JP4144230B2 - Contact structure, contact switch, measuring device and radio - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a contact structure and a contact switch using the contact structure, and is used, for example, in an IC tester, a measuring device such as a semiconductor manufacturing apparatus, a wireless device such as a mobile phone and a PDA.
[0002]
[Prior art]
As an example of an electrostatic microrelay to which a conventional contact structure is applied, there is a configuration shown in FIG. 11 (published in Japanese Patent Laid-Open No. 2000-113792).
[0003]
In this electrostatic micro relay 101, the movable substrate 103 is elastically supported above the connection pads 102 a provided on the upper surface of the fixed substrate 102, the fixed electrode 102 b formed on the upper surface of the fixed substrate 102, and the lower surface of the movable substrate 103. The movable electrode 103a is opposed. The movable substrate 103 and the movable electrode 103a may be made of the same member.
[0004]
The movable substrate 103 has a movable contact portion 105 supported by the support portion 104 at the center, and the movable substrate 103 in the opposite portion on the signal line 102c on the upper surface of the fixed substrate 102 improves high frequency characteristics. In order to achieve this, a portion facing the signal line 102c excluding the support portion 104 and the movable contact portion 105 is cut off.
[0005]
Then, a voltage is applied between the electrodes 102b and 103a to generate an electrostatic attractive force, and the movable electrode 103a is attracted to the fixed electrode 102b, so that the movable substrate 103 is bent and the movable contact 106 is paired with a pair of fixed contacts. It is designed to close across 102d. The movable contact 106 is formed in advance on the lower surface of the movable contact portion 105 that is swingably supported by the support portion 104. In addition, the pair of fixed contacts 102d is formed in advance at the opposing ends of the pair of signal lines 102c.
[0006]
By closing the contact between the movable contact 106 and the pair of fixed contacts 102d, the signal is transmitted from the fixed contact 102d to the movable contact 106 through one signal line 102c, and is further transmitted from the other fixed contact 102d via the movable contact 106. Is transmitted to line 102c. The fixed electrode 102d is also used as the GND of the signal line 102c.
[0007]
[Problems to be solved by the invention]
In the electrostatic microrelay 101 of the above-described prior art, the cross section when the contact between the movable contact 106 and the pair of fixed contacts 102d is closed is expressed by closing the AA cross section and the BB cross section of FIG. The configuration is as shown in FIG.
[0008]
In FIG. 12, the lower surface of the movable contact 106 is in contact with the upper surfaces of a pair of opposing fixed contacts 102d, the movable contact 106 is bridged over the fixed contact 102d, and a space R is formed between the fixed contacts 102d. .
[0009]
Here, a high-frequency signal exceeding 1 GHz passes through the surface of the conductor due to the skin effect. Therefore, in the above-described electrostatic micro relay 101, a high-frequency signal exceeding 1 GHz passes through the upper surface, the side surface, and the lower surface of the signal line 102c, and has a fixed characteristic impedance with a constant characteristic impedance that matches the signal line 102c. Head to 102d.
[0010]
However, as shown in FIG. 12, when the contact is closed, the high-frequency signal moves toward the space R between the fixed contacts 102d when moving from the fixed contact 102d to the movable contact 106, and thus the signal line 102c that has been passed so far. In addition, the side surface and the lower surface of the fixed contact 102d are suddenly lost, and mismatching occurs.
[0011]
In other words, when the contact is closed, the DC signal passes through the contact portion between the closed fixed contact 102d and the movable contact 106 without loss, but the high-frequency signal passes through the space R between the two signal lines 102c as shown in FIG. As a result, mismatching occurs in the characteristic impedance of the transmission line, the radiation state of the electric field with GND changes, and the high-frequency characteristics deteriorate.
