JP4183010B2 - Adapter board for insertion mounting type relay and surface mounting type relay using the same - Google Patents

Description

  The present invention relates to an adapter board for insertion-mounting relay that can convert an insertion-mounting relay into a surface-mounting relay, and the surface-mounting relay using the same.

  Many of the insertion mounting type relays have been proposed, including Patent Document 1 by the present applicant. FIG. 15 is an exploded perspective view showing a typical structure of the insertion mounting type relay 1. The insertion mounting type relay 1 is a high-frequency relay, and is generally configured by arranging a drive mechanism 21 for driving the contact mechanism 11 in parallel with the contact mechanism 11. The contact mechanism 11 is provided with movable contacts 13 and 14 in a shield box 12, and the movable contacts 13 and 14 are driven to be displaced in the reference sign X direction by the drive mechanism 21, whereby fixed contacts 15 and 16; 16/17 contacts / separates and switches the high frequency signal. Therefore, the movable contacts 13 and 14 constitute a coaxial line having a central conductor and the shield box 12 being an external conductor. The movable contacts 13 and 14 are respectively held by drive members 18 and 19 that are displaced and driven by the drive mechanism 21. The fixed contacts 15, 16, and 17 are erected while being electrically insulated in the shield box 12, and the side opposite to the movable contacts 13 and 14 protrudes from the back surface of the base 20, and terminals P 1, P 2 , P3.

  The intermediate fixed contact 16 (terminal P2) is a common contact that can come into contact with both the movable contacts 13 and 14. On the other hand, the fixed contacts 15 and 17 (terminals P1 and P3) at both ends are individual contacts that can contact only the movable contacts 13 and 14, respectively. Furthermore, the fixed contact 15 is a normally-on contact that is connected to the fixed contact 16 when the drive mechanism 21 is not driven, and the fixed contact 17 is separated from the fixed contact 17 when the drive mechanism 21 is not driven. Thus, it is a normally-off contact that is cut off from the fixed contact 16. Between the terminals P1, P2, and P3 of the fixed contacts 15, 16, and 17, ground terminals P4 and P5 are provided.

  The drive mechanism 21 includes an electromagnet 22 and a displacement member 23. In the electromagnet 22, an iron core 26 is inserted into a bobbin 25 around which a coil 24 is wound, and a magnetic path is formed by a yoke 27 between one end and the other end of the iron core 26. Configured. Each end of the coil 24 is connected to terminals P6 and P7 to which an excitation current is applied from the outside.

On the other hand, the displacement member 23 contacts the card 31 that supports the movable contacts 13 and 14 via the drive members 18 and 19, the magnet 32 provided at one end of the card 31, and both ends of the magnet 32. A pair of armatures 33 and 34 sandwiching the iron core 26, a pair of balance springs 35 and 36 extending from the other end of the card 31, and a balance spring for attaching the other end of the balance springs 35 and 36 to the base 20 And a holding plate 37. Therefore, when the electromagnet 22 is demagnetized / excited, the balance springs 35 and 36 of the card 31 are deformed and displaced in the X direction, and the movable contacts 13 and 14 can be driven to displace. The fixed contact 15, 16, 17, the shield box 12, and the electromagnet 22 are accommodated in the base 20, and the displacement member 23 is mounted on the electromagnet 22, and then the housing 38 is put on.
Japanese Utility Model Publication No. 7-24769

  However, when such an insertion mounting type relay 1 is used after being converted to a surface mounting type relay, in a typical prior art, the terminals P1 to P7 are bent into an L shape as shown in FIG. After being cut, it is mounted on a land of a board to be mounted and attached by reflow soldering or the like. For this reason, during bending, a large stress is applied, and a crack occurs in the joint between the base 20 and the casing 38, around the terminal hole of the base 20 into which the terminals P1 to P7 are press-fitted, Airtight failure (leak failure) may occur. In that case, there is a problem that contact failure or operation failure is caused by rust or corrosion due to intruded moisture or the like.

  An object of the present invention is to provide an adapter board for insertion-mounting relay that can improve reliability and a surface-mounting relay using the same.

