing apparatus. For example, when the collection event identifier (CEID) No. 1 is defined as the start of the process and the collection event identifier (CEID) No. 2 is defined as the completion of the cassette loading, the manufacturing apparatus adds the collection event identifier (CEID) to the S6F11 message. Is transmitted to the host, and the host responds to the manufacturing apparatus with an S6F12 message in response to the S6F11 message.

  The S6F15 message indicates a message in which the host makes an inquiry about the collection event identifier (CEID) to the manufacturing apparatus and inquires about the report identifier (RPTID) belonging to the collection event identifier (CEID) and the state variable (SV). The S6F16 message indicates a message that the manufacturing apparatus reports in response to the S6F15 message. In other words, when the host wants to know the value of the report identifier (RPTID) and status identifier (SVID) belonging to a certain collection event identifier (CEID), the collection event identifier (CEID) is written and sent to the manufacturing apparatus. The S6F16 message is a message to which the manufacturing apparatus writes the report identifier (RPTID) and status identifier (SVID) values belonging to the collection event identifier (CEID).

  The S6F19 message indicates a message in which the host inquires of the manufacturing apparatus for a report identifier (RPTID) and searches for a state variable (SV) belonging to the report identifier (RPTID). The S6F20 message indicates a message that the manufacturing apparatus reports in response to the S6F19 message. Here, the state variable (SV) indicates the value of the state identifier (SVID).

  On the other hand, “S” and “F” in the above-described messages indicate messages exchanged between the host and the manufacturing apparatus, which are divided into a stream (S) and a function (F). For example, S6F19 described above indicates a stream 6 and function 19 message. Each of the messages described above is a data request message transmitted from the host to the manufacturing apparatus via the data collection server, and collected data transmitted from the manufacturing apparatus to the host and / or the analysis system via the data collection server.

  Thus, according to the atypical data collection system according to the present invention, the data collected by the data collection server is processed in a synchronized manner as if it were provided from the manufacturing apparatus.

  Next, an atypical data collection method applied to the above-described atypical data collection system will be described. 9 to 12 are flowcharts showing a method for collecting atypical data in a semiconductor manufacturing facility according to an embodiment of the present invention.

  According to FIGS. 9 and 10, the data collection server assigns a state identifier (SVID) defined by the analysis system to the atypical data necessary for the analysis of the manufacturing apparatus (S10). Next, a data request message is received from the host and / or the analysis system (S12). Then, the message received from the host and / or the analysis system is stored in the memory (S14). Next, it is determined whether or not the state identifier (SVID) and the collection event identifier (CEID) included in the message are defined in the manufacturing apparatus (S16). As a result of this determination, information that is not supported by the manufacturing apparatus (information that cannot be handled by the manufacturing apparatus) is interpreted as a request for atypical data (S18). Then, atypical data is collected (S20). Thereafter, the data collection server collects the atypical data via the atypical data detection unit connected to the manufacturing apparatus (S26 in FIG. 10). At this time, the method of collecting the atypical data can be realized by the method described with reference to FIGS. 5a and 5b.

  On the other hand, the data collection server removes information that is not supported by the manufacturing apparatus in the data request message (S22). Then, a message for the standard data request is transmitted to the manufacturing apparatus (S24). Thereafter, the process proceeds to S28 of FIG.

  Next, the standard data is received from the manufacturing apparatus (S28). At this time, the data collection server processes the non-standard data at the time of receiving the standard data as data synchronized with the standard data (S30). For example, while collecting atypical data, a state identifier (SVID) in a fixed form is sent from the manufacturing apparatus to the response message received for at least one of the S6F1, S6F11, S6F15, S6F19, and S1F3 messages. If so, the atypical data collected at that time is processed as synchronized data.

  Next, the collected atypical data is converted into data in a standard format (S32). Here, the fixed format data includes predetermined format data and fixed data that can be recognized by the host or the analysis system.

  Next, the original message is restored by referring to the information stored in the memory (S34). Then, based on the restored message, a reply message is created by combining the standard data collected from the manufacturing apparatus and the atypical data collected from the atypical data detection unit and standardized into a predetermined format (S36). Next, the reply message is transmitted to the analysis system and / or the host (S38).

  On the other hand, according to FIG. 11, the atypical data connected to the manufacturing apparatus for at least one of the S2F33, S2F35, and S2F37 messages during the atypical data collection process (S26 in FIG. 10). If a negative response (NAK: negative acknowledge) is received from the detector, the data collection server cancels the existing atypical data collection operation (S40, S42, and S44). That is, the process of FIG. 11 operates in the background during the atypical data collection process (S26) of FIG.

  In addition, the method for collecting atypical data in the semiconductor manufacturing apparatus according to the embodiment of the present invention is such that when the system malfunctions or is not stable, the communication between the host and the manufacturing apparatus is disconnected and the semiconductor production line is Communication switching means for preventing the stop is provided. That is, the atypical data collection method according to the present invention is prepared for a case where the data collection server is designed not to operate stably depending on the environment of the semiconductor manufacturing apparatus, even though it is designed to operate stably. Communication switching means for switching direct communication between the host and the manufacturing apparatus is provided. A bypass method using such communication switching means will be described below.

