JP4140405B2 - Component mounting system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting system for mounting components on a substrate.
[0002]
[Prior art]
As a device for mounting components on a substrate, a component mounting line serving as a main component device of a printing device, a component mounting device, and a reflow device is used.
[0003]
As a conventional technique related to a component mounting line, there is a method of performing quality control of a board by providing a management computer for managing the component mounting line and collecting calibration information of each device constituting the component mounting line in the management computer. Published (see, for example, Patent Document 1). Hereinafter, this quality control method will be described.
[0004]
FIG. 36 shows a configuration diagram of a component mounting line.
[0005]
The component mounting line 300 includes a board inspection device 301, a printing device 302, a printing inspection device 303, a component mounting device 304, a mounting state inspection device 305, a reflow device 306, a mounting state inspection device 307, and a management computer 309. Further, each device and the management computer 309 are connected via a network 308, and data can be transmitted and received between the device and the management computer 309.
[0006]
Each apparatus is connected by a rail (not shown) for transporting the substrate, and the substrate is sequentially transported from upstream to downstream.
[0007]
The board inspection device 301 inspects the size and displacement of the land posted on the board. The printing device 302 screen-prints a solder paste for component bonding on the land of the substrate. The print inspection device 303 inspects the printed state of the solder paste on the board. The component mounting apparatus 304 mounts components on a board on which a solder paste is printed. The mounting state inspection device 305 inspects the presence / absence of a component and a positional deviation on the substrate after mounting the component. The reflow device 306 heats the solder paste after mounting the components to bond the components to the substrate. The mounting state inspection device 307 inspects the mounting state of components on the bonded substrates.
[0008]
In the above publication, the processing device and the inspection device are combined as a set of processing steps such as the printing device 302 and the printing inspection device 303, the component mounting device 304 and the mounting state inspection device 305, the reflow device 306 and the mounting state inspection device 307. A method for improving the accuracy of the processing step by calibrating the processing device in real time by feeding back the inspection result obtained from the inspection device of the processing step to the processing device is disclosed.
[0009]
However, although the inspection method is used in the above method, the component incorporated in the apparatus, for example, a metal plate for printing a bonding material on a substrate in the case of the printing apparatus 302, and a component mounting in the case of the component mounting apparatus 304 The component supply device for supplying components to the nozzle portion of the device 304 and the reflow device 306 are associated with components incorporated in the device such as a heating nozzle for heating the solder paste on the board. Not.
[0010]
In particular, the metal plate is troublesome for the operator because the variation in mounting accuracy increases depending on the use conditions. In recent years, the dimensions of parts and terminal portions have been minimized, and it has become an important role for operators to maximize the performance of metal plates.
[0011]
If there is one metal plate and one component mounting line, there is little need to consider the difference in characteristics of the metal plate. However, when there are multiple metal plates and multiple component mounting lines, the operator considers the compatibility between the metal plate and the component mounting line, and the target mounting accuracy and processing speed (number of boards / It is necessary to determine whether the operation time can be demonstrated, and there is a limit in the operation method depending on the experience of the operator.
[0012]
In order to improve the mounting accuracy of the component mounting line to the current level or higher, it is necessary to evaluate the difference including the characteristics of the components incorporated in the apparatus.
[0013]
Also, digitized information is necessary in terms of transmission of technical information between operators. It is necessary to construct a system for managing operating conditions including not only the operating conditions of the apparatus but also the components incorporated in the apparatus and a component mounting system including the maintenance process of the constituent elements.
[0014]
In addition, in a quality control method for a component mounting apparatus, a method has been disclosed in which a memory for writing quality information is provided on a board, and information obtained by processing in each process is written in the memory (for example, see Patent Document 2).
[0015]
Also, by storing the component type, component name, number of components, and number of remaining parts in the storage unit of the component supply device, and subtracting the number of remaining components each time mounting is performed, the number of remaining components of the component supply device is monitored in real time. In addition, a method for predicting in advance a component shortage and registering a spare component supply device in advance is disclosed (for example, see Patent Document 3).
[0016]
[Patent Document 1]
JP 2002-134899 A (page 3-6, FIG. 1)
[Patent Document 2]
Japanese Patent Laid-Open No. 7-321492 (page 6-8, FIG. 2)
[Patent Document 3]
Japanese Patent Laid-Open No. 2001-203493 (page 4, FIG. 1)
[0017]
[Problems to be solved by the invention]
In the above-described conventional component mounting system, by combining the processing device and the inspection device constituting the component mounting system as a set of processing steps, the operation state of the processing step is collected and evaluated in real time, and the calibration is performed appropriately. Thus, the processing accuracy of the processing step is improved.
[0018]
However, although the above method collects test results, it is not associated with the components incorporated in the apparatus.
[0019]
An object of the present invention is to improve the processing accuracy of a component mounting system beyond the current level by evaluating the difference including the characteristics of components incorporated in the apparatus.
[0020]
Furthermore, an object of the present invention is to provide information necessary for efficient operation of a component mounting line to an operator and information necessary for transmission of technical information between operators.
[0021]
[Means for Solving the Problems]
  In order to solve the above-mentioned problem, it is described in claim 1.Component mounting systemIsA mask plate having a first storage medium for storing first information for uniquely identifying and forming a hole in the plate surface, and a bonding material printed on the substrate using the mask plate as a constituent elementA printing apparatus; a printing inspection apparatus that inspects a state of a bonding material printed on the substrate by the printing apparatus; and a management computer that manages a component mounting system.Consists of multiple component mounting linesIn the component mounting system, the printing apparatus includes:A second storage medium for storing second information for uniquely identifying the device itself, a reader for reading the first and second information stored in the first and second storage media, and A communication unit that communicates with a management computer, the reader reads the first and second information stored in the first and second storage media, and the first and second information are read from the first and second information, respectively. Control means for transmitting to the management computer via a communication unit;The printing inspection apparatus inspects the state of the bonding material printed on the substrate, and transmits an inspection result to the management computer.First and secondReceiving information, receiving the inspection result from the print inspection apparatus,First and secondA component mounting system for storing information and the inspection result in association with each other.
[0026]
  With the above configuration, the mask plate can store information for uniquely identifying itself.In addition, the printing apparatus can store information for uniquely identifying the apparatus itself.
[0028]
With the above configuration, the printing apparatus can read and transmit information stored in a storage medium of a component incorporated in the printing apparatus itself to the management computer.
[0030]
  With the above configuration, the component mounting system is stored in the storage medium of the component incorporated in the printing apparatus itself.FirstInformation andSecond information stored in a storage medium of the printing apparatus;The inspection result of the print inspection apparatus can be stored in an associated state.
[0095]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0096]
(Embodiment 1)
Embodiment 1 of the present invention will be described with reference to FIGS.
[0097]
FIG. 1 is a diagram showing a block configuration of the component mounting system 1.
[0098]
In FIG. 1, a management computer 10 is connected to each device constituting the component mounting system 1 via a network 100, and manages the entire component mounting system 1.
[0099]
The substrate loading device 20 is connected to the printing device 30, stores the substrate inside the device, and sequentially loads the substrate into the printing device 30.
[0100]
The printing apparatus 30 is connected to the management computer 10 via the network 100, reads a metal plate storage medium, transmits an identification code stored in the storage medium to the management computer 10, and is used for joining components on the land of the board. Print the bonding material. For example, a solder paste is used as the bonding material.
[0101]
The print inspection apparatus 40 is connected to the management computer 10 via the network 100, inspects the printing state of the bonding material on the printed substrate, and transmits the inspection result to the management computer 10.
[0102]
The component mounting apparatus 50 is connected to the management computer 10 via the network 100, reads the storage medium of the component supply apparatus, transmits the identification code stored in the storage medium to the management computer 10, and prints the bonding material. Mount the components on the board.
[0103]
The mounting state inspection device 60 is connected to the management computer 10 via the network 100, inspects for the presence / absence of components on the substrate after component mounting, and transmits the inspection result to the management computer 10.
[0104]
The component bonding apparatus 70 is connected to the management computer 10 via the network 100, reads the storage medium of the heating nozzle, transmits the identification code stored in the storage medium to the management computer 10, and also supplies the bonding material after mounting the components. Heat to bond the component to the substrate.
[0105]
The mounting state inspection device 80 is connected to the management computer 10 via the network 100, inspects the mounting state of components on the substrate after bonding, and transmits the inspection result to the management computer 10.
[0106]
The substrate recovery device 90 is connected to the mounting state inspection device 80 and receives the substrate from the mounting state inspection device 80 and stores it in the device.
[0107]
The devices from the substrate loading device 20 to the substrate recovery device 90 are connected by rails (not shown) for transporting the substrates, and the substrates are sequentially transported from upstream to downstream.
[0108]
The cleaning device 110 is connected to the management computer 10 via the network 100, reads the metal plate storage medium, transmits the identification code stored in the storage medium to the management computer 10, and uses the metal plate used in the printing device 30. Wash.
[0109]
The storage device 120 is connected to the management computer 10 via the network 100, reads the storage medium of the metal plate, transmits the identification code stored in the storage medium to the management computer 10, and is cleaned by the cleaning device 110. Is stored inside the unit.
[0110]
Next, each device constituting the component mounting system 1 will be described in detail.
[0111]
FIG. 2 is a diagram illustrating a block configuration of the substrate loading apparatus 20.
[0112]
In FIG. 2, the control unit 21 controls the entire substrate loading apparatus 20. The input unit 22 pulls out the substrate 34 from the substrate storage unit 24 and carries it out to the printing apparatus 30. The lift unit 23 moves the substrate storage unit 24 in the vertical direction so that the loading unit 22 can pull out the substrate 34. The substrate storage unit 24 stores the substrate 34.
[0113]
The display unit 2A displays the operating status of the apparatus. In the key input unit 2B, an operator inputs operating conditions and the like. The IO port 2 </ b> C is connected to the printing apparatus 30 and notifies the control unit 21 of the operating state of the printing apparatus 30. The memory 2D stores a control program.
[0114]
Next, the processing operation will be described. After the operator stores the substrate 34 in the substrate storage unit 24 and instructs the input start from the key input unit 2B, the control unit 21 confirms the operating state of the printing apparatus 30 through the IO port 2C, and the substrate 34 by the input unit 22. Are pulled out to the printing apparatus 30 at regular intervals.
[0115]
FIG. 3 is a diagram illustrating a block configuration of the printing apparatus 30.