An adapter board for insertion mounting type relay according to the present invention is an adapter board for converting an insertion mounting type relay to a surface mounting type, and includes a board body in which a through hole is formed, and one end of the inside of the through hole. It becomes a connection portion that is electrically and mechanically connected to a terminal of the insertion mounting type relay that is exposed on the peripheral surface and inserted into the through hole, and an intermediate portion is at least one of the inside of the board body or the board body A conductor pattern formed on the surface, the other end being drawn away from the end surface of the substrate body, and a lead terminal serving as a terminal portion mounted on a land of the substrate to be mounted, the lead terminal being the substrate Ri formed by insert molding the body, at least part of the conductor pattern, so as to pattern the crossing formed on the substrate side to be mounted, the group By being formed in at least one of the inside or relay side surface body, and performs terminal position conversion of the relay.

  According to said structure, the insertion mounting type relay used by inserting the terminal extended from the bottom part into the through hole drilled in the board | substrate which should be mounted, and soldering with the land on the back side of the board | substrate which should be mounted. In contrast, the board body in which a through hole is formed, and the terminal of the insertion mounting type relay that is inserted into the through hole with one end exposed on the inner peripheral surface of the through hole, electrically and mechanically The connecting portion to be connected, the intermediate portion becomes a conductor pattern formed in at least one surface of the substrate body or the substrate body, the other end is drawn away from the end surface of the substrate body, and should be mounted By preparing an adapter board comprising lead terminals to be terminal portions mounted on the lands of the board, the adapter board is interposed between the board to be mounted and the relay. Converting the insertion mounting type type relay surface mount. And after the lead terminal is punched from one lead frame and bent by press working as necessary, an adapter board is produced by insert molding to the board body, and then the insertion mounting type relay The terminal is cut to a length shorter than that of the adapter board, inserted into a through hole, and electrically and mechanically connected to the connecting portion by arc welding, laser welding, etc. Can be converted to an implementation type.

  Therefore, when the insertion mounting type relay is converted to the surface mounting type, it is possible to prevent the occurrence of stress that occurs when the terminal is bent. As a result, it is possible to prevent the occurrence of cracks in the joint between the base of the relay and the casing, the periphery of the terminal hole of the base into which the terminal is press-fitted, and the loss of airtightness. Reliability can be improved. In addition, after forming the board body first, and forming an adapter board by forming a conductive layer in the through hole or the like, there is anxiety in reliability, such as peeling of the soldering terminal part, While a soldering pattern is formed on the end face and the like, an uncomfortable feeling with an existing surface mount type component occurs. However, such a problem can be eliminated by manufacturing by insert molding.

Further, when the adapter board is interposed between the relay and the board to be mounted as described above, the lead terminal is soldered to the connection part electrically and mechanically connected to the relay terminal and to the board to be mounted. The terminal position conversion of the relay is performed by forming at least a part of the conductor pattern connecting the terminal portion to be attached to at least one of the inside of the substrate body or the surface on the relay side. Specifically, at least a part of the pattern of the high-frequency signal formed on the substrate side to be mounted and the drive signal of the relay and the pattern of the high-frequency signal are three-dimensionally crossed using the conductor pattern. As a result, among the terminals arranged in a straight line on one end side of the relay, an arbitrary terminal is crossed over the pattern formed on the board side to be mounted by the conductor pattern on the adapter board. The terminal position conversion can be performed by drawing to the end side.

  Therefore, together with the conversion of the insertion mounting type relay into the surface mounting type relay, the connection between each terminal of the relay and another element such as an amplifier mounted on the substrate to be mounted, It can be performed only by the pattern on the substrate to be mounted, and the substrate to be mounted does not require a detour path outside the substrate using a jumper wire or a connector, and can obtain good high-frequency characteristics at low cost. it can.

  Furthermore, the adapter board for insertion mounting type relay of the present invention is characterized in that a GND pattern is formed on the surface of the relay body except the conductor pattern in the board body.

  According to said structure, by forming a GND pattern as much as possible on the surface of the board body on the relay side, it is possible to bring the shield member and the like in the relay close to GND.

  Therefore, high frequency characteristics such as insertion loss and reflection characteristics can be improved, which is suitable for a high frequency relay.

  The adapter board for insertion mounting type relay according to the present invention is characterized in that impedance is set in conformity with impedances of the relay and the board to be mounted.

  According to said structure, since the impedance in this adapter board | substrate changes because the space | interval of the said lead terminal and GND pattern and the dielectric constant of a board | substrate body differ, the impedance changes to the impedance of a relay and the board | substrate which should be mounted. Adapt and change. For example, the impedance is set so as to alleviate the impedance deviation between the relay and the board to be mounted. Further, a plurality of types of adapter boards having different impedances may be prepared, and those corresponding to the desired impedance may be used.

