JP4100404B2 - Contact support mechanism, contact switch, measuring device and radio - Google Patents

Description

  The present invention relates to a contact support mechanism and a contact switch using the contact support mechanism, and is used, for example, in an IC tester, a measuring device such as a semiconductor manufacturing apparatus, a radio device, or the like.

  Conventionally, as an example of an electrostatic micro relay to which a contact support mechanism is applied, there is a configuration shown in FIG. 14 (published in Japanese Patent Laid-Open No. 2000-113792).

  In this electrostatic micro relay 101, the movable substrate 103 is elastically supported above the connection pads 102 a provided on the upper surface of the fixed substrate 102, the fixed electrode 102 b formed on the upper surface of the fixed substrate 102, and the lower surface of the movable substrate 103. The movable electrode 103a is opposed. The movable substrate 103 and the movable electrode 103a may be made of the same member.

  In order to improve the high-frequency characteristics, the movable substrate 103 has a movable contact portion 105 supported by the support portion 104 at the center, and the movable substrate 103 in the opposite portion on the wiring 102c on the upper surface of the fixed substrate 102. Is cut off at portions other than the support portion 104 and the movable contact portion 105.

  Then, a voltage is applied between the electrodes 102b and 103a to generate an electrostatic attractive force, and the movable electrode 103a is attracted to the fixed electrode 102b, so that the movable substrate 103 is bent and the movable contact 105a becomes the fixed contact 102d. It comes to be closed. The movable contact 105a is formed in advance on the lower surface of the movable contact 105 supported by the support 104 and the fixed contact 102d is formed in advance on the opposite end of the wiring 102c.

In the case of the contact structure shown in FIG. 14, the support portions 104 on both sides that support the movable contact portion 105 are arranged on the same straight line that passes through the contact barycenter at the center of the movable contact portion 105. In this case, although the force is evenly distributed to the pair of fixed contacts 102d on both sides of the so-called double break contact, the contact portion contact force / breaking force is provided because the support portion 104 is far from either of the pair of fixed contacts 102d. There was a loss.
JP 2000-113792 A

  The above-mentioned electrostatic micro relay has problems in contact reliability and welding resistance, such as an increase in contact resistance due to insufficient contact force when the contact is closed, and adhesion and welding occur when the contact is opened.

  In order to improve the contact reliability and the welding resistance, it is necessary to increase the adsorption force and the elastic return force so that the contact can be reliably closed and opened.

  For this purpose, it is necessary to increase the electrostatic attractive force generated between the two electrodes, the drive voltage (voltage applied between the electrodes), the expansion of the opposing electrode area, the narrowing of the gap size of the electrode, or It must be dealt with by using electrets. As a result, the occupied volume is increased, the contact withstand voltage is lowered, the structure and the processing process are complicated, and the cost is increased.

The present invention has been made to solve the above-described problems of the prior art, and the object of the present invention is to provide a contact structure with a simple structure, which can be easily and inexpensively manufactured without causing an increase in size. An object of the present invention is to provide a contact support mechanism, a contact switch, a measuring device, and a radio device that have excellent welding resistance.

In order to achieve the above object, in the contact support mechanism of the present invention, the movable contact portion arranged in a rectangular plate shape of the movable substrate opposed to the fixed substrate and straddling the position facing the two fixed contacts is provided. A contact support mechanism for supporting the fixed contact of the fixed substrate in a detachable manner,
A movable substrate having a first elastic support portion provided on each of the left and right sides of the movable contact portion and a rectangular movable electrode having the same size as the left and right elastically supported by the first elastic support portion; The electrode elastically supports the movable contact portion from both sides with a second elastic support portion, and the second elastic support portion supports a position shifted from the center of the movable contact portion of the movable contact portion when the movable contact portion is separated. The second elastic support portion has a left-right asymmetric shape with the movable contact portion at the center , and is connected to an end portion that is a contact portion that contacts each fixed contact of the movable contact portion. It is characterized by that.