[0012]
The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is an excellent structure and a high-frequency characteristic with a simple structure, low signal loss at the time of passing through a contact that can be easily manufactured. To provide a contact structure, a contact switch, a measuring device, and a radio.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, in the contact structure of the present invention, a fixed substrate, a movable substrate provided to face the fixed substrate, and moved by being sucked by the fixed substrate, and the movable substrate anda movable contact supported in projecting the movable contact a contact structure to separably across the pair of fixed contacts of the fixed substrate, said movable contact point is on the fixed substrate side and has a high-frequency signal transmission unit is a convex portion were the high-frequency signal transmission section, Oite during contact closing, so as to reduce the impedance mismatch between the fixed contact, the gap between the pair of fixed contacts characterized the Turkey be located.
[0014]
According to this, since the high-frequency signal transmission unit is located in the gap between the pair of fixed contacts and the high-frequency signal passes through the high-frequency signal transmission unit, mismatching of the characteristic impedance of the transmission line is reduced and the high-frequency characteristic is improved.
[0015]
It is preferable that the high-frequency signal transmission unit is not in contact with the pair of fixed contacts when the contacts are closed.
[0016]
According to this, it is possible to prevent the operation of the actuator that contacts and separates the fixed contact from the movable contact due to friction caused by the high-frequency signal transmission unit coming into contact with the fixed contact.
[0017]
The high-frequency signal transmission unit preferably contacts the pair of fixed contacts when the contact is closed.
[0018]
According to this, the high-frequency signal becomes easier to pass through the high-frequency signal transmission unit, mismatching of the characteristic impedance of the transmission line is further reduced, and the high-frequency characteristic is improved.
[0021]
The high frequency signal transmission unit, it is preferable to be sandwiched between front Symbol pair of fixed contacts when the contacts are closed.
[0022]
According to this, the high-frequency signal transmission unit can contact the pair of fixed contacts when the contacts are closed.
[0023]
It is preferable that the high-frequency signal transmission unit is made of a material different from that of the main body of the movable contact.
[0024]
According to this, the accuracy of the manufacturing process is improved due to the difference in material.
[0025]
Preferably, the high-frequency signal transmission unit is formed of the same material as the pair of fixed contacts.
[0026]
According to this, the specific resistance of the transmission line can be matched between the fixed contact and the high-frequency signal transmission unit, mismatching of the characteristic impedance of the transmission line is further reduced, and the high-frequency characteristic is improved.
[0027]
In the contact switch of the present invention,
Provided with the above contact structure,
The pair of fixed contacts is electrically opened and closed by bringing the movable contact into and out of contact with the pair of fixed contacts.
[0028]
According to this, electrical opening and closing can be performed satisfactorily. Here, as the contact switch, a contacted microrelay or switch having a movable contact straddling a pair of fixed contacts is shown. For example, examples of the micro relay include an electrostatic micro relay, a piezoelectric micro relay, a thermally driven micro relay, a shape memory alloy micro relay, and a magnetic micro relay depending on the driving method.
[0029]
In the measuring device of the present invention,
The above contact structure is provided.
[0030]
According to this, the micro relay having the above contact structure is used in, for example, a measuring device such as an IC tester or a semiconductor manufacturing device, and can open and close a signal between the measuring object and the measuring device.
[0031]
In the radio of the present invention,
The above contact structure is provided.
[0032]
According to this, the micro relay or the like having the above contact structure is used in, for example, a wireless device such as a mobile phone and a PDA, and can open and close a radio wave signal.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
Exemplary embodiments of the present invention will be described below in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention only to those unless otherwise specified. Absent.
[0034]
In addition, although embodiment demonstrates the example which applied the contact structure of this invention to the electrostatic micro relay, others, for example, a piezoelectric micro relay, a heat drive micro relay, a shape memory alloy micro relay, a magnetic micro relay, a switch, etc. Even if applied to a contact switch with no contact, the same effect is exhibited.
[0035]
(First embodiment)
The electrostatic micro relay according to the present embodiment will be described with reference to FIG. The electrostatic micro relay according to the present embodiment is schematically configured as shown in FIG.
