CN103732006A - Surface mounting system technological process dividing and control method - Google Patents
Surface mounting system technological process dividing and control method Download PDFInfo
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- CN103732006A CN103732006A CN201410028193.1A CN201410028193A CN103732006A CN 103732006 A CN103732006 A CN 103732006A CN 201410028193 A CN201410028193 A CN 201410028193A CN 103732006 A CN103732006 A CN 103732006A
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Abstract
The invention provides a surface mounting system technological process dividing and control method, belongs to the field of electrical technologies and electrical engineering and aims at solving the problem that an existing surface mounting process is low in production efficiency. The surface mounting system technological process dividing and control method comprises the steps of 1 preparing mounting; 2 establishing mounting coordinate system; 3 mounting element, wherein the element mounting steps include sub steps of picking up the elements, correcting element postures, abandoning the elements and mounting the elements; 4 processing faults, wherein an operation state of a machine is monitored in real time in the process, fault information is fed back, and the faults are eliminated through a fault-tolerant mechanism or a human-computer interaction interface in a manual processing mode and include reference zero-position looking-up faults, motion system faults, visual system faults, feeder abnormity, element mounting faults and suction nozzle replacement faults; 5 recording the work. By adopting the method, the mounting speed of the machine is approximately 3 seconds for one resistor, the mounting speed is about 5 seconds before optimization, and the efficiency of an existing production process is improved by at least 15%.
Description
Technical field
The present invention relates to surface mount system process and divide and control method, belong to electrical technology and electrical engineering field.
Background technology
Surface mount system (SMS) is a kind of technique being widely used in current Electronic Assemblies industry, it is directly placed in surface element device (components and parts of chipless pin or short tube pin) assigned address of electronic seal brush board (PCB), promoted greatly the development of electron trade, reduced the production cost of electronic equipment, improved the precision and the efficiency that mount, circuit printing plate used can complete and mount without particular procedure.Along with the develop rapidly of Electronic Assemblies technology, China has become the market of surface mounting technology maximum, has been widely used in industries such as space flight, national defence, electronics.At present, still ununified, complete attachment process flow process can be taken into account the multiple requirement that mounts that mounts system and different elements, has therefore limited the raising of production efficiency and quality.
Summary of the invention
There is in order to solve existing attachment process the problem that production efficiency is low in the present invention, and then provides a kind of surface mount system process to divide and control method.
The present invention solves the problems of the technologies described above the technical scheme of taking to be:
A kind of surface mount system process is divided and control method, and described method realizes according to following steps:
Step 1, mount set-up procedure: mount set-up procedure by producing startup, creation data preparation and optimization and three subprocess of pcb board input form;
Step 1 (1) is produced and is started: whether transmission command detection mounts system all hardware running status normal;
Step 1 (2) creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;
Step 2, mount establishment of coordinate system process: mount that establishment of coordinate system process is determined by zero point of reference frame and two subprocess of PCB location positioning form;
Find benchmark zero position, according to the coordinate system positive direction of predetermining, set up and mount coordinate system; Import the exact position of substrate definite PCB into, place PCB substrate to system conveyer, system searching PCB tick lables is corrected PCB substrate placement location;
Step 3, mount components process: mount components process is comprised of pickup device, the rectification of element attitude, spent component and four subprocess of component mounter;
The list of traversal creation data, complete to mounting according to the information in list successively mount components; The paster demand of first searching first production cycle while mounting change suction nozzle, by loader pick up respective element, correct pick up attitude, discarded pick up wrong components and successively by component mounter to PCB substrate relevant position;
Step 4, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism or provide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault; Described fault comprises: benchmark zero-bit looking up the fault, kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault;
Step 5, logging: all fault messages and operation information in recording process flow process, operation information comprises: record running time, mount components kind and quantity, spent component information.
Described pcb board input refers to that controlling machine conveyer is transported to fixed position by pcb board.
The present invention has following beneficial effect: the invention provides and a kind ofly can take into account multiple unified technological process division and the control method that mount requirement that mounts system and different elements, and provide and realize control method and the corresponding program that this flow process is divided.By the inventive method, can effectively improve PCB production efficiency, the machine placement speed that utilizes the inventive method is roughly a resistance about 3 seconds, before not optimizing, is about 5 seconds, improves in existing production technology efficiency and reaches at least 15%.
Accompanying drawing explanation
Fig. 1 is the specific implementation process FB(flow block) of utilizing the inventive method; Fig. 2 mounts establishment of coordinate system process schematic diagram (in figure, abscissa represents machine movement abscissa, unit millimeter; Ordinate represents machine movement coordinate system ordinate, unit millimeter).
Coordinate system is explained: in Fig. 2: in upper figure, lower left corner open circles represents XY kinetic coordinate system initial point, benchmark zero position is the solid initial point of the lower left corner near open circles; It is exactly the benchmark zero position of all mechanical locations, and all parts are known with respect to its mechanical dimension, finds so the position of its relative open circles, can know the approximate location of the relative open circles of all parts.Positive direction be exactly XY motion positive direction, the direction that motor code-disc increases.
Embodiment
Embodiment one: in present embodiment, surface mount system process is divided and control method, wherein said attachment process flow process is divided specific as follows: mounts set-up procedure, mounts establishment of coordinate system process, mount components process, and troubleshooting, logging.
