JP4211252B2 - Pattern exposure method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for exposing a desired pattern on a substrate to be exposed, and more particularly to a method and apparatus for exposing a desired pattern without using a dedicated mask or reticle. The present invention also relates to a device obtained by such a method.
[0002]
[Prior art]
Conventionally, when a pattern is formed on a substrate such as a semiconductor circuit, a printed wiring board, a flexible wiring sheet, a liquid crystal display or a plasma display, the pattern is formed by exposing using a dedicated mask or reticle corresponding to the pattern to be formed. . That is, first, a mask or reticle serving as an original of a circuit pattern to be formed is drawn on a substrate using an electron beam or a laser, and a mask or reticle dedicated to the circuit pattern to be formed is created. Next, it is formed by exposing a wafer substrate or a glass substrate coated with a photosensitive material on the surface by an exposure device using an exclusive mask or reticle on which this circuit pattern is formed, and etching after post-development.
[0003]
[Problems to be solved by the invention]
Such masks and reticles require time and cost to produce themselves, and are particularly problematic in the production of small quantities of various types of products and products that require short delivery times.
[0004]
Further, in order to manufacture a large screen substrate such as a liquid crystal display or a plasma display, it is necessary to manufacture a very large mask, which makes it difficult to manufacture a large screen mask.
[0005]
In addition, in the production using conventional masks, it is necessary to prepare a large number of dedicated masks corresponding to each circuit pattern, and a large space is required for storing the masks, and management costs cannot be ignored. In other words, a mask storage is prepared, and necessary masks need to be quickly taken out from the storage room as needed, and the mask substrate number is entered, the mask storage location is determined, and this information is automatically used as necessary. An unloading system is required.
[0006]
Conventional methods of exposing a substrate using a two-dimensional light modulator without using a mask are described in Japanese Patent Application Laid-Open Nos. 62-21115, 62-21212 and 62-21294. Yes. These methods simply use a two-dimensional spatial modulator as a mask instead of a conventional mask. However, the number of pixels of the two-dimensional optical modulator has an upper limit, and a desired pattern (total number of pixels M) is exposed on the substrate when the total number of pixels N (n × n) modulated by the two-dimensional optical modulator is one time. Can not do it. Therefore, conventionally, at least M / N exposure is repeated by the step-and-repeat method to expose all desired patterns.
[0007]
The conventional step-and-repeat method has the following problems. The first problem is the step-and-repeat exposure, especially in the case of a large substrate, the time of step movement when exposure is not performed, the time for waiting for vibration reduction after movement, the time for alignment, etc. Compared with the time to perform, it becomes equivalent or more, and the throughput is lowered.
[0008]
In the step-and-repeat method, the square inscribed in the circular imaging field of the projection exposure lens is the maximum area that can be patterned by one exposure. Therefore, the maximum throughput can be obtained by performing exposure in the shape of an exposure area close to a square. In contrast, the scanning method employed in the present invention, as will be described later, exposes a rectangle having a length close to the diameter of the imaging field circle, a long side perpendicular to the scanning direction, and inscribed in the exposure field circle. Can be a field. As a result, the number of step movements in the direction perpendicular to the scanning direction (in the case of the scanning method, the number of scans) can be reduced by approximately 1 / √2 compared to the step-and-repeat method. This improves the throughput if the same projection optical system is used in both systems. In addition, under the same exposure field width, this means that an imaging lens with a small imaging field, that is, an inexpensive imaging lens is sufficient.
[0009]
The second problem is that a pattern defect occurs at the boundary of step exposure. This is a particularly noticeable defect in the case of a display device such as liquid crystal or plasma.
[0010]
SUMMARY OF THE INVENTION The object of the present invention is to solve the problems of the prior art, and to provide a pattern exposure method and apparatus capable of dealing with the production of various kinds and small quantities, and an electronic device (print substrate, TFT substrate, semiconductor) using this exposure apparatus. It is to provide a manufacturing method of a device.
It is another object of the present invention to provide a new pattern exposure method and apparatus that improve the conventional step-and-repeat pattern exposure method, and a method of manufacturing an electronic device using the exposure apparatus.
[0011]
[Means for solving problems]
  In order to achieve the above object, in the present invention, a two-dimensional light information pattern is created from exposure illumination light using a two-dimensional light modulator capable of controlling the light modulation state, and the created two-dimensional light information pattern is projected. In a pattern exposure method that exposes the photosensitive material applied to the surface of the exposed substrate by projecting it onto the exposed substrate whose surface is coated with the photosensitive material via the exposure optical system, the exposed substrate is moved in one direction. The two-dimensional optical modulator is moved in a direction opposite to the direction in which the substrate to be exposed moves at a speed corresponding to the enlargement or reduction magnification of the projection exposure optical system with respect to the movement, and a speed corresponding to the enlargement or reduction magnification. By scanning and irradiating the exposure illumination light on the two-dimensional light modulator moving in the same direction as the movement direction of the substrate to be exposed, a desired light formed by the light reflected or transmitted by the two-dimensional light modulator is formed. First two-dimensional optical information pattern Projecting an image onto a first region of a photosensitive material coated on the surface of a substrate to be exposed via a projection optical system to expose the first region; and on a two-dimensional light modulator using exposure illumination light When scanning is finished, the two-dimensional optical modulatorMove the substrate to be exposedOne way andthe sameSaid in the directionSpeed according to enlargement or reduction ratioThe first region is exposed to a second region adjacent to the first region, which is moved at a faster speed to return to the position where the movement in one direction is started and partially overlaps the exposed first region. The light modulation state of the two-dimensional light modulator is controlled so that the second two-dimensional light information pattern that is continuous with the first two-dimensional light information pattern projected and exposed on the region of the light is controlled, and the illumination position of the exposure illumination light is The photosensitive material applied to the surface of the substrate to be exposed was exposed by sequentially repeating the step of returning the dimensional light modulator to the position at the start of movement in one direction.
[0012]
  In order to achieve the above object, according to the present invention, a pattern exposure apparatus includes a light source, scanning means for scanning light emitted from the light source, and two-dimensional light received by light scanned by the scanning means. Two-dimensional light modulator means for forming an information pattern, first table means for mounting the two-dimensional light modulator means and moving in one direction, and two-dimensional light among the light beams scanned by the scanning means Projection optical system means for projecting an image of a two-dimensional light information pattern on a substrate to be exposed at a desired magnification by making light transmitted through the two-dimensional light information pattern formed by the modulation means, and a substrate to be exposed are placed And a second table means movable at least in a plane, a control means for controlling the scanning means, the two-dimensional light modulator means, the first table means and the second table means, Control the second table means to expose The first table means is controlled while moving the substrate in one direction, and the two-dimensional light modulator is exposed at a speed corresponding to the magnification or reduction magnification of the projection exposure optical system with respect to the movement by the second table means. The substrate is moved in the direction opposite to the direction in which the substrate is moved, and the scanning means is controlled to move the exposure substrate on the two-dimensional light modulator moving at a speed corresponding to the magnification or reduction magnification. An image of a first desired two-dimensional optical information pattern formed by controlling the two-dimensional optical modulator by scanning and irradiating in the same direction was applied to the surface of the substrate to be exposed via the projection optical system means. When the first area is exposed by projecting onto the first area of the photosensitive material, and the scanning on the two-dimensional light modulator by the exposure illumination light is finished, the first table means is controlled to control the two-dimensional light modulator.Move the substrate to be exposedOne way andthe sameSaid in the directionSpeed according to enlargement or reduction ratioThe first desired two-dimensional optical information pattern partially overlaps with the first desired two-dimensional optical information pattern by controlling the two-dimensional optical modulator by moving at a faster speed to return to the position where the movement in one direction is started. A second desired two-dimensional light information pattern continuous with the first desired two-dimensional light information pattern is created adjacent to the two-dimensional light information pattern, and the illumination position of the exposure illumination light is two-dimensionally controlled by controlling the scanning means. By repeating the return to the position at which the optical modulator starts moving in one direction, the second region is partially adjacent to the first region of the photosensitive material applied to the surface of the substrate to be exposed. The region and the second region partially overlapped with each other so as to be sequentially exposed.