[0036]
In this electrostatic micro relay 101, the movable substrate 103 is elastically supported above the connection pads 102 a provided on the upper surface of the fixed substrate 102, the fixed electrode 102 b formed on the upper surface of the fixed substrate 102, and the lower surface of the movable substrate 103. The movable electrode 103a is opposed. The movable substrate 103 and the movable electrode 103a may be made of the same member.
[0037]
The movable substrate 103 has a movable contact portion 105 supported by the support portion 104 at the center, and the movable substrate 103 in the opposite portion on the signal line 102c on the upper surface of the fixed substrate 102 improves high frequency characteristics. In order to achieve this, a portion facing the signal line 102c excluding the support portion 104 and the movable contact portion 105 is cut off.
[0038]
Then, a voltage is applied between the electrodes 102b and 103a to generate an electrostatic attractive force, and the movable electrode 103a is attracted to the fixed electrode 102b, so that the movable substrate 103 is bent and the movable contact 106 is paired with a pair of fixed contacts. It is designed to close across 102d. The movable contact 106 is formed in advance on the lower surface of the movable contact portion 105 that is swingably supported by the support portion 104. In addition, the pair of fixed contacts 102d is formed in advance at the opposing ends of the pair of signal lines 102c.
[0039]
By closing the contact between the movable contact 106 and the pair of fixed contacts 102d, the signal is transmitted from the fixed contact 102d to the movable contact 106 through one signal line 102c, and is further transmitted from the other fixed contact 102d via the movable contact 106. Is transmitted to line 102c. The fixed electrode 102d is also used as the GND of the signal line 102c.
[0040]
In the electrostatic micro relay 101 according to the above-described embodiment, the cross section of the movable contact 106 and the pair of fixed contacts 102d when the contact is closed is shown by the AA cross section and the BB cross section of FIG. The configuration as shown in FIG.
[0041]
As shown in FIG. 1, the end of the lower surface of the movable contact 106 contacts the upper surface of a pair of opposed fixed contacts 102d, and the main body of the flat movable contact 106 bridges across the fixed contact 102d. ing. As a feature of the present invention, the movable contact 106 is formed with a convex portion 106a as a high-frequency signal transmission portion that protrudes from the lower surface of the main body to the fixed contact 102d. That is, the convex part 106a located in the area | region S between a pair of fixed contacts 102d at the time of closing is provided.
[0042]
The convex portion 106a is separated from the opposing end surfaces of the pair of fixed contacts 102d, and is in a non-contact state with the fixed contact 102d even when the contacts are closed.
[0043]
For this reason, friction does not occur between the convex portion 106a and the fixed contact 102d that are in a non-contact state, and the operation of the actuator that contacts and separates the fixed contact 102d that opens and closes the contact and the movable contact 106 is prevented. Absent.
[0044]
Here, a high-frequency signal exceeding 1 GHz passes through the surface of the conductor due to the skin effect. Therefore, in the above-described electrostatic micro relay 101, a high-frequency signal exceeding 1 GHz passes through the upper surface, the side surface, and the lower surface of the signal line 102c, and has a fixed characteristic impedance with a constant characteristic impedance that matches the signal line 102c. Head to 102d.
[0045]
As shown in FIG. 1, when the contact is closed, the high-frequency signal passes through the convex portion 106a toward the convex portion 106a between the fixed contacts 102d when moving from the fixed contact 102d to the movable contact 106. Thus, the side and bottom surfaces of the signal line 102c and the fixed contact 102d that have passed so far are not suddenly lost, mismatching of the characteristic impedance of the transmission line is reduced, and high-frequency characteristics are improved.
[0046]
(Evaluation test)
In order to confirm the above effects, the electrostatic microrelay shown in FIG. 2 was produced and evaluated.
[0047]
In the evaluation test, the thickness of the signal line 102c is set to 2.2 μm and the thickness of the fixed electrode 102b which is the GND on the fixed substrate 102 facing the convex portion 106a is set to 0.5 μm in the electrostatic micro relay shown in FIG. The thickness t of the convex portion 106a protruding from the movable contact main body contacting the fixed contact 102d of the movable contact 106 is changed between 0 to 1.7 μm, and a high-frequency signal (2 GHz sine wave, 1 dBm signal ( This is a power signal of 1 dBm = 1 mW, which is equivalent to about 0.224 V in the case of a 50Ω high-frequency transmission line in terms of voltage.