  Therefore, not only the terminal shape but also the impedance can be adapted.

  Furthermore, in the adapter board for insertion mounting type relay according to the present invention, the relay is a high frequency relay.

  According to said structure, since it is an adapter board | substrate which can improve a high frequency characteristic or adapt an impedance as mentioned above, it is especially suitable for a high frequency relay.

  Moreover, the surface mount relay of the present invention is characterized by using the adapter board for insertion mount relay.

  According to said structure, the relay produced for insertion mounting type relays can be diverted to a surface mounting type relay, without impairing reliability, and cost reduction can be achieved by sharing.

  As described above, the insertion mounting type relay adapter board according to the present invention inserts the terminal extending from the bottom into the through hole formed in the board to be mounted, and solders it to the land on the back side of the board to be mounted. For the insertion mounting type relay used, the substrate main body in which a through hole is formed, and the insertion mounting type of the insertion mounting type in which one end is exposed to the inner peripheral surface of the through hole and is inserted into the through hole. It becomes a connection part electrically and mechanically connected to the terminal of the relay, the intermediate part becomes a conductor pattern formed on at least one surface of the board body or the board body, and the other end from the end surface of the board body An adapter board is prepared, which is provided with lead terminals that are pulled out in the separating direction and serve as terminal portions that are mounted on the lands of the board to be mounted. By interposing between the substrate and the relay converts the insertion mounting type type relay surface mount, making the adapter board the lead terminals by insert molding on the substrate main body.

  Therefore, when the insertion mounting type relay is converted to the surface mounting type, it is possible to prevent the occurrence of stress that occurs when the terminal is bent. As a result, it is possible to prevent the occurrence of cracks in the joint between the base of the relay and the casing, the periphery of the terminal hole of the base into which the terminal is press-fitted, and the loss of airtightness. Reliability can be improved. In addition, after forming the board body first, and forming an adapter board by forming a conductive layer in the through hole, etc., there is anxiety in reliability, such as peeling of the soldering terminal part, While a soldering pattern is formed on the end face and the like, an uncomfortable feeling with an existing surface mount type component occurs. However, such a problem can be eliminated by manufacturing by insert molding.

In addition, when the adapter board is interposed between the relay and the board to be mounted in this way, the lead terminal is soldered to the board to be mounted and the connection portion electrically and mechanically connected to the relay terminal. Since the terminal position of the relay is converted by forming at least a part of the conductor pattern for connecting between the terminal portion and the surface on the relay side in the board body, the insertion mounting Along with the conversion of a type of relay to a surface mount type relay, the connection between each terminal of the relay and other elements such as an amplifier mounted on the board to be mounted on the board to be mounted This can be done only by pattern, and the board to be mounted does not require a detour path outside the board using a jumper wire or a connector. It is possible to obtain the sex.

  Furthermore, as described above, the adapter board for insertion mounting type relay of the present invention makes the shield member in the relay close to GND by forming the GND pattern as much as possible on the surface of the board body on the relay side.

  Therefore, high frequency characteristics such as insertion loss and reflection characteristics can be improved, which is suitable for a high frequency relay.

  In addition, the insertion mounting type relay adapter board of the present invention, as described above, because the impedance of the adapter board changes due to the difference between the distance between the lead terminal and the GND pattern and the dielectric constant of the board body. The impedance is changed in accordance with the impedance of the relay and the board to be mounted.

  Therefore, not only the terminal shape but also the impedance can be adapted.

  Furthermore, since the adapter board for insertion mounting type relay of the present invention is an adapter board that can improve the high frequency characteristics and adapt the impedance as described above, the relay is a high frequency relay.

  Therefore, it can be particularly preferably implemented.

  Moreover, the surface mount type relay of the present invention uses the adapter board for insertion mount type relay as described above.

  Therefore, it is possible to reduce the cost by diverting the relay manufactured for the insertion mounting type relay to the surface mounting type relay without impairing the reliability.

  1 and 2 are perspective views showing the structure of a surface mount relay 51 according to an embodiment of the present invention. It should be noted that the surface mount relay 51 of the present embodiment is formed by attaching an adapter board 52 to the insertion mount type high frequency relay 1 shown in FIG.