[0013]
At this time, the substrate to be exposed is scanned at a substantially constant speed over the entire width of the substrate to be exposed in the scanning direction. The two-dimensional light modulator scans a certain width according to the scanning of the substrate, the exposure beam position scanning for irradiating the two-dimensional light modulator, and the dimensions of the two-dimensional light modulator. After this scanning, the two-dimensional spatial modulator is scanned in the reverse direction by a scanning amount substantially in the forward direction. The exposure beam position irradiating the two-dimensional light modulator is scanned in the direction opposite to the scanning of the two-dimensional light modulator according to the scanning amount in the forward direction of the two-dimensional light modulator. By doing so, the non-exposure time other than exposure can be shortened over the entire width of the substrate to be exposed in the scanning direction, and throughput can be improved.
[0014]
Exposure to the entire exposure region in the direction perpendicular to the scanning direction is performed as follows. That is, after the substrate to be exposed is scanned at a substantially constant speed over the entire width to be exposed in the scanning direction, the substrate to be exposed is substantially equal to or slightly smaller than the exposure width Wy at the time of scanning in the direction perpendicular to the scanning direction. The distance Sy is moved stepwise in a direction perpendicular to the scanning direction, and scanning is repeated.
[0015]
At this time, the exposure width Wy is made smaller than the step movement width Sy by ΔWy. Furthermore, the total exposure energy per unit area by the exposure illumination light in the region of width ΔWy exposed twice over two adjacent scans is made equal to the total exposure energy per unit area other than the region. By doing in this way, the conventional subject can be solved, without discontinuous exposure occurring in the region between two adjacent scans.
[0016]
The two-dimensional optical information pattern shown above is projected onto the substrate to be exposed at a constant exposure magnification by the projection exposure optical system. By doing so, exposure with high resolution becomes possible.
[0017]
A plurality of the exposure beams and two-dimensional light modulators are provided in a direction orthogonal to the scanning direction. In this way, it is possible to simultaneously expose a wide range by a single scan of the substrate.
[0018]
The plurality of two-dimensional optical modulator pattern generation regions are provided with a portion displaying the same pattern in the vicinity of the boundary region between adjacent two-dimensional optical modulators. Further, the total exposure energy associated with scanning per unit area by the exposure illumination light from the adjacent two-dimensional spatial modulator to this region is made equal to the total exposure energy associated with scanning per unit area other than this region. By doing in this way, the conventional subject can be solved, without performing discontinuous exposure in the area of the adjacent two-dimensional optical modulator.
[0019]
The two-dimensional light modulator is composed of liquid crystal. Further, a two-dimensional modulator having a mechanism in which a large number of minute mirrors are arranged and deflected by an electric signal to modulate light may be used. When these two-dimensional optical modulators using liquid crystals and micromirrors are made reflective, the back surface can be cooled, and even if the exposure energy increases, the lifetime can be extended without damaging the spatial modulator. Is possible.
[0020]
A plurality of two-dimensional optical modulators are provided in a direction perpendicular to the direction scanned by the scanning means. In this way, the number of scans can be reduced, a desired area can be exposed in a short time, and throughput can be improved.
[0021]
When the plurality of two-dimensional light modulators provided are reflective spatial modulators, a polarization beam splitter is inserted between the reflective spatial modulator and the exposure projection optical system. Further, the exposure illumination system is provided with a polarized beam separating means for separating the exposure light into two orthogonally polarized lights. The polarized beam is guided to the adjacent polarized beam splitter by the polarization separating means. By doing so, it is possible to illuminate the adjacent two-dimensional light modulators with light energy emitted from the light source without waste, and to expose the reflected light incident on the two-dimensional light modulator without waste. It becomes possible to guide to the substrate.
[0022]
By using the exposure method described above, in the process of manufacturing one semiconductor device or display device or a device such as a printed circuit board by one or more exposures, different numbers are assigned to individual devices or individual device groups on the exposure substrate. , Numbers, barcodes, names, symbols, pictures, or indicia. If it is possible to form different numbers, numbers, barcodes, names, symbols, pictures, or indicia for each device, or for each semiconductor device, for example, for a semiconductor device, in the production process It can be used for quality control, accident analysis after entering the market, etc.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
First, the first embodiment of the present invention will be described with reference to FIGS.
In FIG. 1, reference numeral 1 denotes an exposure illumination system, which includes an exposure light source and an optical system that causes the two-dimensional light modulator 3 to generate an exposure beam having desired directivity and intensity distribution. The detailed configuration of the exposure illumination system 1 will be described later. Denoted at 2 is a deflection mirror which is a part of an illumination deflection means for scanning and illuminating the exposure beam on the two-dimensional optical modulator. The illumination deflection means is driven by a mirror (not shown) which rotates within a certain range as shown in the figure. The mechanism is composed of a drive circuit (not shown) that receives the drive signal from the control circuit 6 and drives the drive mechanism. The exposure beam is reflected by the deflecting mirror, passes through the condenser lens 11, and irradiates the two-dimensional light modulator (spatial modulator, two-dimensional spatial modulator) 3.
[0024]
As shown in detail in FIG. 2, the spatial modulator 3 has a large number of picture elements 310 arranged in the xy direction in the modulation plane, and the total number of picture elements in the display area indicated by 31 is at least 2000 × 2000, Preferably it is 10,000 × 10000 or more. The two-dimensional optical modulator shown in the present embodiment is made of liquid crystal, and the liquid crystal material and the alignment film are materials that can sufficiently withstand the g-line and h-line of the mercury lamp that is the exposure wavelength. It is also possible to perform exposure with i-line using a liquid crystal two-dimensional modulator that can withstand i-line of a mercury lamp having a shorter wavelength by selecting a special material.
[0025]
The modulation area of the two-dimensional optical modulator has a width of Wm in the x direction and a width of Wy in the y direction, and the exposure beam is irradiated to the irradiation area 71 that is hatched including a part of the display area. . In this irradiation area 71, the irradiation position changes at a speed Vxm as shown by the arrow in the figure by the illumination deflection means.
[0026]
On the other hand, the two-dimensional optical modulator itself is shown by an arrow Vx in FIG.₁As shown in FIG. 5, the optical disk is driven by a two-dimensional optical modulator stage (not shown) at a high speed in the opposite direction to Vxm. The drive width of this stage is approximately equal to the display width Wm of the two-dimensional optical modulator.
[0027]
In FIG. 1, the exposure light having the exposure pattern transmitted through the two-dimensional light modulator 3 is projected onto the exposure substrate 5 by the projection optical system 4 of equal magnification. A photosensitive material is applied on the surface of the substrate, and an exposure region 72 thereon is irradiated and exposed.
[0028]
FIG. 3 shows that the substrate to be exposed 5 is Vx by a substrate stage (not shown).₂(= -Vx₁) In the x direction at a speed of (), and shows a state where scanning exposure is performed. In order to represent a relative change between the substrate 5 and the field 701 of the projection optical system, the moving substrate 5 is fixed as shown by a thick solid arrow, and the exposure field is moved as shown by a solid arrow. Yes. As shown in FIG. 4, the exposure area 72 is a parallelogram inscribed in the exposure field 701. The side Ly in the y direction is orthogonal to the scanning direction, and the side Lx in the scanning direction is not parallel to the scanning direction. The exposure field is relatively Vx in the left direction as indicated by the thin solid arrow pointing to the left in the lower part of FIG.₂Relative movement at the speed of. If the substrate goes to the right end of FIG. 1, the exposure field goes to the left end of the substrate 5 as shown by the long arrow at the bottom of FIG. During this time, exposure is performed. When reaching this end, the stage moves Sy in the y direction, and the exposure field moves as indicated by an upward arrow. No exposure is performed during the movement in the y direction. After the movement in the y direction is completed, the stage is moved to the left, so that the exposure field moves as shown by the second long and thin arrow (dotted line) from the bottom of FIG. 3, and exposure is performed during this time.
