JP4183007B2 - High frequency relay substrate and high frequency module using the same - Google Patents

Description

  The present invention relates to a high-frequency relay substrate used for a wireless relay device of a mobile phone and a high-frequency module using the same.

  Many high frequency relays have been proposed, including Patent Document 1 by the present applicant. FIG. 7 is an exploded perspective view showing a typical structure of the high-frequency relay 1. The high-frequency relay 1 is generally configured by arranging a contact mechanism 11 in parallel with a drive mechanism 21 that drives the contact mechanism 11. The contact mechanism 11 is provided with movable contacts 13 and 14 in a shield box 12, and the movable contacts 13 and 14 are driven to be displaced in the reference sign X direction by the drive mechanism 21, whereby fixed contacts 15 and 16; 16/17 contacts / separates and switches the high frequency signal. Therefore, the movable contacts 13 and 14 constitute a coaxial line having a central conductor and the shield box 12 being an external conductor. The movable contacts 13 and 14 are respectively held by drive members 18 and 19 that are displaced and driven by the drive mechanism 21. The fixed contacts 15, 16, and 17 are erected while being electrically insulated in the shield box 12, and the side opposite to the movable contacts 13 and 14 protrudes from the back surface of the base 20, and terminals P 1, P 2 , P3.

  The central fixed contact 16 (terminal P2) is a common contact that can come into contact with both the movable contacts 13 and 14. On the other hand, the fixed contacts 15 and 17 (terminals P1 and P3) at both ends are individual contacts that can contact only the movable contacts 13 and 14, respectively. Further, the fixed contact 15 is a contact of a normally contact (NC) that is connected to the fixed contact 16 when the movable contact 13 contacts when the drive mechanism 21 is not driven, and the fixed contact 17 is a movable contact when the drive mechanism 21 is not driven. 14 is a normally-off (NO) contact that is separated from the fixed contact 16 by separating. Between the terminals P1, P2, and P3 of the fixed contacts 15, 16, and 17, ground terminals P4 and P5 are provided.

  The drive mechanism 21 includes an electromagnet 22 and a displacement member 23. In the electromagnet 22, an iron core 26 is inserted into a bobbin 25 around which a coil 24 is wound, and a magnetic path is formed by a yoke 27 between one end and the other end of the iron core 26. Configured. Each end of the coil 24 is connected to terminals P6 and P7 to which an excitation current is applied from the outside.

  On the other hand, the displacement member 23 contacts the card 31 that supports the movable contacts 13 and 14 via the drive members 18 and 19, the magnet 32 provided at one end of the card 31, and both ends of the magnet 32. A pair of armatures 33 and 34 sandwiching the iron core 26, a pair of balance springs 35 and 36 extending from the other end of the card 31, and a balance spring for attaching the other end of the balance springs 35 and 36 to the base 20 And a holding plate 37. Accordingly, when the electromagnet 22 is demagnetized / excited, the balance springs 35 and 36 of the card 31 are deformed and displaced in the X direction, and the movable contacts 13 and 14 can be driven to displace. The fixed contact 15, 16, 17, the shield box 12, and the electromagnet 22 are accommodated in the base 20, and the displacement member 23 is mounted on the electromagnet 22, and then the casing 38 is covered.

  The high-frequency relay 1 configured as described above selects, for example, a plurality of amplifiers A and B as shown in FIG. 8 (a) in the wireless relay device of the mobile phone or the like as shown in FIG. 8 (b). Thus, it is used for switching the signal path such as switching between the amplifier A and the through line L. Thus, FIG. 9 shows an attempt to realize such a signal switching high-frequency module. The high-frequency module 41 includes a surface-mounting type high-frequency relay substrate 42, and includes two high-frequency relays 1 and one amplifier A. As shown in FIG. The through line L is switched.

The high frequency relay 1 shown in FIG. 7 is an insertion mounting type high frequency relay. For the surface mounting type, as shown in FIG. 10, the terminals P1 to P7 are bent into an L shape and cut to a required length. After that, it is mounted on the land of the high frequency relay substrate 42 and attached by reflow soldering or the like.
Japanese Utility Model Publication No. 7-24769

  However, in such a high-frequency module 41, the signal lines 43 and 44 for driving the coil 24 straddle (cross) the high-frequency signal patterns 45 and 46 to the terminal P2 of the common contact. 44 requires a bypass route outside the substrate using a jumper wire, a connector, or the like (in the example of FIG. 9, the signal lines 43 and 44 are jumper wires), which is expensive and has a problem that the high frequency characteristics deteriorate. . Similarly, the amplifier A is interposed, and the high frequency signal patterns 47 and 48 for connecting the normally contacted contacts (the fixed contact 15) and the normally off contact (the fixed contact 17) are connected. The pattern 49 also crosses, and a detour route by the signal line 40 (jumper line) is necessary.