  FIG. 12 is a flowchart showing a communication bypass method applicable to the method for collecting atypical data in the semiconductor manufacturing apparatus according to one embodiment of the present invention. According to FIG. 13, the communication bypass method applicable to the atypical data collection method of the present invention is provided with a watchdog in the data collection server, and automatically when an abnormality sign is generated in the data collection server. The communication line includes a method for directly connecting the host and the manufacturing apparatus. Specifically, in the communication bypass method according to the present invention, the procedure (S44) for determining whether or not the power is turned off by the watchdog, and if the result of the determination is that the power is turned off, The procedure for switching the communication so that the manufacturing apparatus directly communicates bypassing the data collection server (S60), and if the power is not turned off as a result of the above determination, it is determined whether the changeover switch is turned on. A procedure (S46) and a procedure (S60) for switching communication so that the host and the manufacturing apparatus directly communicate with each other bypassing the data collection server when the changeover switch is turned on as a result of the above determination.

  Further, the communication bypass method according to the embodiment of the present invention includes a procedure (S48) of updating the watch dog by itself when the power is not turned off and the changeover switch is not turned on. The communication bypass method is a procedure for switching communication so that the host and the manufacturing apparatus directly communicate with each other by bypassing the data collection server even when the watchdog is turned off or the watchdog timer times out. S50).

  On the other hand, in the above-described embodiment, the data collection system according to the present invention provides a lot of flexibility in the operation of the system because the data collection server partially serves as a host and a manufacturing apparatus.

  In addition, if necessary, the function can be logically expanded with a host computer equipped with a computer-readable recording medium that records a program for realizing the above-described atypical data collection method using a host computer. It is also possible to do.

  As described above, preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art within the scope of the technical idea of the present invention. Is possible.

  According to the present invention, typical data and atypical data can be synchronized and collected in real time without substantially changing the system configuration of an existing semiconductor manufacturing apparatus and substantially increasing the load. In addition, by expanding the function of the data collection server located between the host and the manufacturing apparatus, various functions that cannot be realized only by the existing host and the manufacturing apparatus can be effectively realized. Further, it can be easily applied to both existing devices and new devices. If the data collection system according to the present invention is applied to a semiconductor production line in conjunction with an analysis system, the productivity of the semiconductor industry can be greatly improved.

It is a block diagram which shows the outline | summary of a structure of the conventional general semiconductor manufacturing apparatus. It is a block diagram which shows the outline | summary of a structure of the conventional server data synchronous type semiconductor manufacturing apparatus. It is a block diagram which shows the outline | summary of a structure of the conventional agent data synchronous type semiconductor manufacturing apparatus. It is a block diagram which shows the outline | summary of a structure of the data collection system of the semiconductor manufacturing apparatus which concerns on one Embodiment of this invention. FIG. 5 is a timing diagram illustrating a data synchronization method of the data collection system illustrated in FIG. 4. FIG. 5 is a timing diagram illustrating a data synchronization method of the data collection system illustrated in FIG. 4. It is a block diagram which shows the structure of the data collection server of the data collection system shown in FIG. It is a functional block diagram which shows the module structure of the data collection server shown in FIG. It is a sequence diagram which shows the flow of the signal in the data collection system which concerns on one Embodiment of this invention. It is a flowchart which shows the collection method of the atypical data in the semiconductor manufacturing apparatus which concerns on one Embodiment of this invention. It is a flowchart which shows the collection method of the atypical data in the semiconductor manufacturing apparatus which concerns on one Embodiment of this invention. It is a flowchart which shows the collection method of the atypical data in the semiconductor manufacturing apparatus which concerns on one Embodiment of this invention. It is a flowchart which shows the communication bypass method applicable to the collection method of the atypical data in the semiconductor manufacturing apparatus concerning one Embodiment of this invention.

Explanation of symbols

410 Manufacturing apparatus 420 Data collection server 430 Host 440 Analysis system.

Claims (20)