  FIG. 3 is a top view of the adapter boards 52a and 52b to be the adapter board 52, and FIG. 4 is a bottom view thereof. Through holes H1 to H8 through which the terminals P1 to P7 are inserted are formed in the board body 53 of these adapter boards 52a and 52b. The through hole H8 corresponds to the terminal when the relay 1 is a latching type.

  Connection portions F1a to F8a formed at one ends of the corresponding lead terminals F1 to F8 are exposed on the inner peripheral surfaces of the through holes H1 to H8. The connecting portions F1a to F8a are electrically connected to terminal portions F1c to F8c provided at the other ends of the lead terminals F1 to F8 through intermediate portion conductor patterns F1b to F8b. The lead terminals F4 and F5 corresponding to the ground terminals P4 and P5 of the shield box 12 are also other than the portions where the conductor patterns F1b to F8b are drawn from the connection portions F4a and F5a around the through holes H4 and H5. The GND patterns L4 and L5 are extended. The lead terminal F9 is a dummy terminal.

  Further, the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 serving as a common contact is routed from one end side where the terminals P1 to P3 are arranged in a straight line to the other end side, thereby The position of the terminal P2 is converted by three-dimensionally intersecting the pattern of the high frequency signal formed on the substrate side to be mounted and the pattern of the driving signal of the relay 1.

  The lead terminals F1 to F8 are punched out from one lead frame and bent into a shape as shown in FIGS. 3C and 4B by being bent by pressing. Thereafter, the mold substrate is set so that the mold pins are inserted into the through holes H1 to H8, and the adapter substrates 52a and 52b are completed by being insert-molded into the resin to be the substrate body 53.

  In the adapter board 52a shown in FIG. 3A, the connecting portions F1a to F8a and the GND patterns L4 and L5 are exposed on the surface of the board body 53 on the high frequency relay 1 side. On the other hand, in the adapter substrate 52b shown in FIG. 3B, the connection portions F1a to F8a and the GND patterns L4 and L5 are embedded in the substrate body 53. Therefore, the adapter boards 52a and 52b have different shapes as viewed from the upper surface side, but the shapes as viewed from the bottom surface are the same, and both are shown in FIG. Hereinafter, when these adapter boards 52a and 52b are not particularly distinguished, they are denoted by reference numeral 52.

  FIG. 5 is a perspective view for explaining a process of attaching the adapter board 52 manufactured as described above to the insertion mounting type high frequency relay 1. FIG. 5 (a) shows the insertion mounting type relay 1 as in FIG. 15, and the surface mounting type relay 51 shown in FIG. 5 (c) and FIG. 1 is first shown in FIG. 5 (b). The terminals P1 to P7 extending from the bottom of the base 20 are cut to a length shorter than the adapter substrate 52, for example, about 2/3 of the depth of the through holes H1 to H7. Thereafter, the terminals P1 to P7 having the lengths are inserted into the through holes H1 to H7, and are electrically and mechanically connected by arc welding, laser welding, or the like, thereby corresponding to the terminals P1 to P7. The connecting portions F1a to F7a to be connected are electrically connected, and the high-frequency relay 1 and the adapter substrate 52 are mechanically joined to form the surface-mounted relay 51.

  And this adapter board | substrate 52 adapts the impedance of the relay 1 and the board | substrate (motherboard) which should be mounted, and an impedance is set. Specifically, the width W1 of the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 to be the common contact 16 shown in FIG. 3C, the interval W2 between the conductor pattern F2b and the GND patterns L4, L5, and Since the impedance of the adapter board 52 changes due to the difference in thickness and dielectric constant of the board body 53, the impedance changes in accordance with the impedance of the relay 1 and the board to be mounted. For example, the impedance is set so as to alleviate the impedance deviation between the relay 1 and the board to be mounted. Alternatively, a plurality of types of adapter boards 52 having different impedances may be prepared and the one corresponding to the desired impedance may be used. For example, it is 75Ω when used for switching television signals in a television tuner, and 50Ω when used in a mixed path or branch path of a wireless relay device.

  Therefore, in converting the insertion mounting type relay 1 to the surface mounting type relay 51 in this way, the terminals P1 to P7 are bent by interposing the adapter board 52 between the board on which the adapter board 52 is to be mounted and the relay 1. It is possible to prevent the occurrence of stress that occurs when As a result, cracks are generated at the junction between the base 20 of the relay 1 and the casing 38, the terminal holes of the base 20 into which the terminals P1 to P7 are press-fitted, and the airtightness is impaired. Can be prevented, and the reliability can be improved. In addition, the relay 1 can be shared between the insertion mounting type and the surface mounting type, so that the cost can be reduced.