  An object of the present invention is to provide a high-frequency relay substrate capable of obtaining good high-frequency characteristics at low cost and a high-frequency module using the same.

  The high-frequency relay board of the present invention is a surface-mount type high-frequency relay board that is mounted with a high-frequency relay and is used for switching a signal path, and the high-frequency relay board is divided into a main board and a sub-board, A pattern to be formed on the high-frequency relay substrate is divided into the main substrate and the sub-substrate so that at least a part thereof is three-dimensionally crossed, thereby performing terminal position conversion of the high-frequency relay. To do.

  In addition, the high frequency relay board of the present invention is a surface mount type high frequency relay board that is mounted with a high frequency relay and is used for switching a signal path. The high frequency relay board is divided into a main board and a sub board. Then, on one end side, the terminals of the high-frequency relay arranged on a straight line are formed by being routed to the other end side by a pattern formed on the surface of the sub-board on the high-frequency relay side. And

  According to the above configuration, it is used for a radio relay device, etc., and a high frequency relay is mounted to select a plurality of amplifiers and attenuators, or to switch a signal path such as switching between amplifiers, attenuators and through lines. In the surface mount type high frequency relay substrate used, the function of the high frequency relay substrate is divided into a main substrate and a sub substrate, and the sub substrate is interposed (soldered) on the bottom surface of the high frequency relay, The terminal position of the high frequency relay is converted. Specifically, a pattern to be formed on the high-frequency relay substrate is divided into a main substrate and a sub-substrate, and at least a part of the high-frequency signal pattern and the relay drive signal pattern or the high-frequency signal patterns are arranged. Make a three-dimensional intersection. As a result, of the terminals arranged in a straight line on one end side of the high-frequency relay, an arbitrary terminal is formed on the main board side by the pattern formed on the surface of the sub-board on the high-frequency relay side. The terminal position conversion can be performed by straddling the pattern to the other end side.

  Therefore, the connection between each terminal of the high frequency relay and the element such as the amplifier can be made only by the pattern on the main board, and the high frequency relay board is bypassed by using a jumper wire or a connector. A route is unnecessary, and good high-frequency characteristics can be obtained at low cost.

  Furthermore, in the high frequency relay substrate of the present invention, the sub-board has terminals arranged on a straight line on one end side of the high frequency relay on the surface of the high frequency relay side to the other end side. It has a pattern in the short direction to be routed, and the surface of the sub-substrate on the main substrate side has a pattern non-formation region in the longitudinal direction at a substantially central portion, and the non-formation is formed on the main substrate. It has a pattern of the driving signal in the longitudinal direction corresponding to the region.

  According to said structure, the said terminal position conversion can be performed by the pattern of the transversal direction formed in the surface by the side of the main board | substrate in a subboard | substrate, and the pattern of the transversal direction is the longitudinal direction of the main board | substrate side. Since the driving signal pattern is straddled, the influence of the terminal position conversion is not given to the routing of the driving signal pattern. In this way, a bypass route outside the board using a jumper wire, a connector, or the like can be eliminated from the high frequency relay board.

  In the high frequency relay substrate of the present invention, the high frequency relay is an insertion mounting type relay.

  According to the above configuration, by inserting the insertion mounting type relay used when the high frequency relay board is the insertion mounting type into the sub board, the surface mounting type simultaneously with the terminal position conversion by the sub board Can be converted to a relay.

  Therefore, the insertion mounting type relay can be used for the surface mounting type high frequency relay substrate, and the high frequency relay can be shared between the insertion mounting type and the surface mounting type, thereby reducing the cost.

  Furthermore, the high frequency relay board of the present invention is characterized in that the impedance of the sub board is set in conformity with the impedance of the high frequency relay and the main board.

  According to the above configuration, the thickness and width of the conductive layer, conductor pattern, and soldering pattern in the through hole of the sub-board, the distance from the GND pattern, and the dielectric constant and thickness of the board body are different. Since the impedance in the sub-board changes, the impedance changes in accordance with the impedance of the high-frequency relay and the main board. For example, the impedance is set so as to alleviate the impedance deviation between the high frequency relay and the main board. Alternatively, a plurality of types of sub-boards having different impedances may be prepared, and the one corresponding to the desired impedance may be used.

