JP3979399B2 - High frequency power combiner / distributor and wireless repeater using the same - Google Patents

Description

  The present invention relates to a high-frequency power combiner / distributor suitably implemented in a high-frequency signal wireless relay device such as terrestrial digital television broadcasting and a mobile phone, and a wireless relay device using the same.

  A television broadcast relay station, a mobile phone base station, and the like require a large transmission power of several watts to several hundreds of watts to relay the high-frequency signal. And in order to obtain that large transmission power, and because it is necessary to avoid momentary interruptions in broadcasting and telephone calls, the received signal is distributed to multiple amplifiers, and the amplified signals are combined and transmitted. A signal has been created. Used in such applications is a device called a divider for the distribution and a device called a combiner for the synthesis. These devices are configured by connecting one end of a single transmission path and one end of a branch transmission path, and when the other end of the single transmission path is an output end, the branch transmission path When the other end of the single transmission path becomes the input end, the other end of the branch transmission path becomes the output end and becomes the divider. It can be shared by switching the input and output of. Each branch transmission path is provided with a switch for opening and closing a high-frequency signal so that the malfunction circuit (amplifier) can be operated. What is configured in this way is a high frequency power combiner or distributor called a power switchable combiner divider.

  FIG. 18 is a block diagram simply showing a configuration example of a relay station. Signals from the master station and the preceding relay station received by the antenna 101 are input to the divider 104 through the filter 102 and the amplifier 103, distributed to a plurality of n systems, and the n signal processing circuits C1, C2,. , Cn. Here, in the terrestrial digital television broadcast, each broadcast station does not individually install a relay station as in the case of analog television broadcast, but is commonly used. Cn corresponds to the channel of each broadcasting station. In terrestrial digital television broadcasting, the band from 470 to 770 MHz of conventional UHF broadcasting is divided into five bands each having a bandwidth of 96 MHz (6 MHz per channel, and therefore 16 channels) as shown in Table 1. The configuration of FIG. 18 represents a configuration for one band. Therefore, when the relay station relays a plurality of bands, the configuration of FIG. 18 is provided for the number of bands.

  The received signals input to the signal processing circuits C1 to Cn are filtered by filtering the components in the band by the filter 102, and further filtering the components corresponding to the channels of each broadcasting station by the internal filter. After being processed, the combiner / divider 105 synthesizes n channels, distributes the signals to a plurality of m (3 in FIG. 18) channels, and inputs them to the amplifier unit 106. Here, the power of the high frequency signal handled by the divider 104 and the combiner / divider 105 is small and can be distributed / combined on the wiring board.

  In the amplifier unit 106, the distributed high-frequency signal is input to the power amplifiers A1, A2, and A3 via the switches S1, S2, and S3, and the power is amplified. The power amplified high frequency signal is combined by the switchable combiner 107 and then transmitted from the antenna 108. The switchable combiner 107 includes switches SW1, SW2 and SW3 corresponding to the power amplifiers A1, A2 and A3, and a combiner 109. This switchable combiner 107 is a power switchable combiner divider targeted by the present invention.

  In the power switchable combiner / divider configured as described above, since a high-power high-frequency signal passes through the transmission line, heat dissipation is important. For example, the power amplifiers A1, A2 and A3 may have a capacity of 50 W per unit, and thus the power will be 150 W with 3 branches and 200 W with 4 branches.

Here, as a prior art with respect to the said heat dissipation countermeasure, patent document 1 is mentioned, for example. In the prior art, a plurality of power transistors are directly attached to a metal heat sink, molded, attached to a case, and the power transistor terminals are projected and connected on a substrate provided at a distance from the mold part. While suppressing the heating of the substrate mounting components, the heat dissipation of the power transistor is improved, and the number of assembling steps and the space are reduced.
JP-A-8-274252

  In the above-described prior art, the heat dissipation is certainly improved by using a metal heat sink, but in the high-frequency signal such as the terrestrial digital television broadcast or the cellular phone, the GND characteristic of the substrate, specifically, The impedance with respect to GND, the time to drop to GND, etc. are also important, and there is a problem that this point is not sufficient.

  An object of the present invention is to provide a high-frequency power combiner / distributor that can improve the connectivity of a substrate to GND and improve high-frequency characteristics, and a wireless relay device using the same.