[0116]
In FIG. 3, the control unit 31 controls the entire printing apparatus 30. The squeegee driving unit 32 drives the squeegee 35 at a predetermined squeegee speed. The squeegee 35 has a spatula portion 36 and applies a bonding material 39 onto the metal plate 37. For the bonding material 39, for example, a solder paste is used.
[0117]
The metal plate 37 has a storage medium 38, stores an identification code for uniquely identifying the metal plate, has a hole in a part of the plate surface, and prints the bonding material 39 on the substrate 34. As the storage medium 38, for example, a non-contact IC chip is used. An example of the definition of the identification code stored in the storage medium 38 is shown in FIG. The identification code is composed of 7 digits, with the upper 2 digits being the device category, the next 2 digits being the component category, and the lower 3 digits being the serial number. Details of the metal plate 37 will be described with reference to FIG.
[0118]
The substrate feed mechanism 33 receives the substrate 34 from the substrate loading device 20 and presses it against the lower surface of the metal plate 37 at a predetermined position and squeegee printing pressure. After printing, the substrate feed mechanism unit 33 separates the substrate 34 at a predetermined separation speed and sends it to the print inspection apparatus 40. The reader 3E reads the identification code of the storage medium 38 of the metal plate 37. As the reader 3E, for example, a reader for a non-contact IC chip is used.
[0119]
The display unit 3A displays the operating state of the apparatus. In the key input unit 3B, an operator inputs operating conditions and the like. The communication unit 3C is connected to the management computer 10 and transmits the identification code of the storage medium 38 read by the reader 3E to the management computer 10. The memory 3D stores the control program, the device code 1, and data necessary for the printing process.
[0120]
Next, the processing operation will be described. When the operator installs the metal plate 37 inside the printing apparatus 30 and inputs the operation conditions such as the squeegee speed, the squeegee printing pressure, and the separation speed from the key input unit 3B and instructs the start of printing, the control unit 31 causes the reader 3E to perform the metal operation. The identification code stored in the storage medium 38 of the plate 37 is read and transmitted to the management computer 10 via the communication unit 3C.
[0121]
An example of a message format transmitted from the control unit 31 to the management computer 10 is shown in FIG. The control unit 31 transmits the device code 1, the identification code, the squeegee speed, the squeegee printing pressure, and the separation speed to the management computer 10. The device code 1 is a device code whose device classification is 03 (printing device). The definition of the device code is shown in FIG.
[0122]
Thereafter, the control unit 31 receives the substrate 34 from the substrate loading device 20 by the substrate feeding mechanism unit 33 and presses it against the lower surface of the metal plate 37 at a predetermined position and printing pressure. The control unit 31 drives the squeegee 35 by the squeegee driving unit 32 to apply the bonding material 39 onto the metal plate 37.
[0123]
The control unit 31 separates the substrate 34 at a predetermined separation speed by the substrate feeding mechanism unit 33 and sends the substrate 34 to the print inspection apparatus 40.
[0124]
An embodiment of the metal plate 37 is shown in FIG. FIG. 6A is a top view of the metal plate. The metal plate 37 has a storage medium 38 in a part of the fixing frame. FIG.6 (b) is metal plate AA sectional drawing. The metal plate 37 performs printing when the bonding material applied to the holes remains on the land on the substrate 34. FIG. 6C is an enlarged view of part B. Since the hole portion of the normal metal plate has a right-angle structure at the corner, when the number of times of printing is increased, the bonding material remains at the corner and causes clogging. The corners of the holes of the metal plate 37 of the present invention prevent the clogging of the bonding material by providing a curvature.
[0125]
FIG. 7 is a diagram illustrating a block configuration of the print inspection apparatus 40.
[0126]
In FIG. 7, the control unit 41 controls the entire print inspection apparatus 40. The camera driving unit 42 moves the camera 45 to the inspection target unit. The camera 45 images the inspection target part.
[0127]
The substrate feeding mechanism unit 43 receives the substrate 44 on which the bonding material 39 is printed from the printing apparatus 30 and fixes it at a predetermined position. After the inspection, the board feeding mechanism 43 sends the board 44 to the component mounting apparatus 50.
[0128]
The display unit 4A displays the operating status of the apparatus. In the key input unit 4B, an operator inputs operating conditions and the like. The communication unit 4C is connected to the management computer 10 and transmits the inspection result to the management computer 10. The memory 4D stores the control program, the device code 2, and data necessary for the print inspection process.
[0129]
Next, the processing operation will be described. When the operator inputs the center coordinates, the area, and the land number of the land 46 from the key input unit 4B and instructs to start printing, the control unit 41 causes the substrate feeding mechanism unit 43 to move the substrate 44 on which the bonding material 39 is printed from the printing apparatus 30 to the substrate 44. Receive and fix in place. The land number is a code for uniquely identifying the land 46.
[0130]
The control unit 41 causes the camera driving unit 42 to move the camera 45 to the inspection target unit. The control unit 41 images the inspection target portion with the camera 45. The control unit 41 analyzes the inspection target unit, creates an inspection result, and transmits the inspection result to the management computer 10 via the communication unit 3C.
[0131]
An example of the inspection method of the control unit 41 is shown in FIG. The control unit 41 measures the positional deviation between the center coordinate of the land 46 and the center coordinate of the bonding material 39 and outputs it as Δx · Δy. Further, the control unit 41 measures the area of the bonding material 39 and outputs it as a% notation of the bonding material amount.
[0132]
An example of a message format transmitted from the control unit 41 to the management computer 10 is shown in FIG. The control unit 41 transmits the inspection result N from the device code 2 and the inspection result 1 to the management computer 10. The device code 2 is a device code whose device classification is 04 (printing inspection device). The definition of the device code is shown in FIG. N is the number of inspected lands. The inspection result n (n = 1 to N) is composed of land number, Δx, Δy, and% notation of the amount of bonding material.
[0133]
FIG. 9 is a diagram illustrating a block configuration of the component mounting apparatus 50.
[0134]
In FIG. 9A, the control unit 51 controls the entire component mounting apparatus 50. The nozzle drive unit 52 moves the nozzle 53 to the X, Y, Z coordinates and the Z axis angle. The nozzle unit 53 sucks the component 56 of the component supply device 57 and places it on the substrate 54.
[0135]
The component supply unit 59 is a table on which several tens of component supply devices 57 are mounted, and moves the table so that the nozzle unit 53 can suck the component 56. The reader 5E reads the identification code of the storage medium 58 of the component supply device 57. As the reader 5E, for example, a reader for a non-contact IC chip is used.
[0136]
The substrate feeding mechanism unit 53 receives the substrate 54 from the print inspection apparatus 40 and fixes it to a predetermined position. After the components are mounted, the board feeding mechanism unit 53 sends the board 54 to the mounting state inspection device 60.
[0137]
The display unit 5A displays the operating status of the apparatus. In the key input unit 5B, an operator inputs operating conditions and the like. The communication unit 5C is connected to the management computer 10 and transmits the identification code of the storage medium 58 read by the reader 5E to the management computer 10. The memory 5D stores a control program, device code 3, and data necessary for component mounting processing.
[0138]
In FIG. 9B, the component supply device 57 taps the component 56 and winds it around the reel, and the component holding the component reel 57a and feeding the component 56 one by one to the position where the nozzle portion 53 can suck the component 56. The feeding mechanism 57b, a fixing unit 57c for fixing the component supply device 57 itself to the component supply unit 59, and a storage medium 58 for storing an identification code for uniquely identifying the component supply device.
[0139]
Next, the processing operation will be described. When the operator installs the component supply device 57 on the component supply unit 59 and instructs to start component mounting from the key input unit 5B, the control unit 51 uses the reader 5E to identify the identification code stored in the storage medium 58 of the component supply device 57. Read and transmit to the management computer 10 via the communication unit 5C.
[0140]
An example of a message format transmitted from the control unit 51 to the management computer 10 is shown in FIG. The control unit 51 transmits the identification code N from the device code 3 and the identification code 1 to the management computer 10. The device code 3 is a device code whose device classification is 05 (component mounting device). The definition of the device code is shown in FIG. Note that N corresponds to the number of component supply devices 57 mounted on the component supply unit 59.
[0141]
Thereafter, the control unit 51 receives the substrate 54 that has been inspected from the print inspection apparatus 40 by the substrate feeding mechanism unit 53 and fixes it to a predetermined position.
[0142]
The control unit 51 performs a mounting process according to the mounting information. The control unit 51 causes the component supply unit 59 to move the component supply device 57 to a row where the nozzle unit 53 can suck the component 56. The control unit 51 drives the nozzle unit 55 onto the component supply device 57 by the nozzle unit driving unit 52. The control unit 51 sucks the component 57 of the component supply device 57 through the nozzle unit 55. The control unit 51 drives the nozzle unit 55 onto the substrate 54 by the nozzle unit driving unit 52. The control unit 51 mounts the component 57 on the substrate 54 by the nozzle unit 55.
[0143]
An example of the mounting information is shown in FIG. The mounting code is a code for uniquely identifying the component 56 mounted on the board 54. The part part number code is a code for uniquely identifying a part, and sets the part number of the part manufacturer. The X and Y coordinates are the center position of the part and are expressed in mm. The angle is a mounting angle of the component viewed from the Z axis. The column number is a code indicating which column on the component supply unit 59 the component supply device 57 is in. The operator fixes the component supply device 57 holding the component reel of the component product number code in the column indicated by the column number. It is assumed that the original mounting information is stored in the management computer 10 and downloaded to the component mounting apparatus 50 before component mounting.
[0144]
After completing the component mounting, the control unit 51 sends the substrate 54 to the mounting state inspection device 60 by the substrate feeding mechanism unit 53.
[0145]
FIG. 11 is a diagram showing a block configuration of the mounting state inspection apparatus 60.
[0146]
In FIG. 11, the control unit 61 controls the entire mounting state inspection device 60. The camera driving unit 62 moves the camera 65 to the inspection target unit. The camera 65 images the inspection target part.
[0147]
The substrate feeding mechanism 63 receives the substrate 64 on which the component 57 is mounted from the component mounting device 50 and fixes it at a predetermined position. After the inspection, the board feeding mechanism unit 63 sends the board 64 to the component bonding apparatus 70.
[0148]
The display unit 6A displays the operating status of the apparatus. In the key input unit 6B, an operator inputs operating conditions and the like. The communication unit 6C is connected to the management computer 10 and transmits the inspection result to the management computer 10. The memory 6D stores a control program, a device code, and data necessary for mounting state inspection processing.