  Further, by forming GND patterns L4 and L5 on the surface of the relay board 1, particularly as shown in FIG. 3A, the shield box 12 and the shield board 12 are formed as shown in FIGS. The distance between the GND patterns L4 and L5 is reduced. FIG. 6 shows a state in which the insertion mounting type relay 1 is converted to the surface mounting type relay 51 using the adapter board 52a in which the GND patterns L4 and L5 are formed on the surface of the relay 1 as shown in FIG. FIG. 7 shows a state where the insertion mounting type relay 1 is mounted on a board (motherboard) 57 to be mounted with its terminals P1 to P7 bent as shown in FIG. It is sectional drawing. 6 and 7, when the adapter board 52a of FIG. 6 is used, the bottom surface of the relay 1 immediately faces the GND patterns L4 and L5, whereas the bent formation of FIG. In some cases, the dimension of the bent portion, for example, 0.7 to 1 mm is required between the GND pattern and the GND pattern formed on the substrate 57 because of the bending jig.

  FIG. 8 and FIG. 9 show the experimental results of the present inventors. These are graphs showing time domain reflect characteristics when the relay 1 has a 50Ω impedance corresponding to the wireless relay device and a high frequency signal is input from the terminal P2 serving as a common contact. FIG. That is, when the adapter board 52a is used, FIG. 9 corresponds to FIG. 7, that is, the case where the terminals P1 to P7 are bent. In FIGS. 8 and 9, the numbers surrounded by circles similarly correspond to the numbers given in FIGS. 6 and 7, that is, indicate the distances from the substrates 52 a and 57 (GND) via the terminals P <b> 2. .

  In general, the terminal portion that is not surrounded by the shield plate has a structurally large impedance, but the impedance can be reduced by bringing the mismatched portion closer to the GND surface. Therefore, as is clear from FIG. 9, the impedance of the terminal P2 increases as the distance from the GND increases, and a large reflection occurs at the boundary between the fixed contact 16 and the movable contact 14 connected to the terminal P2. When the distance from the distance is short, as shown in FIG. 8, the reflection is small and there is no large deviation in impedance. Thus, by forming GND patterns L4 and L5 as much as possible on the surface of the adapter board 52 on the relay 1 side, high frequency characteristics such as VSWR, insertion loss, isolation, and impedance matching can be improved. It is suitable for.

  Further, by designing the matching of the adapter board 52 to be smaller than the setting (for example, 50Ω), the influence of this mismatching can be further reduced. In this way, not only the terminal shape but also the total impedance matching can be realized by the relay 1 and the adapter board 52, and the influence of the impedance deviation of various boards (motherboards) can be suppressed.

  Furthermore, in the present embodiment, the adapter substrate 52 is manufactured by insert molding as described with reference to FIGS. On the other hand, like the surface-mounted relay 51 ′ shown in FIG. 10, the adapter substrate 52 ′ is plated with the soldering patterns F1 ′ to F8 ′ on the end surface of the substrate body 53 ′ having the through holes H1 to H8. It is also conceivable to make the film by forming it. The soldering patterns F1 ′ to F8 ′ are formed on the inner peripheral surface of the through holes H1 to H8 via a conductor pattern formed on the surface of the substrate body 53 ′ on the relay 1 side or on the surface of the substrate to be mounted. It is electrically connected to the formed conductive layer.

  However, when such an adapter board 52 ′ is used, after the surface mount relay 51 ′ is manufactured by soldering the terminals P1 to P7 to the through holes H1 to H7 by reflow, the surface mount relay is further formed. 51 'is soldered to the board to be mounted. For this reason, measures such as using a solder having a high melting temperature for the previous soldering or suppressing the deviation between the adapter substrate 52 ′ and the relay 1 so that the previous soldering is not peeled off by the subsequent soldering. Is required. On the other hand, by producing the adapter substrate 52 by insert molding as in the present embodiment, the terminals P1 to P7 can be electrically and mechanically connected by arc welding or laser welding as described above. This eliminates the problem of soldering and is excellent in terms of cost and reliability.