In a data collection system for collecting atypical data from the semiconductor manufacturing apparatus via a data collection server connected to the semiconductor manufacturing apparatus, the host and the analysis system,
A program stored in a memory; and a processor connected to the memory to execute the program;
The processor assigns an atypical data state identifier necessary for the analysis of the manufacturing apparatus by the program, receives a data request message from at least one of the host and the analysis system, and sends the data request message to the processor. It is determined whether the state identifier and the collection event identifier stored in the memory and included in the data request message are defined in the manufacturing apparatus, and information that cannot be handled by the manufacturing apparatus is determined as an atypical data request message. The standard data request message is transmitted to the manufacturing apparatus in the data request message, the atypical data request message is transmitted to the atypical data detection unit, and the first standard data according to the SECS standard format is transmitted from the manufacturing apparatus. Receive atypical data from the atypical data detector The non-standard data is converted into second standard data according to a predetermined format that can be recognized by at least one of the host and the analysis system, and the first standard data and the second standard data are synchronized, and the host and A data collection system in a semiconductor manufacturing apparatus, wherein the data is transmitted to at least one of the analysis systems.   The data collection server periodically collects the atypical data from the atypical data detection unit, and calculates the maximum value, the minimum value, and the average value of the atypical data when the first standard data is received. The data collection system according to claim 1, wherein the calculated value is processed together with the atypical data synchronized with the first standard data.   The data collection system according to claim 2, wherein the data collection server samples and collects the atypical data at regular intervals between a start event and an end event.   The data collection system according to claim 2, wherein the data collection server updates the atypical data collected at a constant interval while sampling the atypical data at a constant interval.   The data collection system according to claim 1, wherein the data collection server forcibly collects the atypical data via the atypical data detection unit.   The data collection system according to claim 1, wherein the data collection server includes a transmission / reception module, a fixed data collection module, an atypical data collection module, and a data conversion module.   The data collection server may further include a filtering module that selectively transmits a part of at least one of the collected first fixed data and second fixed data. The data collection system described.   The data collection system according to claim 1, wherein the data collection server further includes a communication switching module that directly connects the manufacturing apparatus and the host through a communication line.   2. The non-standard data detection unit includes at least one of a unit that detects a state variable of the manufacturing apparatus and a unit that calls the state variable stored in a memory in the manufacturing apparatus. The data collection system described in In a method of collecting atypical data with a data collection server connected to a semiconductor manufacturing apparatus, a host and an analysis system,
A procedure for assigning state identifiers of atypical data necessary for analysis of the manufacturing equipment;
Receiving a data request message from at least one of the host and the analysis system;
Storing the data request message in a memory;
Determining whether a status identifier and a collection event identifier included in the data request message are defined in the manufacturing apparatus;
A procedure for determining information that cannot be handled by the manufacturing apparatus as an atypical data request message;
A procedure for transmitting a standard data request message to the manufacturing apparatus in the data request message;
Transmitting the atypical data request message to the atypical data detector;
Receiving first standard data in accordance with the SECS standard format from the manufacturing apparatus;
A procedure for collecting atypical data from the atypical data detector;
Converting the non-standard data into second standard data according to a predetermined format recognizable by at least one of the host and the analysis system; and synchronizing the first standard data and the second standard data, and A data collection method in a semiconductor manufacturing apparatus, comprising: a procedure for transmitting to at least one of a host and the analysis system; The procedure for collecting the atypical data is as follows:
Periodically collecting the atypical data from the host;
A procedure for calculating a maximum value, a minimum value and an average value of the atypical data at the time of receiving the first standard data; and the atypical data in which the calculated value is synchronized with the first standard data. The data collection method according to claim 10, further comprising a procedure for processing together with the data.   The procedure for periodically collecting the atypical data includes a procedure for sampling and collecting the atypical data at regular intervals between a start event and an end event. Data collection method.   The procedure for periodically collecting the atypical data includes a procedure for updating the atypical data collected at the predetermined interval while sampling the atypical data at a predetermined interval. The data collection method according to claim 11.   The procedure of transmitting the standard data request message to the manufacturing apparatus includes a procedure of transmitting the standard data request message to the manufacturing apparatus after deleting the information that cannot be handled by the manufacturing apparatus from the data request message. The data collection method according to claim 10, wherein   The data collection method according to claim 10, further comprising a procedure of canceling the work in progress if a negative response message is received from the manufacturing apparatus. And a step of restoring the data request message with reference to information stored in the memory; and a step of combining the first fixed data and the second fixed data to form a reply message. The data collection method according to claim 15.   The method according to claim 10, further comprising a step of directly connecting the manufacturing apparatus and the host for communication when the data collection server malfunctions or is not operating stably. Data collection method. A program for causing a data collection server connected to a semiconductor manufacturing apparatus, a host, and an analysis system to collect atypical data according to the following procedure,
A procedure for assigning a status identifier of atypical data necessary for analysis of the manufacturing apparatus; a procedure for receiving a data request message from at least one of the host and the analysis system; and storing the data request message in a memory; A procedure for determining whether or not a status identifier and a collection event identifier included in the data request message are defined in the manufacturing apparatus, and after deleting information that cannot be handled by the manufacturing apparatus from the data request message, the manufacturing apparatus A procedure for transmitting a typical data request message to the manufacturing device, a procedure for determining the information that cannot be handled by the manufacturing apparatus as an atypical data request message, and an atypical data detection unit connected to the manufacturing apparatus for the atypical data request message And atypical data is collected from the atypical data detector. Procedures and the the step of receiving the first type data according the manufacturing apparatus SECS standard format, the first type data the atypical data collected at the time of receiving the first type data into synchronized non to A procedure for determining as fixed data, a procedure for converting the determined non-standard data into second fixed data according to a predetermined format recognizable by at least one of the host and the analysis system, and the first fixed data And a procedure for synchronizing and transmitting the second fixed data to at least one of the host and the analysis system.   The program according to claim 18, wherein the procedure of collecting the atypical data includes a procedure of sampling and collecting the atypical data at a predetermined interval between a start event and an end event.   The procedure for collecting the atypical data includes a procedure for updating the atypical data collected at the predetermined interval while sampling the atypical data at a constant interval. The program described in.

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