  According to this, the second elastic support portion supports the vicinity of the contact portion of the movable contact portion with respect to the fixed contact so that the contact force is sufficiently transmitted from the second elastic support portion when the contact is closed, and the second elastic support portion when the contact is opened. The peeling force can be transmitted from the elastic support portion, and the contact reliability and welding resistance are improved.

  The contact switch according to the present invention includes the contact support mechanism described above, and electrically opens and closes the movable contact portion and the fixed contact by bringing the movable contact portion into and out of contact with the fixed contact. It is characterized by.

  According to this, electrical opening and closing can be performed satisfactorily. Here, as the contact switch, a contacted microrelay or switch is shown. For example, examples of the micro relay include an electrostatic micro relay, a piezoelectric micro relay, a thermally driven micro relay, a shape memory alloy micro relay, and a magnetic micro relay depending on the driving method.

  The measuring device according to the present invention includes the contact support mechanism described above.

  According to this, the micro relay having the contact support mechanism described above is used in, for example, a measuring device such as an IC tester or a semiconductor manufacturing device, and can open and close a signal between the measuring object and the measuring device.

  The wireless device of the present invention includes the contact support mechanism described above.

  According to this, the micro relay or the like having the contact support mechanism described above is used for a radio device or the like, and can open and close a radio wave signal.

  According to the present invention, there is provided a contact support mechanism, a contact switch, a measuring device, and a radio device that have a simple structure, are inexpensive and can be easily manufactured without causing an increase in size, and have excellent contact reliability and welding resistance. Can be provided.

  Exemplary embodiments of the present invention will be described below in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the components described in this embodiment are not intended to limit the scope of the present invention only to those unless otherwise specified. Absent.

  In addition, although embodiment demonstrates the example which applied the contact support mechanism of this invention to the electrostatic micro relay or switch, for example, a piezoelectric micro relay, a heat drive micro relay, a shape memory alloy micro relay, a magnetic micro relay The same effect can be achieved even if it is applied to contact switches with contacts such as.

  (First Embodiment) FIGS. 1 and 2 show an electrostatic microrelay 1 according to this embodiment. The electrostatic micro relay 1 has a configuration in which a movable substrate 3 is integrated with an upper surface of a fixed substrate 2. FIG. 1 shows the fixed substrate 2 and the movable substrate 3 separately, and FIG. 2 shows a state where the fixed substrate 2 and the movable substrate 3 are integrated.

  The fixed substrate 2 is provided with a fixed electrode 2a and two signal lines 2b on the upper surface of the glass substrate. The fixed electrode 2a is formed at a position lower than the signal line 2b.

  The surface of the fixed electrode 2a is covered with an insulating film, and is connected to a connection pad via wiring.

  The two signal lines 2b are arranged on the same straight line. The ends of the signal lines 2b facing each other with a predetermined interval are fixed contacts 2c. On the other hand, the lead-out part of the signal line 2b led out to the fixed contact 2c is connected to the connection pad. The fixed contact 2c has a narrower shape than the lead-out portion, so that the overlap area between the second elastic support portion 4 and the signal line 2b can be reduced, and good high frequency characteristics can be secured. It has become.

  The fixed electrode 2a is formed with the same distance on both sides of the signal line 2b, and also serves as a high-frequency GND electrode, thereby forming a coplanar structure. The fixed electrodes 2a located on both sides of the signal line 2b are connected to each other between the fixed contacts 2c. As a result, the lines of electric force generated by the open / close signal are terminated at the high-frequency GND electrode between the fixed contacts 2c, so that the isolation characteristics are improved.

  Here, the isolation characteristic indicates how much signal leakage exists between the signal lines 2b when the contact is opened, and signal leakage is reduced by improving the characteristics.

  On the other hand, the movable substrate 3 elastically supports the movable electrode 3b via a first elastic support portion 3a with a substantially rectangular plate-like silicon substrate, and a second elastic support portion 4 as a support portion at the center. Thus, the movable contact portion 5 is elastically supported.

