JP4154629B2 - Non-contact IC card - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact IC card for transmitting information using an induction electromagnetic field as a transmission medium.
[0002]
[Prior art]
Non-contact IC cards are classified into an electromagnetic coupling method, an electromagnetic induction method, a radio wave method, and the like depending on a transmission medium. Among them, the electromagnetic coupling and electromagnetic induction type configurations generally have a circuit board on which electronic components such as a winding coil and an IC and a capacitor are mounted in a housing made of plastic resin.
[0003]
However, when a winding coil is used, it is difficult to reduce the thickness of the card and reduce the number of assembly steps. Recently, the antenna coil 6 and the line 4 are formed on a plastic film 7b by etching or printing as shown in FIG. The IC chip 1 on which the bumps 3 are formed is bare-chip mounted on the line 4 face down with the anisotropic conductive adhesive 5, and these are bonded with the adhesives 8a and 8b and the plastic films 7a and 7c. Coated non-contact IC cards have been proposed and put into practical use.
[0004]
[Problems to be solved by the invention]
However, when a non-contact IC card as shown in FIG. 4 is subjected to a bending durability test and a pressing load durability test to the peripheral portion of the IC chip 1, the IC chip 1 breaks or the bump 3 of the IC chip 1 and the antenna There existed a subject that the track | line 4 which connects the coil 6 might be disconnected.
[0005]
It is an object of the present invention to provide a non-contact type IC card that can suppress the bending of the card, the cracking of the IC chip with respect to the pressing load, and / or the occurrence of disconnection of the IC chip and the line.
[0006]
[Means for Solving the Problems]
The non-contact type IC card of the present invention is an IC card composed of a line for electrically connecting an antenna coil and an IC chip , a covering member made of a plastic film or a sheet, and the like. Is characterized in that an operation area in which bumps and circuits are formed, a dummy area is provided around the operation area, and a half-cut groove is formed at the boundary between the operation area and the dummy area.
[0007]
Further, the non-contact type IC card of the present invention includes an antenna coil, an IC chip, other electronic components if necessary, a line for electrically connecting them, a covering member made of a plastic film or a sheet, etc. an IC card constituted by the line connected to the bumps of the IC chip, characterized in that at two or more as a line for performing at least the same connection.
[0008]
Before reporting, the dummy area is provided with the operation area on the basis of the circuit around the operation area, line connected to the bumps of the IC chip having grooves of the half-cut at the boundary of the operating area and the dummy area is also at least as connected It is preferable that there are two or more lines for performing the above.
[0009]
Of the two or more lines connected to the bumps of the IC chip, it is more preferable that at least two lines are formed in a direction perpendicular to the bumps of the IC chip.
[0010]
It is preferable that the line and the IC chip and other electronic components if necessary are connected by an anisotropic conductive adhesive.
[0011]
It is preferable that at least the antenna coil and the IC chip are directly connected face-down with an anisotropic conductive adhesive.
DETAILED DESCRIPTION OF THE INVENTION
[0012]
The antenna coil used in the present invention can be formed by conducting screen printing with conductive ink, and can also be formed by etching away unnecessary portions of the metal foil.
[0013]
It is preferable to use an IC chip having an operation area in which a normal circuit is formed and a dummy area around it, and a half-cut groove is formed between them, and the operation area is widened by an interval of the dummy area. What is formed on the wafer at a pitch can be cut by a dicing saw or the like, and at that time, a half-cut groove can be formed using the same dicing saw.
[0014]
Other electronic components when necessary include, for example, a capacitor for resonance of an antenna circuit, a diode for rectifying a signal from a reader / writer that transmits a signal with a non-contact IC card, and smoothing the rectified signal These capacitors can be mounted as individual components or can be built into an IC chip.
[0015]
The line that electrically connects the antenna coil and the IC chip to other electronic components when necessary is preferably formed in the same manner as the antenna coil. Insulating resin can be formed so as to straddle the antenna coil and a conductor can be formed thereon.
[0016]
The covering member made of a plastic film or sheet is preferably made of an inexpensive material such as a polyethylene terephthalate film.
[0017]
It is highly possible that the number of lines connected to the bumps of the IC chip is at least two lines that perform at least the same connection. Even if one line is disconnected, the other is likely to remain. If at least two of the two or more lines to be connected are formed in a direction perpendicular to the bump of the IC chip, the force applied when two or more lines are disconnected can be dispersed. preferable.