  In the case of the adapter substrate 52 ', the manufacturing method is as shown in FIG. That is, the through holes H1 to H8 are drilled on a large substrate 55 with a drill or the like, and then a conductive layer is formed on the inner peripheral surface thereof by metal plating, sputtering, printing, or the like, and a conductor pattern is formed. . At this time, through holes and conductive layers are also formed in the portions to be the soldering patterns F1 ′ to F8 ′, and divided along the perforation 56, the conductive layer at the outer peripheral edge is exposed to the outside. The soldering patterns F1 ′ to F8 ′ formed on the end surface of the adapter substrate 52 ′. However, when manufactured in this way, when dividing along the perforation 56, the cutter blade may be caught by the soldering patterns F <b> 1 ′ to F <b> 8 ′, and the reliability may be lowered. For this reason, each adapter board 52 ′ cannot actually be formed adjacent to each other, and a marginal area is required around the adapter board (the cutter blade is placed on the margin side so that the peeling occurs on the margin side. Cut it off.) On the other hand, when the adapter board | substrate 52 is produced by insert molding like this Embodiment, there is no such malfunction.

  Furthermore, in terms of appearance, the soldering patterns F1 ′ to F8 ′ are formed on the end surface of the adapter substrate 52 ′, whereas in the adapter substrate 52 of the present embodiment, the terminal portions F1c to F mounted on the lands are formed. Since it has F8c, there is no sense of incongruity with the existing surface mount type parts.

  Further, as described above, the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 serving as a common contact is three-dimensionally intersected with the pattern on the board side to be mounted, and is routed to the end on the opposite side of the adapter board 52. By performing the position conversion of P2, as shown in FIG. 12, the connection between other elements such as an amplifier (LNA) mounted on the substrate 72 to be mounted is made on the substrate 72 to be mounted. This can be performed only by the patterns 72 and 74, and the circuit board 72 to be mounted does not require a detour path outside the board 82 using the jumper wires 89, 90, 91 and connectors as shown in FIG. Thus, good high frequency characteristics can be obtained. FIG. 13 is a diagram showing the structure of a high-frequency module 81 equipped with a high-frequency relay 51 ′ using an adapter board that does not cause the three-dimensional intersection.

  Specifically, FIG. 12 and FIG. 13 are configured by including two high-frequency relays 51 and 51 ′, one amplifier (LNA) and high-frequency relay boards 72 and 82, respectively, and a line through the amplifier (LNA). 74 and 84 and through lines 73 and 83 are switched. The high-frequency relay 51R used in FIG. 12 basically has the structure of the high-frequency relay 1 shown in FIG. 15, but has a shield structure inside the relay and is normally contacted (in the example of FIG. 15, fixed contact 15). (Terminal P1)) and normally-off contacts (in the example of FIG. 15, fixed contact 17 (terminal P3)) are provided opposite to each other.

  Therefore, in the high-frequency module 81 shown in FIG. 13, since the drive signal patterns 85 and 86 and the patterns 87 and 88 on the substrate 82 corresponding to the terminal P2 intersect, the jumper lines 89 and 90 are necessary. On the other hand, in the high-frequency module 71 of the present embodiment, the drive signal patterns 75 and 76 and the conductor pattern F2b are orthogonal to each other without contact with each other by the three-dimensional intersection as described above. The jumper wires 89 and 90 are not necessary, and good high frequency characteristics can be obtained at low cost. Further, by preparing two types of high frequency relays 51 and 51R and using them as a pair for the high frequency module 71, the contacts (P1, P1 ′) of normally contacts and the contacts of normally off (P3, P3) are used. ') Will be opposed to each other, so that the two branched signal paths 73 and 74 can be prevented from crossing each other, thereby eliminating the need for the jumper line 91 shown in FIG. .

  In the above-described embodiment, the lead terminals F1 to F8 are bent into a crank shape by press working so that the bottom surfaces of the relays 51 and 51R are mounted on the substrate 71 when mounted on the substrate 71. However, when the hole corresponding to the relay is formed in the board 71, it does not need to be bent like the adapter board 52c shown in FIG. The adapter board 52c corresponds to the adapter board 52a described above, and lead terminals F1 to F8 and GND patterns L4 and L5 are formed on the surface of the board body 53 on the relay 1 side.