  The anchors 3 c are erected at two positions on the lower surface of the movable substrate 3, and one anchor 3 c is electrically connected to a connection pad via wiring provided on the upper surface of the fixed substrate 2.

  The 1st elastic support part 3a is formed by the slit provided along the both-sides edge part of the movable board | substrate 3, and each anchor 3c is integrated in the end part lower surface.

  The movable electrode 3b faces the fixed electrode 2a, and is attracted to the fixed electrode 2a by electrostatic attraction generated by applying a voltage between the electrodes 2a and 3b. Further, the movable electrode 3b is removed from the portion facing the signal line 2b. Therefore, since there is no capacitive coupling between the signal lines 2b via the movable electrode 3b, the isolation characteristics are improved.

  Next, the structure of the 2nd elastic support part 4 and the movable contact part 5 which are the characterizing parts of this invention is demonstrated. A schematic configuration of the second elastic support portion 4 and the movable contact portion 5 is shown in FIG. The second elastic support portion 4 and the movable contact portion 5 are formed by cutting the movable substrate 3 between the movable electrodes 3b.

  The movable contact portion 5 has a rectangular plate shape and has a shape straddling a position facing the two fixed contacts 2c. A movable contact (not shown) is provided on the lower surface of the movable contact portion 5 via an insulating film. The movable contact is electrically connected to the signal line 2b by closing with the two fixed contacts 2c.

  The second elastic support portion 4 is a narrow beam that connects the movable electrode 3 b and the movable contact portion 5. The second elastic support portion 4 is connected to the upper and lower ends of the figure shown in FIG. 4 which are offset from the center of the movable contact portion 5 from the two movable electrodes 3b, and the relative relationship between the positions is pointed from the center of the movable contact portion 5. Symmetrical arrangement. That is, the two second elastic support portions 4 have an arrangement configuration in which the center lines do not coincide with each other.

  Therefore, the contact center of gravity of the movable contact portion 5 does not exist on the extension line in the extending direction of the second elastic support portion 4 that swings and supports the movable contact portion 5. For this reason, the point of action of the force when the movable contact is separated by the second elastic support portion 4 is deviated from the center of gravity of the contact, and the contact portion where the movable contact contacts the fixed contact 2c (the upper and lower sides of the movable contact portion 5 in FIG. 4). (End)).

  Then, the manufacturing method of the electrostatic micro relay 1 which consists of said structure is demonstrated. The electrostatic micro relay 1 can be easily manufactured by manufacturing it using a semiconductor manufacturing process as described later.

  First, the fixed electrode 2a, the signal line 2b, the fixed contact 2c, and the like are formed on a glass substrate such as Pyrex (registered trademark). Then, the fixed substrate 2 is completed by covering the surface of the fixed electrode 2a with an insulating film.

On the other hand, in order to form a gap between contacts on the lower surface of the SOI wafer composed of the Si layer, the SiO ₂ layer, and the Si layer, for example, wet etching by TMAH using a silicon oxide film as a mask is performed, and an anchor 3c protruding downward is formed. To do. Then, a movable contact is formed through an insulating layer at the center of the portion removed by wet etching.

  Then, the anchor 3c of the previous SOI wafer is bonded and integrated to the glass substrate of the fixed substrate 2 by anodic bonding. Thereafter, the upper surface of the SOI wafer is thinned by etching the oxide film with an alkaline etching solution such as TMAH or KOH. Further, the oxide film is removed with a fluorine etching solution to expose the Si layer that becomes the movable electrode 3b. Then, die-etching etching is performed by dry etching using RIE or the like to form slits and notches to form the first elastic support portion 3a, the second elastic support portion 4 and the movable contact portion 5, and the movable substrate 3 The electrostatic micro relay 1 is completed simultaneously with completion.

  Next, the operation of the electrostatic micro relay having the above configuration will be described with reference to FIG.

