JP4183011B2 - High frequency relay and high frequency module using the same - Google Patents

Description

  The present invention relates to a high-frequency relay used for a wireless relay device of a cellular phone and a high-frequency module using the same.

  Many high frequency relays have been proposed, including Patent Document 1 by the present applicant. FIG. 17 is an exploded perspective view showing a typical structure of the high-frequency relay 1. The high-frequency relay 1 is generally configured by arranging a contact mechanism 11 in parallel with a drive mechanism 21 that drives the contact mechanism 11. The contact mechanism 11 is provided with movable contacts 13 and 14 in a shield box 12, and the movable contacts 13 and 14 are driven to be displaced in the reference sign X direction by the drive mechanism 21, whereby fixed contacts 15 and 16; 16/17 contacts / separates and switches the high frequency signal. Therefore, the movable contacts 13 and 14 constitute a coaxial line having a central conductor and the shield box 12 being an external conductor. The movable contacts 13 and 14 are respectively held by drive members 18 and 19 that are displaced and driven by the drive mechanism 21. The fixed contacts 15, 16, and 17 are erected while being electrically insulated in the shield box 12, and the side opposite to the movable contacts 13 and 14 protrudes from the back surface of the base 20, and terminals P 1, P 2 , P3.

  The central fixed contact 16 (terminal P2) is a common contact that can come into contact with both the movable contacts 13 and 14. On the other hand, the fixed contacts 15 and 17 (terminals P1 and P3) at both ends are individual contacts that can contact only the movable contacts 13 and 14, respectively. Further, the fixed contact 15 is a contact of a normally contact (NC) that is connected to the fixed contact 16 when the movable contact 13 contacts when the drive mechanism 21 is not driven, and the fixed contact 17 is a movable contact when the drive mechanism 21 is not driven. 14 is a normally-off (NO) contact that is separated from the fixed contact 16 by separating. Between the terminals P1, P2, and P3 of the fixed contacts 15, 16, and 17, ground terminals P4 and P5 are provided.

  The drive mechanism 21 includes an electromagnet 22 and a displacement member 23. In the electromagnet 22, an iron core 26 is inserted into a bobbin 25 around which a coil 24 is wound, and a magnetic path is formed by a yoke 27 between one end and the other end of the iron core 26. Configured. Each end of the coil 24 is connected to terminals P6 and P7 to which an excitation current is applied from the outside.

  On the other hand, the displacement member 23 contacts the card 31 that supports the movable contacts 13 and 14 via the drive members 18 and 19, the magnet 32 provided at one end of the card 31, and both ends of the magnet 32. A pair of armatures 33 and 34 sandwiching the iron core 26, a pair of balance springs 35 and 36 extending from the other end of the card 31, and a balance spring for attaching the other end of the balance springs 35 and 36 to the base 20 And a holding plate 37. Accordingly, when the electromagnet 22 is demagnetized / excited, the balance springs 35 and 36 of the card 31 are deformed and displaced in the X direction, and the movable contacts 13 and 14 can be driven to displace. The fixed contact 15, 16, 17, the shield box 12, and the electromagnet 22 are accommodated in the base 20, and the displacement member 23 is mounted on the electromagnet 22, and then the casing 38 is covered.

  The high-frequency relay 1 configured as described above, for example, in a mobile phone wireless relay device or the like, divides and inputs signals to a plurality of amplifiers, amplifies the power, and then combines the signals from the amplifiers. It is called a power switchable combiner / divider, and is used in a distributor / synthesizer, which is a high-frequency module, and is used to disconnect any amplifier in the event of a failure or maintenance. Therefore, for example, when six antennas are installed by dividing the radiation direction of 360 ° every 60 °, at least six such power switchable combiners / dividers are also installed, and the relay unit In order to reduce the size, it is also essential to reduce the size of the high-frequency relay 1. In addition to the wireless relay device, the same applies to applications using a large number of high-frequency relays 1 such as measuring equipment.