The high-frequency power combiner / distributor of the present invention is configured such that a substrate having a high-frequency signal transmission path formed on a surface thereof is housed in a housing connected to GND, and the power of the high-frequency signal is combined or distributed. The high-frequency power combiner or distributor includes a conductive plate that is interposed between the back surface of the substrate and the inner surface of the housing and is made of a metal lump. The conductive plate includes the substrate on the conductive plate. A first screw hole for fixing and a second screw hole for fixing the conductive plate to the housing are formed in communication with each other, and a portion other than each transmission path on the substrate surface is a GND pattern. next, the substrate back surface becomes entirely GND pattern, in GND pattern of the substrate surface, and forming a through hole connecting to the rear surface of the substrate GND pattern around each transmission path

  According to said structure, it is implemented suitably for the radio relay apparatus of high frequency signals, such as terrestrial digital television broadcasting and a mobile phone, for example, connecting one end of a single transmission line and one end of a branch transmission line, In a high-frequency power combiner / distributor called a power switchable combiner / divider, etc., which is configured by providing a switch for opening and closing a high-frequency signal in the branch transmission path, connection to GND between the board and the housing In order to improve the heat dissipation and to improve the heat dissipation against the passage of high-frequency high-frequency signals, a conductive plate made of a metal lump is provided between the back surface of the substrate and the inner surface of the housing. The first screw hole for fixing the substrate formed on one surface of the conductive plate and the second screw hole for fixing to the housing formed on the other surface, that is, Flip formed at a position.

  Therefore, a high-frequency signal that has flowed into the GND pattern from the transmission line on the surface of the substrate passes through the substrate and the conductive plate that are fixed to each other around the communicating screw hole, and is connected to the GND. It flows in the shortest path and is removed. Thereby, the connectivity to GND between the substrate and the housing can be improved, and the high frequency characteristics can be improved.

  Further, the screw hole to the conductive plate can be processed by forming the thread after forming the through hole, and the processing is easy. For this reason, if it is the same processing time, the number of screw holes can be increased and the connectivity to GND can be further improved. Furthermore, even if the number of screw holes is increased in order to improve the connectivity to GND as described above, the screw hole positions on both the front and back surfaces of the conductive plate are the same, so that space saving can be realized. it can.

Further, portions other than the transmission lines prior Symbol substrate surface and GND pattern, the substrate back surface and the entire surface GND pattern, in GND pattern of the substrate surface, the substrate rear surface of the GND pattern around each transmission path, Therefore, since a through hole connected to the conductive plate is formed, the GND pattern around each transmission path can surely secure GND, and impedance matching can be performed satisfactorily.

  Furthermore, the high frequency power combiner / distributor of the present invention has a switch for opening and closing the high frequency signal interposed in the transmission line formed on the surface of the substrate, and the switch is mounted on the conductive plate. The substrate protrudes from the insertion hole formed in the substrate to the substrate surface side.

  According to the above configuration, when the switch for opening and closing the high-frequency signal is provided, the switch is not mounted on the substrate, but is mounted on the conductive plate, and the insertion hole formed in the substrate is moved from the insertion hole to the substrate surface side. It protrudes and is connected to a transmission path for high-frequency signals formed on the substrate surface.

  Therefore, the heat generated by the switch due to the passage of the high power can be efficiently released to the conductive plate made of the metal block, and the connectivity to the switch base can be improved.

  The radio relay apparatus of the present invention is characterized in that the high-frequency power combiner / distributor includes an amplifier individually corresponding to each branch transmission line.

  According to said structure, the radio | wireless relay apparatus which can improve the connectivity to GND between a board | substrate and a housing | casing and can improve a high frequency characteristic is realizable.

  As described above, the high-frequency power combiner / distributor of the present invention is preferably implemented in a high-frequency signal wireless relay device such as terrestrial digital television broadcasting or a mobile phone, for example, one branch of a single transmission line and branch transmission In a high-frequency power combiner / distributor called a power switchable combiner / divider, etc., which is connected to one end of the line and provided with a switch for opening and closing a high-frequency signal in each branch transmission line. In order to improve the connectivity to the GND between the body and the heat dissipation against the passage of high-power high-frequency signals, a metal lump is formed between the back surface of the substrate and the inner surface of the housing. In providing the conductive plate, the first screw hole for fixing the substrate formed on one surface of the conductive plate and the first screw hole for fixing to the housing formed on the other surface. It communicates the screw holes, i.e. formed at the same position.

  Therefore, on the surface of the substrate, the high-frequency signal flowing into the GND pattern from the transmission path passes through the substrate and the conductive plate that are fixed to each other around the communicating screw hole, and is connected to the GND. It flows into the body through the shortest path and is removed. Thereby, the connectivity to GND between the substrate and the housing can be improved, and the high frequency characteristics can be improved.