[0029]
FIG. 4 is a view showing an exposure area near the boundary between the scanning of the exposure field. The right-to-left scanning of the solid line in FIG. 3 is performed along the exposure field center line C1-C1 ′, and the second left-to-right scanning from the bottom is along the exposure field center line C2-C2 ′. Made. The distance between the center lines is Sy. The parallelogram exposure field has a width wy in the y direction, and wy is longer than Sy by the length component Δwy in the y direction of the side Lx. That is, this inclined portion overlaps in the exposure field of the adjacent scanning.
[0030]
By doing so, the problem that occurs when the above-mentioned display device is exposed by the step-and-repeat method, that is, the pattern width and the like change only when the upper and lower exposure amounts slightly change at the boundary between the two scans. , No conspicuous borderline is generated.
[0031]
Next, the operations of the substrate, the two-dimensional light modulator, and the scanning exposure beam in one scanning will be described with reference to FIGS. FIG. 5 shows the movement of the exposure illumination light accompanying the driving of the illumination deflection means in the projection optical system imaging region 701 on the two-dimensional light modulator. As the time elapses, the inside of the projection optical system imaging region 701 changes to hatched hatched portions 711, 712, 713, and 714 as shown in (a), (b), (c), and (d) from the right in FIG. . The exposure light is scanned in the horizontal hatching portion 70 by driving the two-dimensional light modulator and the illumination deflecting means.
[0032]
FIG. 6 shows a situation in which the position of the exposure light relatively changes on the two-dimensional light modulator by such scanning. The positions of the exposure beam shown in (a), (b), (c), and (d) of FIG. 5 on the two-dimensional optical modulator are 711, 712, 713, and 714, respectively. That is, when the two-dimensional light modulator moves leftward at a speed Vx1 and when the exposure illumination light moves rightward by the illumination deflecting means 2 at a speed Vxm, the exposure illumination light changes as shown in the figure.
[0033]
FIG. 7 shows the position change of the image by the exposure light on the substrate to be exposed and the projection optical system of the two-dimensional light modulator. The positions of the exposure light on the substrate to be exposed corresponding to the positions of the exposure lights 711, 712, 713 and 714 in FIGS. 5 and 6 are 721, 722, 723 and 724, respectively. As shown in the drawing, the upper and lower two lines of FIG. 7 have the same center line C1-C1 for exposure scanning in the x direction on the substrate to be exposed. The sequential scanning of the light modulator and the illumination light is shown shifted up and down. Ie time t₀~ T₀One scan of the two-dimensional light modulator and illumination light is performed during + ts. When the operation is finished, it returns to the starting position over time Δt. Then the second scan is time t₀+ ts + Δt ~ t₀between + ts + Δt + ts.
[0034]
The exposure light position at the start of the second scan and the pattern generated by the two-dimensional light modulator are indicated by 721 'in the figure, which is exactly the same as 724 in the first scan exposure. This is because only half of the exposure energy is exposed by scanning exposure at the center line in the y direction of 724 as compared to locations other than 724. Therefore, by starting the second scanning at this position, there is no pattern break. This is for exposure. The arrows shown in the figure indicate the situation where the position of the exposure light changes with time. When the first scanning is completed, the two-dimensional optical modulator stage and the illumination deflecting unit are driven and returned to the scanning start position over time Δt. By returning, the start exposure position of the second scan becomes equal to the end position of the first scan. Further, the start pattern 721 'displayed by the two-dimensional optical modulator matches the pattern 724 at the end of the second scan. In this way, it is possible to continuously expose the pattern even if the substrate to be exposed moves at a constant speed.
[0035]
FIG. 8 is a graph showing changes with time of the position of the substrate to be exposed, the position of the two-dimensional light modulator, and the position at which the exposure illumination light from the illumination deflecting means scans the two-dimensional light modulator. 8A and 8B show changes in the position of the substrate stage in the x and y directions. FIG. 8C shows a change in the position of the two-dimensional optical modulator stage in the x direction. However, the x direction of the secondary current spatial modulator is different from the x direction of the substrate stage. FIG. 8D shows a change in the position in the x direction when the illumination light driven by the illumination deflector scans the two-dimensional optical modulator. The exposure starts when the time t is 0, and the two-dimensional light modulator stage is moved in the x direction from (n−1) (ts + Δt) to (n−1) (ts + Δt) + ts. Meanwhile, exposure is performed by moving the illumination light in the x direction on the two-dimensional light modulator by driving the illumination deflection means. However, the x direction of the illumination light is the same as the x direction of the substrate.
[0036]
Between (n-1) (ts + Δt) + ts and n (ts + Δt), the two-dimensional optical modulator stage is returned in the direction opposite to x at a high speed, and during that time the illumination deflecting means is also driven, Return at high speed in the opposite direction of x on the dimensional light modulator. Of course, during this return, the illumination light is shielded by a shutter (not shown). This is repeated until the integer n is 1 to N, that is, N (ts + Δt), thereby exposing a desired range in the direction of the substrate stage x as shown in FIG. When the exposure for one scan of the substrate stage is completed, the substrate stage is moved Sy in the y direction as shown in FIG. 8 (b), and the second scan is performed in the reverse direction by the above method. The above operation is repeated until a desired area in the y direction is exposed, and the exposure is completed.
[0037]
FIG. 9 shows that eight exposure optical systems shown in FIG. 1 are installed in parallel, and simultaneously expose eight columns. The exposure fields of the respective exposure optical systems are 701, 702,... 708, and two of the adjacent exposure fields are shown in FIG. In the adjacent field in the case where there is one exposure optical system described above, the sides in the x direction are not parallel to the x direction and are slightly inclined. In this way, by performing exposure from both of the adjacent exposure fields in the vicinity of the boundary line BB ′, it is possible to prevent the generation of a discontinuous pattern occurring at the boundary portion.
[0038]
FIG. 11 is a diagram showing details of the exposure optical system 1 shown in FIG. 17 is a mercury lamp, 18 is an ellipsoidal mirror, and 16 is a rod lens array whose details are shown in FIGS. In order to perform exposure by scanning and to take a long and narrow exposure area diagonally to the projection lens, the exposure illumination light is formed into an oval shape as indicated by 100 in FIG. In order to realize this, as shown in FIG. 13 and FIG. 14, a large number of convex lenses having sides having short Wx in the x direction and long Wy in the y direction are arranged and used as shown in FIG. 13.
[0039]
When light from a mercury lamp close to a point light source is collected on such a rod lens array 16, g-line, h-line or i-line emitted from the light source enters the rod lens with very little loss. The incident parallel light component directed in a specific direction is collected at a specific position at the exit end of the rod lens, becomes divergent light having a large divergence angle in the y direction, and divergent light having a small divergence angle in the x direction. And exits from the exit end.
[0040]
The emitted light passes through the mirror 15 and the lens 14 and enters the aperture plate 13 shown in detail in FIG. The aperture plate has 1371 parallelogram apertures. The light having different divergence angles for x and y becomes illumination light having an oval shape as indicated by 100 on the aperture plate. The intensity distribution in the aperture becomes uniform due to the diffusion effect of the rod lens array. Since this opening is conjugated to the surface of the two-dimensional light modulator 3 by the lenses 12 and 11, the light transmitted through this opening forms an image of this opening on the two-dimensional light modulator.
[0041]
Further, the light transmitted through the opening 1371 is condensed on the surface of the mirror 2 of the illumination deflecting means at the focal position of the lens 12. The distance between the mirror surface and the lens 11 is equal to the focal length of the lens 11. For this reason, the principal ray of the light transmitted through the lens 11 does not depend on the deflection angle of the mirror 2 of the illumination deflecting means, and the irradiation position is always in the x direction according to the deflection angle while maintaining the vertical irradiation on the two-dimensional optical modulator. To change. In this way, exposure illumination light that is long in the y direction can be scanned in the x direction.
[0042]
A modification of the first embodiment described above is shown in FIGS.
FIGS. 15 and 16 are examples in which the illumination light emitted from one light source is divided into two and divided into two exposure illumination systems. 15 is a perspective view, and FIG. 16 is a side view. Reference numerals 101 and 102 in FIG. 15 branch the exposure light emitted from one light source (not shown) into two by means for showing details later. The operations of the respective exposure optical systems shown in FIGS. 15 and 16 are as described above. In this embodiment, a transmission type such as a liquid crystal is used as the two-dimensional light modulator.