  Therefore, not only the change of the terminal position but also the impedance can be adapted.

  The high-frequency module of the present invention uses the above-described high-frequency relay substrate, and the high-frequency relay has terminals of three fixed contacts arranged in a straight line on one end side, and has individual contact points at both ends. One is a contact for a normally contact, the other is a contact for a normally-off, and a pair of high-frequency relays in which the contact of the normally-contact and the contact of a normally-off are provided opposite to each other To do.

  According to said structure, as said high frequency relay, it has the terminal of three fixed contacts arrange | positioned on a straight line in one edge part side, and an internal movable contact is both ends with respect to a center common contact. A high-frequency module using a high-frequency relay in which one individual contact becomes a contact of a normally contact and the other individual contact becomes a contact of a normally-off by performing a reciprocal operation that separates the other when connecting one of the individual contacts In FIG. 2, two types of high-frequency relays in which a normally contact and a normally-off contact are provided opposite to each other are prepared and used as a pair.

  Therefore, two high frequency relays when branching one signal path into two and passing through different amplifiers or selecting amplifiers and through lines and then joining again to connect to one signal path The normally contacted contacts and the normally-off contacts are opposed to each other, so that the two branched signal paths can be prevented from crossing each other, and a board using a jumper wire or a connector is used. An external detour route is not required.

  As described above, the high-frequency relay board of the present invention is used in a radio relay device or the like, and is equipped with a high-frequency relay to select a plurality of amplifiers or attenuators, or to switch between amplifiers, attenuators, and through lines. In a surface mount type high frequency relay substrate used for switching such a signal path, the function of the high frequency relay substrate is divided into a main substrate and a sub substrate, and the sub substrate is interposed on the bottom surface of the high frequency relay. Thus, the terminal position of the high frequency relay is converted.

  Therefore, the connection between each terminal of the high frequency relay and the element such as the amplifier can be made only by the pattern on the main board, and the high frequency relay board is connected to the outside of the board using a jumper wire or a connector. A detour route is unnecessary, and good high-frequency characteristics can be obtained at low cost.

  Furthermore, as described above, the high-frequency relay substrate of the present invention has a terminal on the surface of the high-frequency relay side on which the sub-board is arranged in a straight line on the one end side of the high-frequency relay. A pattern in the short direction that is routed to the part side, and has a pattern non-formation region in the longitudinal direction at the substantially central portion on the surface on the main substrate side, and the non-formation region is formed on the main substrate. A corresponding drive signal pattern in the longitudinal direction is provided.

  Therefore, as described above, a bypass path outside the board using a jumper wire, a connector, or the like can be eliminated from the high frequency relay board.

  Moreover, the high frequency relay board | substrate of this invention makes the said high frequency relay an insertion mounting type relay as mentioned above.

  Therefore, by inserting it into the sub board, it is possible to convert it into a surface mount type relay at the same time as the terminal position conversion, and the insertion mount type relay can be used for this surface mount type high frequency relay board. The high frequency relay can be shared between the insertion mounting type and the surface mounting type, thereby reducing the cost.

  Furthermore, as described above, the high-frequency relay substrate of the present invention includes the thickness and width of the conductive layer, conductor pattern, and soldering pattern in the through-hole of the sub-substrate, and the distance from the GND pattern, and further the substrate body. Since the impedance of the sub-board changes due to the difference in the dielectric constant and thickness of the sub-board, the impedance changes according to the impedance of the high-frequency relay and the main board.

  Therefore, not only the change of the terminal position but also the impedance can be adapted.

  Further, as described above, the high-frequency module of the present invention has three fixed contact terminals arranged in a straight line on one end side as the high-frequency relay, and the internal movable contact is the center. When one of the individual contacts at both ends is connected to the common contact, the reciprocal operation of separating the other is performed, so that one individual contact becomes a normally contact and the other individual contact becomes a normally-off contact. In the high-frequency module using the high-frequency relay, two types of high-frequency relays in which normally-contacts and normally-off contacts are provided opposite to each other are prepared and used as a pair.

  Therefore, when one signal path is branched into two and passed through different amplifiers, or after selecting an amplifier and a through line, they are joined again and connected to one signal path. The normally-contact and normally-off contacts of the relay face each other, so that the two branched signal paths can be prevented from crossing each other, and jumper wires and connectors are used. A detour route outside the substrate is not required.

