JP4149100B2 - Electronic component heatsink - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention attaches electronic components that generate heat, such as transistors, ICs, LSIs, diodes, thyristors, etc., and conducts heat transfer from these electronic components to dissipate heat from the heat dissipation fins. It is about a vessel.
[0002]
[Prior art]
FIG. 3 is a perspective view in the middle of assembling a conventional heat radiator for an electronic component, and a plurality of parallel grooves 10a formed on a plane of a metal substrate 10 such as right-angled quadrilateral aluminum are made of a metal plate such as aluminum. One side edge 11a of the plurality of radiating fins 11 is fitted and fixed, and the other side edge 11b of the radiating fin 11 is fitted into a plurality of parallel grooves 12a formed on a plane inside the cover member 12 such as aluminum. The heat sink of the electronic component is assembled by fixing the metal side plates 13 and 13 such as aluminum to the both end faces 10b of the metal substrate 10 and the both end faces 12b of the cover member 12 with screws 14.
An electronic component (not shown) is attached to the outer surface 10c of the metal substrate 10 or the outer surface 12c of the cover member 12.
[0003]
[Problems to be solved by the invention]
In the conventional electronic component radiator as described above, there are many constituent members of the radiator, and the metal side plates 13 and 13 are screwed on the both end faces 10b of the metal substrate 10 and the both end faces 12b of the cover member 12. Therefore, there is a problem that the assembly of the heat radiator for the electronic parts is troublesome and the manufacturing cost becomes high.
An object of the present invention is to provide a radiator for an electronic component that has few components, is easy to assemble, and can be manufactured at low cost.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is characterized in that a right-sided quadrilateral metal substrate 1 in which a plurality of parallel grooves 1a are formed on a plane and one side edge 2a is fitted and fixed to each of the grooves 1a. A plurality of heat radiating fins 2 made of a metal plate to be implanted and a plurality of parallel grooves 3a into which the other side edges 2b of the heat radiating fins 2 are fitted are formed in a metal cross section formed on the inner plane. Ends of both side pieces 3b of the cover member 3 which are formed by a gate-shaped cover member 3 and are covered with the other side edges 2b of the plurality of radiating fins 2 planted on the plane of the metal substrate 1 The radiator of the electronic component is characterized by being assembled so that the portion 3b 'is engaged with both end faces 1b of the metal substrate.
[0005]
The electronic component according to claim 1, wherein the cover member 3 is assembled and configured so as to cover all of the other side edges 2 b of the plurality of radiating fins 2. This is a radiator.
[0006]
Further, in the invention according to claim 3, the cover member 3 is assembled and configured to cover a part of the other side edge 2b of the plurality of radiating fins 2. It is a component heatsink.
[0007]
By configuring the electronic component like the radiator of the invention according to the first to third aspects, the number of constituent members is reduced and the assembly is simplified, so that the manufacturing cost is reduced.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a radiator for an electronic component according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of a radiator for an electronic component of the present invention, and FIG. 2 is a perspective view showing the second embodiment.
[0009]
As shown in FIG. 1, a first embodiment of a radiator for an electronic component according to the present invention includes a metal substrate 1 such as right-angled quadrilateral aluminum in which a plurality of parallel grooves 1a are formed on a plane, A plurality of radiating fins 2 made of a metal plate such as aluminum and planted with one side edge 2a fitted and fixed to the groove 1a, and a plurality of parallel grooves into which the other side edge 2b of the radiating fin 2 is fitted. 3a includes a cover member 3 having a gate shape of a cross section made of metal such as aluminum formed on an inner plane.
Then, one side edge 2a of the plurality of radiating fins 2 is fitted and fixed in a plurality of parallel grooves 1a formed on the plane of the metal substrate 1. Further, a plurality of parallel grooves 3 a formed on the inner surface of the cover member 3 are fitted to the other side edges 2 b of the plurality of planted heat radiation fins 2, and the other side edges of the heat radiation fins 2 are fitted. In addition to covering all 2b, it is assembled so that tip portions 3b 'of both side pieces 3b of the cover member 3 are engaged with both end faces 1b of the metal substrate 1, thereby constituting a radiator of an electronic component.
[0010]