  In an initial state where no voltage is applied between the fixed electrode 2a and the movable electrode 3b, as shown in FIG. 3A, the fixed substrate 2 and the movable substrate 3 are kept parallel, and the movable contact is a fixed contact. Separated from 2c.

  When a voltage is applied between the movable electrode 3b and the fixed electrode 2a, an electrostatic attractive force is generated between the electrodes 2a and 3b. As a result, as shown in FIG. 3B, the movable substrate 3 approaches the fixed substrate 2 against the elastic force of the first elastic support portion 3a, and the movable contact comes into contact with the fixed contact.

  Thereafter, the movable substrate 3 continues to move until the movable electrode 3b contacts the fixed electrode 2a even after the movable contact contacts the fixed contact, as shown in FIG. 3C.

  At this time, since the two second elastic support portions 4 are connected to the end portions which are contact portions that come into contact with the fixed contacts 2 c of the movable contact portion 5, the contact pressure is increased by the second elastic support portions 4. Can do. Therefore, desired contact reliability can be obtained when the contacts are closed.

  When the applied voltage is removed, the movable substrate 3 is separated from the fixed substrate 2 by the elastic force of both the first elastic support portion 3 a and the second elastic support portion 4. At this time, as shown in FIG. 3D, adhesion or welding of the movable contact to the fixed contact 2c occurs.

  In this case, as shown in FIG. 3 (e), the second elastic support portions 4 are connected to the end portions that are contact portions that come into contact with the fixed contacts 2 c of the movable contact portions 5. By intentionally generating a torsional force at the contact and trying to lift the ends connected to each other to the opposite side, by applying not only a peeling force in the direction directly above but also a peeling force from the sideways direction The adhesion or welding of the movable contact to each fixed contact 2c is easily peeled off. Therefore, the welding resistance can be improved when the contact is opened.

  Thereafter, the movable substrate 3 continues to move upward by the elastic force of only the first elastic support portion 3a, and returns to the initial state (FIG. 3A) in which the movable contact is separated from the fixed contact.

  (Other Embodiments) Other configurations of the second elastic support portion 4 and the movable contact portion 5 which are characteristic portions of the present invention will be described below. 5 to 11, the movable electrode 3b is provided on both sides of the movable contact portion 5 as in the first embodiment, and the second elastic support portion 4 and the movable contact portion as in FIG. 5 is shown.

  The configuration of FIG. 5 is a configuration in which each one second elastic support portion 4 is extended from two movable electrodes 3b to support the movable contact portion 5 as in the first embodiment. The second elastic support portions 4 are connected to different end portions of the movable contact portion 5, and are arranged symmetrically with respect to the center of the movable contact portion 5. That is, the first embodiment has a configuration in which the arrangement position of the second elastic support portion 4 is reversed.

  The configuration of FIG. 6 is a configuration in which each one second elastic support portion 4 is extended from two movable electrodes 3 b to support the movable contact portion 5, as in the first embodiment and FIG. 5. However, the second elastic support portion 4 does not extend orthogonally between the movable electrode 3b and the movable contact portion 5, but between the end portions of the movable contact portion 5 to which the second elastic support portion 4 is connected. It extends from the position of the movable electrode 3b substantially on the center line, is connected to the end of the movable contact portion 5, and has a point-symmetric arrangement from the center of the movable contact portion 5. The arrangement of the second elastic support portion 4 can be reversed as in the relationship between FIGS.

  The configuration in FIG. 7 is a configuration in which each of the two second elastic support portions 4 is extended from the two movable electrodes 3 b to support the movable contact portion 5. That is, it is the structure which has the 2nd elastic support part 4 in total. The second elastic support portion 4 extending from one movable electrode 3b is connected to each end portion of the movable contact portion 5, and one has a wide width and the other has a narrow cross section. The four second elastic support portions 4 are arranged in a point symmetry from the center of the movable contact portion 5. Further, the center lines of the second elastic support portions 4 extending from the two movable electrodes 3b coincide with each end of the movable contact portion 5 to which the two second elastic support portions 4 are connected. 4 have different cross-sectional areas. The arrangement of the second elastic support portion 4 can be reversed as in the relationship between FIGS.