  However, when the high frequency relay is reduced in size, there is a problem that it is difficult to obtain a desired impedance. For example, when the target impedance is set to 50Ω corresponding to the wireless relay device, the impedance of each part shown in FIG. 18 is as shown in FIG. FIG. 19 is a graph showing time domain reflect characteristics of the high frequency relay 1 shown in FIG. That is, in general, the terminal portion that is not surrounded by the shield plate has a large impedance, and it is difficult to match each portion to the target impedance, and as a whole, it is actually matched to the target impedance. . Therefore, there is a problem that deviation occurs from the target impedance.

  On the other hand, when the high-frequency relay 1 having the same configuration is used for antenna input switching of a television receiver, the impedance to be set is 75Ω, and it is necessary to replace parts such as changing the shape of the shield box 12. .

Therefore, Patent Document 2 is cited as another conventional technique for reducing such a problem. In the prior art, a groove is formed between a signal line that is a fixed common contact formed on the base and a GND pattern formed around the signal line, and the width and depth of the groove are adjusted, thereby achieving high impedance. Matching is possible.
Japanese Utility Model Publication No. 7-24769 Japanese Patent Laid-Open No. 11-273529

  However, even in the prior art of Patent Document 2, although the adjustment range of impedance is expanded, the variation (lot variation) associated with the fabrication cannot be eliminated, and the impedance cannot be adjusted after the fabrication.

  The objective of this invention is providing the high frequency relay which can adjust the shift | offset | difference of an impedance after manufacture, and a high frequency module using the same.

High frequency relay of the present invention, a relay body for switching high frequency signals, viewed contains an adapter board which is interposed between the relay body and the substrate to be mounted to it, the adapter board, the through holes puncture A board body to be provided, and a connection part electrically and mechanically connected to a terminal of the relay body of an insertion mounting type in which one end is exposed on the inner peripheral surface of the through hole and inserted into the through hole, The intermediate portion becomes a conductor pattern formed in the substrate body or on at least one surface of the substrate body, the other end is drawn out from the end surface of the substrate body, mounted on the land of the substrate to be mounted, and soldered, Alternatively, the lead includes a land formed on the back surface through a through hole formed in the substrate to be mounted and a lead terminal serving as a terminal portion to be soldered. A child is insert-molded into the board body, and at least a part of the conductor pattern is formed between the surface of the board body or the relay body side so as to form a three-dimensional intersection with the pattern formed on the board side to be mounted. The terminal position conversion of the relay main body is performed by forming at least one .

  According to the above configuration, in a small-sized high-frequency relay that is used for switching high-frequency signals, the portion that actually switches the high-frequency signals is used as a relay body. In the present invention, an adapter board is used separately for the relay body. It is interposed between the relay body and the board to be mounted, and the adapter board is used to compensate for the impedance difference from the board side to be mounted that could not be adjusted on the relay body side, or to adapt to the impedance in another application. For impedance conversion. Specifically, one end is connected to the terminal of the relay body, the other end is pulled out from the end face of the adapter board, and is soldered to the board to be mounted, the lead terminal and the GND pattern The impedance can be adjusted by adjusting the interval of the adapter substrate or by adjusting the thickness or dielectric constant of the adapter substrate itself.

  Therefore, just by adding the adapter board, it is possible to adjust the deviation of the impedance of the relay body after fabrication and improve the high frequency characteristics, or to be used in different applications with different impedances, The cost can be reduced.

The relay body is an insertion mounting type, and the adapter board includes a board body in which a through hole is drilled, and a relay body in which one end is exposed on the inner peripheral surface of the through hole and is inserted into the through hole. It is a connection part that is electrically and mechanically connected to the terminal, the intermediate part is a conductor pattern formed in at least one surface of the substrate body or the substrate body, and the other end is away from the end surface of the substrate body To the land of the substrate to be mounted and soldered, or through the through-hole formed in the substrate to be mounted, to become a terminal portion to be soldered to the land formed on the back surface And a lead terminal. And after the lead terminal is punched out from one lead frame and bent by pressing as necessary, the adapter body is insert molded into the board body, and then the terminal of the relay body is The high frequency relay is completed by being cut to a length shorter than that of the adapter substrate, inserted into a through hole, and electrically and mechanically connected to the connecting portion by arc welding or laser welding.