[Embodiment 1]
FIG. 1 is a diagram showing a structure of a high-frequency module 51 according to an embodiment of the present invention. The high-frequency module 51 includes two high-frequency relays 1a and 1b, one amplifier A, and a high-frequency relay substrate 50, similar to the high-frequency module 41 shown in FIG. As shown, the amplifier A and the through line L are switched.

  It should be noted that in this high-frequency module 51, the high-frequency relay substrate 50 is a surface-mount type substrate, and a part of its function is divided into sub-substrates 52 soldered to the bottom surfaces of the high-frequency relays 1a and 1b. The high frequency relay substrate 50 is a main substrate. The high-frequency relays 1a and 1b are insertion-mounting relays similar to the high-frequency relay 1 shown in FIG. 7 described above. By interposing the sub-board 52, the common contact terminal P2 is inserted as described later. It is to convert the terminal position and to the surface mount type.

2 is a top view of the sub-board 52, and FIG. 3 is a bottom view thereof. The substrate body 53 of the sub-board 52 is made of, for example, glass epoxy, glass fluorine type resin, or ceramic, and has through holes H1 to H7 through which the terminals P1 to P7 are inserted. The through holes H1 to H7 have a conductive layer on the inner peripheral surface, and are electrically connected to a conductor pattern formed around the through holes H1 to H7 on at least one of the upper surface and the bottom surface. Through holes H1-H3, H6, H7, the corresponding conductor patterns L1 to L3, L6, through L7, the substrate main body 53 of the soldering patterns are formed on the end surface F 1~F3, F6, F7, respectively Connected. The conductor patterns corresponding to the ground terminals P4 and P5 of the shield box 12 are connected to the GND pattern 54. On the upper surface side of the substrate body 53, the GND pattern 54 is formed as much as possible except for the conductor patterns L1 to L3, L6, and L7. The GND patterns 54 on the front and back surfaces of the substrate body 53 are connected to each other by a large number of through holes H0.

  The sub-board 52 is set in impedance in accordance with the impedances of the relays 1a and 1b and the high-frequency relay board 50 as the main board. Specifically, the thicknesses and widths of the conductive layers in the through holes H1 to H7, the conductor patterns L1 to L3, L6, and L7, the soldering patterns F1 to F3, F6, and F7, and their distance to the GND pattern 54, Since the impedance of the sub-board 52 changes due to the different dielectric constant and thickness of the board body 53, the impedance changes according to the impedance of the relays 1a and 1b and the high-frequency relay board 50. For example, the impedance is set so as to alleviate the deviation in impedance between the relays 1a and 1b and the high frequency relay substrate 50. Alternatively, a plurality of types of sub-boards 52 having different impedances may be prepared, and the one corresponding to the desired impedance may be used. For example, it is 75Ω when used for switching television signals in a television tuner, and 50Ω when used in a mixed path or branch path of the wireless relay device.

  FIG. 4 is a plan view for explaining the method for manufacturing the sub-substrate 52. The sub-board 52 is small (for example, 15 × 9.6 mm). Therefore, as shown in FIG. 4, after a plurality of sub-boards 52 are integrally formed on a large board 55, the perforation indicated by reference numeral 56 is provided. The sub-board 52 is manufactured by cutting along the lines. Specifically, the through-holes H1 to H7 are formed in the large substrate 55 with a drill or the like, and then a conductive layer is formed on the inner peripheral surface by metal plating, sputtering, printing, or the like. The conductor patterns L1 to L3, L6, and L7 are formed. At this time, through holes and conductive layers are also formed in the portions to be the soldering patterns F1 to F3, F6, and F7 and are divided along the perforations 56 so that the conductive layer on the outer peripheral edge is externally formed. And can be used as the soldering patterns F1 to F3, F6, and F7 formed on the end surface of the sub-board 52. By producing in this way, it is possible to simplify the production of the soldering patterns F1 to F3, F6, and F7.

  FIG. 5 is a perspective view for explaining a process of attaching the sub-board 52 manufactured as described above to the high frequency relays 1a and 1b. FIG. 5 (a) shows the insertion mounted relay 1 as in FIG. 7, and in order to obtain the surface mounted relay shown in FIG. 5 (c) and FIG. 1, first, as shown in FIG. 5 (b). The terminals P1 to P7 extending from the bottom of the base 20 are cut to a length shorter than the sub-board 52, for example, about 2/3 of the depth of the through holes H1 to H7. On the other hand, the sub-board 52 is filled with solder paste to such an extent that it does not protrude into the through holes H1 to H7 even if the terminals P1 to P7 having the length are inserted. Thereafter, the two are combined and soldered in a reflow furnace, so that the soldering patterns F1 to F3, F6 and F7 corresponding to the terminals P1 to P3, P6 and P7, and the GND terminal and the GND pattern 54 are obtained. While being electrically connected, the high frequency relays 1a and 1b and the sub-board 52 are mechanically joined to form a surface mount relay.