  Further, the screw hole to the conductive plate can be processed by forming the thread after forming the through hole, and the processing is easy. For this reason, if it is the same processing time, the number of screw holes can be increased and the connectivity to GND can be further improved. Furthermore, even if the number of screw holes is increased in order to improve the connectivity to GND as described above, the screw hole positions on both the front and back surfaces of the conductive plate are the same, so that space saving can be realized. it can.

  In addition, as described above, the radio relay apparatus of the present invention includes the high-frequency power combiner / distributor including an amplifier individually corresponding to each branch transmission line.

  Therefore, it is possible to realize a wireless relay device that can improve the connectivity to the GND between the substrate and the housing and improve the high-frequency characteristics.

[Embodiment 1]
FIG. 1 is a plan view of a power switchable combiner / divider 51 that is a high-frequency power combiner / distributor according to the first embodiment of the present invention with the lid 52 removed, and FIG. FIG. 3 is a front view of the switchable combiner divider 51, FIG. 3 is a rear view, and FIG. 4 is a cross-sectional view taken along the section line IV-IV in FIG. This power switchable combiner / divider 51 is a substrate for synthesizing or distributing high-frequency power in a housing 54 comprising a lid 52 made of a conductive material and a base 53 to which the lid 52 is combined. 55 and a control circuit board 56 for switching and controlling switches SW1, SW2, SW3; SW11, SW12 (generally referred to as reference numeral SW hereinafter) mounted on the board 55.

  This power switchable combiner divider 51 is used for the above-mentioned terrestrial digital television broadcasting, and synthesizes or distributes three signals. Accordingly, one end of the three branch transmission lines K1, K2, K3 is commonly connected to one end of the single transmission line K0, and the other end of the single transmission line K0 is connected to the back surface of the housing 54. The connector pins P1 and P2 of the connectors J1, J2 and J3 which are soldered to the connector pins P0 of the connector J0 provided on the front end of the casing 54 and the other ends of the branch transmission lines K1, K2 and K3 are soldered. , P3, respectively. In the power switchable combiner / divider 51, each of the connectors J1, J2, J3 serves as an input end, and when the connector J0 serves as an output end, it becomes a combiner, and each of the connectors J1, J2, J3 serves as an output end. When the connector J0 becomes an input end, it becomes a divider.

  Each connector J0-J3 is screwed and fixed with a plug fixed to the tip of the coaxial cable. As a result, the transmission lines K0 to K3 are connected to the central conductor of the coaxial cable via the connector pins P0 to P3, and the casing 54 is connected to the outer conductor of the coaxial cable connected to GND.

  The substrate 55 is a double-sided substrate, and the transmission lines K0 to K3 are formed on the surface, and stub patterns ST1 and ST2 are formed, and the remaining area is the transmission lines K0 to K3. A gap required for impedance matching with the stub patterns ST1 and ST2 (for example, about 50 mm at 50Ω when the pattern width of the transmission line is 2 mm) is opened to form a GND pattern 57. Further, the back surface of the substrate 55 has a GND pattern on the entire surface, and through holes 59 for connecting the front and back GND patterns and improving the connectivity to the GND, particularly on both sides of the transmission lines K0 to K3. A large number are densely formed. As a result, the GND pattern around each of the transmission lines K0 to K3 can reliably ensure GND, and impedance matching can be performed satisfactorily.

  Between the back surface of the substrate 55 and the inner surface of the base 53, in order to improve the connectivity to the GND, the heat dissipation of the switches SW1, SW2, SW3; SW11, SW12 against the passage of large power is provided. In order to increase it, a conductive plate 58 made of a metal mass is provided. The substrate 55 and the conductive plate 58 are fixed to each other by a large number of screws 61 and 62. The switches SW1, SW2, SW3; SW11, SW12 are mounted on the conductive plate 58 and protrude from the insertion holes H1, H2, H3; H11, H12 formed in the substrate 55 to the substrate surface side, and are connected to the terminals. Is soldered to the transmission line. As a result, the heat generated by the switch due to the passage of power can be efficiently released to the conductive plate 58 made of the metal lump, and the switch-based GND connection is also improved.