Accordingly, the compensation and conversion of the impedance, it is possible to convert the relay body of insert mounting type surface mounting type. In addition, when converting the insertion mounting type relay body to the surface mounting type, it is possible to prevent the occurrence of stress that would occur if the terminals were bent, and the connection between the base of the relay body and the housing It is possible to prevent cracks from being generated around the terminal and the terminal hole of the base into which the terminal is press-fitted, and the airtightness is impaired, and the reliability can be improved.

Furthermore, in the lead terminal, at least a part of a conductor pattern for connecting between a connection part electrically and mechanically connected to a terminal of the relay body and a terminal part soldered to the board to be mounted is provided. The terminal position of the relay body is converted by forming it on at least one of the substrate body and the surface on the relay body side. Specifically, at least a part of the pattern of the high-frequency signal formed on the substrate side to be mounted and the drive signal of the relay main body, or the pattern of the high-frequency signal is three-dimensionally crossed using the conductor pattern. As a result, among the terminals arranged in a straight line on one end side of the relay main body, any terminal is placed across the pattern formed on the board to be mounted by the conductor pattern on the adapter board. The terminal position conversion can be performed by drawing to the end side.

  Therefore, in addition to the compensation and conversion of the impedance, the connection between each terminal of the relay body and other elements such as an amplifier mounted on the substrate to be mounted is limited to the pattern on the substrate to be mounted. The circuit board to be mounted does not require a detour path outside the board using a jumper wire or a connector, and good high-frequency characteristics can be obtained at low cost.

  The high-frequency relay of the present invention is characterized in that a GND pattern is formed in the remaining area excluding the conductor pattern on at least the surface of the board body in the board body.

  According to said structure, a GND member and the shield member in a relay main body can be closely approached by forming a GND pattern as much as possible on the surface of the said board main body by the side of the relay main body.

  Therefore, high frequency characteristics such as insertion loss and reflection characteristics can be improved.

  Furthermore, the high-frequency module of the present invention uses the above-described high-frequency relay, and the relay main body has terminals of three fixed contacts arranged in a straight line on one end side, and one of the individual contacts at both ends. Is a normally contact contact, the other is a normally-off contact, and a pair of high-frequency relays in which the normally-contact and normally-off contacts are provided opposite to each other are mounted. .

  According to said structure, it has the terminal of three fixed contacts arrange | positioned on the straight line in one edge part side, and an internal movable contact has one of the individual contacts of both ends with respect to a center common contact. In a high-frequency module using a high-frequency relay in which one individual contact becomes a contact of a normally contact and the other individual contact becomes a normally-off contact by performing a reciprocal operation that separates the other when connecting. In addition, two types of objects in which normally-contact and normally-off contacts are provided opposite to each other are prepared and used as a pair.

  Therefore, when one signal path is branched into two and passed through different amplifiers, or after selecting an amplifier and a through line, they are joined again and connected to one signal path. The normally-contact and normally-off contacts of the relay face each other, so that the two branched signal paths can be prevented from crossing each other, and jumper wires and connectors are used. A detour route outside the substrate is not required.

  As described above, the high-frequency relay of the present invention is a small-sized high-frequency relay that is used for switching high-frequency signals. The portion that actually switches the high-frequency signal is used as a relay body. In the present invention, an adapter board is additionally provided. Use it to interpose between the relay body and the board to be mounted, and to compensate for the difference in impedance between the adapter board and the board to be mounted that could not be adjusted on the relay body side, or for other purposes Impedance conversion to adapt to the impedance of

  Therefore, by simply adding the adapter board, it is possible to adjust the deviation of the impedance of the relay body after fabrication and improve the high-frequency characteristics, or to be used in different applications with different impedances. The cost can be reduced.

The relay body is an insertion mounting type, and the adapter board includes a board body in which a through hole is drilled, and a relay body in which one end is exposed on the inner peripheral surface of the through hole and is inserted into the through hole. A connecting portion that is electrically and mechanically connected to the terminal, an intermediate portion is a conductor pattern formed in the substrate body or on at least one surface of the substrate body, and the other end is separated from the end surface of the substrate body. A terminal portion that is pulled out in a direction, mounted on a land of the substrate to be mounted and soldered, or inserted through a through hole formed in the substrate to be mounted, and soldered to the land formed on the back surface; And is produced by insert molding.