[0048]
Here, the evaluation was judged by the magnitude of insertion loss = 10 log (Pout (high-frequency output on the signal line 102c after passing through the contact) / Pin (high-frequency input on the signal line 102c before passing through the contact))). .
[0049]
The results of the evaluation test are shown in FIG. As shown in FIG. 3, the insertion loss decreased from −0.3 dB to about −0.175 dB as the thickness t of the convex portion 106a of the movable contact 106 increased.
[0050]
In the case of the high frequency used here, the general insertion loss specification is in the range of -0.5 to -1.0 dB.
[0051]
As described above, by adopting the configuration of the first embodiment, it was confirmed that the mismatch of the characteristic impedance of the transmission line was reduced and the high frequency characteristics were improved.
[0052]
(Production method of convex part)
Below, the manufacturing method of the convex part 106a is demonstrated. Here, two types of methods with different manufacturing methods will be described. In the following description, for the convenience of the manufacturing method, the convex portion 106a is formed upward, contrary to the actual usage state where the convex portion 106a faces downward.
[0053]
(First manufacturing method A)
The first manufacturing method A will be described with reference to FIG. In this manufacturing method, the convex portion 106 a is manufactured using the same kind of material as that of the main body of the movable contact 106.
[0054]
(A1)
First, the Si substrate 401 of the movable contact portion 105 that has the movable contact 106 is prepared (FIG. 4A).
[0055]
(A2)
Au 402 to be the movable contact 106 is sputtered on the Si substrate 401 (FIG. 4B).
[0056]
(A3)
Further, a resist 403 is applied on the Au 402 by the width of the movable contact 106 (FIG. 4C).
[0057]
(A4)
The region where the resist 403 is not applied is etched to remove Au in the region where the resist 403 is not applied (FIG. 4D).
[0058]
(A5)
The resist 403 is removed to expose Au (FIG. 4E).
[0059]
(A6)
A resist 404 is applied on the exposed Au by the width of the convex portion 106a (FIG. 4F).
[0060]
(A7)
The region where the resist 404 is not applied is etched, and the Au in the region where the resist 404 is not applied is removed to a thickness that becomes the main body of the predetermined movable contact 106 (FIG. 4G).
[0061]
(A8)
The resist 404 was removed, Au was exposed, and the convex part 106a was produced (FIG.4 (h)).
[0062]
With the first manufacturing method A described above, the convex portion 106 a can be made of the same material as the main body of the movable contact 106.
[0063]
For example, if the signal line 102c and the movable contact 106 are made of the same material, the specific resistance of the transmission line can be matched between the fixed contact 102d and the convex portion 106a, and mismatching of the characteristic impedance of the transmission line is further reduced. The effect of improving the high frequency characteristics can be exhibited.
[0064]
(Second production method B)
The second manufacturing method B will be described with reference to FIG. In this manufacturing method, the convex portion is manufactured using a material different from that of the main body of the movable contact 106.
[0065]
(B1)
First, the Si substrate 501 of the movable contact portion 105 that will have the movable contact 106 is prepared (FIG. 5A).
[0066]
(B2)
On the Si substrate 501, Ru502 serving as the main body of the movable contact 106 and Au 503 serving as the convex portion 106a of the movable contact 106 are sequentially sputtered (FIG. 5B).
[0067]
(B3)
A resist 504 is applied on the Au 503 by the width of the main body of the movable contact 106 (FIG. 5C).
[0068]
(B4)
The region where the resist 504 is not applied is etched to remove Au and Ru in the region where the resist 504 is not applied (FIG. 5D).
[0069]
(B5)
The resist 504 is removed to expose Au (FIG. 5E).