[0018]
The track and the IC chip and other electronic components if necessary can be connected using an anisotropic conductive adhesive.
This anisotropic conductive adhesive is composed of epoxy resin and conductive particles, and can be formed on a line by a method of laminating a film or by applying an adhesive, and an IC chip to be connected Alternatively, the electronic components can be stacked and connected by heating and pressing.
[0019]
When an IC chip is provided with an operating area and a dummy area around it, and a half-cut groove is provided at the boundary between the IC chip and the IC card is bent and a pressing load is applied to break the IC, first the IC half-cut groove Since the crack occurs in the part and thereafter, the dummy area functions as a protective member for the operation area, the operation area is hardly cracked.
[0020]
In addition, by using two or more lines connected to one bump of the IC chip, even when bending or the like is applied to the IC card and the lines connected to the bumps of the IC chip are disconnected, a plurality of lines are connected. Since it is connected, the function as a card is maintained.
[0021]
【Example】
As shown in FIG. 3, the conductive coil is screen-printed on the surface of a plastic film 7b made of a polyethylene terephthalate film (hereinafter referred to as PET) having a thickness of 50 μm, so that the antenna coil 6 and the bump 3 of the IC 1 are applied. On the other hand, a line 4 having a shape wired from two directions was formed. At this time, the portions straddling the antenna coil 6 were connected by screen-printing solder resist ink between them and screen-printing conductive ink thereon.
The size of the IC 1 is 6 mm square with a thickness of 280 μm, the outer periphery 1.5 mm is the dummy area 1 b, the central 3 mm square is the operation area 1 a, and the 0.25 mm width of the boundary is deep from the device surface side during dicing. A half-cut groove 2 having a thickness of 180 μm was provided, and a bump 3 by Au plating was formed on the connection pad. The IC 1 was mounted on the line 4 by face-down bare chip mounting via an anisotropic conductive adhesive 5. The plastic film 7b on which the IC was mounted was covered by laminating the plastic films 7a and 7c and the adhesives 8a and 8b, and punched to a predetermined size to form a non-contact IC card.
[0022]
When the non-contact IC card produced in this way was subjected to a bending durability test and a pressing load durability test to the peripheral part of the IC chip 1, cracking of the IC chip and disconnection of the line occurred at 100 sheets. There wasn't.
[0023]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a non-contact type IC card that can suppress the occurrence of bending of the IC chip, cracking of the IC chip due to load, or disconnection of the line.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an IC chip showing an embodiment of the present invention.
FIG. 2 is a configuration diagram of a line showing another embodiment of the present invention.
FIG. 3 is a configuration diagram of a non-contact type IC card showing an embodiment of the present invention.
FIG. 4 is a configuration diagram of a non-contact type IC card for explaining a conventional example.
[Explanation of symbols]
1. IC chip 1a. Operating area 1b. Dummy area 2. Half cut groove Bump 4. Line 5 Anisotropic conductive adhesive Antenna coils 7a, 7b, 7c. Plastic film 8a, 8b. adhesive

Claims (5)

An IC card comprising a line for electrically connecting an antenna coil and an IC chip, and a covering member made of a plastic film or sheet, wherein the IC chip has an operation area in which bumps and circuits are formed, and A non-contact type IC card, wherein a dummy area is provided around the operation area, and a half-cut groove is used at the boundary between the operation area and the dummy area. An antenna coil, and the line for electrically connecting the IC chip, an IC card constituted by a covering member made of a plastic film or sheet, the line connected to the bumps of the IC chip is at least the same connection The contactless IC card according to claim 1, wherein there are two or more lines for performing the operation. An IC card comprising a line electrically connecting an antenna coil and an IC chip, and a covering member made of a plastic film or sheet, wherein two or more lines connected to the bumps of the IC chip among them, non-contact type IC card according to claim 2, wherein at least two lines is formed in a direction orthogonal as the intersection bumps of the IC chip. Line and, IC chip and the non-contact type IC card according to any one of claims 1-3, characterized in that it is connected by an anisotropic conductive adhesive. At least an antenna coil and IC chip are directly by the anisotropic conductive adhesive, the non-contact type IC card according to any one of claims 1-4, characterized in that it is connected to the face-down.

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