  Therefore, in addition to the compensation and conversion of the impedance described above, it is possible to convert an insertion mounting type relay body into a surface mounting type. In addition, when converting the insertion mounting type relay body to the surface mounting type, it is possible to prevent the occurrence of stress that would occur if the terminals were bent, and the connection between the base of the relay body and the housing It is possible to prevent cracks from being generated around the terminal and the terminal hole of the base into which the terminal is press-fitted, and the airtightness is impaired, and the reliability can be improved.

Furthermore, when intervening adapter board between the board to be mounted with the Relay, in the lead terminal, to the substrate to be the mounting terminal and the electrical and connection portion that is mechanically connected to the relay body The terminal position of the relay main body is converted by forming at least a part of the conductor pattern connecting the terminal portion to be soldered with at least one of the inside of the substrate main body or the surface on the relay main body side.

  Therefore, together with the compensation and conversion of the impedance, the connection between each terminal of the relay body and another element such as an amplifier mounted on the substrate to be mounted is a pattern on the substrate to be mounted. The circuit board to be mounted does not require a detour path outside the board using a jumper wire or a connector, and good high frequency characteristics can be obtained at low cost.

  Further, as described above, the high-frequency relay of the present invention brings the shield member and the like in the relay body close to GND by forming a GND pattern as much as possible on the surface of the board body on the relay body side.

  Therefore, high frequency characteristics such as insertion loss and reflection characteristics can be improved.

  Furthermore, as described above, the high-frequency module of the present invention has three fixed contact terminals arranged in a straight line on one end side, and the internal movable contact is connected to the central common contact. When one of the individual contacts at both ends is connected, the high frequency relay in which one individual contact is a normally contact and the other individual contact is a normally off contact is performed by reciprocating the other. In the high-frequency module to be used, two types of high-frequency relays in which normally-contact and normally-off contacts are provided opposite to each other are prepared and used as a pair.

  Therefore, when one signal path is branched into two and passed through different amplifiers, or after selecting an amplifier and a through line, they are joined again and connected to one signal path. The normally-contact and normally-off contacts of the relay face each other, so that the two branched signal paths can be prevented from crossing each other, and jumper wires and connectors are used. A detour route outside the substrate is not required.

[Embodiment 1]
1 and 2 are perspective views showing the structure of a high-frequency relay 51 according to an embodiment of the present invention. It should be noted that the high frequency relay 51 of the present embodiment is formed by attaching the adapter substrate 52 to the high frequency relay 1 shown in FIG. 17 as a relay body.

  FIG. 3 is a top view of the adapter boards 52a and 52b to be the adapter board 52, and FIG. 4 is a bottom view thereof. Through holes H1 to H8 through which the terminals P1 to P7 are inserted are formed in the board body 53 of these adapter boards 52a and 52b. The through hole H8 corresponds to the terminal when the high-frequency relay 1 is a latching type.

  Connection portions F1a to F8a formed at one ends of the corresponding lead terminals F1 to F8 are exposed on the inner peripheral surfaces of the through holes H1 to H8. The connecting portions F1a to F8a are electrically connected to terminal portions F1c to F8c provided at the other ends of the lead terminals F1 to F8 through intermediate portion conductor patterns F1b to F8b. The lead terminals F4 and F5 corresponding to the ground terminals P4 and P5 of the shield box 12 are also other than the portions where the conductor patterns F1b to F8b are drawn from the connection portions F4a and F5a around the through holes H4 and H5. The GND patterns L4 and L5 are extended. The lead terminal F9 is a dummy terminal.

  Further, the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 serving as a common contact is routed from one end side where the terminals P1 to P3 are arranged in a straight line to the other end side, thereby The position of the terminal P2 is converted by three-dimensionally intersecting the pattern of the high frequency signal formed on the substrate side to be mounted and the pattern of the driving signal of the high frequency relay 1.

  The lead terminals F1 to F8 are punched out from one lead frame and bent into a shape as shown in FIGS. 3C and 4B by being bent by pressing. Thereafter, the mold substrate is set so that the mold pins are inserted into the through holes H1 to H8, and the adapter substrates 52a and 52b are completed by being insert-molded into the resin to be the substrate body 53.