[0043]
Next, a second embodiment will be described with reference to FIG.
FIG. 17 shows an example using a reflective two-dimensional optical modulator. The same part numbers in FIG. 17 and FIG. 11 represent the same thing. The light emitted from the mercury lamp 7 is condensed by the ellipsoidal mirror 18 onto the light integrator 16 described with reference to FIGS. The light that has passed through the optical integrator passes through the lens 14 and the shutter 133 and then irradiates the opening 131 with uniform light. The opening 131, the two-dimensional light modulator 301, and the substrate 5 are in an imaging relationship. The light transmitted through the opening 131 is divided into two by the polarization beam splitter 110. That is, the P-polarized component of the light incident on the polarization beam splitter is transmitted through the polarization beam split surface, and the S-polarized component is reflected. The reflected S-polarized light component is converted to P-polarized light by the half-wave plate 1223 and reflected by the mirror 1222. The P-polarized exposure light thus branched passes through the respective exposure optical systems as shown below, and exposes regions 711 and 712 on the substrate, respectively. In the biaxial exposure optical system of FIG. 17, the hatched one is the back, and the one not hatched is the front exposure optical system. Since both optical systems are exactly the same, only the front exposure optical system will be described below.
[0044]
The linearly polarized light oscillating in the y direction that has passed through the polarizing beam splitter 110 passes through the lens 1112, is condensed on the deflecting mirror 1113 attached to the rotation drive source 1102, is reflected, and enters the lens 1111. The light transmitted through the lens 1111 is incident on the second polarization beam splitter 311. Since the light incident on the second polarization beam splitter is linearly polarized light in the y direction, it becomes S-polarized light for the polarization beam splitter. As a result, almost 100% of the light incident on the second polarizing beam splitter 311 is reflected and enters the two-dimensional optical modulator 301.
[0045]
The two-dimensional light modulator 301 of this embodiment is a reflective two-dimensional light modulator. A reflection type two-dimensional modulator using liquid crystal may be used, or a two-dimensional modulator based on deflection of a minute mirror array may be used. When liquid crystal is used, one of the two surfaces sandwiching the liquid crystal, that is, the upper surface in FIG. 17 is a mirror surface, and the lower surface is a transmission surface. In a normal transmissive liquid crystal, polarizing plates are necessary on both surfaces of the glass sandwiching the liquid crystal, but the polarizing plate is not necessary in the liquid crystal two-dimensional light modulator of this embodiment. That is, the polarization beam splitter 311 plays this role. That is, the linearly polarized light in the y direction directed upward by the polarization beam splitter 311 enters the two-dimensional light modulator 301. After being reflected by the glass on the upper surface, the reflected polarized light becomes linearly polarized light in the x and y directions depending on the display state and non-display state caused by the voltage applied to each pixel of the two-dimensional spatial modulator. For this reason, when the light passes through the polarizing beam splitter again, only the reflected light from the display state pixel which is linearly polarized light in the x direction passes through the polarizing beam splitter.
[0046]
Thus, the electrical signal information applied by the two-dimensional spatial modulator becomes the two-dimensional information of the exposure light, and is imaged and projected onto the exposure substrate 5 by the projection exposure lens 401 and exposed. As described above, since exposure should not be performed when the scanning of the two-dimensional light modulator and the exposure illumination light is returned, the exposure light is shielded by using the shutter 133 at the time of return.
[0047]
Also in this embodiment, as described above, by driving the substrate 5, the two-dimensional optical modulator 301, and the deflecting mirror as indicated by arrows, it is possible to scan the substrate 5 at a substantially constant speed to expose the entire surface of the substrate. become.
[0048]
Although the above description uses a reflective liquid crystal two-dimensional light modulator, a two-dimensional spatial modulator in which minute deflection mirrors are two-dimensionally arranged may be used. In this case, a quarter wavelength plate is inserted between the deflecting beam splitter 311 and the two-dimensional spatial modulator 301 ′. By doing so, it is possible to use the reflected light from the display unit for almost 100% exposure as in the above-described liquid crystal two-dimensional spatial modulator. In the pixel portion in the display state, the deflection angle of the micromirror is 0 degree, and in the pixel in the non-display state, the deflection angle is θ. The light reflected by the display unit enters almost 100% into the pupil of the projection exposure lens 401 to expose the substrate. On the other hand, the light reflected by the non-display portion is directed to the projection exposure lens with a 2θ inclination with respect to the optical axis of the exposure optical system. When the numerical aperture of the projection exposure lens is NA and the magnification of the projection exposure is 1 / M, the deflection angle θ of the non-displayed pixel is selected so as to satisfy the condition of sin (2θ) ≧ NA / M. The light reflected by the display unit deviates from the pupil of the projection exposure lens and does not reach the substrate. Further, when M is large, the light from the non-display portion passes outside the projection exposure lens. Therefore, by providing a light shielding plate in this portion, it is possible to avoid noise exposure on the substrate 5 to be exposed.
In the above description, the case where the projection exposure magnification is 1 / M and M = 1 has been described, but M is not limited to 1. The present invention can be applied to both reduced exposure and enlarged exposure. When the magnification is 1 / M, the scanning speed of the two-dimensional spatial modulator and the exposure illumination light on the two-dimensional optical modulator with respect to the scanning speed of the substrate 5 may be set to be M times that when the scanning speed is one time. it is obvious.
[0049]
Although omitted in the above embodiment, when a normal circuit or a display device is manufactured by this method, it is not completed by one exposure, and a multilayer film is formed by changing the pattern several times or 20 times and performing overexposure. Make a device consisting of In such a case, since a new pattern is overlaid and exposed on the pattern already formed on the substrate, the exposure apparatus has a well-known alignment function for detecting and aligning the pattern on the substrate. .
[0050]
FIG. 18 shows an example in which the present invention is applied to a process for manufacturing a semiconductor device by processing a wafer. Reference numeral 5 ′ denotes a wafer on which a semiconductor LSI pattern is exposed. This wafer has already been formed with a multilayer thin film that will be a semiconductor circuit, and the uppermost layer is a wiring pattern that is exposed by the above-described exposure apparatus of the present invention and has a relatively wide pattern. A semiconductor LSI chip 501 is finally cut into one device. This chip includes a wiring pattern portion 501 and a chip individual information area 503 in which various numbers, names, etc. are individually written for each of the devices. This chip individual information area 503 includes numbers such as a manufacturing number and serial number shown in 504, numbers, names, symbols, pictures, indicia, etc. representing parameters and manufacturing conditions at the time of manufacturing, barcodes shown in 505, etc. Necessary information such as an information code is exposed by the exposure apparatus of the present invention.
[0051]
That is, the exposure method and apparatus of the present invention can individually write various numbers and names on device products manufactured on a substrate, which was impossible when using a conventional mask. As a result, quality control becomes easy at the production stage. In addition, since the history is clear after the product is completed, sold, and put on the market, even if a failure occurs later, by reading the information in the chip individual information area 503, the cause can be clarified and countermeasures can be taken. It becomes easy to do.
In order to record the chip individual information area 503 on the chip, the information to be recorded is recorded in advance in the memory of the control circuit 6 of the exposure apparatus together with other circuit pattern information. A two-dimensional optical modulator that moves in synchronization with scanning during exposure of the exposure substrate (wafer substrate) may be driven based on this recording information to generate display patterns 502 and 503 in FIG.
[0052]
Thus, each device is a device such as a semiconductor device made of a semiconductor chip manufactured through the above exposure process, a display device such as a liquid crystal display or a plasma display, a printed circuit board, a flexible pattern substrate, or a micromachine device. Device individual information is written in In this way, quality control at the time of manufacturing the device itself becomes possible. Even after the product is put on the market, the information recorded in the device is read by the enlargement detection means or the like, so that the history at the time of manufacture of the product can be surely understood and fine maintenance can be performed. In addition, since information such as sales channels and product numbers can be managed, it is possible to take quick measures or respond to an accident.