  In the power switchable combiner divider 51, two stub patterns ST1 and ST2 having different attachment positions are formed on one side and the other side in the transmission line K0. In these stub patterns ST1, ST2, all of the branching switches SW1, SW2, SW3 are closed, that is, when three combinations or three distributions are performed, the distance from the connection point 60 of the transmission lines K0 to K3 is short. The stub switch SW11 is closed, the stub switch SW12 having a longer distance is opened, impedance matching is performed, and one of the branch switches SW1, SW2, and SW3 is opened, that is, two-composition or When two distributions are made, the stub switch SW11 having a short distance from the connection point 60 is opened, and the stub switch SW12 having a long distance is closed, and impedance matching is performed.

  The stub patterns ST1 and ST2 may be formed such that the length thereof can be adjusted depending on which band of the five bands corresponds. Specifically, the stub patterns ST1 and ST2 are divided into five parts corresponding to the five bands, and only the necessary parts corresponding to the wavelengths are soldered when the switches SW are soldered. The length is adjusted by soldering or soldering with a metal plate. Alternatively, the stub patterns ST1 and ST2 are formed in advance to the maximum necessary length, the necessary portion corresponding to the wavelength is left, the pattern at the boundary with the remaining pattern is peeled off, and the remaining pattern The length may be adjusted by cutting off. In this way, it is possible to finely adapt to the frequency of each high-frequency signal in the five bands. The effective length of each stub pattern ST1, ST2 is determined including the lengths of the stub switches SW11, SW12.

  On the other hand, FIG. 5 is a longitudinal sectional view showing one configuration example of the switch SW, and FIG. 6 is an exploded perspective view thereof. As shown in these drawings, the switch SW is generally configured by fixing the solenoid 10 and the base block 20 with screws B1 and is held in an insulated state by the conductive base 1. The contact 4A disposed between the base 1 and the contact terminals 2a and 2b is opened and closed by the solenoid 10 with respect to the pair of contact terminals 2a and 2b.

  The base 1 is made of a conductive metal material such as aluminum, and is chamfered at a corner portion of a rectangular parallelepiped side surface. On the upper surface of the base 1, as shown in FIG. 7 (a), a recess 1b recessed in a long hole shape is formed so as to extend in the longitudinal direction, and screws are provided on both sides in the longitudinal direction of the recess 1b. A hole 1e is formed. Further, a through hole 1c penetrating in the vertical direction is formed at the center of the bottom surface of the recess 1b.

  Further, as shown in FIG. 7B, a transverse groove 1a that opens downward and extends in the longitudinal direction is formed on the lower surface of the base 1, and a circular groove is formed so as to straddle the transverse groove 1a. The fitting portion 1f is formed at two locations. Further, a pair of bottomed fixing holes 1d are formed near both ends of the upper surface of the transverse groove 1a. The pair of contact terminals 2a and 2b and the contact 4A are disposed in the transverse groove 1a, and the sub-base 5 is disposed below the pair of contact terminals 2a and 2b.

  The contact terminals 2a and 2b are insert-molded in insulating members 3a and 3b such as liquid crystal polymer resin. The terminal portions 20a and 20b of the contact terminals 2a and 2b protruding from the opposite side of the insulating members 3a and 3b are portions on the base end side of the transmission path K0; K1, K2, K3 or the stub patterns ST1 and ST2. And soldered.

  The insulating members 3a and 3b are formed in a shape that fits into the transverse groove 1a of the base 1, and projections 3c and 3d that fit into the fixing holes 1d of the base 1 are formed on the top surface thereof. The protrusions 3c and 3d are press-fitted into the fixing hole 1d, so that the contact terminals 2a and 2b are held in the base 1 in an insulated state.

  As shown in FIG. 8, the contact 4A is formed as a substantially strip-shaped single contact, and a deformed through hole 4a is formed at the center thereof. The contact 4A is preferably one in which a plate material such as beryllium copper having a thickness dimension of about 0.3 to 0.6 mm and high heat resistance is punched with a press and plated with gold.

  The contact 4A is disposed so that the surface on which the burr is generated by the punching process faces the contact terminals 2a and 2b, and the opposite surface faces the upper surface of the transverse groove 1a of the base 1. Also, hemispherical protrusions 4b are formed in the vicinity of both ends of the contact 4A so as to protrude in the direction of the contact terminals 2a and 2b. The protrusion 4b is set to a height that protrudes beyond the height of the burr produced by the punching process.

  The sub-base 5 is formed in a bowl shape and is fitted and fixed to the transverse groove 1a and the fitting portion 1f of the base 1, thereby closing the transverse groove 1a that opens downward and holding the base 1 in the holding state. The members 3a and 3b are held and fixed.