In addition, as shown in FIG. 2, the second embodiment of the electronic component radiator of the present invention is provided on the other side edge 2b of the plurality of radiating fins 2 planted on the plane of the metal substrate 1. The plurality of parallel grooves 3 a formed on the inner plane of the cover member 3 are fitted to cover a part of the other side edge 2 b of the plurality of heat radiation fins 2, that is, the plurality of heat radiation fins 2. It is assembled so as to cover both side portions along the row to constitute a heat radiator for electronic components.
[0011]
In order to fit and fix one side edge 2a of the radiating fin 2 in a parallel groove 1a on the plane of the metal substrate 1, the one side edge 2a can be easily fitted from above. After the grooves 1a are formed and one side edge 2a of each radiating fin 2 is fitted to each groove 1a, the groove 1a can be fitted and fixed by pressing with a pressing tool. As another embodiment of fitting and fixing one side edge 2a of the radiating fin 2 to the groove 1a on the flat surface 1, the one side edge 2a of the radiating fin 2 is connected to the groove 1a via an adhesive or "wax". It can also be fitted and glued or “brazed” to secure.
Further, the groove 3a formed on the inner plane of the cover member 3 having the cross-sectional gate shape can be easily fitted to the other side edges 2b of the plurality of radiating fins 2 planted on the plane of the metal substrate 1. In addition, in this embodiment, it is formed in a semicircular shape.
As an embodiment in which the tip portions 3b 'of both side pieces 3b of the cover member 3 are engaged with both end surfaces 1b of the metal substrate 1, as shown in FIGS. Are formed on the both ends 1b of the metal substrate 1 to form a recess in which the tip 3b 'is fitted, and the other side edges of the plurality of radiating fins 2 planted on the plane of the metal substrate 1 are formed. The groove 3a formed on the inner surface of the cover member 3 is fitted into 2b, and the tip 3b 'of the both side pieces 3b is fitted into the recesses of the both end faces 1b of the metal substrate 1 while being bent. However, the present invention is not limited to this, and may be reversed.
An electronic component (not shown) is attached to the outer surface 1 c of the metal substrate 1.
[0012]
By configuring as in the inventions according to claims 1 to 3, the constituent members are the metal substrate 1, the heat radiating fins 2, and the cover member 3 having a cross-sectional gate shape. One side edge 2a of the plurality of heat radiation fins 2 is fitted and fixed in a plurality of parallel grooves 1a formed on a plane, and the cover member 3 is formed on the other side edge 2b of the plurality of heat radiation fins 2. A heat radiator for an electronic component can be obtained simply by engaging the groove 3a formed on the inner flat surface of the cover member 3 and engaging the front end portions 3b 'of both side pieces 3b of the cover member 3 with both end surfaces 1b of the metal substrate 1. Manufacturing cost can be reduced.
[0013]
【The invention's effect】
By constructing a radiator of an electronic component as in the inventions according to claims 1 to 3, the constituent members are the three points of the metal substrate, the radiation fins, and a cross-sectional gate-shaped cover member, and the heat radiation. One side edge of the fin is fitted and fixed in a plurality of parallel grooves formed on the plane of the metal substrate, and the other side edge of the heat radiating fin is the inner side of the cover member having a cross section made of metal. The radiator of the electronic component can be easily assembled by engaging the front ends of both side pieces of the cover member with the both end faces of the metal substrate.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a radiator for an electronic component according to a second aspect of the present invention.
FIG. 2 is a perspective view showing an embodiment of a radiator for an electronic component according to a third aspect of the present invention.
FIG. 3 is a perspective view in the middle of assembly of a conventional electronic component radiator.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal substrate 1a Groove 1b Both-ends surface 1c Outer surface 2 Radiation fin 2a One side edge 2b Other side edge 3 Cross-sectional portal cover member 3a Groove 3b Both side piece 3b 'Tip part

Claims (3)

A metal substrate having a right-handed quadrilateral shape in which a plurality of parallel grooves are formed on a plane, a plurality of heat dissipating fins made of a metal plate planted by fitting and fixing one side edge of each groove, and A plurality of parallel grooves into which the other side edges are fitted are made of a metal cross-sectional gate-shaped cover member formed on the inner plane,
The front ends of both side pieces of the cover member covered with the other side edges of the plurality of radiating fins planted on the plane of the metal substrate are engaged with both end surfaces of the metal substrate. An electronic component radiator characterized by being assembled. 2. The radiator for an electronic component according to claim 1, wherein the cover member is assembled and configured to cover all of the other side edges of the plurality of radiation fins. 2. The radiator for an electronic component according to claim 1, wherein the cover member is assembled so as to cover a part of the other side edge of the plurality of heat radiation fins.

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