[0053]
In the above description, an example in which different information is written to each device has been described. For example, the same information is recorded on a semiconductor device obtained from one wafer, and all information obtained from one wafer is recorded. The chip may be a single device group. Moreover, the same number is given to the chip | tip of the same place on the wafer in 1 lot (it consists normally of 10 to several dozen wafers), it is set as one device group, a different number is attached to a different place, and a different device group You may manage as.
[0054]
FIG. 19 is a diagram in which the exposure method according to the present invention is applied to proximity exposure. The exposed substrate 5 ″ and the two-dimensional spatial modulator 3 ″ are scanned in the direction of the x direction arrow at the same speed Vx2 ′ (= Vx1 ′). The exposure illumination light 71 ″ is scanned in the x direction opposite to this direction at a speed Vxm1 ′ smaller than the above speed. When the exposure illumination light reaches the right end of the two-dimensional spatial modulator, the two-dimensional spatial modulator and the exposure illumination light are returned to the positions shown in the figure. At this time, the substrate to be exposed continues scanning at a constant speed Vx2 ′. This operation is continued until exposure is completed to the right end of the exposure substrate, and then the substrate to be exposed is stepped in the y direction in the same manner as exposure by the imaging lens described above. By repeating this operation, the entire substrate is widely exposed. The above drive control is performed by the control circuit 6 ″.
[0055]
Next, a third embodiment of the present invention will be described with reference to FIG.
FIG. 20 shows an embodiment using a reflective two-dimensional spatial modulator 3 ″. The length of the reflection part of the minute deflection mirror 310 ″, which is the part that reflects the light of the spatial modulator, is smaller than the arrangement pitch of the deflection mirrors. As a result, the intensity of the pattern projected onto the substrate 5 decreases between the adjacent deflection mirror portions. As a result, if the resolution of the projection optical system is smaller than the size of the deflecting mirror, the pattern does not become a continuous pattern but a pattern made of dots, and a desired pattern cannot be exposed.
[0056]
Reference numeral 300 ″ in FIG. 20 denotes a microlens array that solves this problem. The projection exposure lens 401 (and 402) is used, and the microlens array 300 ″ is arranged separately from the projection lens and close to the two-dimensional light modulator. The pitch of this microlens array is equal to that of the minute deflection mirror, and the focal position is on the reflection surface of the minute deflection mirror. As a result, all of the rectangular illumination light entering each rectangular microlens array is focused on the micro-deflection mirror corresponding to each microlens, reflected, and returned to the rectangular microlens at the time of incidence again. The same light path is emitted in reverse. Therefore, if the projection exposure lens 401 (402) allows the microlens emission surface to form an image on the exposure surface of the substrate, the intensity between the picture elements does not decrease and the dot pattern does not become separated. A desired pattern can be exposed.
[0057]
The microlens array 300 ″ shown in FIG. 20 is composed of minute convex lenses, but an array of minute Fresnel lenses may be used. Further, a reflection type Fresnel lens or a reflection type hologram is formed on the surface of the minute deflection mirror surface 310 ″, and the reflected light from each mirror is appropriately overlapped on the surface Σh at a distance h after reflection, and a gap is formed. The intensity distribution should be uniform without leaving a gap. In this way, when the surface Σh is imaged on the exposure surface of the substrate 5 by the projection exposure lens 401 (402), a desired pattern can be exposed without forming a dot pattern in which the picture elements are separated. It becomes possible.
[0058]
Next, a fourth embodiment of the present invention will be described with reference to FIGS.
In the fourth embodiment, the display pattern 3101 ″ of the two-dimensional spatial modulator 3 ″ moves on the two-dimensional spatial modulator at the velocity Vd.₁″ ″ Moves the two-dimensional spatial modulator 3 ″ (velocity Vx₁The point of movement in the “″) direction is different from those of the first to third embodiments. That is, in the first to third embodiments described above, for example, when the imaging magnification of the projection optical system is set to 1, the scanning speed Vxm of the substrate 5 and the scanning speed Vx of the two-dimensional spatial modulator.₁They were equal. However, in the fourth embodiment shown in FIGS. 21 and 22, Vxm = Vx₁″ ″ + Vd₁″. The reason why the two, that is, the two-dimensional light modulator and the display pattern image are moved together is as follows.
[0059]
The first reason is that the dimension of the spatial modulator in the scanning direction can be reduced by moving the two. The second reason is that unless the spatial modulator is moved at all, the display speed of the spatial modulator regulates the exposure throughput, and high-throughput exposure cannot be performed. Therefore, the display pattern may be moved in the scanning direction on the two-dimensional spatial modulator as long as the display switching speed is possible without problems, and the two-dimensional spatial modulator itself may be moved in the scanning direction by the shortage.
[0060]
Here, as a third embodiment, a solution for the problem that the intensity between picture elements becomes weak and does not become a continuous pattern but becomes dot-like is shown using FIG. 20. It can also be solved by the method shown. That is, in the case of the fourth embodiment shown in FIGS. 21 and 22, the problem can be similarly solved by slightly tilting the array of the two-dimensional spatial modulator in the scanning direction from the scanning direction. it can. In this way, in the case of the embodiment shown in FIGS. 21 and 22, when attention is paid to an arbitrary portion of the pattern exposed on the substrate, the two-dimensional spatial modulator used to expose the portion is used. The number of picture elements is over a number k of picture elements. Therefore, if the k picture elements in the scanning direction are inclined by about one picture element in a direction perpendicular to the scanning direction, the unevenness in the intensity between adjacent picture elements in the direction perpendicular to the scanning direction is eliminated. The intensity unevenness between adjacent picture elements in the scanning direction averages the intensity between adjacent picture elements by generating a slight speed unevenness in the scanning speed during the time of scanning the two-dimensional optical modulator by the above-mentioned k minutes. It can be eliminated.
[0061]
In the embodiment in which the display pattern is not moved on the two-dimensional spatial modulator shown in FIG. 1 and the like, the exposure pattern of the substrate 5 does not vary between adjacent picture elements regardless of the method of FIG. A method of performing this will be described with reference to FIGS.
[0062]
In the scanning direction, the intensity between adjacent picture elements is averaged by generating a slight speed variation in the scanning speed in the same manner as described above. About the direction orthogonal to the scanning direction, about one picture element is meandered in this direction within the time to expose the picture element of interest.
[0063]
This will be described in detail below with reference to FIGS. FIG. 23 is a diagram of a two-dimensional spatial modulator, and 310 represents one picture element of a micromirror or a liquid crystal display element. That is, light that is transmitted or reflected through the two-dimensional spatial modulator comes out of the 310 rectangular area. The hatched picture elements in the figure are in an ON state, that is, a region that reflects or transmits light. Therefore, when this light is projected onto the substrate 5 by the projection exposure lens 4 (or 401, 402), the projected image intensity distribution (exposure intensity distribution) of the AA and BB cross sections shown in FIG. As shown in (b). When the imaging magnification is 1: 1, if the scanning of the projection image and the scanning of the substrate 5 are completely coincident with each other, a dot-like pattern is formed on the substrate that is identical to that shown in FIG. . The original desired pattern is to connect adjacent ON dots, but they are separated.
[0064]
As shown in FIG. 23, the pixel pitches in the x and y directions are Px and Py. Since the dimension of the exposure irradiation light on the two-dimensional optical modulator in the scanning direction is We, the time for which the exposure illumination light passes through the pixel of interest is We / (Vx1 ″ −Vxm). t_epAnd As shown in FIG. 25 during the scanning exposure time in the x direction.
[0065]
That is, the scanning of the two-dimensional optical modulator is not performed at a constant speed as indicated by a dotted line, but a slight speed unevenness is generated, and the deviation amount ± Δx from the linear change of the x coordinate position is equal to the pixel pitch Px. Set to about 0.2 to 0.8. In this way, the projection pattern is swung in the x direction during the exposure of the pixel of interest. As a result, as shown in FIG. 25 (a2), unevenness between dots indicated by dotted lines (dot-like separation) disappears, and a desired pattern having a uniform distribution can be obtained as indicated by solid lines.