  In the adapter board 52a shown in FIG. 3A, the connecting portions F1a to F8a and the GND patterns L4 and L5 are exposed on the surface of the board body 53 on the high frequency relay 1 side. On the other hand, in the adapter substrate 52b shown in FIG. 3B, the connection portions F1a to F8a and the GND patterns L4 and L5 are embedded in the substrate body 53. Therefore, the adapter boards 52a and 52b have different shapes as viewed from the upper surface side, but the shapes as viewed from the bottom surface are the same, and both are shown in FIG. Hereinafter, when these adapter boards 52a and 52b are not particularly distinguished, they are denoted by reference numeral 52.

  FIG. 5 is a perspective view for explaining a process of attaching the adapter board 52 manufactured as described above to the high-frequency relay 1. FIG. 5 (a) shows the high-frequency relay 1 as in FIG. 17, and in order to obtain the high-frequency relay 51 shown in FIG. 5 (c) and FIG. 1, first, as shown in FIG. The terminals P1 to P7 extending from the bottom of the table 20 are cut to a length shorter than the adapter substrate 52, for example, about 2/3 of the depth of the through holes H1 to H7. Thereafter, the terminals P1 to P7 having the lengths are inserted into the through holes H1 to H7, and are electrically and mechanically connected by arc welding, laser welding, or the like, thereby corresponding to the terminals P1 to P7. The connecting portions F1a to F7a to be connected are electrically connected, and the high frequency relay 1 and the adapter substrate 52 are mechanically joined to form the high frequency relay 51.

  And this adapter board | substrate 52 adapts the impedance of the high frequency relay 1 and the board | substrate (motherboard) which should be mounted, and an impedance is set. Specifically, the width W1 of the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 to be the common contact 16 shown in FIG. 3C, the interval W2 between the conductor pattern F2b and the GND patterns L4, L5, and Since the impedance of the adapter substrate 52 changes due to the difference in thickness and dielectric constant of the substrate body 53, the impedance changes according to the impedance of the relay 1 and the substrate to be mounted. For example, the impedance is set so as to alleviate the impedance deviation between the high frequency relay 1 and the substrate to be mounted. Also, a plurality of types of adapter boards 52 having different impedances are prepared, and the one corresponding to the desired impedance is used. When a plurality of types are selected and used, for example, in a television tuner, 75Ω is used for switching a television signal, and 50Ω is used for switching a mixing route or a branching route of a wireless relay device.

  Therefore, by interposing the adapter board 52 between the board on which the adapter board 52 is to be mounted and the high frequency relay 1, the impedance of the manufactured high frequency relay 1 and the impedance of the board (motherboard) on which the high frequency relay 1 is to be mounted are reduced. Even if there is variation from the target impedance, they can be compensated (matched) to improve high-frequency characteristics. Alternatively, by simply exchanging the adapter substrate 52, it can be used for different purposes with different impedances, thereby enhancing versatility and reducing costs.

  Further, by forming GND patterns L4 and L5 on the surface of the relay board 1, particularly as shown in FIG. 3A, the shield box 12 as shown in FIG. 6 and FIG. And the GND patterns L4 and L5 become closer to each other. FIG. 6 shows a state in which the high frequency relay 51 using the adapter substrate 52a on which the GND patterns L4 and L5 are formed on the surface on the high frequency relay 1 side as shown in FIG. FIG. 18 is a cross-sectional view showing a state where the high-frequency relay 1 is mounted on a substrate (motherboard) 57 to be mounted as it is. 6 and 18, when the adapter board 52a of FIG. 6 is used, the bottom surface of the high-frequency relay 1 immediately faces the GND patterns L4 and L5, whereas the direct insertion of FIG. In this case, the thickness of the substrate 57 exists between the GND pattern formed on the back surface of the substrate 57.

  FIG. 7 and FIG. 19 show the experimental results of the present inventors. These are graphs showing time domain reflect characteristics when a high frequency signal is input from the terminal P2 serving as a common contact, with the high frequency relay 1 having an impedance of 50Ω corresponding to the wireless relay device, and FIG. FIG. 19 corresponds to FIG. 18, that is, the case where the adapter board 52a is used. In FIGS. 7 and 19, the numbers surrounded by circles similarly correspond to the numbers given in FIGS. 6 and 18, that is, indicate the distances from the substrates 52 a and 57 (GND) via the terminals P <b> 2. .