[0070]
(B6)
A resist 505 is applied on the exposed Au by the width of the convex portion 106a (FIG. 5F).
[0071]
(B7)
The region where the resist 505 is not applied is etched, and Au in the region where the resist 505 is not applied is removed to expose Ru (FIG. 5G).
[0072]
(B8)
The resist 505 was removed, Au was exposed, and the convex part 106a was produced (FIG.5 (h)).
[0073]
In the second manufacturing method B described above, the convex portion 106 a can be made of a material different from that of the main body of the movable contact 106. For this reason, the accuracy of the manufacturing process is improved due to the difference in materials.
[0074]
Similarly to the first manufacturing method A, for example, if the signal line 102c and the convex portion 106a of the movable contact 106 are made of the same material, the fixed contact 102d and the convex portion 106a can match the specific resistance of the transmission line. Thus, the mismatch of the characteristic impedance of the transmission line can be further reduced, and the high frequency characteristics can be improved.
[0075]
(Other embodiments)
Below, the other structure of the high frequency signal transmission part which is the characterizing part of this invention is demonstrated. In the following description, only the features that are different from the first embodiment will be described, and the other configurations are the same as those of the first embodiment, and the description thereof will be omitted.
[0076]
(Second Embodiment)
In the configuration of FIG. 6, the movable contact 106 has a convex portion 106b as a high-frequency signal transmission unit, as in the first embodiment. Further, in the configuration of FIG. 6, the convex portion 106b is in contact with the fixed contact 102d.
[0077]
In the present embodiment, the cross section of the electrostatic micro relay 101 when the movable contact 106 and the pair of fixed contacts 102d are closed is expressed by closing the AA cross section and the BB cross section of FIG. The configuration is as shown in FIG.
[0078]
As shown in FIG. 6, the lower surface of the main body of the movable contact 106 is in contact with the upper surfaces of a pair of opposing fixed contacts 102d, and the main body of the plate-shaped movable contact 106 is bridged across the fixed contact 102d. As a feature of the present invention, the movable contact 106 is formed with a convex portion 106b as a high-frequency signal transmission portion that protrudes from the lower surface of the main body to the fixed contact 102d.
[0079]
The convex portion 106b has a shape that is rounded from the side surface toward the apex, and a part of the convex portion 106b comes into contact with the opposing tapered end surfaces of the pair of fixed contacts 102d.
[0080]
The tapered end surface of the fixed contact 102d has a shape that increases the distance between the pair of fixed contacts 102d as the movable contact 106 is approached.
[0081]
For this reason, a high-frequency signal is more likely to pass between the projecting portion 106b and the fixed contact 102d that are in contact with each other, mismatching of the characteristic impedance of the transmission line is further reduced, and high-frequency characteristics are improved.
[0082]
(Third embodiment)
In the configuration of FIG. 7, the movable contact 106 has a convex portion 106 c as a high-frequency signal transmission unit as in the first embodiment. Further, in the configuration of FIG. 7, the convex portion 106c is in contact with the fixed contact.
[0083]
In the present embodiment, the cross section of the electrostatic micro relay 101 when the movable contact 106 and the pair of fixed contacts 102d are closed is expressed by closing the AA cross section and the BB cross section of FIG. The configuration is as shown in FIG.
[0084]
As shown in FIG. 7, the lower surface of the main body of the movable contact 106 is in contact with the upper surfaces of a pair of opposed fixed contacts 102d, and the main body of the plate-shaped movable contact 106 is bridged across the fixed contact 102d. As a feature of the present invention, the movable contact 106 is formed with a convex portion 106c as a high-frequency signal transmission portion that projects from the lower surface of the main body to the fixed contact 102d.
[0085]
The convex portion 106c has a tapered side surface that comes into contact with the opposing tapered end surfaces of the pair of fixed contacts 102d.
[0086]
The tapered end surface of the fixed contact 102d has a shape that increases the distance between the pair of fixed contacts 102d as the movable contact 106 is approached.