[0066]
On the other hand, the pattern in the direction orthogonal to the scanning is t as shown in FIGS._epThe two-dimensional spatial modulator that is originally kept stationary is moved by ± Δy in the y direction. In this way, the projection pattern is shaken in the y direction during exposure of the pixel of interest. As a result, as shown in FIG. 25 (b2), unevenness between dots indicated by dotted lines (dot-like separation) disappears, and a desired pattern having a uniform distribution can be obtained as indicated by solid lines. FIG. 26 shows the above contents two-dimensionally.
[0067]
When the two-dimensional light modulator is not slightly changed, the exposure pattern is exposed as it is as shown by the oblique line 722 in FIG. 26A, and the space 723 between adjacent picture elements is not exposed. . However, as shown in FIG. 26 (b), which is good for finely moving the two-dimensional optical modulator as described above, the inter-picture element 723 'of the exposure area 720 for one field of view on the substrate 5 is exposed to form a desired pattern. It becomes possible to expose.
[0068]
Such control of the above-mentioned two-dimensional optical modulator is originally performed by measuring the stage position in the scanning direction and the direction orthogonal thereto with a laser length measuring device or a magnescale (not shown). Since the stage is controlled by the control circuit 6 based on the above, it can be easily realized. In the above embodiment, Δx and Δy are slightly changed by the two-dimensional spatial modulator. However, the two-dimensional spatial modulator is linearly operated, and the fine fluctuation component is applied to the substrate stage as in the case of the two-dimensional spatial modulator. You can put it on.
[0069]
FIG. 27 is a diagram showing a further embodiment that eliminates the reduction in exposure intensity that occurs between picture elements. In the figure, the transmission type two-dimensional optical modulator is used for explanation, but the reflection type is also effective. The part numbers in FIG. 27A and those in FIG. 1 that are the same represent the same thing. The display surface of the liquid crystal 31 and the like that modulates the light of the two-dimensional spatial modulator 3 ″ is the 311 surface in FIG. A surface 312 that is shifted in the optical axis direction by Δ from the display surface 311 is arranged in a conjugate relationship with the surface to be exposed of the substrate 5 by the projection exposure lens. By doing so, the display pattern of the two-dimensional spatial modulator is projected onto the substrate in a slightly defocused state. As a result, as shown in FIG. 27 (c), the reduction in exposure intensity occurring between the picture elements 723 ″ in the exposure area 720 for one field of view of the exposure optical system 4 on the substrate 5 is eliminated, and a desired pattern is obtained. The substrate can be exposed.
[0070]
Next, a fifth embodiment will be described with reference to FIG.
28, the same number as the part number in FIG. 17 represents the same thing. In the second embodiment shown in FIG. 17, the scanning of exposure light to the reflective two-dimensional spatial modulators 301 and 302 is performed by the deflectors 1102 and 1202, but the fifth embodiment shown in FIG. In the embodiment, the aperture plate 13 is driven up and down as indicated by an arrow 73 by the driving device 132, and the aperture 131 of the aperture plate 31 is conjugate with the two-dimensional spatial modulator, so that the exposure light is transmitted on the two-dimensional spatial modulator. Scanned. This scanning is controlled by the control device 6 in synchronization with the scanning of the two-dimensional spatial modulators 301 and 302 and the scanning of the xy stage 9 on which the substrate is mounted. The exposure light applied to the aperture plate 13 is somewhat larger than that of the aperture 131. Even if the aperture plate moves up and down, the intensity of the exposure light passing through the aperture 131 does not change and is substantially uniform within the aperture. It is.
[0071]
The xy stage 9 on which the substrate 5 is mounted has a length measuring device 901 in the x direction and a length measuring device 902 in the y direction, and the position of the stage is measured with an accuracy of sub μm. The intensity unevenness between adjacent picture elements can also be reduced by slightly meandering in the xy direction shown in the description of FIG. 5 by controlling the xy stage with the control circuit 6 based on the measurement data of the length measuring devices 901 and 902. Is done.
[0072]
The exposure of the pattern to most exposure substrates may be several times in the case of a display element such as a liquid crystal and several tens of times in the case of a semiconductor circuit. When an element is formed by performing multiple exposures in this way, a new pattern is overlaid and exposed on a pattern that has already been exposed. At this time, it is necessary to accurately perform overlay exposure on the already formed pattern. Therefore, alignment marks 91 and 92 shown in FIG. 28 are formed on the substrate during the first pattern exposure. This mark is enlarged and formed on the imaging surface of the imaging device 81 such as a CCD by the pattern detection optical system 80 to detect the image of the mark. From the position of the mark detected by the image pickup apparatus and the position of the xy stage detected by the length measuring devices 901 and 902, the exact positions of the alignment marks 91 and 92 are obtained by the control circuit. Based on this value, the exposure position, the position of the two-dimensional spatial modulator, and its display pattern are determined, and scanning exposure is executed according to the command of the control circuit so that the exposure is accurately overlaid on the pattern already exposed on the substrate. Is done.
[0073]
In the exposure of the second and subsequent layers, in addition to positioning with the alignment mark, a pattern for alignment is exposed in the previously exposed pattern, and this pattern is subjected to pattern detection optical system 80 and the imaging device before scanning exposure. Detection may be performed at 81, and the position of the two-dimensional modulator, the display pattern, and the position of the substrate may be determined by the control circuit 6 based on this value, and exposure scanning may be performed.
[0074]
Further, the optical axes of the projection exposure optical systems 401 and 402 may be removed, and an alignment detection optical system (not shown) may be incorporated, and a pattern position on the substrate may be measured using this to perform overlay control in real time. . At this time, it is better to finely align the two-dimensional optical modulator. In this way, for example, the substrate to be exposed is a flexible substrate or a soft substrate on a sheet, and even if these substrates are distorted, this distortion can be detected in real time and exposure can be performed according to this distortion. Even with such a soft substrate, it is possible to expose with high overlay accuracy.
[0075]
In the first to fifth embodiments described above, the two-dimensional optical modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) and the substrate to be exposed 5 are placed in opposite directions. Although the configuration in which exposure is performed while being moved has been described, the two-dimensional light modulators (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) are fixed to continuously expose the substrate 5 to be exposed. The light pattern formed by the two-dimensional light modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) is sequentially changed in synchronization with the movement of the substrate to be exposed. Also good. That is, the light pattern formed by the two-dimensional light modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) is projected on the same position on the moving substrate 5 for a certain time. In order to continue, the position of the exposure pattern formed on the two-dimensional light modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) is adjusted in accordance with the movement of the substrate 5 to be exposed. Move on the two-dimensional light modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″). Thus, the two-dimensional light modulator (3, 31, 32, 301, 301 ′, 302, 302 ′, 3 ″) is fixed on the substrate 5 to be exposed continuously with the two-dimensional light modulator. The formed light pattern can be projected.
FIG. 29 shows a method of forming a pattern on a substrate having a large step on the surface using the exposure apparatus according to the present invention. The pattern already formed on the substrate 5 is a pattern with severe irregularities. Such a pattern is formed, for example, when a micromachine is produced by exposure. 5 substrate has 53 recesses, 531 has a linear slope portion from 5301 ridge line on the substrate surface, and 532 has a bottom surface portion with ridge line 5302 as a boundary.
[0076]
When it is necessary to expose the pattern 54 to such a recessed portion, it becomes difficult to simultaneously expose a desired pattern on the substrate surface, the slope surface, and the bottom surface by performing normal exposure. When the pattern line width d becomes finer and the level difference h becomes larger, the exposure depth of focus Δ becomes smaller than h, making it difficult to form a pattern with a single exposure. That is, as shown in the cross-sectional view of FIG. 29B, when the cross section is divided by the depth of focus (the width in the optical axis direction in which the pattern of the pattern width d can be exposed) Δ, it is divided into 551, 552, 553, and 554 layers. . That is, each layer has an interval of Δ, and a pattern can be exposed in each layer. Therefore, in order to expose the entire pattern 54, for example, the substrate is moved by Δ in the optical axis direction, and focusing is performed for each of the above layers, and exposure is performed four times.