  Accordingly, by interposing the sub-board 52 between the high-frequency relay board 50 and the high-frequency relays 1a and 1b, the position of the common contact terminal P2 is changed, and the insertion-mounted high-frequency relays 1a and 1b are surface-mounted. Further, in performing the conversion, it is possible to prevent the occurrence of stress that occurs when the terminals P1 to P7 are bent as shown in FIG. As a result, cracks occur at the joint between the base 20 and the housing 38 of the high-frequency relays 1a and 1b, the terminal holes of the base 20 into which the terminals P1 to P7 are press-fitted, and airtightness is impaired. Can be prevented and reliability can be improved. Further, the high frequency relays 1a and 1b can be shared by the insertion mounting type and the surface mounting type, thereby reducing the cost. Furthermore, since there is no terminal, there is no terminal deformation during packaging and transportation.

  Further, by forming the GND pattern 54 as much as possible on the surface of the sub-board 52 on the relay 1 side, the distance between the shield box 12 and the GND pattern 54 is reduced. On the other hand, in the case of the bending formation of FIG. 10, the dimension of the bending portion between the GND pattern formed on the high frequency relay substrate 50 due to the bending jig, for example, 0.7 to 1mm is required. Therefore, the high-frequency characteristics such as VSWR, insertion loss, isolation, and impedance matching can be improved by making the bottom surfaces of the high-frequency relays 1a and 1b immediately face the GND pattern 54, which is suitable for the high-frequency relay.

  Furthermore, referring to FIG. 2 and FIG. 3, among the terminals P1 to P5 arranged on a straight line on one end side of the high frequency relays 1a and 1b in the sub-board 52, the terminal P2 of the common contact is From the periphery of the through hole H2, it is routed to the other end side by the pattern L2a in the short direction formed on the surface (the upper surface in FIG. 2) of the sub-board 52 on the high frequency relay 1a, 1b side. Via the soldering terminal F2, it is folded back to the surface on the main substrate 50 side (the bottom surface in FIG. 3) and connected to the common terminal P0. On the other hand, the surface (bottom surface in FIG. 3) of the sub-substrate 52 on the main substrate 50 side has a pattern non-formation region 59 in the longitudinal direction at a substantially central portion. The drive signal pattern L10 in the longitudinal direction corresponding to the non-formation region 59 is formed.

  Therefore, the pattern L2a and the pattern L10 are orthogonal to each other without contact with each other due to the three-dimensional intersection, and thus the terminal position of the common contact terminal P2 can be converted. As a result, the jumper wires 43 and 44 as shown in FIG. 9 can be eliminated, and good high frequency characteristics can be obtained at low cost.

  It should be noted that the high-frequency relays 1a and 1b basically have the structure of the high-frequency relay 1 shown in FIG. 7, but have a shield structure inside the relay and are normally contacted (see FIG. 7). In the example, the fixed contact 15 (terminal P1)) and the normally-off contact (in the example of FIG. 7, the fixed contact 17 (terminal P3)) are provided opposite to each other. Thus, by preparing two types of high frequency relays 1a and 1b and using them as a pair in the high frequency module 51, the contacts (P1, P1 ′) of normally contacts and the contacts of normally off (P3, P3 ′) are used. The two signal paths 61 and 62 branched from each other can be prevented from crossing each other, and according to this, the jumper line 40 shown in FIG. 9 can be made unnecessary.

[Embodiment 2]
FIG. 6 is a bottom view of a sub-board 52 ′ used in a high-frequency module according to another embodiment of the present invention. The sub-board 52 ′ is similar to the sub-board 52 shown in FIGS. 2 and 3 described above, and corresponding portions are denoted by the same reference numerals and description thereof is omitted. It should be noted that in the sub-board 52 ′, through holes H1 and H3 into which the terminals P1 and P3 are respectively inserted in order to interchange the terminals P1 and P3 of the fixed contacts 15 and 17 serving as the individual contacts. The patterns L1 ′ and L3 ′ are drawn to the opposite side in the longitudinal direction beyond the terminal P2 (through hole H2) of the fixed contact 16 serving as a common contact, and the soldering patterns F1 ′ and F3 ′ are provided on the opposite side. It is formed.

