JP4199636B2 - 後視鏡装置 - Google Patents
後視鏡装置 Download PDFInfo
- Publication number
- JP4199636B2 JP4199636B2 JP2003353009A JP2003353009A JP4199636B2 JP 4199636 B2 JP4199636 B2 JP 4199636B2 JP 2003353009 A JP2003353009 A JP 2003353009A JP 2003353009 A JP2003353009 A JP 2003353009A JP 4199636 B2 JP4199636 B2 JP 4199636B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- light
- endoscope apparatus
- mirror
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Rear-View Mirror Devices That Are Mounted On The Exterior Of The Vehicle (AREA)
- Planar Illumination Modules (AREA)
Description
(イ)ミラー4周辺の車両後方に向いている光放射端2cを発光させているので、車両の後方からの視認性を高めることができる。
(ロ)ハウジング2は、光入射端2dから光放射端2cに向かって漸次薄くしているので、LEDランプ7からの発光光がハウジング2の厚さ内を伝播するとき、ハウジング2の塗装領域2a以外の外表面から外部に漏れる光が強くなり、しかもその発光領域を大きくとれるので、車両の前方からの視認性を高めることができる。
(ハ)光源としてLEDランプ7を用いているので、低消費電力化が図れ、ハウジング2の過熱を防ぐことができる。また、光入射端2dから光放射端2cまでの距離を比較的長くとれるので、光放射端2cを強弱なく均一に発光させることができる。
(ニ)ハウジング2自体がライトガイドの役割を果たすので、別途ライトガイドを必要とせず、その取付部材も不要となることから部品点数を低減でき、構成の簡素化を図れる。
(ホ)インナーカバー6をハウジング2の内側に空隙を設けて配置したので、ハウジング2の導光を妨げることがないため、LEDランプ7からの光を光放射端2cまで効率良く伝播させることができる。
(ヘ)ハウジング2に施された塗料によって外部からLEDランプ7等が見えないので、意匠的に優れたものとなる。
2 ハウジング
2a 塗装領域
2c 光放射端
2d 光入射端
3 開口
4 ミラー
5 ミラーブラケット
6 インナーカバー
7 LEDランプ
8 回路基板
70A,70B リードフレーム
70a 底面
70b 反射面
71 LEDチップ
71a サファイア基板
71b 窒化物半導体層
72 ワイヤ
73 樹脂封止部材
74 カップ
75 導電性接着剤
76 サブマウント
77 金バンプ
100 自動車
101 ドア
Claims (4)
- 移動車両の所定の位置に設置され、ミラーにより前記移動車両の後方等を確認するための後視鏡装置において、
後方に形成された開口を有する中空構造のハウジングと、
前記ハウジングの開口を塞ぐように配置されるミラーと、
前記ハウジングの内側に所定の空間を設けて配置されたインナーカバーと、
前記ハウジングの内側に配置されたLEDランプとを備え、
前記ハウジングは、透明あるいは半透明材料からなり、厚肉部と薄肉部との間に内側へ突出する段差を設けることにより前記LEDランプからの光が入射する前記光入射端が形成され、前記開口を構成する前記ミラーの周辺の端面が前記入射端に入射された光を前記移動車両の後方へ放射させる光放射端をなし、前記光入射端から前記光放射端に向かって厚さが漸次薄くなるように形成されることを特徴とする後視鏡装置。 - 複数の前記LEDランプが前記ハウジングの下側に水平方向に並べられるとともに、前記段差が前記ハウジングの下側に形成され、
前記ハウジングの下側の外表面には塗装領域が形成され、
複数の前記LEDランプが発光すると、前記ハウジングにおける前記ミラーの周辺の前記端面の上側が発光することを特徴とする請求項1に記載の後視鏡装置。 - 前記インナーカバーは、外部から内部が見えないように着色されたことを特徴とする請求項1または2に記載の後視鏡装置。
- 前記ハウジングの前記放射端は、前記放射端から放射される前記光を拡散させる拡散処理が施されたことを特徴とする請求項1から3のいずれか1項に記載の後視鏡装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003353009A JP4199636B2 (ja) | 2003-10-10 | 2003-10-10 | 後視鏡装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003353009A JP4199636B2 (ja) | 2003-10-10 | 2003-10-10 | 後視鏡装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005112316A JP2005112316A (ja) | 2005-04-28 |
JP4199636B2 true JP4199636B2 (ja) | 2008-12-17 |
Family
ID=34543711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003353009A Expired - Fee Related JP4199636B2 (ja) | 2003-10-10 | 2003-10-10 | 後視鏡装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4199636B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100613552B1 (ko) | 2005-05-26 | 2006-08-16 | 주식회사 쉐프네커 풍정 | 방향지시등 내장식 아웃사이드미러 |
JP4654921B2 (ja) * | 2006-01-19 | 2011-03-23 | 市光工業株式会社 | 車両用灯具、車両用灯具を備える車両用アウトサイドミラー装置 |
DE102012104529A1 (de) | 2012-05-25 | 2013-11-28 | SMR Patents S.à.r.l. | Lichtleiteinheit |
CN106494312B (zh) * | 2016-12-09 | 2023-02-07 | 重庆平步青云汽车配件有限公司 | 后视镜防撞用安全机构 |
JP6971123B2 (ja) * | 2017-10-23 | 2021-11-24 | 株式会社小糸製作所 | 車両用灯具 |
-
2003
- 2003-10-10 JP JP2003353009A patent/JP4199636B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005112316A (ja) | 2005-04-28 |
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