  On the other hand, a card 6, a card spring 7, and a cylindrical card 8 are disposed in order from below in a recess 1 b formed on the upper surface of the base 1, and between the bottom of the recess 1 b and the card 6. A pair of return springs 9 are arranged. The contacts 4A are moved up and down by the components 6 to 8 and the solenoid 10 attached to the base 1.

  The card 6 is made of an insulating resin or the like, and has a base portion 6a that fits into the concave portion 1b of the base 1, and a protruding portion 6b that protrudes downward from the central portion of the base portion 6a. A pair of convex portions 6d projecting downward is formed on both sides of the projecting portion 6b on the lower surface, and a pair of convex portions 6e projecting upward are formed on the upper surface on the opposite side. The protruding portion 6b of the card 6 protrudes from the through hole 1c of the concave portion 1b of the base 1 into the transverse groove 1a and is inserted into the through hole 4a of the contact 4A to be fixed by heat caulking.

  As shown in FIG. 8, the through-hole 4a of the contact 4A is formed such that one corner of the quadrangle is deformed into an inclined surface, and the tip portion 6c of the protruding portion 6b is also formed in a shape corresponding to this shape. ing. Therefore, the contact 4A cannot be inserted into the protrusion 6b opposite to the front and back, and it is ensured that the protrusion 4b of the contact 4A faces downward.

  The card spring 7 is a flat spring and has a pair of holes 7 a inserted through the convex portions 6 e of the card 6 so that the central portion of the card spring 7 is pushed by the card 8. ing. The card 8 is made of an insulating resin or the like, and transmits the driving force of the solenoid 10 to the card spring 7. The return spring 9 is a coiled compression spring, and is guided by the convex portion 6d of the card 6 to urge the card 6 upward, and the contact 4A attached to the protruding portion 6b of the card 6 is used as the base 1. Are brought into pressure contact with the upper surface of the transverse groove 1a.

  The solenoid 10 is attached to the upper surface of the base 1 by a screw B1 that is screwed into the screw hole 1e of the base 1. The solenoid 10 includes a columnar movable iron core 11, a cylindrical insulating bobbin 12 that accommodates the movable iron core 11 therein, and a coil 13 in which a conductor wire is wound around a side peripheral portion of the bobbin 12. A fixed iron core 14 disposed below the movable iron core 11, a yoke 15 that fixes the fixed iron core 14 and covers the bobbin 12 in a U shape from below, and a magnet, and the upper end of the bobbin 12. A pair of flat ring-shaped halves 16 fitted to the part, a plate 17 which is fitted to the left and right upper ends of the yoke 15 and covers the half 16 in a U-shape from above, and the whole in a U-shape from above. And a cover 18 for covering.

  A through hole 14a is formed at the center of the fixed iron core 14, and the card 8 is inserted into the through hole 14a. The movable iron core 11 can be moved back and forth by switching pulse currents flowing in the opposite directions from the control circuit board 56 to the coil 13, thereby switching the switching state. When the movable iron core 11 advances, the protrusion 4b of the contact 4A attached to the card 6 comes into contact with the contact terminals 2a and 2b, respectively, and the switch is closed. When the movable iron core 11 is retracted, the protrusion 4b of the contact 4A is separated from the contact terminals 2a and 2b, and the switch is opened. The switch SW is a latching relay. When no current flows through the coil 13, the movable iron core 11 is held by the half 16.

  The switching control of each switch SW is performed in response to a signal from the power amplifiers A1, A2, A3 inputted to the connector 70 or a remote control signal from a monitoring station or the like, and the pulse given from the control circuit board 56. Is performed by a current. Then, the current only flows when switching is performed by the switch SW of the latching relay, which saves power.

  FIG. 9 is a cross-sectional view taken along section line IX-IX in FIG. 1 for explaining the routing of the drive signal line 63 of the switch SW. It should be noted that in the power switchable combiner / divider 51, as shown in FIG. 9, the drive signal line 63 derived from the side surface of the switch SW is in the thickness direction of the conductive plate 58. It is drawn from an insertion hole 64 formed immediately below the lead-out port of the drive signal line 63, formed on the surface opposite to the substrate 55 of the conductive plate 58, and through a lead-out groove 65 communicating with the insertion hole 64. It is drawn out in the surface direction of the conductive plate 58 and connected to the control circuit board 56. However, in FIG. 9, the switch SW2 is omitted for easy understanding of the drawing.