[0087]
For this reason, there is no gap between the projecting portion 106c and the fixed contact 102d in contact with each other, so that the high-frequency signal is more easily transmitted than in the second embodiment, and mismatching of the characteristic impedance of the transmission line is caused. More reduced and high frequency characteristics are improved.
[0088]
(Fourth embodiment)
In the configuration of FIG. 8, the high-frequency signal transmission unit 106d is in contact with the fixed contact 102d.
[0089]
In the present embodiment, the cross section of the electrostatic micro relay 101 when the movable contact 106 and the pair of fixed contacts 102d are closed is expressed by closing the AA cross section and the BB cross section of FIG. The configuration is as shown in FIG.
[0090]
As shown in FIG. 8, as a feature of the present invention, a high-frequency signal transmission unit 106 d is laminated and provided on the entire lower surface of the movable contact 106.
[0091]
The high-frequency signal transmission unit 106d has tapered side surfaces that come into contact with the opposing tapered end faces of the pair of fixed contacts 102d.
[0092]
In other words, in the present embodiment, the movable contact 106 has a contact structure in which the main body of the movable contact 106 does not contact the fixed contact 102d and the high-frequency signal transmission unit 106d contacts the fixed contact 102d.
[0093]
The tapered end surface of the fixed contact 102d has a shape that increases the distance between the pair of fixed contacts 102d as the movable contact 106 is approached.
[0094]
For this reason, in this embodiment, although the main body of the movable contact 106 does not contact the fixed contact 102d, the high-frequency signal transmission unit 106d and the fixed contact 102d are assembled with no gap, so that the DC signal can be passed. The high-frequency signal becomes easier to pass, mismatching of the characteristic impedance of the transmission line is further reduced, and the high-frequency characteristic is improved.
[0095]
(Application to various devices)
Next, the case where the micro relay using the said embodiment is applied to various apparatuses is demonstrated.
[0096]
(Application to measuring equipment)
The case where the micro relay of the said embodiment is applied to a measuring device is demonstrated.
[0097]
Examples of such a measuring device include an IC tester and a semiconductor manufacturing device. An IC tester is a device that measures IC characteristics.
[0098]
The IC tester is a large-scale facility in which an oscilloscope and a multimeter are further arrayed, and the floor area is about 2 or 3 tatami mats.
[0099]
The number of micro relays used in the IC tester is also as large as 5,000 to 10,000.
[0100]
In addition, the semiconductor manufacturing apparatus is classified as a measurement apparatus because it is assumed to be used for a measurement unit in the apparatus.
[0101]
Here, an internal configuration of a measuring apparatus using one embodiment of the electrostatic micro relay according to the present invention will be described with reference to FIG. FIG. 9 is a block diagram of an internal configuration of a measuring apparatus using one embodiment of the electrostatic micro relay according to the present invention.
[0102]
In the measuring device 901 shown in FIG. 9, an electrostatic micro relay 903 is connected to each signal line from the internal circuit 902 to a measurement object (not shown), and each electrostatic micro relay 903. The measurement object can be switched by turning on and off.
[0103]
As described above, in the microrelay of the above-described embodiment, mismatching of the characteristic impedance of the transmission line can be reduced and the high frequency characteristics can be improved.
[0104]
Therefore, when the microrelay of the above embodiment is used in a measuring device, the characteristics of the measuring device itself can be improved in accordance with the improvement of the characteristics of the microrelay using the above embodiment.
[0105]
(Application to radio)
The case where the micro relay of the said embodiment is applied to a radio | wireless machine is demonstrated.
[0106]
Examples of such a radio device include a mobile phone and a PDA.
[0107]
As described above, in the microrelay of the above-described embodiment, mismatching of the characteristic impedance of the transmission line can be reduced and the high frequency characteristics can be improved.
[0108]
Therefore, when the microrelay of the above embodiment is used for a radio, the characteristics of the radio itself can be improved in accordance with the improvement of the characteristics of the microrelay used in the above embodiment.
