JP4211413B2 - 回路基板用部材 - Google Patents

回路基板用部材 Download PDF

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Publication number
JP4211413B2
JP4211413B2 JP2003023269A JP2003023269A JP4211413B2 JP 4211413 B2 JP4211413 B2 JP 4211413B2 JP 2003023269 A JP2003023269 A JP 2003023269A JP 2003023269 A JP2003023269 A JP 2003023269A JP 4211413 B2 JP4211413 B2 JP 4211413B2
Authority
JP
Japan
Prior art keywords
layer
circuit board
film
adhesive
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003023269A
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English (en)
Japanese (ja)
Other versions
JP2004088059A (ja
JP2004088059A5 (enExample
Inventor
孝義 赤松
太 奥山
徹也 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2003023269A priority Critical patent/JP4211413B2/ja
Publication of JP2004088059A publication Critical patent/JP2004088059A/ja
Publication of JP2004088059A5 publication Critical patent/JP2004088059A5/ja
Application granted granted Critical
Publication of JP4211413B2 publication Critical patent/JP4211413B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
JP2003023269A 2002-02-05 2003-01-31 回路基板用部材 Expired - Fee Related JP4211413B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003023269A JP4211413B2 (ja) 2002-02-05 2003-01-31 回路基板用部材

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002027763 2002-02-05
JP2002196835 2002-07-05
JP2003023269A JP4211413B2 (ja) 2002-02-05 2003-01-31 回路基板用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008227823A Division JP2008300881A (ja) 2002-02-05 2008-09-05 回路基板用部材およびそれを用いた電子部品実装回路基板の製造方法

Publications (3)

Publication Number Publication Date
JP2004088059A JP2004088059A (ja) 2004-03-18
JP2004088059A5 JP2004088059A5 (enExample) 2006-03-16
JP4211413B2 true JP4211413B2 (ja) 2009-01-21

Family

ID=32074060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003023269A Expired - Fee Related JP4211413B2 (ja) 2002-02-05 2003-01-31 回路基板用部材

Country Status (1)

Country Link
JP (1) JP4211413B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100463107C (zh) * 2007-03-26 2009-02-18 友达光电股份有限公司 可挠性阵列基板的制造方法

Also Published As

Publication number Publication date
JP2004088059A (ja) 2004-03-18

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