[0149]
Next, the processing operation will be described. When the operator instructs the start of mounting state inspection from the key input unit 6B, the control unit 61 receives the substrate 64 on which the component 57 is mounted from the component mounting device 50 by the substrate feeding mechanism unit 63, and fixes it to a predetermined position.
[0150]
The control unit 61 causes the camera driving unit 62 to move the camera 65 to the inspection target unit. The control unit 61 images the inspection target portion with the camera 65. The control unit 61 analyzes the inspection target unit, creates an inspection result, and transmits the inspection result to the management computer 10 via the communication unit 6C.
[0151]
FIG. 12 is a diagram illustrating an example of the inspection method of the control unit 61. The control unit 61 performs a mounting state inspection process according to the mounting information. The control unit 61 measures the positional deviation between the normal center coordinates of the component 57 and the actual center coordinates, and outputs them as Δx · Δy · special notes. The special notes indicate whether or not a component is mounted. When there is a component mounted, a measured value is set to Δx · Δy, and when there is no component mounted, “−” is set to Δx · Δy.
[0152]
An example of a message format transmitted from the control unit 61 to the management computer 10 is shown in FIG. The control unit 61 transmits the inspection result N from the device code 4 and the inspection result 1 to the management computer 10. The device code 4 is a device code whose device classification is 06 (mounting state inspection device). The definition of the device code is shown in FIG. N is the number of parts 57 to be inspected. The inspection result n (n = 1 to N) includes an implementation code, Δx, Δy, and special notes. The mounting code is the same as the description of the mounting information in FIG.
[0153]
FIG. 13 is a diagram illustrating a block configuration of the component bonding apparatus 70.
[0154]
In FIG. 13, the control unit 71 controls the entire component joining apparatus 70.
[0155]
The heating nozzle 72 has a storage medium 78 and stores an identification code for uniquely identifying the heating nozzle and heats and melts the bonding material to bond the component 57 to the substrate 74. The sensor 75 measures the temperature inside the furnace. As the storage medium 78, for example, a non-contact IC chip is used. An example of the definition of the identification code stored in the storage medium 78 is shown in FIG.
[0156]
The substrate feeding mechanism 73 receives the substrate 74 from the mounting state inspection device 60, moves the inside of the furnace at a predetermined speed, and sends it out to the bonding state inspection device 80. The reader 7E reads the identification code of the storage medium 78 of the heating nozzle 72. As the reader 7E, for example, a reader for a non-contact IC chip is used.
[0157]
The display unit 7A displays the operating state of the apparatus. In the key input unit 7B, an operator inputs operating conditions and the like. The communication unit 7C is connected to the management computer 10 and transmits the identification code of the storage medium 78 read by the reader 7E to the management computer 10. The memory 7D stores a control program, device code 5, and data necessary for component joining processing.
[0158]
Next, the processing operation will be described. When the operator installs the heating nozzle 72 in the component bonding apparatus 70 and inputs an operation condition such as a moving speed / temperature set value of the substrate feed mechanism unit 73 from the key input unit 7B and instructs the start of component bonding, the control unit 71 Reads the identification code stored in the storage medium 78 of the heating nozzle 72 by the reader 7E, and transmits it to the management computer 10 via the communication unit 7C.
[0159]
An example of a message format transmitted from the control unit 71 to the management computer 10 is shown in FIG. The control unit 71 transmits the device code 5, the identification code, and the temperature set value to the management computer 10. The device code 5 is a device code whose device classification is 07 (joining device). The definition of the device code is shown in FIG.
[0160]
After confirming that the temperature inside the furnace has reached a preset temperature set value by the sensor 75, the control unit 71 receives the substrate 74 from the mounting state inspection device 60, moves the inside of the furnace at a predetermined speed, and performs bonding. It is sent to the state inspection device 80.
[0161]
FIG. 14 is a diagram illustrating a block configuration of the bonding state inspection apparatus 80.
[0162]
In FIG. 14, the control unit 81 controls the bonding state inspection device 80 as a whole. The camera driving unit 82 moves the camera 85 to the inspection target unit. The camera 85 images the inspection target part.
[0163]
The board feeding mechanism unit 83 receives the board 84 to which the component 57 is bonded from the component bonding apparatus 70 and fixes it to a predetermined position. After the inspection, the substrate feeding mechanism unit 83 feeds the substrate 84 to the substrate recovery device 90.
[0164]
The display unit 8A displays the operating state of the apparatus. In the key input unit 8B, the operator inputs operating conditions and the like. The communication unit 8C is connected to the management computer 10 and transmits the inspection result to the management computer 10. The memory 8D stores the control program, the device code 6, and data necessary for the bonding state inspection process.
[0165]
Next, the processing operation will be described. When the operator instructs the start of bonding state inspection from the key input unit 8B, the control unit 81 receives the substrate 84 to which the component 57 is bonded from the component bonding apparatus 70 by the substrate feeding mechanism unit 83, and fixes it to a predetermined position.
[0166]
The control unit 81 causes the camera driving unit 82 to move the camera 85 to the inspection target unit. The control unit 81 images the inspection target portion with the camera 85. The control unit 81 analyzes the inspection target unit, creates an inspection result, and transmits the inspection result to the management computer 10 via the communication unit 8C.
[0167]
An embodiment of the inspection method of the control unit 81 is shown in FIG. The control unit 81 performs a joining state inspection process according to the mounting information. The control unit 81 measures the positional deviation between the normal center coordinates of the component 57 and the actual center coordinates, and outputs them as Δx · Δy · special notes. The special notes indicate whether or not a component is mounted. When there is a component mounted, a measured value is set to Δx · Δy, and when there is no component mounted, “−” is set to Δx · Δy.
[0168]
An example of a message format transmitted from the control unit 81 to the management computer 10 is shown in FIG. The control unit 81 transmits the inspection result N from the device code 6 and the inspection result 1 to the management computer 10. The device code 6 is a device code whose device classification is 08 (bonding state inspection device). The definition of the device code is shown in FIG. N is the number of parts 57 to be inspected. The inspection result n (n = 1 to N) includes an implementation code, Δx, Δy, and special notes. The mounting code is the same as the description of the mounting information in FIG.
[0169]
FIG. 15 is a diagram illustrating a block configuration of the substrate recovery apparatus 90.
[0170]
In FIG. 15, the control unit 91 controls the entire substrate collection apparatus 90. The collection unit 92 receives the substrate 84 from the bonding state inspection device 80 and collects it in the substrate storage unit 94. The lift unit 93 moves the substrate storage unit 94 in the vertical direction so that the collection unit 92 can collect the substrate 84. The substrate storage unit 94 stores the substrate 84.
[0171]
The display unit 9A displays the operating state of the apparatus. In the key input unit 9B, an operator inputs operating conditions and the like. The IO port 9 </ b> C is connected to the bonding state inspection device 80 and notifies the bonding state inspection device 80 of the operating state of the substrate recovery device 90. For example, it notifies that the board storage unit 94 is full and cannot be stored. The memory 9D stores a control program.
[0172]
Next, the processing operation will be described. When the operator instructs the start of recovery from the key input unit 9B, the control unit 91 stores the substrate 84 in the substrate storage unit 94 by the recovery unit 92 while confirming the operating state of the substrate storage unit 94.
[0173]
FIG. 16 is a diagram illustrating a block configuration of the cleaning device 110.
[0174]
In FIG. 16, the control unit 111 controls the entire cleaning device 110. The reader 112 reads the storage medium 38 of the metal plate 37. As the reader 112, for example, a reader for a non-contact IC chip is used. The cleaning unit 113 cleans the metal plate 37.
[0175]
The display unit 11A displays the operating status of the apparatus. In the key input unit 11B, an operator inputs operating conditions and the like. The communication unit 11 </ b> C is connected to the management computer 10 and transmits the identification code of the storage medium 38 read by the reader 112 to the management computer 10. The memory 11D stores a control program and a device code 7.
[0176]
Next, the processing operation will be described. When the operator installs the metal plate 37 on the cleaning unit 113 and reads the identification code of the storage medium 38 by the reader 112 and then instructs the key input unit 11B to start cleaning, the control unit 111 reads the storage medium 38 read by the reader 112. Is transmitted to the management computer 10 via the communication unit 11C.
[0177]
An example of a message format transmitted from the control unit 111 to the management computer 10 is shown in FIG. The control unit 111 transmits the identification code N from the device code 7 and the identification code 1 to the management computer 10. The device code 7 is a device code whose device classification is 11 (cleaning device). The definition of the device code is shown in FIG. N is the number of metal plates 37 to be cleaned.
[0178]
FIG. 17 is a diagram illustrating a block configuration of the storage device 120.
[0179]
In FIG. 17, the control unit 121 controls the entire storage device 120. The reader 122 reads the storage medium 38 of the metal plate 37. As the reader 122, for example, a reader for a non-contact IC chip is used. The storage unit 123 stores the metal plate 37.
[0180]
The display unit 12A displays the operating state of the apparatus. In the key input unit 12B, an operator inputs operating conditions and the like. The communication unit 12 </ b> C is connected to the management computer 10 and transmits the identification code of the storage medium 38 read by the reader 122 to the management computer 10. The memory 12D stores a control program and device code 8.
[0181]
Next, the processing operation will be described. When the operator stores the metal plate 37 in the storage unit 123 and reads the identification code of the storage medium 38 by the reader 122 and then instructs the storage start from the key input unit 12B, the control unit 121 reads the storage medium read by the reader 122. 38 identification codes are transmitted to the management computer 10 via the communication unit 12C.
[0182]
An example of a message format transmitted from the control unit 121 to the management computer 10 is shown in FIG. The control unit 121 transmits the identification code N from the device code 8 and the identification code 1 to the management computer 10. The device code 8 is a device code whose device classification is 12 (storage device). The definition of the device code is shown in FIG. N is the number of metal plates 37 to be stored.
[0183]
FIG. 18 is a diagram illustrating a block configuration of the management computer 10.
[0184]
In FIG. 18, the control unit 11 controls the entire management computer 10. The storage unit 12 stores data necessary for component mounting in association with various data collected from each device constituting the component mounting system 1 and outputs data corresponding to the search condition when the search condition is input. . The storage unit 12 uses, for example, a hard disk. The clock unit 13 outputs the current date time.
