CN103732006B - Surface mount system process is divided and control method - Google Patents
Surface mount system process is divided and control method Download PDFInfo
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- CN103732006B CN103732006B CN201410028193.1A CN201410028193A CN103732006B CN 103732006 B CN103732006 B CN 103732006B CN 201410028193 A CN201410028193 A CN 201410028193A CN 103732006 B CN103732006 B CN 103732006B
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Abstract
Surface mount system process is divided and control method, belongs to electrical technology and electrical engineering field. There is in order to solve existing attachment process the problem that production efficiency is low in the present invention. Step 1, mount set-up procedure; Step 2, mount establishment of coordinate system process; Step 3, mount components process: mount components process is made up of pickup device, the rectification of element attitude, spent component and four subprocess of component mounter; Step 4, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism or provide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault; Described fault comprises: benchmark zero-bit looking up the fault, kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault; Step 5, logging. The machine placement speed that utilizes this method is roughly a resistance about 3 seconds, before not optimizing, is about 5 seconds, improves in existing production technology efficiency and reaches at least 15%.
Description
Technical field
The present invention relates to surface mount system process and divide and control method, belong to electrical technology and electrical engineering field.
Background technology
Surface mount system (SMS) is a kind of technique being widely used in current Electronic Assemblies industry, and it is by surface element device(components and parts of chipless pin or short tube pin) are directly placed in the assigned address of electronic seal brush board (PCB), have promoted greatly electricityThe development of sub-industry, has reduced the production cost of electronic equipment, has improved the precision and the efficiency that mount, circuit printing usedPlate can complete and mount without particular procedure. Along with the develop rapidly of Electronic Assemblies technology, China has become surface mounting technologyMaximum market, has been widely used in industries such as space flight, national defence, electronics. At present, still ununified, completeAttachment process flow process can take into account the multiple requirement that mounts that mounts system and different elements, therefore limited production efficiency and matterThe raising of amount.
Summary of the invention
There is in order to solve existing attachment process the problem that production efficiency is low in the present invention, and then a kind of surface mount system is providedTechnological process division and control method.
The present invention solves the problems of the technologies described above the technical scheme of taking to be:
A kind of surface mount system process is divided and control method, and described method realizes according to following steps:
Step 1, mount set-up procedure: mount set-up procedure defeated by producing startup, creation data preparation and optimization and pcb boardEnter three subprocess compositions;
Step 1 (1) is produced and is started: whether transmission command detection mounts system all hardware running status normal;
Step 1 (2) creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;
Step 2, mount establishment of coordinate system process: mount that establishment of coordinate system process is determined by zero point of reference frame and PCB position is trueFixed two subprocess composition;
Find benchmark zero position, set up and mount coordinate system according to the coordinate system positive direction of predetermining; Import substrate into and determine PCBExact position, place PCB substrate to system conveyer, system searching PCB tick lables is corrected PCB substrate and is placed positionPut;
Step 3, mount components process: mount components process is by pickup device, the rectification of element attitude, spent component and elementMount four subprocess compositions;
The list of traversal creation data, complete to mounting according to the information in list successively mount components; While mounting, first look intoLook for the paster demand of first production cycle to change suction nozzle, pick up respective element, correct and pick up attitude, discarded by loaderPick up wrong components and successively component mounter arrived to PCB substrate relevant position;
Step 4, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism orProvide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault; Described fault comprises: benchmark zero-bit looking up the fault,Kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault;
Step 5, logging: all fault messages and operation information in recording process flow process, operation information comprises: recordRunning time, mount components kind and quantity, spent component information.
Described pcb board input refers to that controlling machine conveyer is transported to fixed position by pcb board.
The present invention has following beneficial effect: the invention provides and a kind ofly can take into account the multiple subsides that mount system and different elementsUnified technological process division and the control method of reload request, and provide and realize control method that this flow process divides and correspondingProgram. Can effectively improve PCB production efficiency by the inventive method, utilize the machine placement speed of the inventive method roughlyBeing a resistance about 3 seconds, is about 5 seconds before not optimizing, and improves in existing production technology efficiency and reaches at least 15%.
Brief description of the drawings
Fig. 1 is the specific implementation process FB(flow block) that utilizes the inventive method; Fig. 2 mounts establishment of coordinate system process schematic diagram(in figure, abscissa represents machine movement abscissa, unit millimeter; Ordinate represents machine movement coordinate system ordinate, unitMillimeter).
Coordinate system is explained: in Fig. 2: in upper figure, lower left corner open circles represents XY kinetic coordinate system initial point, and benchmark zero position isThe lower left corner is near the solid initial point of open circles; It is exactly the benchmark zero position of all mechanical locations, all parts with respect to itMechanical dimension is known, finds so the position of its relative open circles, can know the relative open circles of all parts roughlyPosition. Positive direction be exactly XY motion positive direction, the direction that motor code-disc increases.
Detailed description of the invention
Detailed description of the invention one: in present embodiment, surface mount system process is divided and control method, wherein saidAttachment process flow process is divided specific as follows: mounts set-up procedure, mounts establishment of coordinate system process, mount components process, andTroubleshooting, logging.