  In general, the terminal portion that is not surrounded by the shield plate has a structurally large impedance, but the impedance can be reduced by bringing the mismatched portion closer to the GND surface. Accordingly, as is clear from FIG. 19, the impedance of the terminal P2 increases as the distance from the GND increases, and a large reflection occurs at the boundary between the fixed contact 16 and the movable contact 14 connected to the terminal P2. When the distance from the distance is short, as shown in FIG. 7, the reflection is small and there is no large deviation in impedance. Thus, by forming GND patterns L4 and L5 as much as possible on the surface of the adapter board 52 on the relay 1 side, high frequency characteristics such as VSWR, insertion loss, isolation, impedance matching, etc. can be improved. It is suitable for.

[Embodiment 2]
8 and 9 are perspective views showing the structure of a high-frequency relay 61 according to another embodiment of the present invention. The high-frequency relay 61 is similar to the above-described high-frequency relay 51, and corresponding portions are denoted by the same reference numerals and description thereof is omitted. It should be noted that the high frequency relay 51 is the surface mount type, while the high frequency relay 51 is the insertion mount type using the same high frequency relay 1 as the relay body. That is, by changing the adapter board 52 to the adapter board 62, the insertion mounting type high frequency relay 1 can be changed to the surface mounting type by using the same high frequency relay 1 together with the impedance adjustment as described above.

  FIG. 10 is a perspective view showing the lead terminals F1 to F9 and the GND patterns L4 and L5 used for the adapter substrate 62, that is, a state in which the lead frame is punched out. As apparent from the comparison with FIG. 3A described above, the lead terminals F1 to F9 are bent in an L shape in FIG. FIG. 10 is different only in that it is bent in a crank shape.

  In this way, the adapter substrate 62 enables the high-frequency relay 1 to be converted into the surface mount type, thereby preventing the occurrence of stress that occurs when the terminals P1 to P7 are bent as shown in FIG. it can. As a result, cracks are generated at the junction between the base 20 of the relay 1 and the casing 38, the terminal holes of the base 20 into which the terminals P1 to P7 are press-fitted, and the airtightness is impaired. Can be prevented, and the reliability can be improved. In addition, the relay 1 can be shared between the insertion mounting type and the surface mounting type, so that the cost can be reduced.

  Here, the adapter board 62 is not the insert molding described in FIGS. 3 and 4, but a board body having through holes H1 to H8 like the adapter board 62 ′ of the surface mount relay 61 ′ shown in FIG. 12. It can be considered that the soldering patterns F1 ′ to F8 ′ are formed on the end face of 63 ′ by plating or the like. The soldering patterns F1 ′ to F8 ′ are arranged on the inner peripheral surface of the through holes H1 to H8 via a conductor pattern formed on the surface of the substrate body 63 ′ on the high frequency relay 1 side or on the surface of the substrate to be mounted. And electrically connected to the conductive layer formed on the substrate.

  However, when such an adapter board 62 ′ is used, after the surface mount relay 61 ′ is manufactured by soldering the terminals P1 to P7 to the through holes H1 to H7 by reflow, the surface mount relay is further provided. 61 'is soldered to the board to be mounted. For this reason, a solder having a high melting temperature is used for the previous soldering, or the deviation between the adapter board 62 ′ and the high-frequency relay 1 is suppressed so that the previous soldering is not peeled off. Countermeasures are required. On the other hand, by making the adapter substrate 62 by insert molding as in the present embodiment, the terminals P1 to P7 can be electrically and mechanically connected by arc welding or laser welding as described above. This eliminates the problem of soldering and is excellent in terms of cost and reliability.