[0185]
The display unit 1A displays the operating state of the apparatus. In the key input unit 1B, an operator inputs operating conditions and the like. 1 C of communication parts are connected with each apparatus which comprises the component mounting system 1 via the network 100, and transmit / receive data. The memory 1D stores a control program and various data collected from each device constituting the component mounting system 1.
[0186]
A procedure in which the management computer 10 processes various data collected from each device constituting the component mounting system 1 will be described.
[0187]
The control unit 11 receives the messages of FIG. 4A from the printing device 30 and the message of FIG. 4B from the printing inspection device 40 via the communication unit 1C.
[0188]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (a), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (a). Save to the printer device file.
[0189]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (b), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (b). Save to a print inspection device file.
[0190]
The display state of the inspection result of the print inspection apparatus 40 of the display unit 1A of the management computer 10 is shown in FIG. The control unit 11 receives the message of FIG. 4A from the printing device 30 and the message of FIG. 4B from the printing inspection device 40, and the operating conditions of the printing device 30 are displayed on the upper screen, and the substrate 44 is displayed on the lower middle of the screen. The inspection result of the land is displayed. The operation condition is displayed as the date, the device code of the printing device 30, the operation condition of the printing device 30 (squeegee speed, squeegee printing pressure, pulling speed), the identification code of the metal plate 37 and the land number. The inspection result displays land number Δx, Δy, and% notation of the amount of bonding material. The graph displays the number of printed sheets on the horizontal axis and the notation of Δx / Δy / bonding material amount on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0191]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0192]
The display state of the search result on the display unit 1A of the management computer 10 is shown in FIG. When the operator inputs the start date, the end date, the device code, and the identification code, the control unit 11 searches the printing device file and the print inspection device file in the storage unit 12 and displays the corresponding search results on the display unit 1A. indicate. Further, the operator may add the land number and the standard deviation of Δx and Δy to the search condition to search for the inspection result satisfying these conditions and display it on the display unit 1A.
[0193]
The control unit 11 receives the message of FIG. 4C from the component mounting device 50 and the message of FIG. 4D from the mounting state inspection device 60 via the communication unit 1C.
[0194]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (c), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (c). Save to the component mounting device file. Data from the identification code 1 to the identification code N is stored individually.
[0195]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (d), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (d). Save to the mounting state inspection device file. Data from the identification code 1 to the identification code N is stored individually.
[0196]
The display state of the inspection result of the mounting state inspection device 60 of the display unit 1A of the management computer 10 is shown in FIG. The control unit 11 receives the message of FIG. 4C from the component mounting device 50 and the message of FIG. 4D from the mounting state inspection device 60, and the operation condition of the component mounting device 50 is displayed in the upper part of the screen, and further in the lower part of the screen. The inspection result of the part 57 is displayed. The operation condition is displayed as the date, the device code of the component mounting device 50, the identification code of the component supply device 57, and the mounting code. As the inspection result, Δx · Δy of the component 57 indicated by the mounting code is displayed. The graph displays the number of printed sheets on the horizontal axis and Δx · Δy on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0197]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0198]
The display state of the search result on the display unit 1A of the management computer 10 is shown in FIG. When the operator inputs the start date, end date, device code, and identification code, the control unit 11 searches the component mounting device file and the mounting state inspection device file in the storage unit 12 and displays the corresponding search results. 1A is displayed. Further, the operator may add the standard deviations of Δx and Δy to the search conditions to search for inspection results that satisfy these conditions and display them on the display unit 1A.
[0199]
The control unit 11 receives the telegram of FIG. 4E from the component joining device 70 and the message of FIG. 4F from the joining state inspection device 80 via the communication unit 1C.
[0200]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (e), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (e). Save to the parts joining device file.
[0201]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (f), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (f). It saves in the joining state inspection device file. Data from the identification code 1 to the identification code N is stored individually.
[0202]
The display state of the inspection result of the bonding state inspection device 80 of the display unit 1A of the management computer 10 is shown in FIG. The control unit 11 receives the message of FIG. 4 (e) from the component joining device 70 and the message of FIG. 4 (f) from the joining state inspection device 80, and the operation condition of the component joining device 70 is displayed on the upper stage of the screen, and further, The inspection result of the part 57 is displayed. The operation condition is displayed as the date, the device code of the component joining device 70, the identification code of the heating nozzle 72, and the mounting code. As the inspection result, Δx · Δy of the component 57 indicated by the mounting code is displayed. The graph displays the number of printed sheets on the horizontal axis and Δx · Δy on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0203]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0204]
The display state of the search result on the display unit 1A of the management computer 10 is shown in FIG. When the operator inputs the start date, the end date, the device code, and the identification code, the control unit 11 searches the component joining device file and the joining state inspection device file in the storage unit 12 and displays the corresponding search results. 1A is displayed. Further, the operator may add the standard deviations of Δx and Δy to the search conditions to search for inspection results that satisfy these conditions and display them on the display unit 1A.
[0205]
Next, the processing procedure of the cleaning process will be described.
[0206]
When the control unit 11 receives the message of FIG. 4A from the printing device 30 via the communication unit 1C, the control unit 11 confirms that the device classification of the device code 1 is 03 (printing device), and FIG. The data is saved in the metal plate file of the storage unit 12 in the format of h). Only when the usage state is a value indicating storage, a value indicating the usage is set in the usage state. If the usage status is other than storage, a value indicating an error is set in the usage status.
[0207]
The control unit 11 receives the message of FIG. 4G from the cleaning device 110 via the communication unit 1C. The display state of the display unit 1A of the management computer 10 is shown in FIG.
[0208]
The control unit 11 displays the date, the device code, the identification code, and the usage state when received in the message of FIG.
[0209]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (g), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (g). Save to a metal plate file. Data from the identification code 1 to the identification code N is stored individually.
[0210]
Further, the control unit 11 confirms that the device classification of the device code 7 is 11 (cleaning device), and saves it in the metal plate file of the storage unit 12 in the format of FIG. Only when the use state is a value indicating use, a value indicating cleaning is set in the use state. If the usage status is not in use, a value indicating an error is set in the usage status. Data from the identification code 1 to the identification code N is stored individually.
[0211]
The control unit 11 receives the message of FIG. 4H from the storage device 120 via the communication unit 1C. The display state of the display unit 1A of the management computer 10 is shown in FIG.
[0212]
The control unit 11 displays the date, the device code, the identification code, and the usage state when received in the message of FIG.
[0213]
The control unit 11 adds the year / month / day / hour / minute / second when received to the message of FIG. 4 (h), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (i). Save to a metal plate file. Data from the identification code 1 to the identification code N is stored individually.
[0214]
Further, the control unit 11 confirms that the device classification of the device code 8 is 12 (storage device), and saves it in the metal plate file of the storage unit 12 in the format of FIG. Only when the use state is a value indicating that the product is being cleaned, the value indicating that the product is being stored is set in the use state. If the usage status is not cleaning, set a value indicating an error in the usage status. Data from the identification code 1 to the identification code N is stored individually.
[0215]
The display state of the search result on the display unit 1A of the management computer 10 is shown in FIG. When the operator inputs the start identification code and the end identification code, the control unit 11 searches the metal plate file in the storage unit 12 and displays the corresponding search result on the display unit 1A.
[0216]
As described above, in the first embodiment, a storage medium for storing an identification code is provided in a component incorporated in the apparatus, a reader for the storage medium is provided in the apparatus, and these data are stored in the management computer 10. By evaluating the difference including the characteristics of the component devices, the processing accuracy of the component mounting system can be improved to the current level or higher.
[0217]
Furthermore, it is possible to provide information necessary for efficiently operating the component mounting line to the operator, and also provide information necessary for transmission of technical information between the operators.
[0218]
In this description, the three inspection apparatuses, that is, the print inspection apparatus 40, the mounting state inspection apparatus 60, and the bonding state inspection apparatus 80 are used. However, one inspection apparatus that is necessary for actual operation is used. Or use in combination.
[0219]
(Embodiment 2)
The second embodiment of the present invention will be described with reference to FIGS. 2, 5, 6, 7, 8, 10, 11, 12, 14, 15, 19, 20, 21, 22, 23, 24, 25, and FIGS. I will explain.
[0220]
FIG. 29 is a diagram illustrating a block configuration of the component mounting system 200.
[0221]
In FIG. 29, a management computer 210 is connected to each device constituting the component mounting system 200 via the network 100, and manages the entire component mounting system 200.
[0222]
The substrate loading device 20 is connected to the printing device 30, stores the substrate inside the device, and sequentially loads the substrate into the printing device 30.
[0223]
The printing apparatus 130 has a storage medium for storing the apparatus code of the apparatus itself, and is connected to the management computer 10 via the network 100. The printing apparatus 130 transmits operating conditions to the management computer 10 and is used for joining parts on the land of the board. Print the bonding material. For example, a solder paste is used as the bonding material.
[0224]
The print inspection apparatus 40 is connected to the management computer 210 via the network 100, inspects the printing state of the bonding material on the printed substrate, and transmits the inspection result to the management computer 210.
[0225]
The component mounting device 150 has a storage medium for storing the device code of the device itself, is connected to the management computer 210 via the network 100, and mounts the component on the board on which the bonding material is printed.
[0226]
The mounting state inspection device 60 is connected to the management computer 210 via the network 100, inspects for the presence / absence of a component on the substrate after component mounting and the positional deviation, and transmits the inspection result to the management computer 210.
[0227]
The component bonding apparatus 170 has a storage medium for storing the apparatus code of the apparatus itself, and is connected to the management computer 210 via the network 100. The component bonding apparatus 170 transmits operating conditions to the management computer 210 and heats the bonding material after mounting the components. Then, the component is bonded to the board.
[0228]
The mounting state inspection apparatus 80 is connected to the management computer 210 via the network 100, inspects the mounting state of components on the substrate after bonding, and transmits the inspection result to the management computer 210.
[0229]
The substrate recovery device 90 is connected to the mounting state inspection device 80 and receives the substrate from the mounting state inspection device 80 and stores it in the device.
[0230]
The devices from the substrate loading device 20 to the substrate recovery device 90 are connected by rails (not shown) for transporting the substrates, and the substrates are sequentially transported from upstream to downstream.
[0231]
The information input device 180 includes a storage medium of the printing device 130 itself, a storage medium of a metal plate, a storage medium of the component mounting device 150 itself, a storage medium of the component supply device, a storage medium of the component joining device 170 itself, and a storage medium of the heating nozzle. And the information stored in each storage medium is transmitted to the management computer 210.