  FIG. 10 is a plan view of the conductive plate 58, and FIG. 11 is a bottom view thereof. As can be understood from FIG. 9, the conductive plate 58 has a drawer groove 65a for the stub switches SW11 and SW12 arranged close to each other, and a drawer for the branch switches SW1, SW2 and SW3. Accordingly, two insertion holes 64 communicate with the drawing groove 65a, and three insertion holes 64 communicate with the drawing groove 65b. Thus, the drive signal line 63 is drawn into the control circuit board 56 through the shortest path while sharing the lead-out groove 65. The conductive plate 58 is for improving the heat dissipation of the switch SW through which a large amount of power passes and the connectivity to the GND as described above, and forms a lead groove 65 for routing the drive signal line 63. Therefore, there is no problem for heat dissipation even if the extraction groove 65 and the insertion hole 64 are partially formed.

  In this way, the length of exposure of the drive signal line 63 on the surface of the substrate 55 is minimized, and a malfunction due to a high-frequency signal of large power flowing through the transmission lines K0 to K3 entering the drive signal line 63 Malfunctions can be reduced.

  It should be noted that in the power switchable combiner / divider 51, as shown in FIGS. 1 and 9, the substrate 55 on which the high-frequency signal transmission lines K0 to K3 and the switch SW are mounted, and the control A conductive partition wall 66 connected to GND is provided between the circuit board 56 and a drive signal line 63 drawn in the surface direction of the conductive plate 58 is provided on the control circuit board 56. And being introduced through the partition wall 66. As a result, the drive signal line 63 with the minimum exposure on the surface of the substrate 55 as described above can be drawn into the control circuit substrate 56 while being shielded, and malfunction due to the penetration of the high-frequency signal into the drive signal line 63. And malfunction can be further reduced.

  The control circuit board 56 includes a drive board 56a to which the drive signal line 63 is connected and generates a current pulse for switching the switch SW, and a control board 56b on which the connector 70 is mounted. . The drive board 56a is equipped with, for example, a power element for switching and controlling the switch SW with a voltage of 24V, and the control board 56b is supplied with signals from the power amplifiers A1, A2, A3, a monitoring station, and the like. A control circuit for receiving the remote control signal and driving and controlling the power element is mounted. Even if the substrates 56a and 56b are separated from the substrate 55 by the partition wall 66, the control substrate 56b that handles a low-amplitude signal among the substrates 56a and 56b and is sensitive to noise is the substrate 55. It is arranged farther away.

  The partition 66 and the drive substrate 56 a are secured to each other by a spacer 67 and screwed together to the side surface of the conductive plate 58 by screws 68. The control board 56b is mounted on the drive board 56a via a support member 69.

  Furthermore, it should be noted that in this power switchable combiner divider 51, as shown in FIG. 4, in order to improve the connectivity to the GND between the substrate 55 and the housing 54, the substrate When a conductive plate 58 made of a metal lump is provided between the back surface of 55 and the inner surface of the housing 54, a first screw hole 71 for fixing the substrate 55 formed on the surface of the conductive plate 58 is provided. And the second screw hole 72 for fixing to the housing 54 formed on the back surface is communicated, that is, formed at the same position. In the cross section of FIG. 4, a screw 73 is screwed into the second screw hole 72 and the substrate 55 and the housing 54 are fixed, and the first screw hole 71 is not screwed. However, this portion is a portion on which an extended board is mounted in the case of four branches, which will be described later, and is screwed with screws 61. In FIG. 1, the first screw hole 71 and the second screw hole 72 are formed in communication with each other at a portion where the screw 61 is screwed and the outer shape of the second screw hole 72 is indicated by a broken line. It is a place.

  With this configuration, high-frequency signals that flow into the GND pattern 57 from the transmission paths K0 to K3 are fixed to each other around the threaded holes 71 and 72 formed on the surface of the substrate 55. After flowing through the substrate 55 and the conductive plate 58, it flows into the casing 54 connected to the GND through the shortest path and is removed. Accordingly, the connectivity to the GND between the substrate 55 and the housing 54 can be improved, and the high frequency characteristics can be improved.

  Also, the screw hole to the conductive plate 58 can be processed by forming a thread after forming the through hole, and the processing is easy. For this reason, if it is the same processing time, the number of screw holes can be increased and the connectivity to GND can be further improved. Furthermore, even if the number of screw holes is increased in order to improve the connectivity to GND as described above, the positions of the screw holes 71 and 72 on both the front and back surfaces of the conductive plate 58 are the same, thus saving space. Can be realized.