  Therefore, although the area of the GND pattern 54 is reduced and the number of through holes H0 is also reduced, the high frequency relay can be unified with the high frequency relay 1 shown in FIG. 7, and further cost reduction is achieved. be able to.

  Here, in Japanese translations of PCT publication No. 2006-523001, a pattern is formed on the base of the relay, and the pattern forms a fixed contact or a power supply line to the coil. The function of the pattern is completely different from the sub-boards 52 and 52 'of the present invention inserted for conversion.

It is a figure which shows the structure of the high frequency module which concerns on one Embodiment of this invention. It is a top view of the sub-board | substrate used for the high frequency module shown in FIG. It is a bottom view of the sub-board | substrate used for the high frequency module shown in FIG. It is a perspective view for demonstrating the manufacturing method of the said subboard | substrate. It is a perspective view for demonstrating the assembly process which converts an insertion mounting type high frequency relay into a surface mounting type relay using the said subboard | substrate. It is a bottom view of the sub-board used for the high frequency module concerning other embodiments of the present invention. It is a disassembled perspective view which shows the typical structural example of the insertion mounting type high frequency relay. It is a figure for demonstrating the high frequency module used as the usage example of the said high frequency relay. It is a figure which shows the structure considered as a prior art of the said high frequency module. It is a side view which shows the prior art in the case of surface mounting the insertion mounting type high frequency relay.

Explanation of symbols

1, 1a, 1b High-frequency relay 11 Contact mechanism 12 Shield box 13, 14 Movable contact 15, 16, 17 Fixed contact 18, 19 Drive member 20 Base 21 Drive mechanism 22 Electromagnet 23 Displacement member 24 Coil 25 Bobbin 26 Iron core 27 Relay 31 Card 32 Magnet 33, 34 Armature 38 Housing 50 High-frequency relay substrate 51 High-frequency module 52, 52 ′ Sub-board 53 Substrate body 54 GND pattern 59 Non-formation area A, B Amplifiers F1-F3, F6, F7 Soldering pattern L through line H0 to H7 through hole L1, L2, L2a, L3, L6, L7 conductor pattern L10 drive signal pattern P0 common terminal P1 to P7 terminal

Claims (6)

In a surface mount type high frequency relay board that is equipped with a high frequency relay and used for switching signal paths,
The high frequency relay substrate is divided into a main substrate and a sub substrate, and a pattern to be formed on the high frequency relay substrate is divided into the main substrate and the sub substrate so that at least a part thereof intersects three-dimensionally. By doing so, the terminal position conversion of this high frequency relay is performed, The board | substrate for high frequency relays characterized by the above-mentioned. The sub-board has a short-side pattern on the surface of the high-frequency relay side, in which terminals arranged on a straight line on one end side of the high-frequency relay are routed to the other end side. The surface of the sub-substrate on the main substrate side has a pattern non-formation region in the longitudinal direction at a substantially central portion, and the drive signal pattern in the longitudinal direction corresponding to the non-formation region on the main substrate. high frequency relay substrate according to claim 1 Symbol mounting and having a. In a surface mount type high frequency relay board that is equipped with a high frequency relay and used for switching signal paths,
A pattern in which the high frequency relay substrate is divided into a main substrate and a sub substrate, and terminals of the high frequency relay arranged on one straight line are formed on the surface of the sub substrate on the high frequency relay side. By drawing to the other end side,
The sub-board has a short-side pattern on the surface of the high-frequency relay side, in which terminals arranged on a straight line on one end side of the high-frequency relay are routed to the other end side. The surface of the sub-substrate on the main substrate side has a pattern non-formation region in the longitudinal direction at a substantially central portion, and the drive signal pattern in the longitudinal direction corresponding to the non-formation region on the main substrate. high-frequency substrate for relay further comprising a.   The high-frequency relay substrate according to claim 1, wherein the high-frequency relay is an insertion mounting type relay.   5. The high frequency relay board according to claim 1, wherein an impedance of the sub board is set in conformity with impedances of the high frequency relay and the main board. 6. Using the high frequency relay substrate according to any one of claims 1 to 5,
The high-frequency relay has terminals of three fixed contacts arranged on a straight line on one end side, one of the individual contacts at both ends becomes a contact of a normally contact, and the other becomes a contact of a normally-off, A high-frequency module comprising a pair of high-frequency relays in which normally-contacts and normally-off contacts are provided opposite to each other.

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