[0232]
Next, each device constituting the component mounting system 200 will be described in detail.
[0233]
The configuration and processing procedure of the substrate loading apparatus 20 are the same as those described with reference to FIG.
[0234]
FIG. 30 is a diagram illustrating a block configuration of the information input device 180.
[0235]
In FIG. 30, the control unit 181 controls the entire information input device 180. The reader 182 reads the storage medium of the apparatus main body and components. As the reader 182, for example, a reader for a non-contact IC chip is used.
[0236]
The display unit 18A displays the operating state of the apparatus. The key input unit 18B instructs the operator to start and end reading of the storage medium and start transmission of the read information. The communication port 18C transmits the information read by the reader 182 to the management computer 210. The memory 18D stores a control program and data necessary for input processing.
[0237]
FIG. 31 is a diagram illustrating a block configuration of the printing apparatus 130.
[0238]
In FIG. 31, the control unit 131 controls the entire printing apparatus 130. The squeegee driving unit 132 drives the squeegee 135 at a predetermined squeegee speed. The squeegee 135 has a spatula portion 136 and applies a bonding material 139 onto the metal plate 137. As the bonding material 139, for example, a solder paste is used.
[0239]
The metal plate 137 has a storage medium 138, stores an identification code for uniquely identifying the metal plate, has a hole in a part of the plate surface, and prints the bonding material 139 on the substrate 134. As the storage medium 138, for example, a non-contact IC chip is used. An example of the definition of the identification code stored in the storage medium 138 is shown in FIG. Details of the metal plate 137 are the same as those in FIG.
[0240]
The substrate feeding mechanism unit 133 receives the substrate 134 from the substrate loading device 20 and presses it against the lower surface of the metal plate 137 at a predetermined position and squeegee printing pressure. After printing, the substrate feeding mechanism unit 133 separates the substrate 134 at a predetermined separation speed and sends it to the print inspection apparatus 40.
[0241]
The display unit 13A displays the operating state of the apparatus. In the key input unit 13B, an operator inputs operating conditions and the like. The communication unit 13 </ b> C is connected to the management computer 210 and transmits operating conditions to the management computer 210. The memory 3D stores the control program, the device code 1, and data necessary for the printing process. The storage medium 13E stores a device code of the printing device 130.
[0242]
Next, the processing operation will be described. The operator installs the metal plate 137 inside the printing apparatus 130, reads the storage medium 13 </ b> E and the storage medium 138 with the information input apparatus 180, and transmits them to the management computer 210. FIG. 32A shows an example of a message format transmitted from the information input device 180 to the management computer 210. The information input device 180 transmits the device code 1 and the identification code to the management computer 210. The device code 1 is a device code whose device classification is 03 (printing device). The definition of the device code is shown in FIG.
[0243]
Next, when the operator inputs a printing start after inputting operating conditions such as a squeegee speed, a squeegee printing pressure, and a separating speed from the key input unit 13B, the control unit 131 transmits the operating conditions to the management computer 210 via the communication unit 13C. To do.
[0244]
An example of a message format transmitted from the control unit 131 to the management computer 210 is shown in FIG. The control unit 131 transmits the device code 1 and the squeegee speed / squeegee printing pressure / separation speed to the management computer 210. The device code 1 is a device code whose device classification is 03 (printing device). The definition of the device code is shown in FIG.
[0245]
Thereafter, the control unit 131 receives the substrate 134 from the substrate loading apparatus 20 by the substrate feeding mechanism unit 133 and presses it against the lower surface of the metal plate 137 at a predetermined position and printing pressure. The control unit 131 drives the squeegee 135 by the squeegee driving unit 132 to apply the bonding material 139 onto the metal plate 137.
[0246]
The control unit 131 separates the substrate 134 at a predetermined separation speed by the substrate feeding mechanism unit 133 and sends the substrate 134 to the print inspection apparatus 40.
[0247]
The configuration and processing procedure of the print inspection apparatus 40 are the same as those in FIGS.
[0248]
An example of a message format transmitted from the control unit 41 of the print inspection apparatus 40 to the management computer 10 is shown in FIG. The control unit 41 transmits the inspection result N from the device code 2 and the inspection result 1 to the management computer 210. The device code 2 is a device code whose device classification is 04 (printing inspection device). The definition of the device code is shown in FIG. N is the number of inspected lands. The inspection result n (n = 1 to N) is composed of land number, Δx, Δy, and% notation of the amount of bonding material. The land number is a code for uniquely identifying the land 46.
[0249]
FIG. 33 is a diagram illustrating a block configuration of the component mounting apparatus 150.
[0250]
In FIG. 33A, the control unit 151 controls the entire component mounting apparatus 150. The nozzle drive unit 152 moves the nozzle unit 153 to the X, Y, Z coordinates and the Z axis angle. The nozzle unit 153 sucks the component 156 of the component supply device 157 and places it on the substrate 154.
[0251]
The component supply unit 159 is a table on which several tens of component supply devices 157 are placed and moved, and the table is moved so that the nozzle unit 153 can suck the component 156.
[0252]
The substrate feeding mechanism unit 153 receives the substrate 154 from the print inspection apparatus 40 and fixes it at a predetermined position. After mounting the components, the board feeding mechanism unit 153 sends the board 154 to the mounting state inspection apparatus 60.
[0253]
The display unit 15A displays the operating state of the apparatus. In the key input unit 15B, an operator inputs operating conditions and the like. The communication unit 15C is connected to the management computer 210 and transmits the operating status of the apparatus to the management computer 210. The memory 15D stores a control program, device code 3, and data necessary for component mounting processing. The storage medium 15E stores a device code of the component mounting device 150.
[0254]
In FIG. 33B, the component supply device 157 taps the component 156 and winds the component 156 around the reel, and a component holding the component reel 157a and feeding the component 156 one by one to a position where the nozzle unit 153 can suck the component 156. The feeding mechanism 157b, a fixing unit 157c for fixing the component supply device 157 itself to the component supply unit 159, and a storage medium 158 for storing an identification code for uniquely identifying the component supply device.
[0255]
Next, the processing operation will be described. The operator installs the component supply device 157 in the component supply unit 159, reads the storage medium 15 E and the storage medium 158 with the information input device 180, and transmits them to the management computer 210. An example of a message format transmitted from the information input device 180 to the management computer 210 is shown in FIG. The information input device 180 transmits the identification code N from the device code 3 and the identification code 1 to the management computer 10. The device code 3 is a device code whose device classification is 05 (component mounting device). The definition of the device code is shown in FIG. The operator reads the component supply devices 157 mounted on the component supply unit 159 in ascending order of column numbers, and N matches the number of component supply devices 157.
[0256]
Next, when the operator instructs to start component mounting from the key input unit 15B, the control unit 151 receives the substrate 154 that has been inspected from the print inspection apparatus 40 by the substrate feeding mechanism unit 153, and fixes it to a predetermined position.
[0257]
The control unit 151 performs a mounting process according to the mounting information. The control unit 151 causes the component supply unit 159 to move the component supply device 157 to a row in which the nozzle unit 153 can suck the component 156. The control unit 151 drives the nozzle unit 155 onto the component supply device 157 by the nozzle unit driving unit 152. The control unit 151 sucks the component 157 of the component supply device 157 through the nozzle unit 155. The control unit 151 drives the nozzle unit 155 onto the substrate 154 by the nozzle unit driving unit 152. The control unit 151 mounts the component 157 on the substrate 154 by the nozzle unit 155.
[0258]
The description of the mounting information is the same as in FIG.
[0259]
After completing the component mounting, the control unit 151 sends the substrate 154 to the mounting state inspection device 60 by the substrate feeding mechanism unit 153.
[0260]
Since the configuration and processing procedure of the mounting state inspection apparatus 60 are the same as those in FIGS.
[0261]
FIG. 32E shows an example of a message format that the control unit 61 of the mounting state inspection apparatus 60 transmits to the management computer 210. The control unit 61 transmits the inspection result N from the device code 4 and the inspection result 1 to the management computer 210. The device code 4 is a device code whose device classification is 06 (mounting state inspection device). The definition of the device code is shown in FIG. N is the number of parts 57 to be inspected. The inspection result n (n = 1 to N) includes an implementation code, Δx, Δy, and special notes. The mounting code is the same as the description of the mounting information in FIG.
[0262]
FIG. 34 is a diagram showing a block configuration of the component bonding apparatus 170.
[0263]
In FIG. 34, the control unit 171 controls the entire component joining apparatus 170.
[0264]
The heating nozzle 172 has a storage medium 178 and stores an identification code that uniquely identifies the heating nozzle and heats and melts the bonding material to bond the component 157 to the substrate 174. Sensor 175 measures the temperature inside the furnace. As the storage medium 178, for example, a non-contact IC chip is used. An example of the definition of the identification code stored in the storage medium 178 is shown in FIG.
[0265]
The substrate feeding mechanism 173 receives the substrate 174 from the mounting state inspection device 60, moves the inside of the furnace at a predetermined speed, and sends it out to the bonding state inspection device 80.
[0266]
The display unit 17A displays the operating status of the apparatus. In the key input unit 17B, an operator inputs operating conditions and the like. The communication unit 17C is connected to the management computer 210 and transmits operating conditions to the management computer 210. The memory 17D stores a control program, a device code, and data necessary for component joining processing. The storage medium 17E stores a device code of the component joining device 170.
[0267]
Next, the processing operation will be described. The operator installs the heating nozzle 172 inside the component bonding apparatus 170, reads the storage medium 17 E and the storage medium 178 with the information input apparatus 180, and transmits them to the management computer 210. FIG. 32F shows an example of a message format transmitted from the information input device 180 to the management computer 210. The information input device 180 transmits the device code 5 and the identification code to the management computer 210. The device code 5 is a device code whose device classification is 07 (component joining device). The definition of the device code is shown in FIG.
[0268]
Next, when the operator inputs an operation condition such as the moving speed / temperature set value of the board feed mechanism 173 from the key input unit 17B and then instructs to start component joining, the control unit 171 manages the operation condition via the communication unit 7C. Send to computer 10.
[0269]
An example of a message format transmitted from the control unit 171 to the management computer 210 is shown in FIG. The control unit 171 transmits the device code 5 and the temperature set value to the management computer 210. The device code 5 is a device code whose device classification is 07 (joining device). The definition of the device code is shown in FIG.