  It should be noted that in this power switchable combiner / divider 51, in order to improve the connectivity to the GND between the substrate 55 and the housing 54, the substrate 55 and the inner surface of the housing 54 are arranged. In the meantime, a conductive connecting member 81 as shown in FIG. 12 is provided as shown in FIG. The connecting member 81 is formed by, for example, forming a U-shaped recess 82 in an aluminum plate or the like and punching holes 83 and 84 on both sides thereof, and then bending a portion 85 serving as a leg. The recess 82 is arranged inside the casing 54 so as to straddle the connectors J0 to J3, and the U-shaped top insertion hole 83 is a screw for fixing the connectors J0 to J3 to the casing 54. The insertion hole 84 of the leg portion 85 is screwed to the conductive plate 58 through the substrate 55 by the screw 88.

  As a result, in the substrate 55, the high frequency signal that has flowed into the GND pattern 57 from the transmission lines K0 to K3 flows into the casing 54 connected to the GND via the connecting member 81 and is removed. Accordingly, the connectivity to the GND between the substrate 55 and the housing 54 can be improved, and the high frequency characteristics can be improved.

  Further, since the connecting member 81 is screwed to the housing 54 with the same screw 86 and nut 87 as the attachment of the connectors J0 to J3 to the housing 54, the GND cable is connected to the connectors J0 to J3. The GND pattern 57 of the board 55 can be connected to the GND at the shortest distance from the mounting screw 86 of the connectors J0 to J3 via the connecting member 81, and the GND connection can be further improved. Further, since the connection between the connectors J0 to J3 and the board 55 is performed not only by the soldering of the connector pins P0 to P3 but also by the connecting member 81, the strength of the connecting portion is improved, and the cable is deformed or vibrated. Thus, stress applied to the soldered portions of the connector pins P0 to P3 can be relaxed, solder cracks and peeling can be prevented, and reliability can be improved.

  Furthermore, the connecting member is provided on the substrate 55 side in order to improve the connectivity to the GND between the substrate 55 and the housing 54, and is screwed to the conductive plate 58 made of a metal lump. Further, the connectivity to the GND between the substrate 55 and the housing 54 can be further improved. The connecting member 81 is screwed to the conductive plate 58 with a screw 88 inserted through the substrate 55, so that the conductive plate 58 has a portion in direct contact with the inner peripheral surface of the housing 54. The connecting member 81 also forms a current path to the housing 54, and when the cable connected to the connectors J0 to J3 becomes GND as described above, the path by the connecting member 81 is the path to GND. The high-frequency signal that has entered the conductive plate 58 nearby can be effectively removed.

[Embodiment 2]
FIG. 13 is a front view of a power switchable combiner divider 51 ′ according to the second embodiment of the present invention, and FIG. 14 is a rear view thereof. The power switchable combiner / divider 51 ′ is similar to the power switchable combiner / divider 51 described above. Corresponding portions are denoted by the same reference numerals, and description thereof is omitted. It should be noted that in this power switchable combiner / divider 51 ′, the lid 52 forming the casing 54 is divided into a lid 52a on the board 55 side and a lid 52b on the control circuit board 56 side. It has been done. Thereby, the partition 66 is omitted.

[Embodiment 3]
FIG. 15 is a plan view of the power switchable combiner / divider 51 ″ according to the third embodiment of the present invention with the lid 52 removed, and FIG. 16 shows the power switchable combiner / divider. FIG. 17 is a front view of 51 ″, and FIG. 17 is a cross-sectional view seen from the right side. The power switchable combiner / divider 51 ″ is similar to the power switchable combiner / divider 51 described above, and corresponding portions are denoted by the same reference numerals, and description thereof is omitted. It should be noted that in this power switchable combiner divider 51 ″, the branch transmission line formed on the substrate 55 ″ has four branches K1, K2, K3, and K4. For this reason, the connector J4 is added, the connector pin P4 is soldered to the branch transmission line K4, and the terminal of the branch switch SW4 protruding from the insertion hole H4 formed in the board 55 ″ to the board surface side is also provided. Soldered to the branch transmission line K4.

  However, the bending direction of the single transmission line K0 ″ is opposite to that shown in FIG. 1, and the mounting position of the connector J0 is the same even if it is divided into four branches, and a common housing 54 is used. Can be done. Therefore, the rear view is the same as FIG. 3 and is omitted.