The configuration of FIG. 8 is the same as that of FIG. 7, but the center line of the second elastic support portion 4 extending from the two movable electrodes 3b is not made to coincide with each end of the movable contact portion 5 to be connected. It is. In this way, the configuration of FIG. 7 can be modified. In addition, arrangement | positioning of the 2nd elastic support part 4 is shown in FIG.
It is also possible to reverse the relationship as shown in FIG.

  The configuration of FIG. 9 is a configuration in which each of the two second elastic support portions 4 is extended from the two movable electrodes 3b and the movable contact portion 5 is supported, as in FIGS. That is, it is the structure which has the 2nd elastic support part 4 in total. The two second elastic support portions 4 extending from one movable electrode 3b are wider and have different cross-sectional areas than the two second elastic support portions 4 extending from the other movable electrode 3b. Similarly to FIG. 7, the center lines of the second elastic support portions 4 extending from the two movable electrodes 3 b coincide with each end of the movable contact portion 5 to be connected, and these center lines coincide with each other. The cross-sectional areas of the two second elastic support portions 4 are different. The arrangement of the second elastic support portion 4 can be reversed as in the relationship between FIGS.

  The four second elastic support portions 4 may have the same width and the same cross-sectional area. In this case, since the force generated between the movable electrode 3b and the fixed electrode 2a can be transmitted directly to the movable contact portion 5, both the contact force and the separation force are improved.

  The configuration of FIG. 10 is the same as that of FIG. 9, but the center line of the second elastic support portion 4 extending from the two movable electrodes 3b is not made to coincide with each end portion of the movable contact portion 5 to be connected. It is. In this way, the configuration of FIG. 9 can be modified. The arrangement of the second elastic support portion 4 can be reversed as in the relationship between FIGS.

  In the configuration of FIG. 11, one second elastic support portion 4 is extended from one movable electrode 3b, and two second elastic support portions 4 are extended from the other movable electrode 3b to support the movable contact portion 5. It is. One second elastic support portion 4 is connected to the middle of both end portions of the movable contact portion 5 from one movable electrode 3b, and two second elastic support portions 4 are connected to the movable contact portion 5 from the other movable electrode 3b. Connected to both ends. Even in this case, a torsional force can be generated intentionally. The arrangement of the second elastic support portion 4 can be reversed as in the relationship between FIGS.

  Note that the cross-sectional areas of the three second elastic support portions 4 do not necessarily have the same cross-sectional area.

  Even in the configuration of the other embodiment described above, the same effect as that of the first embodiment can be exhibited.

  (Application to Various Devices) Next, the case where the micro relay or switch using the above embodiment is applied to various devices will be described.

  (Application to Measuring Device) A case where the micro relay or switch of the above embodiment is applied to a measuring device will be described.

  Examples of such a measuring device include an IC tester and a semiconductor manufacturing device. As an IC tester, this is a device that measures the characteristics of an IC.

  The IC tester is a large-scale facility in which an oscilloscope and a multimeter are further arrayed, and the floor area is about 2 or 3 tatami mats.

  The number of relays used in the IC tester is also large, 5000 to 10,000.

  In addition, the semiconductor manufacturing apparatus is classified as a measurement apparatus because it is assumed to be used for a measurement unit in the apparatus.

Here, an internal configuration of a measuring apparatus using one embodiment of the electrostatic micro relay according to the present invention will be described with reference to FIG. FIG. 12 is a block diagram of an internal configuration of a measuring apparatus using one embodiment of the electrostatic micro relay according to the present invention.

  In a measuring device 1401 shown in FIG. 12, an electrostatic micro relay 1403 is connected to each signal line from an internal circuit 1402 to a measurement object (not shown). The measurement object can be switched by turning on and off.

  As described above, the micro relays and switches according to the above-described embodiments have excellent contact reliability and welding resistance of the contacts, and can improve the characteristics.