[0270]
After confirming that the temperature inside the furnace has reached a preset temperature set value by the sensor 175, the control unit 171 receives the substrate 174 from the mounting state inspection device 60, moves the inside of the furnace at a predetermined speed, and performs bonding. It is sent to the state inspection device 80.
[0271]
The configuration and processing procedure of the bonding state inspection device 80 are the same as those in FIG.
[0272]
An example of a message format transmitted from the control unit 81 of the bonding state inspection device 80 to the management computer 210 is shown in FIG. The control unit 81 transmits the inspection result N from the device code 6 and the inspection result 1 to the management computer 210. The device code 6 is a device code whose device classification is 08 (bonding state inspection device). The definition of the device code is shown in FIG. N is the number of parts 57 to be inspected. The inspection result n (n = 1 to N) includes an implementation code, Δx, Δy, and special notes. The mounting code is the same as the description of the mounting information in FIG.
[0273]
The configuration and processing procedure of the substrate recovery apparatus 90 are the same as those in FIG.
[0274]
FIG. 35 is a diagram illustrating a block configuration of the management computer 210.
[0275]
In FIG. 35, the control unit 211 controls the entire management computer 210. The storage unit 212 stores various data collected from each device constituting the component mounting system 100 in association with each other and outputs data corresponding to the search condition when the search condition is input. The clock unit 213 outputs the current date time. The communication port 214 receives data from the information input device 180.
[0276]
The display unit 21A displays the operating status of the apparatus. In the key input unit 21B, an operator inputs operating conditions and the like. The communication unit 21C is connected to each device configuring the component mounting system 100 via the network 100, and transmits and receives data. The memory 21 </ b> D stores a control program and various data collected from each device constituting the component mounting system 100.
[0277]
A procedure in which the management computer 210 processes various data collected from each device constituting the component mounting system 100 will be described.
[0278]
The control unit 211 receives the message of FIG. 32A from the information input device 180 via the communication port 214 and the message of FIG. 32B from the printing device 130 via the communication unit 21C.
[0279]
The control unit 211 adds the year / month / day / hour / minute / second when received to the messages of FIGS. 32 (a) and 32 (b), and uses the identification code + year / month / day / hour / minute / second as a search key. Is saved in the printing device file in the storage unit 212.
[0280]
The control unit 211 appends the year / month / day / hour / minute / second when received to the message of FIG. 32 (c), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (b). Save to a print inspection device file.
[0281]
The display state of the inspection result of the print inspection apparatus 40 of the display unit 1A of the management computer 210 is shown in FIG. The control unit 211 receives the messages of FIG. 32A from the information input device 180, FIG. 32B from the printing device 130, and FIG. 32C from the print inspection device 40, and operates the printing device 130 on the upper stage of the screen. The inspection result of the land of the substrate 44 is displayed in the lower part of the screen. The operation condition is displayed as the date, the device code of the printing device 130, the operation condition of the printing device 130 (squeegee speed, squeegee printing pressure, pulling speed), the identification code of the metal plate 137 and the land number. The inspection result displays land number Δx, Δy, and% notation of the amount of bonding material. The graph displays the number of printed sheets on the horizontal axis and the notation of Δx / Δy / bonding material amount on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0282]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0283]
The display state of the search result on the display unit 21A of the management computer 210 is shown in FIG. When the operator inputs the start date, end date, device code, and identification code, the control unit 211 searches the storage unit 212 and displays a corresponding search result on the display unit 21A. Further, the operator may add the land number and the standard deviation of Δx and Δy to the search condition to search for the inspection result satisfying these conditions and display it on the display unit 21A.
[0284]
The control unit 211 receives the message of FIG. 32D from the information input device 180 via the communication port 214 and the message of FIG. 32E from the mounting state inspection device 60 via the communication unit 21C.
[0285]
The control unit 211 adds the year / month / day / hour / minute / second when received to the message of FIG. 32 (d), and uses the identification code + year / month / date / time / minute / second as a search key in the format of FIG. 19 (c). Save to the component mounting device file. Data from the identification code 1 to the identification code N is stored individually.
[0286]
The control unit 211 adds the year / month / day / hour / minute / second when received to the message of FIG. 32 (e), and uses the identification code + year / month / day / hour / minute / second as a search key in the format of FIG. 19 (d). Save to the mounting state inspection device file. Data from the identification code 1 to the identification code N is stored individually.
[0287]
The display state of the inspection result of the mounting state inspection device 60 of the display unit 21A of the management computer 210 is shown in FIG. The control unit 211 receives the message of FIG. 32 (d) from the information input device 180 and the message of FIG. 32 (e) from the mounting state inspection device 60, and the operating condition of the component mounting device 150 is displayed on the upper part of the screen, and further on the lower part of the screen. The inspection result of the part 57 is displayed. As the operation condition, the date, the device code of the component mounting device 150, the identification code of the component supply device 157, and the mounting code are displayed. As the inspection result, Δx · Δy of the component 57 indicated by the mounting code is displayed. The graph displays the number of printed sheets on the horizontal axis and Δx · Δy on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0288]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0289]
A display state of the search result on the display unit 21A of the management computer 210 is shown in FIG. When the operator inputs the start date, end date, device code, and identification code, the control unit 211 searches the storage unit 212 and displays a corresponding search result on the display unit 21A. Further, the operator may add the standard deviations of Δx and Δy to the search conditions to search for inspection results that satisfy these conditions and display them on the display unit 21A.
[0290]
The control unit 211 receives the information input device 180 from the communication port 214 through FIG. 32 (f), the communication unit 21C through the component joining device 70 through FIG. 32 (g), and the joined state inspection device 80 through FIG. 32 (h). Receive the message.
[0291]
The control unit 211 adds the year / month / day / hour / minute / second when received to the messages in FIGS. 32 (f) and 32 (g), and uses the identification code + year / month / day / hour / minute / second as a search key. To save in the component joining device file of the storage unit 212.
[0292]
The control unit 211 adds the year / month / day / hour / minute / second when received to the message in FIG. 32 (h), and uses the identification code + year / month / date / time / minute / second as a search key in the format of FIG. 19 (f). It saves in the joining state inspection device file. Data from the identification code 1 to the identification code N is stored individually.
[0293]
The display state of the inspection result of the bonding state inspection device 80 of the display unit 21A of the management computer 210 is shown in FIG. The control unit 211 receives the messages of FIG. 32 (f) from the information input device 180, FIG. 32 (g) from the component joining device 170, and FIG. 32 (h) from the joining state inspection device 80. The operation result of 170 and the inspection result of the part 57 are displayed in the lower part of the screen. The operating condition is the date, the device code of the component joining device 170, the identification code of the heating nozzle 172, and the mounting code. As the inspection result, Δx · Δy of the component 57 indicated by the mounting code is displayed. The graph displays the number of printed sheets on the horizontal axis and Δx · Δy on the vertical axis. By displaying the number of printed sheets on the horizontal axis, changes in inspection results can be confirmed in real time.
[0294]
In addition, a threshold value for generating an alarm in advance can be provided, an alarm can be generated when the threshold value is exceeded, and component mounting can be stopped.
[0295]
The display state of the search result on the display unit 21A of the management computer 210 is shown in FIG. When the operator inputs the start date, end date, device code, and identification code, the control unit 211 searches the storage unit 212 and displays a corresponding search result on the display unit 21A. Further, the operator may add the standard deviations of Δx and Δy to the search conditions to search for inspection results that satisfy these conditions and display them on the display unit 21A.
[0296]
As described above, in the second embodiment, a storage medium for storing an identification code is provided in a component incorporated in the apparatus, and a dedicated information input device 180 that reads the storage medium is used to store these data. By evaluating the management computer 210 including the difference in the characteristics of the component devices, it is possible to improve the processing accuracy of the component mounting system to the current level or higher.
[0297]
Furthermore, it is possible to provide information necessary for efficiently operating the component mounting line to the operator, and also provide information necessary for transmission of technical information between the operators.
[0298]
In this description, the three inspection apparatuses, that is, the print inspection apparatus 40, the mounting state inspection apparatus 60, and the bonding state inspection apparatus 80 are used. However, one inspection apparatus that is necessary for actual operation is used. Or use in combination.
[0299]
【The invention's effect】
As is clear from the above description, according to the component mounting system of the present invention, the operating conditions of each device constituting the component mounting system are associated with the components incorporated in the device, including the difference in the characteristics of the component devices. By evaluating, the processing accuracy of the component mounting system can be improved.
[0300]
Furthermore, it is possible to provide information necessary for efficiently operating the component mounting line to the operator, and also provide information necessary for transmission of technical information between the operators.
[Brief description of the drawings]
FIG. 1 is a block configuration diagram of a component mounting system 1 according to a first embodiment of the present invention.
FIG. 2 is a block configuration diagram of a substrate loading apparatus 20 according to the first embodiment of the present invention.
FIG. 3 is a block diagram of the printing apparatus 30 according to the first embodiment of the present invention.
FIG. 4A is a diagram of a message format transmitted to the management computer 10 according to the first embodiment of the present invention.
(B) Diagram of a message format transmitted to the management computer 10 according to the first embodiment of the present invention
(C) Diagram of a message format transmitted to the management computer 10 according to the first embodiment of the present invention
(D) Diagram of the message format transmitted to the management computer 10 according to the first embodiment of the present invention
(E) Message format transmitted to the management computer 10 according to the first embodiment of the present invention
(F) Diagram of message format transmitted to management computer 10 according to the first embodiment of the present invention
(G) Diagram of a message format transmitted to the management computer 10 according to the first embodiment of the present invention
(H) Diagram of a message format transmitted to the management computer 10 according to the first embodiment of the present invention
FIG. 5A is a diagram showing a definition of a device code according to the first and second embodiments of the present invention.
(B) The figure which shows the definition of the apparatus code of Embodiment 1 and 2 of this invention
FIG. 6A is a top view of the metal plate 37 according to the first embodiment of the present invention.
(B) Sectional view of the metal plate 37 according to the first embodiment of the present invention.
(C) Enlarged view of portion B of metal plate 37 according to the first embodiment of the present invention.
FIG. 7 is a block diagram of the print inspection apparatus 40 according to the first embodiment of the present invention.
FIG. 8 is a diagram showing an example of an inspection method of the print inspection apparatus 40 according to the first embodiment of the present invention.