  In the case of the adapter substrate 62 ', the manufacturing method is as shown in FIG. That is, the through holes H1 to H8 are drilled in a large substrate 65 with a drill or the like, and then a conductive layer is formed on the inner peripheral surface thereof by metal plating, sputtering, printing, or the like, and a conductor pattern is formed. . At this time, through holes and conductive layers are also formed in the portions to be the soldering patterns F1 ′ to F8 ′ and are divided along the perforations 66, so that the conductive layer at the outer peripheral edge is exposed to the outside. The soldering patterns F1 ′ to F8 ′ formed on the end face of the adapter substrate 62 ′ are formed. However, when manufactured in this way, when dividing along the perforation 66, the cutter blade may be caught by the soldering patterns F <b> 1 ′ to F <b> 8 ′, and the reliability may be lowered. Therefore, in actuality, each adapter board 62 ′ cannot be formed adjacent to each other, and a marginal area is required in the periphery (the cutter blade is placed on the margin side so that the peeling occurs on the margin side. Cut it off.) On the other hand, when the adapter substrate 62 is produced by insert molding as in the present embodiment, there is no such inconvenience.

  Furthermore, in terms of appearance, the soldering patterns F1 ′ to F8 ′ are formed on the end surface of the adapter substrate 62 ′, whereas in the adapter substrate 62 of the present embodiment, the terminal portions F1c to F mounted on the lands are formed. Since it has F8c, there is no sense of incongruity with the existing surface mount type parts.

  In addition, as described above, the conductor pattern F2b of the lead terminal F2 corresponding to the terminal P2 serving as a common contact is three-dimensionally crossed with the pattern on the board side to be mounted to the end on the opposite side of the adapter board 62, and the terminal By performing the position conversion of P2, as shown in FIG. 14, the connection between the other elements such as an amplifier (LNA) mounted on the substrate 72 to be mounted is changed on the substrate 72 to be mounted. This can be performed only by the patterns 72 and 74, and the circuit board 72 to be mounted does not require a detour path outside the board 82 using the jumper wires 89, 90, 91 and connectors as shown in FIG. Thus, good high frequency characteristics can be obtained. FIG. 15 is a diagram showing the structure of a high-frequency module 81 on which a high-frequency relay 61 ′ using an adapter board that does not cause the three-dimensional intersection is mounted.

  Specifically, FIG. 14 and FIG. 15 are configured to include two high-frequency relays 61 and 61 ′, one amplifier (LNA), and high-frequency relay boards 72 and 82, respectively, and a line through the amplifier (LNA). 74 and 84 and through lines 73 and 83 are switched. The high-frequency relay 61R used in FIG. 14 basically has the structure of the high-frequency relay 1 shown in FIG. 17, but it has a shield structure inside the relay and is normally contacted (in the example of FIG. (Terminal P1)) and normally-off contacts (in the example of FIG. 17, the fixed contact 17 (terminal P3)) are provided opposite to each other.

  Accordingly, in the high-frequency module 81 shown in FIG. 15, the drive signal patterns 85 and 86 and the patterns 87 and 88 on the substrate 82 corresponding to the terminal P2 cross each other, so that the jumper lines 89 and 90 are necessary. On the other hand, in the high-frequency module 71 of the present embodiment, the drive signal patterns 75 and 76 and the conductor pattern F2b are orthogonal to each other without contact with each other by the three-dimensional intersection as described above. The jumper wires 89 and 90 are not necessary, and good high frequency characteristics can be obtained at low cost. Further, by preparing two types of high frequency relays 61 and 61R and using them as a pair in the high frequency module 71, the contacts (P1, P1 ′) of normally contacts and the contacts of normally off (P3, P3) are used. ') Will be opposed to each other, so that the two branched signal paths 73 and 74 can be prevented from crossing each other, thereby eliminating the need for the jumper line 91 shown in FIG. .

  In the above-described embodiment, the lead terminals F1 to F8 are bent into a crank shape by press working so that the bottom surfaces of the relays 61 and 61R are mounted on the substrate 71 when mounted on the substrate 71. However, when the hole corresponding to the relay is formed in the board 71, it does not need to be bent like the adapter board 62c shown in FIG.