  Therefore, when the micro relay or switch of the above embodiment is used in a measuring device, the characteristics of the measuring device itself can be improved in accordance with the improvement of the characteristics of the micro relay or switch using the above embodiment.

  (Application to Radio) The case where the micro relay and switch of the above embodiment are applied to a radio will be described.

  Examples of such a radio device include a mobile phone and a PDA.

  As described above, the micro relays and switches according to the above-described embodiments have excellent contact reliability and welding resistance of the contacts, and can improve the characteristics.

  Therefore, when the micro relay or switch of the above embodiment is used for a radio, the characteristics of the radio itself can be improved in accordance with the improvement of the characteristics of the micro relay or switch of the above embodiment.

  Here, an internal configuration of a radio using one embodiment of the electrostatic micro relay according to the present invention will be described with reference to FIG. FIG. 13 is a block diagram of the internal configuration of a radio using one embodiment of the electrostatic microrelay according to the present invention described above.

  In this wireless device, the electrostatic micro relay 1503 is connected between the internal circuit 1501 and the antenna 1504. By turning the electrostatic micro relay 1504 on and off, the internal circuit 1501 can transmit and receive through the antenna 1504. , Switching to a state where transmission / reception is not possible.

FIG. 1 is a diagram showing a configuration of the electrostatic micro relay according to the first embodiment. FIG. 2 is a diagram illustrating a configuration of the electrostatic micro relay according to the first embodiment. FIG. 3 is an explanatory view showing the operation of the electrostatic micro relay according to the first embodiment. FIG. 4 is a diagram showing a main part of the electrostatic micro relay according to the first embodiment. FIG. 5 is a diagram showing a main part of an electrostatic micro relay according to another embodiment. FIG. 6 is a diagram showing a main part of an electrostatic micro relay according to another embodiment. FIG. 7 is a view showing a main part of an electrostatic micro relay according to another embodiment. FIG. 8 is a diagram showing a main part of an electrostatic micro relay according to another embodiment. FIG. 9 is a view showing a main part of an electrostatic micro relay according to another embodiment. FIG. 10 is a diagram showing a main part of an electrostatic micro relay according to another embodiment. FIG. 11 is a diagram showing a main part of an electrostatic micro relay according to another embodiment. FIG. 12 is a block diagram of an internal configuration of a measuring apparatus using one embodiment of the electrostatic micro relay. FIG. 13 is a block diagram of the internal configuration of a radio using one embodiment of the electrostatic micro relay. FIG. 14 is a diagram showing an electrostatic micro relay according to the prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electrostatic micro relay 2 Fixed board | substrate 2a Fixed electrode 2b Signal line 2c Fixed contact 3 Movable board 3a 1st elastic support part 3b Movable electrode 3c Anchor 4 2nd elastic support part 5 Movable contact part

Claims (4)

A contact support mechanism for supporting a movable contact portion, which is a rectangular plate shape of a movable substrate opposed to a fixed substrate and straddles a position facing two fixed contacts, so as to be able to contact with and separate from the fixed contact of the fixed substrate. And
A movable substrate having a first elastic support portion provided on each of the left and right sides of the movable contact portion and a rectangular movable electrode of the same size on the left and right elastically supported by the first elastic support portion;
The movable electrode elastically supports the movable contact portion from both sides with a second elastic support portion,
A position shifted from the center of gravity of the movable contact portion of the movable contact portion when the movable contact portion is separated is supported by the second elastic support portion,
The second elastic support part has a left-right asymmetric shape with the movable contact part at the center , and is connected to an end part which is a contact part in contact with each fixed contact of the movable contact part. Contact support mechanism. A contact switch comprising the contact support mechanism according to claim 1, wherein the movable contact portion and the fixed contact are electrically opened / closed by contacting / separating the movable contact portion with the fixed contact. . A measuring device comprising the contact support mechanism according to claim 1. A wireless device comprising the contact support mechanism according to claim 1.

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