FIG. 9A is a block configuration diagram of the component mounting apparatus 50 according to the first embodiment of the present invention.
(B) Block configuration diagram of the component mounting apparatus 50 according to the first embodiment of the present invention.
FIG. 10 is a diagram showing an example of mounting information according to the first and second embodiments of the present invention.
FIG. 11 is a block configuration diagram of the mounting state inspection apparatus 60 according to the first embodiment of the present invention.
12A is a top view showing an example of an inspection method for the mounting state inspection apparatus 60 and the bonding state inspection apparatus 80 according to Embodiment 1 of the present invention. FIG.
(B) The A section enlarged view of one Example of the inspection method of the mounting state inspection apparatus 60 and the joining state inspection apparatus 80 of Embodiment 1 of this invention.
FIG. 13 is a block configuration diagram of a component bonding apparatus 70 according to the first embodiment of the present invention.
FIG. 14 is a block configuration diagram of a bonding state inspection device 80 according to the first embodiment of the present invention.
FIG. 15 is a block configuration diagram of a substrate recovery apparatus 90 according to the first embodiment of the present invention.
FIG. 16 is a block configuration diagram of the cleaning apparatus 110 according to the first embodiment of the present invention.
FIG. 17 is a block configuration diagram of the storage device 120 according to the first embodiment of the present invention.
FIG. 18 is a block configuration diagram of the management computer 10 according to the first embodiment of the present invention.
FIG. 19A is a diagram showing a format of the storage unit 12 and the storage unit 212 of the second embodiment of the present invention;
(B) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention, and the memory | storage part 212 of 2
(C) The figure which shows the format of the memory | storage part 12 of the memory | storage part 12 and 2 of Embodiment 1 of this invention.
(D) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention, and the memory | storage part 212 of 2
(E) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention, and the memory | storage part 212 of 2
(F) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention, and the memory | storage part 212 of 2
(G) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention, and the memory | storage part 212 of 2
(H) The figure which shows the format of the memory | storage part 12 of the memory | storage part 12 and 2 of Embodiment 1 of this invention.
(I) The figure which shows the format of the memory | storage part 12 of Embodiment 1 of this invention and the memory | storage part 212 of 2
FIG. 20 is a diagram showing a display state of the inspection result of the print inspection apparatus 40 according to the first and second embodiments of the present invention.
FIG. 21 is a diagram showing a display state of a search result of the print inspection apparatus 40 of the management computer 10 and the management computer 210 of the first embodiment of the present invention.
FIG. 22 is a view showing a display state of an inspection result of the mounting state inspection device 60 according to the first and second embodiments of the present invention.
FIG. 23 is a diagram showing a display state of a search result of the mounting state inspection device 60 of the management computer 10 and the management computer 210 of the first embodiment of the present invention;
FIG. 24 is a diagram showing a display state of an inspection result of the bonding state inspection device 80 according to the first and second embodiments of the present invention.
FIG. 25 is a diagram showing a display state of a search result of the joining state inspection device 80 of the management computer 10 and the management computer 210 of the first embodiment of the present invention.
FIG. 26 is a diagram showing a display state when the management computer 10 according to the first embodiment of the present invention receives a message from the cleaning device 110.
FIG. 27 is a diagram showing a display state when the management computer 10 according to the first embodiment of the present invention receives a message from the storage device 120.
FIG. 28 is a diagram showing a display state of the search result of the metal plate of the management computer 10 according to the first embodiment of the present invention.
FIG. 29 is a block configuration diagram of a component mounting system 200 according to the second embodiment of the present invention.
FIG. 30A is a block configuration diagram of an information input device 180 according to the second embodiment of the present invention.
(B) Enlarged view of the key input unit of the information input device 180 according to the second embodiment of the present invention.
FIG. 31 is a block diagram of the printing apparatus 130 according to the second embodiment of the present invention.
FIG. 32A is a diagram of a message format transmitted to the management computer 210 according to the second embodiment of the present invention.
(B) Diagram of a message format transmitted to the management computer 210 according to the second embodiment of the present invention
(C) Diagram of a message format transmitted to the management computer 210 according to the second embodiment of the present invention
(D) Diagram of a message format transmitted to the management computer 210 according to the second embodiment of the present invention
(E) Message format transmitted to the management computer 210 according to the second embodiment of the present invention
(F) Message format transmitted to the management computer 210 according to the second embodiment of the present invention
(G) Diagram of a message format transmitted to the management computer 210 according to the second embodiment of the present invention
(H) Message format transmitted to the management computer 210 according to the second embodiment of the present invention
FIG. 33 (a) is a block configuration diagram of a component mounting apparatus 150 according to the second embodiment of the present invention.
(B) Block configuration diagram of the component mounting apparatus 150 according to the second embodiment of the present invention.
FIG. 34 is a block configuration diagram of a component bonding apparatus 170 according to Embodiment 2 of the present invention.
FIG. 35 is a block diagram of a management computer 210 according to the second embodiment of the present invention.
FIG. 36 is a configuration diagram of a conventional component mounting line.
[Explanation of symbols]
1 Component mounting system according to Embodiment 1 of the present invention
10 Management computer according to Embodiment 1 of the present invention
11 Control unit of management computer 10 according to the first embodiment of the present invention
12 Storage unit of management computer 10 according to the first embodiment of the present invention
13 Clock unit of management computer 10 according to the first embodiment of the present invention
1A Display Unit of Management Computer 10 of Embodiment 1 of the Present Invention
1B Key input unit of management computer 10 according to Embodiment 1 of the present invention
1C Communication unit of management computer 10 according to Embodiment 1 of the present invention
1D Memory of management computer 10 according to the first embodiment of the present invention
20 Substrate loading apparatus according to Embodiments 1 and 2 of the present invention
21 Control unit of substrate loading apparatus 20 according to first and second embodiments of the present invention
22 Loading unit of substrate loading apparatus 20 according to first and second embodiments of the present invention
23 Lift portion of substrate loading apparatus 20 according to first and second embodiments of the present invention
24 Substrate storage part of substrate loading apparatus 20 according to first and second embodiments of the present invention
2A Display Unit of Substrate Loading Device 20 of Embodiments 1 and 2 of the Present Invention
2B Key Input Unit of Substrate Loading Device 20 of Embodiments 1 and 2 of the Present Invention
2C IO port of substrate loading apparatus 20 of embodiments 1 and 2 of the present invention
2D Memory of Substrate Loading Device 20 of Embodiments 1 and 2 of the Present Invention
30 Printing apparatus according to the first embodiment of the present invention
31 Control Unit of Printing Apparatus 30 of Embodiment 1 of the Invention
32 Squeegee Drive Unit of Printing Apparatus 30 of Embodiment 1 of the Invention
33 Substrate feeding mechanism section of printing apparatus 30 according to the first embodiment of the present invention
34 Substrate of printing apparatus 30 according to the first embodiment of the present invention
35 Squeegee of printing apparatus 30 according to the first embodiment of the present invention.
36 Spatula part of printing apparatus 30 according to the first embodiment of the present invention
37 Metal plate of printing apparatus 30 according to the first embodiment of the present invention
38 Storage medium of metal plate 37 according to the first embodiment of the present invention
39 Joining material of printing apparatus 30 according to the first embodiment of the present invention
3A Display Unit of Printing Device 30 of Embodiment 1 of the Present Invention
3B Key input unit of printing apparatus 30 according to the first embodiment of the present invention
3C IO port of the printing apparatus 30 according to the first embodiment of the present invention
3D Memory of printing apparatus 30 according to the first embodiment of the present invention
3E Reader of printing apparatus 30 according to Embodiment 1 of the present invention
40 Print inspection apparatus 40 according to first and second embodiments of the present invention
41 Control unit of print inspection apparatus 40 according to first and second embodiments of the present invention
42 Camera drive unit of print inspection apparatus 40 according to first and second embodiments of the present invention
43 Substrate feed mechanism section of print inspection apparatus 40 according to first and second embodiments of the present invention
44 Substrate of printing inspection apparatus 40 according to first and second embodiments of the present invention
45 Camera of the printing inspection apparatus 40 according to the first and second embodiments of the present invention
46 Land of the print inspection apparatus 40 according to the first and second embodiments of the present invention
4A Display Unit of Print Inspection Apparatus 40 of Embodiments 1 and 2 of the Present Invention
4B Key Input Unit of Print Inspection Apparatus 40 of Embodiments 1 and 2 of the Present Invention
4C Communication unit of print inspection apparatus 40 according to embodiments 1 and 2 of the present invention
4D Memory of Print Inspection Apparatus 40 of Embodiments 1 and 2 of the Present Invention
50 Component mounting apparatus according to Embodiment 1 of the present invention
51 Control unit of component mounting apparatus 50 according to Embodiment 1 of the present invention
52 Nozzle part drive part of component mounting apparatus 50 of Embodiment 1 of the present invention
53 Nozzle portion of component mounting apparatus 50 according to Embodiment 1 of the present invention
54 Substrate of component mounting apparatus 50 according to the first embodiment of the present invention
55 Substrate feed mechanism section of component mounting apparatus 50 according to the first embodiment of the present invention
56 Parts of the component mounting apparatus 50 according to the first embodiment of the present invention
57 Component supply apparatus for component mounting apparatus 50 according to Embodiment 1 of the present invention
57a Component reel of component supply device 57 of Embodiment 1 of the present invention
57b Component feeding mechanism of component feeding device 57 according to Embodiment 1 of the present invention
57c Fixing mechanism of component supply device 57 according to Embodiment 1 of the present invention
58 Storage medium of component supply device 57 according to Embodiment 1 of the present invention
59 Component supply unit of component mounting apparatus 50 according to the first embodiment of the present invention
5A Display unit of component mounting apparatus 50 according to Embodiment 1 of the present invention
5B Key input unit of component mounting apparatus 50 according to Embodiment 1 of the present invention
5C Communication unit of component mounting apparatus 50 according to Embodiment 1 of the present invention
5D Memory of component mounting apparatus 50 according to Embodiment 1 of the present invention
5E Reader of component mounting apparatus 50 according to Embodiment 1 of the present invention
60 Mounting state inspection apparatus according to first and second embodiments of the present invention
61 Control Unit of Mounting State Inspection Device 60 of Embodiments 1 and 2 of the Present Invention