Wherein, mounting set-up procedure forms by producing three subprocess of startup, creation data preparation and optimization and pcb board input;Mounting establishment of coordinate system process is determined with two subprocess of PCB location positioning and is formed by zero point of reference frame; Mount components process byPickup device, the rectification of element attitude, spent component and four subprocess compositions of component mounter;
Described technological process order is as follows:
1, produce and start: whether software transmission command detection mounts system all hardware running status normal;
2, creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;
3, mount establishment of coordinate system: find benchmark zero position, set up and mount coordinate system according to the coordinate system positive direction of predetermining;
4, import the exact position of substrate definite PCB into: place PCB substrate to system conveyer, system searching PCB positionPut mark and correct PCB substrate placement location;
5, mount components: the list of traversal creation data, complete to mounting according to the information in list successively mount components; Carry outWhile mounting, first searching the paster demand of first production cycle changes suction nozzle, is picked up respective element, corrected and pick up by loaderGet attitude, discard and pick up wrong components and successively component mounter arrived to PCB substrate relevant position.
6, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism or people is providedThe mode of utilizing artificial treatment of machine interactive interface is eliminated fault. Described fault comprises: benchmark zero-bit looking up the fault, motionThe system failure, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault.
7, logging: all fault messages and operation information in recording process flow process, operation information comprises: when record operationBetween, mount components kind and quantity, spent component information.
The program that realizes process control method in the present invention is as follows:
Each process all realizes concrete function by calling this class of ClassProduceControl below.
Claims (2)
- Surface mount system process divide and a control method, it is characterized in that: described method be according to belowStep realizes:Step 1, mount set-up procedure: mount set-up procedure by producing startup, creation data preparation and optimization and PCB baseThree subprocess compositions of plate input;Step 1 (1) is produced and is started: whether transmission command detection mounts system all hardware running status normal;Step 1 (2) creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;Step 2, mount establishment of coordinate system process: mount establishment of coordinate system process and determined and PCB substrate position by zero point of reference framePut and determine two subprocess compositions;Find benchmark zero position, set up and mount coordinate system according to the coordinate system positive direction of predetermining; Import PCB substrate true intoDetermine the exact position of PCB substrate, place PCB substrate to system conveyer, system searching PCB substrate position mark is rectifiedPositive PCB substrate placement location;Step 3, mount components process: mount components process is by pickup device, the rectification of element attitude, spent component and elementMount four subprocess compositions;The list of traversal creation data, complete to mounting according to the information in list successively mount components; While mounting, first look intoLook for the paster demand of first production cycle to change suction nozzle, pick up respective element, correct and pick up attitude, discarded by loaderPick up wrong components and successively component mounter arrived to PCB substrate relevant position;Step 4, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism orProvide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault; Described fault comprises: benchmark zero-bit looking up the fault,Kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault;Step 5, logging: all fault messages and operation information in recording process flow process, operation information comprises: recordRunning time, mount components kind and quantity, spent component information.
- 2. a kind of surface mount system process according to claim 1 is divided and control method, it is characterized in that:In step 1, described PCB substrate input refers to that controlling machine conveyer is transported to fixed position by PCB substrate.
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| CN201410028193.1A CN103732006B (en) | 2014-01-22 | 2014-01-22 | Surface mount system process is divided and control method |
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| CN201410028193.1A CN103732006B (en) | 2014-01-22 | 2014-01-22 | Surface mount system process is divided and control method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105323978B (en) * | 2014-07-24 | 2019-05-31 | 韩华精密机械株式会社 | Data Generator and data creation method |
| CN106292526B (en) * | 2015-05-14 | 2019-07-30 | 广东木几智能装备有限公司 | A kind of the attachment control system and method for the visual identity of both arms bull |
| CN107087387B (en) * | 2017-06-13 | 2018-03-27 | 港加贺电子（深圳）有限公司 | A kind of surface mount elements correction pickup complete machine |
| CN111465210B (en) * | 2020-05-09 | 2021-07-09 | 宁波智能装备研究院有限公司 | Clustering-based LED chip mounter pick-and-place path optimization method |
Citations (3)
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|---|---|---|---|---|
| CN1350421A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting system and mounting method |
| JP2004281518A (en) * | 2003-03-13 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Part mounting system |
| JP2006278503A (en) * | 2005-03-28 | 2006-10-12 | Toho Syst Kk | Method and device for creating processing data of substrate supporting jig |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1350421A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting system and mounting method |
| JP2004281518A (en) * | 2003-03-13 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Part mounting system |
| JP2006278503A (en) * | 2005-03-28 | 2006-10-12 | Toho Syst Kk | Method and device for creating processing data of substrate supporting jig |
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Inventor after: Gao Huijun Inventor after: Yu Jinyong Inventor after: Qiu Jianbin Inventor after: Wang Nan Inventor after: Wang Guang Inventor after: Yao Bozhang Inventor after: Ning Zhaoke Inventor before: Gao Huijun Inventor before: Yu Jinyong Inventor before: Wang Nan Inventor before: Wang Guang Inventor before: Yao Bozhang Inventor before: Ning Zhaoke |
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Effective date of registration: 20190911 Address after: 150001 No. 434, postal street, Nangang District, Heilongjiang, Harbin Co-patentee after: Gao Hui Jun Patentee after: Harbin Institute of Technology Asset Investment Management Co., Ltd. Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Patentee before: Harbin Institute of Technology |
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