  Thus, even in the case of four branches, the length that the drive signal line 63 is exposed on the surface of the substrate 55 ″ is minimized, and a high-frequency signal with large power flowing through the transmission lines K0 ″ and K1 to K4 is generated. Malfunctions and malfunctions caused by entering the drive signal line 63 can be reduced. Further, when the conductive plate 58 is provided, the first screw hole 71 into which the screw 61 is screwed is formed to communicate with the second screw hole 72, so that high frequency characteristics can be improved. Furthermore, by providing the conductive connecting member 81, connectivity to the GND between the substrate 55 "and the housing 54 can be improved, and high frequency characteristics can be improved.

  The power switchable combiner dividers 51, 51 ′, 51 ″ of the present invention are suitably implemented in a high-frequency signal wireless relay device such as a terrestrial digital television broadcast or a cellular phone by being combined with a power amplifier. be able to.

It is a top view in the state where a lid of a power switchable combiner divider which is a high frequency electric power combiner or distributor concerning a 1st embodiment of the present invention was removed. It is a front view of the power switchable combiner divider of FIG. It is a rear view of the power switchable combiner divider of FIG. It is sectional drawing seen from the cut surface line IV-IV of the power switchable combiner divider of FIG. It is a longitudinal cross-sectional view which shows one structural example of switch SW. FIG. 6 is an exploded perspective view of FIG. 5. It is a perspective view which shows the structure of the base of the said switch. It is a front view which shows the structure of the contact of the said switch. FIG. 2 is a cross-sectional view taken along section line IX-IX in FIG. 1 for explaining routing of drive signal lines of the switch. It is a top view of an electroconductive plate. It is a bottom view of the conductive plate. It is a perspective view of a connection member. It is a top view in the state where the cover of the power switchable combiner divider concerning a 2nd embodiment of the present invention was removed. It is a front view of the power switchable combiner divider of FIG. It is a top view in the state where the cover of the power switchable combiner divider concerning a 3rd embodiment of the present invention was removed. It is a front view of the power switchable combiner divider of FIG. It is sectional drawing seen from the right side surface of the power switchable combiner divider of FIG. It is a block diagram which shows simply the example of 1 structure of the relay station of terrestrial digital television broadcasting.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2a, 2b Contact terminal 4A Contact 10 Solenoid 20 Base block 20a, 20b Terminal part 51, 51 ', 51''Power switchable combiner divider 52; 52a, 52b Lid 53 Base 54 Case 55, 55''Board 56 Control circuit board 56a Drive board 56b Control board 57 GND pattern 58 Conductive plate 59 Through hole 60 Connection point 61, 62 Screw 63 Drive signal line 64 Insertion hole 65; 65a, 65b Lead groove 66 Partition 67 Spacer 68 Screw 69 Support member 70 Connector 71 First screw hole 72 Second screw hole 73 Screw 81 Connecting member 82 Recess 83, 84 Insertion hole 85 Leg portion 86 Screw 87 Nut 88 Screw 101 Antenna 102 Filter 103 Amplifier 104 Divider 105 Combiner divider 106 Anne Unit 107 Switchable combiner A1, A2, A3 Power amplifier C1-Cn Signal processing circuit H1-H4; H11, H12 Insertion hole J0; J1-J4 Connector K0, K0 '' Single transmission line K1-K4 Branch transmission line P0; P1-P4 Connector pins ST1, ST2 Stub pattern SW1-SW4 Branch switch SW11, SW12 Stub switch

Claims (3)

In a high frequency power synthesizer or distributor configured by housing a substrate having a high-frequency signal transmission path formed on a surface thereof in a housing connected to GND, and synthesizing or distributing the power of the high-frequency signal.
A conductive plate is interposed between the back surface of the substrate and the inner surface of the housing and made of a metal lump. The conductive plate has a first screw hole for fixing the substrate to the conductive plate. And a second screw hole for fixing the conductive plate to the housing in communication with each other,
The portions other than each transmission path on the substrate surface become a GND pattern, and the back surface of the substrate becomes a GND pattern on the entire surface. In the GND pattern on the substrate surface, through holes are formed around each transmission path to connect to the GND pattern on the substrate back surface. A high frequency power combiner or distributor characterized by: The switch is interposed in the transmission path formed on the substrate surface, and opens and closes the high-frequency signal. The switch is mounted on the conductive plate and extends from the insertion hole formed in the substrate to the substrate surface side. RF power combiner or divider as claimed in claim 1 Symbol mounting, characterized in that protrudes. 3. A radio relay apparatus according to claim 1, wherein the high frequency power combiner or distributor includes an amplifier individually corresponding to each branch transmission line.

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