62 Camera Drive Unit of Mounting State Inspection Device 60 of Embodiments 1 and 2 of the Present Invention
63 Substrate feeding mechanism section of mounting state inspection apparatus 60 according to first and second embodiments of the present invention
64 Substrate of mounting state inspection apparatus 60 according to first and second embodiments of the present invention
65 Camera of mounting state inspection device 60 of Embodiments 1 and 2 of the present invention
6A Display Unit of Mounting State Inspection Device 60 of Embodiments 1 and 2 of the Present Invention
6B Key input unit of mounting state inspection apparatus 60 according to Embodiments 1 and 2 of the present invention
6C Communication unit of mounting state inspection apparatus 60 according to embodiments 1 and 2 of the present invention
6D Memory of mounting state inspection apparatus 60 according to Embodiments 1 and 2 of the present invention
70 Component joining apparatus according to Embodiment 1 of the present invention
71 Control part of component joining apparatus 70 according to Embodiment 1 of the present invention
72 Heating nozzle of component joining apparatus 70 according to Embodiment 1 of the present invention
73 Substrate feeding mechanism section of component joining apparatus 70 according to Embodiment 1 of the present invention
74 Substrate of component bonding apparatus 70 according to Embodiment 1 of the present invention
75 Sensor of component joining apparatus 70 according to Embodiment 1 of the present invention
78 Storage medium of heating nozzle 72 according to Embodiment 1 of the present invention
7A Display unit of component joining apparatus 70 according to Embodiment 1 of the present invention
7B Key input unit of component joining apparatus 70 according to Embodiment 1 of the present invention
7C Communication unit of component joining apparatus 70 according to Embodiment 1 of the present invention
7D Memory of component joining apparatus 70 according to Embodiment 1 of the present invention
80 Joining state inspection apparatus according to first and second embodiments of the present invention
81 Control unit of bonding state inspection apparatus 80 according to first and second embodiments of the present invention
82 Camera Drive Unit of Joining State Inspection Device 80 of Embodiments 1 and 2 of the Present Invention
83 Substrate feeding mechanism section of bonding state inspection apparatus 80 according to first and second embodiments of the present invention
84 Substrate of bonding state inspection apparatus 80 according to first and second embodiments of the present invention
85 Camera of bonding state inspection apparatus 80 according to first and second embodiments of the present invention
8A Display unit of bonding state inspection apparatus 80 according to embodiments 1 and 2 of the present invention
8B Key input unit of joining state inspection device 80 according to embodiments 1 and 2 of the present invention
8C Communication unit of bonding state inspection apparatus 80 according to embodiments 1 and 2 of the present invention
8D Memory of bonding state inspection apparatus 80 according to embodiments 1 and 2 of the present invention
90 Substrate recovery apparatus according to first and second embodiments of the present invention
91 Control Unit of Substrate Recovery Apparatus 90 of Embodiments 1 and 2 of the Present Invention
92 Recovery unit of substrate recovery apparatus 90 according to first and second embodiments of the present invention
93 Lift part of substrate recovery apparatus 90 of Embodiments 1 and 2 of the present invention
94 Substrate storage part of substrate recovery apparatus 90 of embodiments 1 and 2 of the present invention
9A Display Unit of Substrate Recovery Apparatus 90 of Embodiments 1 and 2 of the Present Invention
9B Key input unit of substrate recovery apparatus 90 according to embodiments 1 and 2 of the present invention
9C IO port of the substrate recovery apparatus 90 according to the first and second embodiments of the present invention
9D Memory of substrate recovery apparatus 90 according to embodiments 1 and 2 of the present invention
100 Network of Embodiments 1 and 2 of the present invention
110 Cleaning apparatus according to embodiment 1 of the present invention
111 Control Unit of Cleaning Device 110 of Embodiment 1 of the Present Invention
112 Reader of cleaning device 110 according to Embodiment 1 of the present invention
113 Cleaning unit of cleaning device 110 according to Embodiment 1 of the present invention
11A Display unit of cleaning apparatus 110 according to Embodiment 1 of the present invention
11B Key input unit of cleaning apparatus 110 according to Embodiment 1 of the present invention
11C Communication unit of cleaning device 110 according to Embodiment 1 of the present invention
11D Memory of cleaning device 110 according to Embodiment 1 of the present invention
120 Storage device of embodiment 1 of the present invention
121 Control Unit of Storage Device 120 of Embodiment 1 of the Invention
122 Reader of storage device 120 according to Embodiment 1 of the present invention
123 Storage unit of storage device 120 according to Embodiment 1 of the present invention
12A Display unit of storage device 120 according to Embodiment 1 of the present invention
12B Key input unit of storage device 120 according to Embodiment 1 of the present invention
12C Communication unit of storage device 120 according to Embodiment 1 of the present invention
12D Memory of storage device 120 according to Embodiment 1 of the present invention
130 Printing apparatus according to Embodiment 2 of the present invention
131 Control Unit of Printing Apparatus 130 of Embodiment 2 of the Invention
132 Squeegee driving unit of printing apparatus 130 according to the second embodiment of the present invention
133 Substrate feed mechanism of printing apparatus 130 according to the second embodiment of the present invention
134 Substrate of printing apparatus 130 according to the second embodiment of the present invention
135 Squeegee of printing apparatus 130 according to embodiment 2 of the present invention
136 Spatula Unit of Printing Device 130 of Embodiment 2 of the Present Invention
137 Metal Plate of Printing Apparatus 130 in Embodiment 2 of the Present Invention
138 Storage medium of metal plate 137 according to Embodiment 2 of the present invention
139 Bonding material of printing apparatus 130 according to Embodiment 2 of the present invention
13A Display unit of printing apparatus 130 according to embodiment 2 of the present invention
13B Key input unit of printing apparatus 130 according to the second embodiment of the present invention
13C IO port of the printing apparatus 130 according to the second embodiment of the present invention.
13D Memory of printing apparatus 130 according to the second embodiment of the present invention
13E Storage medium of printing apparatus 130 according to the second embodiment of the present invention
150 Component mounting apparatus according to Embodiment 2 of the present invention
151 Control Unit of Component Mounting Device 150 according to Embodiment 2 of the Present Invention
152 Nozzle part drive part of component mounting apparatus 150 of Embodiment 2 of the present invention
153 Nozzle portion of component mounting apparatus 150 according to Embodiment 2 of the present invention
154 Board of component mounting apparatus 150 according to the second embodiment of the present invention
155 Substrate Feed Mechanism Unit of Component Mounting Device 150 according to Embodiment 2 of the Present Invention
156 Parts of the component mounting apparatus 150 according to the second embodiment of the present invention
157 Component supply device of component mounting device 150 according to the second embodiment of the present invention
157a Component reel of component supply device 157 according to the second embodiment of the present invention
157b Component feeding mechanism of component feeder 157 according to Embodiment 2 of the present invention
157c Fixing mechanism of component supply device 157 according to Embodiment 2 of the present invention
158 Storage medium of component supply device 157 according to Embodiment 2 of the present invention
159 Component supply unit of component mounting apparatus 150 according to the second embodiment of the present invention
15A Display unit of component mounting apparatus 150 according to Embodiment 2 of the present invention
15B Key input unit of component mounting apparatus 150 according to Embodiment 2 of the present invention
15C Communication unit of component mounting apparatus 150 according to Embodiment 2 of the present invention
15D Memory of component mounting apparatus 150 according to Embodiment 2 of the present invention
15E Storage medium of component mounting apparatus 150 according to Embodiment 2 of the present invention
170 Component joining apparatus according to Embodiment 2 of the present invention
171 Control Unit of Component Joining Device 170 in Embodiment 2 of the present invention
172 Heating nozzle of component joining apparatus 170 according to Embodiment 2 of the present invention
173 Substrate feed mechanism section of component joining apparatus 170 according to Embodiment 2 of the present invention
174 Substrate of component bonding apparatus 170 according to Embodiment 2 of the present invention
175 Sensor of component joining apparatus 170 according to embodiment 2 of the present invention
178 Storage medium of heating nozzle 172 according to Embodiment 2 of the present invention
17A Display unit of component joining apparatus 170 according to Embodiment 2 of the present invention
17B Key input unit of component joining apparatus 170 according to Embodiment 2 of the present invention
17C Communication unit of component joining apparatus 170 according to Embodiment 2 of the present invention
17D Memory of component joining apparatus 170 according to Embodiment 2 of the present invention
17E Storage medium of component joining apparatus 170 according to Embodiment 2 of the present invention
180 Information input device according to the second embodiment of the present invention
200 Component mounting system according to Embodiment 2 of the present invention
210 Management computer according to the second embodiment of the present invention
211 A control unit of the management computer 210 according to the second embodiment of the present invention
212 Storage unit of management computer 210 according to the second embodiment of the present invention
213 Clock unit of management computer 210 according to the second embodiment of the present invention
214 Communication port of management computer 210 according to the second embodiment of the present invention
21A Display unit of management computer 210 according to Embodiment 2 of the present invention
21B Key input unit of management computer 210 according to Embodiment 2 of the present invention
21C Communication unit of management computer 210 according to Embodiment 2 of the present invention
21D Memory of management computer 210 according to the second embodiment of the present invention
300 Conventional component mounting line
301 Board inspection device for conventional component mounting line
302 Conventional component mounting line printing apparatus
303 Print inspection device for conventional component mounting line
304 Component mounting apparatus for conventional component mounting line
305 Conventional component mounting line mounting state inspection device
306 Reflow device for conventional component mounting line
307 Mounting state inspection device for conventional component mounting line
308 Network of conventional component mounting lines
309 Conventional component mounting line management computer

Claims (1)

A mask plate having a first storage medium for storing first information for uniquely identifying and forming a hole in the plate surface; and a printing apparatus for printing a bonding material on a substrate using the mask plate as a component ; a print test device in which the printing apparatus to inspect the state of the bonding material printed on the substrate, the component mounting system comprising a plurality of component mounting line and a management computer that manages the component mounting system, is the printing device device itself A second storage medium for storing second information for uniquely identifying the data, a reader for reading the first and second information stored in the first and second storage media, and the management computer A communication unit that communicates with the first and second information stored in the first and second storage media by the reader, and the first and second information are read in advance. A control means for transmitting to the management computer via a communication unit, the printing inspection device inspects the state of the bonding material printed on the substrate, and transmits the test result to the management computer, the management computer the component mounting system for receiving the first and second information from the printing device, receiving the test results from the printing inspection apparatus, and stores in a state of associating the test result and the first and second information.

Images