[0077]
Conventionally, in order to perform such exposure, four exposure pattern masks shown in FIGS. 29 (d) to 29 (g) in each layer are manufactured to expose the white pattern in FIG. 29 (c). However, it was necessary to perform exposure while sequentially exchanging these. In the method using the two-dimensional spatial modulator of the present invention, it is not necessary to prepare such a mask, the display pattern is changed one after another as shown in FIGS. 29D to 29G, and the substrate or the projection exposure lens is moved in the optical axis direction. Therefore, it is possible to easily expose a pattern having such a large step at a high speed at a high speed.
[0078]
FIG. 30 illustrates a case where this conductor wafer is processed using the exposure apparatus according to the present invention. Reference numeral 5 ″ denotes a wafer, and reference numeral 501 denotes a chip exposed and manufactured on the wafer. Reference numeral 5002 denotes wafer information in which information necessary for the wafer manufacturing process is recorded. In this field 5002, wafer lot number, wafer number, conditions and matters in each process necessary in the production process are recorded first. In addition, new conditions and matters to be recorded at the stage of the process are entered. Such information is not limited to information relating to the entire wafer. For example, this is possible because the array address is also determined by each exposure shot in the wafer or information for each chip.
[0079]
FIG. 31 uses the information recorded on the wafer 5002 in this way to perform feedback and feedforward of the semiconductor manufacturing process including the exposure process, thereby realizing more reliable and automated production. P_exnIs an exposure apparatus of the present invention or a conventional exposure apparatus. In this exposure apparatus, the process conditions preliminarily exposed to the wafer in FIG. 30 are read by, for example, the pattern detection optical system 80 and the imaging device 81 in FIG. 28, and exposure and subsequent processes are automatically set based on the read information. . That is, the exposure conditions, film formation conditions, heat treatment conditions, etc. recorded on the 5002 portion on the wafer 5 ″ are read and temporarily stored in the control device 60. Based on this recorded condition, the exposure P_exnAnd subsequent process P_n1, P_n2And P_n3These conditions are read from the control device 60, and the conditions of each process device are set.
[0080]
These P_exnTo P_n3Of the conditions that were actually executed during the period up to this point, those that affect the subsequent processes are changed to P as necessary._{exn + 1}During the exposure, additional recording is performed in the area 5002 of the wafer 5 ″. By doing in this way, it becomes possible to perform the optimum process necessary for each wafer in the lot in a flexible manner. In such an exposure process, the process for one exposure unit shown in FIG. 31 is repeatedly performed for several tens of units until the LSI is completed. Each time, the conditions can be read and written as described above, and information management for each wafer is performed. And process control.
[0081]
It is possible to simultaneously realize the above condition management and control in units of wafers and management in units of chips using FIG. 18, and complete production management of LSI chips and wafers, which has been impossible in the past. Made possible.
[0082]
FIG. 32 shows an outline of a manufacturing process of an electronic device using the exposure apparatus according to the present invention. Here, a semiconductor wafer processing process will be described as an example of an electronic device.
[0083]
In the manufacturing process shown in FIG. 32, the semiconductor wafer information reading device P including the pattern detection optical system 80 and the imaging device 81 such as a CCD as shown in FIG._RP based on information read in_exnTo expose the photosensitive film coated on the surface of the semiconductor wafer, and the exposure conditions and I_neThe control device 60 stores the exposure results such as the alignment accuracy with the lower layer pattern inspected in step 1 and the exposure pattern width. Based on these conditions, the conditions such as etching are changed to the process equipment P._n1And the above-described semiconductor wafer is optimally etched. Various measurements such as the line width of the pattern formed on the semiconductor wafer after this etching are performed._n1The result is stored in the control device.
[0084]
P_n2Is a film forming process. Film formation conditions are determined based on information stored in the control device 60, and film formation is performed on the surface of the semiconductor wafer. After film formation, measurement of film thickness etc. is I_n2The result is stored in the control device 60. Depending on the apparatus, this measurement may be performed in the film formation apparatus during film formation. Based on the result of film formation in this way, the heat treatment apparatus P_n3Annealing the semiconductor wafer with This annealing condition is also stored in the control circuit. Next, the film forming apparatus P_n4The film is formed at I_n2The film thickness is measured and the result is stored in the control device.
[0085]
P_exnTo P_n4Of the various information stored in the control device in the processes up to, the necessary information is the next exposure process P._{exn + 1}Then, it is recorded in 5002 on the electronic device 5 ″ using the above-described two-dimensional light modulator 3 (or 301, 302). In this way, since the history during the semiconductor wafer manufacturing process can also be recorded on the semiconductor wafer, all the information necessary for the semiconductor circuit manufacturing process can be left on the wafer, and analysis of the manufacturing process can be performed. It will be easy to do.
[0086]
Although the semiconductor device manufacturing process has been described as an example of the electronic device manufacturing process described above, the present invention is not limited to this, and can be used, for example, in a printed circuit board manufacturing process. If the present invention is applied to a printed circuit board manufacturing process, a different circuit pattern can be formed for each small number of lots or for each sheet at a practical processing speed, and each print can be performed using the exposure apparatus according to the present invention. Information unique to each substrate can be formed as a pattern on the substrate. Thereby, the history information which can be put in the manufacturing process can be easily obtained as needed about the printed circuit board incorporated in various apparatuses.
[0087]
【The invention's effect】
According to the present invention, it is possible to perform pattern exposure at high speed and over a wide range without using a mask or a reticle, and the mask and the reticle become unnecessary. As a result, a storage space for masks and reticles is no longer necessary, and a transport device for these masks and reticles is not required. This results in a large economic effect in device manufacture.
[0088]
In addition, each device manufactured by this exposure system has a number and necessary information recorded for each device, so quality control during production, product quality assurance, maintenance, quick response in the event of a product accident, etc. This is also effective in earning the trust of customers' products.
[Brief description of the drawings]
FIG. 1 is a front view illustrating a schematic configuration of an exposure apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view of a two-dimensional spatial modulator.
FIG. 3 is a plan view of a substrate to be exposed for explaining a relative positional relationship between the substrate to be exposed and exposure illumination light.
FIG. 4 is a plan view of a substrate to be exposed for explaining adjacent scanning regions of exposure light for relatively scanning the exposure substrate.
FIG. 5 is a plan view of an exposure field representing temporal changes in an imaging range and illumination position by a projection lens on a two-dimensional spatial modulator.
FIG. 6 is a plan view of a two-dimensional spatial modulator representing a change in position of the two-dimensional spatial modulator and exposure illumination light.
FIG. 7 is a plan view of a substrate to be exposed showing exposure light on the substrate to be exposed and an image position change by a projection optical system of a two-dimensional light modulator.
FIGS. 8A to 8D are graphs showing a relative relationship between a position change of a substrate to be exposed, a two-dimensional spatial light modulator, and exposure light.
FIG. 9 is a plan view of a substrate to be exposed for explaining a state in which a plurality of exposure optical systems are provided side by side.
FIG. 10 is a plan view of a substrate to be exposed for explaining adjacent exposure fields of a plurality of exposure optical systems provided side by side;
FIG. 11 is a front view showing a detailed configuration of an exposure illumination optical system of the exposure apparatus according to the first embodiment of the present invention.
FIG. 12 is a plan view of an aperture plate that determines an exposure region.
FIG. 13 is a plan view of a rod lens array (integrator) in the exposure illumination system.
FIG. 14 is a perspective view showing the shape of one lens in the rod lens array.
FIG. 15 is a perspective view of an exposure apparatus having a configuration in which a plurality of exposure optical systems are obtained from one light source according to a modification of the first embodiment of the present invention.
FIG. 16 is a front view of an exposure apparatus having a configuration in which a plurality of exposure optical systems are obtained from one light source, as a modification of the first embodiment of the present invention.
FIG. 17 is a perspective view showing a basic configuration of an exposure optical apparatus using a reflective two-dimensional spatial modulator according to a second embodiment of the present invention.
FIG. 18 is a plan view of a device in which information unique to each device is recorded according to the present invention.