  Here, in Japanese translations of PCT publication No. 2006-523001, a pattern is formed on the base of the relay. The pattern forms a fixed contact or a power supply line to the coil. Is similar in that the substrate is used, and the function of the pattern is completely different. Specifically, in the present invention, the adapter board 52 is inserted in the case of surface mounting, the adapter board 52 is not used in the case of insertion mounting, and the terminals P1 to P7 of the relay 1 are connected to the board (motherboard) as usual. ) Is inserted directly into the terminal hole.

It is the perspective view seen from the upper surface side which shows the structure of the surface mount type relay which concerns on one Embodiment of this invention. It is the perspective view seen from the bottom face side which shows the structure of the surface mount type relay which concerns on one Embodiment of this invention. It is the perspective view seen from the upper surface side for demonstrating the structure of the adapter board | substrate used for the surface mount type relay shown in FIG. 1 and FIG. It is the perspective view seen from the bottom face side for demonstrating the structure of the adapter board | substrate used for the surface mount type relay shown in FIG. 1 and FIG. It is a perspective view for demonstrating the assembly process of the surface mount type relay which concerns on one Embodiment of this invention. It is sectional drawing which shows the state which converted the insertion mounting type relay into the surface mounting type relay in this Embodiment. It is sectional drawing which shows the state which bent the terminal of the insertion mounting type relay, and was surface-mounted on the board | substrate which should be mounted. 7 is a graph showing the time domain reflect characteristic of FIG. 6. It is a graph which shows the time domain reflect characteristic of FIG. It is the perspective view seen from the bottom face side which shows the structure of the surface mount type relay using the adapter board | substrate of the structure example which can be considered elsewhere. It is a perspective view for demonstrating the manufacturing method of the adapter board | substrate shown in FIG. It is a top view which shows the structure of the high frequency module carrying the surface mount type relay using the adapter board | substrate which concerns on one Embodiment of this invention. Furthermore, it is a top view which shows the structure of the high frequency module which mounts the surface mount type relay using the adapter board | substrate of the structure example considered further. It is the perspective view seen from the upper surface side for demonstrating the other structure of the adapter board | substrate used for the surface mount type relay shown in FIG. 1 and FIG. It is a disassembled perspective view which shows the typical structural example of an insertion mounting type relay. It is a side view which shows the typical prior art in the case of surface mounting an insertion mounting type relay.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insertion mounting type relay 11 Contact mechanism 12 Shield box 13,14 Movable contact 15,16,17 Fixed contact 18,19 Drive member 20 Base 21 Drive mechanism 22 Electromagnet 23 Displacement member 24 Coil 25 Bobbin 26 Iron core 27 Relay 31 Card 32 Magnet 33, 34 Armature 38 Housing 51, 51R Surface mount relay 52, 52a, 52b, 52c Adapter board 53 Board body 72 Board to be mounted (motherboard)
L4, L5 GND patterns F1 to F8 Lead terminals F1a to F8a Connection portions F1b to F8b Conductor patterns F1c to F8c Terminal portions H1 to H8 Through holes P1 to P7 Terminals

Claims (5)

An adapter board for converting an insertion mounting type relay to a surface mounting type,
A substrate body in which a through hole is formed;
One end is exposed to the inner peripheral surface of the through hole and becomes a connection part that is electrically and mechanically connected to a terminal of the insertion mounting type relay inserted into the through hole, and an intermediate part is in the board body or A conductive pattern formed on at least one surface of the substrate body, the other end being drawn away from the end surface of the substrate body, and a lead terminal serving as a terminal portion mounted on a land of the substrate to be mounted ,
Ri formed by insert molding the lead terminals on the substrate body,
At least a part of the conductor pattern is formed on at least one of the inside of the substrate body or the surface on the relay side so as to form a three-dimensional intersection with the pattern formed on the substrate side to be mounted. An adapter board for insertion mounting type relay, characterized by performing position conversion . In the substrate body, the surface of the relay side except the conductive pattern, the insertion mounting type relay adapter board according to claim 1 Symbol mounting, characterized in that the GND pattern is formed. The relay and adapted to the impedance of the substrate to be mounted, according to claim 1 or 2 Hole Devices relay adapter board, wherein the impedance is set. The adapter board for insertion mounting type relay according to any one of claims 1 to 3 , wherein the relay is a high-frequency relay. A surface-mounting type relay comprising the adapter board for insertion mounting type relay according to any one of claims 1 to 4 .