[0109]
Here, an internal configuration of a radio using one embodiment of the electrostatic micro relay according to the present invention will be described with reference to FIG. FIG. 10 is a block diagram of an internal configuration of a radio using one embodiment of the electrostatic microrelay according to the present invention described above.
[0110]
In the wireless device 1001, the electrostatic micro relay 1003 is connected between the internal circuit 1002 and the antenna 1004, and the internal circuit 1002 can transmit and receive through the antenna 1004 by turning on and off the electrostatic micro relay 1003. And a state in which switching between a state in which transmission and reception cannot be performed is possible.
[0111]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a contact structure, a contact switch, a measuring device, and a radio device that have a simple structure, are inexpensive and can be easily manufactured, have low signal loss when passing through the contact, and have excellent high frequency characteristics. it can.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a contact configuration of an electrostatic micro relay according to a first embodiment.
FIG. 2 is a diagram showing a configuration of an electrostatic microrelay for performing an evaluation test of the first embodiment.
FIG. 3 is a graph showing test results of the evaluation test of the first embodiment.
FIG. 4 is a diagram showing a method for manufacturing a movable contact.
FIG. 5 is a diagram showing a method for manufacturing a movable contact.
FIG. 6 is a cross-sectional view showing a contact configuration of an electrostatic micro relay according to a second embodiment.
FIG. 7 is a cross-sectional view showing a contact configuration of an electrostatic micro relay according to a third embodiment.
FIG. 8 is a cross-sectional view showing a contact configuration of an electrostatic micro relay according to a fourth embodiment.
FIG. 9 is a block diagram of an internal configuration of a measuring apparatus using one embodiment of an electrostatic micro relay.
FIG. 10 is a block diagram of an internal configuration of a radio using one embodiment of an electrostatic micro relay.
FIG. 11 is a perspective view showing an electrostatic micro relay.
FIG. 12 is a cross-sectional view showing a contact configuration of a conventional electrostatic micro relay.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 101 Electrostatic micro relay 102 Fixed board | substrate 102a Connection pad 102b Fixed electrode 102c Signal line 102d Fixed contact 103 Movable board 103a Movable electrode 104 Support part 105 Movable contact part 106 Movable contact 106a Convex part 106b Convex part 106c Convex part 106d High frequency signal transmission part 901 Measuring device 902 Internal circuit 903 Electrostatic micro relay 1001 Radio 1002 Internal circuit 1003 Electrostatic micro relay 1004 Antenna

Claims (9)

A fixed substrate;
A movable substrate that is provided facing the fixed substrate and moves by being sucked by the fixed substrate ;
A movable contact supported by the movable substrate ;
Have
A contact structure that enables the movable contact to be contacted and separated across a pair of fixed contacts of the fixed substrate,
The movable contact point has a high-frequency signal transmission section is a protrusion that protrudes on the fixed substrate,
The high frequency signal transmission unit, Oite during contact closing, so as to reduce the impedance mismatch between the fixed contact, you position in the gap between the pair of fixed contacts
Contact structure, wherein a call.   The contact structure according to claim 1, wherein the high-frequency signal transmission unit is not in contact with the pair of fixed contacts when the contact is closed.   The contact structure according to claim 1, wherein the high-frequency signal transmission unit contacts the pair of fixed contacts when the contact is closed. The high frequency signal transmission section, the contact structure according to claim 3, characterized in that it is sandwiched between front Symbol pair of fixed contacts when the contacts are closed. The high frequency signal transmission section, the contact structure according to any one of claims 1 to 4, characterized in that said main body of the movable contact are formed of different materials. The high frequency signal transmission section, the contact structure according to any one of claims 1 to 4, characterized in that it is formed of the same material as the pair of fixed contacts. The contact structure according to any one of claims 1 to 6 ,
A contact switch that electrically opens and closes the pair of fixed contacts by bringing the movable contact into and out of contact with the pair of fixed contacts. Measuring device characterized by comprising a contact structure according to any one of claims 1 to 6. Radio, characterized in that it comprises a contact structure according to any one of claims 1 to 6.

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