FIG. 19 is a perspective view of a proximity exposure apparatus to which an exposure method according to the present invention is applied.
FIG. 20 is a perspective view showing a relationship between a two-dimensional spatial modulator and a microlens array of an exposure apparatus according to a third embodiment of the present invention.
FIG. 21 is a front view showing the basic structure of an exposure optical apparatus showing a fourth embodiment according to the present invention.
FIG. 22 is a plan view of a display pattern on the two-dimensional spatial modulator in the embodiment of the present invention.
FIG. 23 is a plan view showing a picture element display opening of a two-dimensional spatial modulator.
24A is a graph showing the exposure intensity distribution in the AA cross section of FIG. 23, and FIG. 24B is a graph showing the exposure intensity distribution in the BB cross section of FIG.
FIG. 25 (a1) is a graph showing a deviation from a linear change in the x coordinate position in the AA cross section of FIG. 23, and (a2) is a graph showing the exposure intensity distribution at this time. b1) is a graph showing a deviation from a linear change of the y-coordinate position in the BB cross section of FIG. 23, and (b2) is a graph showing the exposure intensity distribution at this time.
FIG. 26 (a) is a plan view of an exposure pattern when the two-dimensional light modulator is not slightly changed, and FIG. 26 (b) is an exposure when the two-dimensional light modulator is slightly changed. It is a top view of a pattern.
FIG. 27A is a schematic front view of an exposure optical system for reducing the intensity between adjacent picture elements according to the present invention, and FIG. 27B is a liquid crystal display of the exposure optical system shown in FIG. The front view of the liquid crystal display surface which shows the relationship between a surface and the position conjugate with the to-be-exposed surface of the board | substrate of a projection imaging lens system, (c) is a top view of the exposure surface of a board | substrate.
FIG. 28 is a perspective view showing the basic structure of an exposure apparatus according to a fifth embodiment of the present invention.
29A is a perspective view of a substrate having a large step on the surface, FIG. 29B is a sectional view of the substrate, FIG. 29C is a plan view of an exposure pattern on the substrate, and FIGS. [FIG. 6] is a plan view of a conventional divided pattern for exposing the pattern (c).
FIG. 30 is a plan view of an exposure substrate such as a wafer on which information is entered.
FIG. 31 is a block diagram showing a schematic configuration of an exposure system using an exposure apparatus according to the present invention.
FIG. 32 is a block diagram showing a schematic configuration of a semiconductor device manufacturing system using an exposure apparatus according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Exposure illumination system 2 ... Exposure light deflecting means 3 ... Spatial modulator 4 ... Projection exposure optical system 5 ... Substrate to be exposed 6 ... Control circuit

Claims (8)

A two-dimensional light information pattern is created from exposure illumination light using a two-dimensional light modulator capable of controlling the light modulation state, and the photosensitive material is formed on the surface of the created two-dimensional light information pattern via a projection exposure optical system. A pattern exposure method for projecting onto a coated substrate to be exposed and exposing a photosensitive material coated on the surface of the substrate to be exposed, wherein the two-dimensional light modulator is moved while moving the substrate to be exposed in one direction. Is moved in a direction opposite to the direction in which the substrate to be exposed moves at a speed corresponding to the magnification or reduction magnification of the projection exposure optical system with respect to the movement, and moved at a speed corresponding to the magnification or reduction magnification. The two-dimensional light modulator is scanned with the exposure illumination light in the same direction as the movement direction of the substrate to be exposed, and is irradiated with the desired light formed by the light reflected or transmitted by the two-dimensional light modulator. Of the first two-dimensional optical information pattern Projecting the first area onto the first area of the photosensitive material coated on the surface of the substrate to be exposed through a projection optical system, and the two-dimensional light modulation by the exposure illumination light When scanning on the apparatus is finished, the two-dimensional optical modulator is moved in the same direction as the one in which the substrate to be exposed is moved while moving the substrate to be exposed in the one direction, at a speed corresponding to the enlargement or reduction magnification. To return to the position where the movement in the one direction is started by moving at a high speed, and to expose the second region adjacent to the first region partially overlapping the exposed first region. The exposure illumination light is controlled by controlling a light modulation state of the two-dimensional light modulator so as to create a second two-dimensional light information pattern continuous with the first two-dimensional light information pattern projected and exposed on the first region. The two-dimensional optical modulator By sequentially repeating the step of returning to the position of at the start of movement to the pattern exposure method characterized by exposing the photosensitive material applied to the surface of the substrate to be exposed.   The two-dimensional light information pattern projected onto the substrate to be exposed is formed by a partial area of the two-dimensional light modulator capable of controlling the light modulation state, and the partial area of the two-dimensional light modulator is The pattern exposure method according to claim 1, wherein the pattern exposure method moves with relative movement between the exposure substrate and the two-dimensional optical information pattern.   The exposure illumination light to be scanned and irradiated on the two-dimensional light modulator is shaped into a shape that is long in one direction, and scanning on the two-dimensional light modulator means that the exposure illumination light has a long shape. 2. The pattern exposure method according to claim 1, wherein scanning is performed in a direction perpendicular to the direction. A light source, scanning means for scanning light emitted from the light source, two-dimensional light modulator means for receiving a light scanned by the scanning means to form a two-dimensional light information pattern, and the two-dimensional light modulator A first table means which can be moved in one direction by placing means, and light transmitted through the two-dimensional light information pattern formed by the two-dimensional light modulation means among the light beams scanned by the scanning means. Projection optical system means for projecting the image of the two-dimensional optical information pattern on the substrate to be exposed at a desired magnification, and second table means for mounting the substrate to be exposed and movable at least in a plane And control means for controlling the scanning means, the two-dimensional light modulator means, the first table means, and the second table means,
The control means controls the second table means to move the substrate to be exposed in one direction while controlling the first table means to move the two-dimensional optical modulator by the second table means. The projection exposure optical system is moved in a direction opposite to the direction in which the substrate to be exposed moves at a speed according to the magnification or reduction magnification of the projection exposure optical system, and the scanning means is controlled to correspond to the magnification or reduction magnification. A two-dimensional light modulator that is moving at a speed is formed by controlling the two-dimensional light modulator by scanning and irradiating the exposure illumination light in the same direction as the moving direction of the substrate to be exposed. Projecting an image of a desired two-dimensional optical information pattern on the first region of the photosensitive material coated on the surface of the substrate to be exposed through the projection optical system means to expose the first region, On the two-dimensional light modulator by the exposure illumination light And it controls the second table means to terminate the scan moves the substrate to be exposed to the two-dimensional light modulator controls said first table means while moving the substrate to be exposed to said one direction It is moved in the same direction as the one direction at a speed faster than the speed according to the enlargement or reduction magnification to return to the position where the movement in the one direction is started, and the two-dimensional optical modulator is controlled to control the first A second desired two-dimensional image that partially overlaps the desired two-dimensional light information pattern and is adjacent to the first desired two-dimensional light information pattern and is continuous with the first desired two-dimensional light information pattern. The light exposure pattern is created by repeating the return of the illumination position of the exposure illumination light to the position when the two-dimensional light modulator starts moving in the one direction by creating an optical information pattern and controlling the scanning means. Feel applied to the surface of the board A pattern exposure apparatus that sequentially exposes a second region that partially overlaps the first region of the conductive material and a third region that partially overlaps and adjoins the second region .   5. The pattern exposure apparatus according to claim 4, wherein the two-dimensional light modulator means is constituted by using a liquid crystal element.   6. The pattern exposure apparatus according to claim 5, wherein the liquid crystal element is a reflective liquid crystal element.   5. The pattern according to claim 4, wherein the two-dimensional light modulator means includes a mechanism for optically modulating a plurality of minute mirrors arranged two-dimensionally and deflecting each minute mirror with an electric signal. Exposure device.   The scanning means has a light shaping portion that shapes light emitted from the light source into a shape that is long in one direction, and the light that is shaped in a long shape in one direction by the light shaping portion with respect to the long one direction. 5. The pattern exposure apparatus according to claim 4, wherein said two-dimensional light modulator means is scanned in a direction perpendicular to the vertical direction.

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