It is the perspective view seen from the upper surface side which shows the structure of the high frequency relay which concerns on one Embodiment of this invention. It is the perspective view seen from the bottom face side which shows the structure of the high frequency relay which concerns on one Embodiment of this invention. It is the perspective view seen from the upper surface side for demonstrating the structure of the adapter board | substrate used for the high frequency relay shown in FIG. 1 and FIG. It is the perspective view seen from the bottom face side for demonstrating the structure of the adapter board | substrate used for the high frequency relay shown in FIG. 1 and FIG. It is a perspective view for demonstrating the assembly process of the high frequency relay which concerns on one Embodiment of this invention. It is sectional drawing which shows the state mounted in the board | substrate (motherboard) which should mount the high frequency relay which concerns on one Embodiment of this invention. 7 is a graph showing the time domain reflect characteristic of FIG. 6. It is the perspective view seen from the upper surface side which shows the structure of the high frequency relay which concerns on other forms of implementation of this invention. It is the perspective view seen from the bottom face side which shows the structure of the high frequency relay concerning other forms of implementation of the present invention. It is the perspective view seen from the upper surface side for demonstrating the structure of the adapter board | substrate used for the high frequency relay shown in FIG. 8 and FIG. It is a side view which shows the typical prior art in the case of surface mounting an insertion mounting type relay. It is the perspective view seen from the bottom face side which shows the structure of the surface mount type relay using the adapter board | substrate of the structure example which can be considered elsewhere. It is a perspective view for demonstrating the manufacturing method of the adapter board | substrate shown in FIG. It is a top view which shows the structure of the high frequency module carrying the high frequency relay using the adapter board | substrate which concerns on other embodiment of this invention. Furthermore, it is a top view which shows the structure of the high frequency module which mounts the surface mount type relay using the adapter board | substrate of the structure example considered further. It is the perspective view seen from the upper surface side for demonstrating the other structure of the adapter board | substrate used for the surface mount type relay shown in FIG. 8 and FIG. It is a disassembled perspective view which shows the typical internal structure example of a high frequency relay. It is sectional drawing which shows the state mounted in the board | substrate (motherboard) which should mount the high frequency relay of a prior art. It is a graph which shows the time domain reflect characteristic of FIG.

Explanation of symbols

1, 51, 61, 61R High-frequency relay 11 Contact mechanism 12 Shield box 13, 14 Movable contact 15, 16, 17 Fixed contact 18, 19 Drive member 20 Base 21 Drive mechanism 22 Electromagnet 23 Displacement member 24 Coil 25 Bobbin 26 Iron core 27 Yoke 31 card 32 magnet 33, 34 armature 38 housing 52, 52a, 52b, 62, 62c adapter board 53 board body 72 board to be mounted (motherboard)
L4, L5 GND patterns F1 to F8 Lead terminals F1a to F8a Connection portions F1b to F8b Conductor patterns F1c to F8c Terminal portions H1 to H8 Through holes P1 to P7 Terminals

Claims (3)

In high frequency relays,
A relay body that switches high-frequency signals;
Look including an adapter board which is interposed between the relay body and the substrate to be mounted to it,
The adapter board is
A substrate body in which a through hole is formed;
One end is exposed on the inner peripheral surface of the through hole and becomes a connection part electrically and mechanically connected to the terminal of the insertion body of the insertion mounting type inserted into the through hole, and the intermediate part is inside the board body Or it becomes a conductor pattern formed on at least one surface of the substrate body, and the other end is drawn out from the end surface of the substrate body, mounted on a land of the substrate to be mounted and soldered, or on the substrate to be mounted Through the formed through hole, including a land formed on the back surface and a lead terminal that becomes a terminal portion to be soldered,
The lead terminal is formed by insert molding into the substrate body,
At least a part of the conductor pattern is formed on at least one of the inside of the board body or the surface of the relay body side so as to form a three-dimensional intersection with the pattern formed on the board side to be mounted. A high-frequency relay characterized by performing terminal position conversion . In the substrate body, at least the high frequency relay according to claim 1, wherein the surface of the relay main body, wherein the GND pattern is formed on the remaining region excluding the conductive pattern. Using the high frequency relay according to claim 1 or 2 ,
The relay body has terminals of three fixed contacts arranged in a straight line on one end side, one of the individual contacts at both ends is a contact of a normally contact, the other is a contact of a normally off, A high-frequency module comprising a pair of high-frequency relays in which normally-contacts and normally-off contacts are provided opposite to each other.