Wherein, mounting set-up procedure forms by producing three subprocess of startup, creation data preparation and optimization and pcb board input; Mounting establishment of coordinate system process is determined with two subprocess of PCB location positioning and is formed by zero point of reference frame; Mount components process is comprised of pickup device, the rectification of element attitude, spent component and four subprocess of component mounter;
Described technological process order is as follows:
1, produce and start: whether software transmission command detection mounts system all hardware running status normal;
2, creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;
3, mount establishment of coordinate system: find benchmark zero position, according to the coordinate system positive direction of predetermining, set up and mount coordinate system;
4, import the exact position of substrate definite PCB into: place PCB substrate to system conveyer, system searching PCB tick lables is corrected PCB substrate placement location;
5, mount components: the list of traversal creation data, complete to mounting according to the information in list successively mount components; The paster demand of first searching first production cycle while mounting change suction nozzle, by loader pick up respective element, correct pick up attitude, discarded pick up wrong components and successively by component mounter to PCB substrate relevant position.
6, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism or provide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault.Described fault comprises: benchmark zero-bit looking up the fault, kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault.
7, logging: all fault messages and operation information in recording process flow process, operation information comprises: record running time, mount components kind and quantity, spent component information.
The program that realizes process control method in the present invention is as follows:
Each process all realizes concrete function by calling this class of Class ProduceControl below.
Claims (2)
1. surface mount system process is divided and a control method, it is characterized in that: described method realizes according to following steps:
Step 1, mount set-up procedure: mount set-up procedure by producing startup, creation data preparation and optimization and three subprocess of pcb board input form;
Step 1 (1) is produced and is started: whether transmission command detection mounts system all hardware running status normal;
Step 1 (2) creation data is prepared and is optimized: editor mounts information, determines and mounts path and generate creation data list;
Step 2, mount establishment of coordinate system process: mount that establishment of coordinate system process is determined by zero point of reference frame and two subprocess of PCB location positioning form;
Find benchmark zero position, according to the coordinate system positive direction of predetermining, set up and mount coordinate system; Import the exact position of substrate definite PCB into, place PCB substrate to system conveyer, system searching PCB tick lables is corrected PCB substrate placement location;
Step 3, mount components process: mount components process is comprised of pickup device, the rectification of element attitude, spent component and four subprocess of component mounter;
The list of traversal creation data, complete to mounting according to the information in list successively mount components; The paster demand of first searching first production cycle while mounting change suction nozzle, by loader pick up respective element, correct pick up attitude, discarded pick up wrong components and successively by component mounter to PCB substrate relevant position;
Step 4, troubleshooting: flow process is monitored the running status of machine in real time, feedback fault message, by fault tolerant mechanism or provide the mode of utilizing artificial treatment of Man Machine Interface to eliminate fault; Described fault comprises: benchmark zero-bit looking up the fault, kinematic system fault, vision system fault, loader are abnormal, component mounter fault, suction nozzle replacing fault;
Step 5, logging: all fault messages and operation information in recording process flow process, operation information comprises: record running time, mount components kind and quantity, spent component information.
2. a kind of surface mount system process according to claim 1 is divided and control method, it is characterized in that: in step 1, described pcb board input refers to that controlling machine conveyer is transported to fixed position by pcb board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410028193.1A CN103732006B (en) | 2014-01-22 | 2014-01-22 | Surface mount system process is divided and control method |
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| CN201410028193.1A CN103732006B (en) | 2014-01-22 | 2014-01-22 | Surface mount system process is divided and control method |
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| CN103732006A true CN103732006A (en) | 2014-04-16 |
| CN103732006B CN103732006B (en) | 2016-05-25 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323978A (en) * | 2014-07-24 | 2016-02-10 | 韩华泰科株式会社 | Data generator and data generating method |
| CN106292526A (en) * | 2015-05-14 | 2017-01-04 | 广东木几智能装备有限公司 | The attachment control system of a kind of both arms bull visual identity and method |
| WO2018227889A1 (en) * | 2017-06-13 | 2018-12-20 | 邝嘉豪 | Chip component correcting and pickup machine |
| CN111465210A (en) * | 2020-05-09 | 2020-07-28 | 宁波智能装备研究院有限公司 | L ED chip mounter pick-and-place path optimization method based on clustering |
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| CN1350421A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting system and mounting method |
| JP2004281518A (en) * | 2003-03-13 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Part mounting system |
| JP2006278503A (en) * | 2005-03-28 | 2006-10-12 | Toho Syst Kk | Method and device for creating processing data of substrate supporting jig |
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2014
- 2014-01-22 CN CN201410028193.1A patent/CN103732006B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1350421A (en) * | 2000-10-25 | 2002-05-22 | 松下电器产业株式会社 | Element mounting system and mounting method |
| JP2004281518A (en) * | 2003-03-13 | 2004-10-07 | Matsushita Electric Ind Co Ltd | Part mounting system |
| JP2006278503A (en) * | 2005-03-28 | 2006-10-12 | Toho Syst Kk | Method and device for creating processing data of substrate supporting jig |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323978A (en) * | 2014-07-24 | 2016-02-10 | 韩华泰科株式会社 | Data generator and data generating method |
| CN105323978B (en) * | 2014-07-24 | 2019-05-31 | 韩华精密机械株式会社 | Data Generator and data creation method |
| CN106292526A (en) * | 2015-05-14 | 2017-01-04 | 广东木几智能装备有限公司 | The attachment control system of a kind of both arms bull visual identity and method |
| CN106292526B (en) * | 2015-05-14 | 2019-07-30 | 广东木几智能装备有限公司 | A kind of the attachment control system and method for the visual identity of both arms bull |
| WO2018227889A1 (en) * | 2017-06-13 | 2018-12-20 | 邝嘉豪 | Chip component correcting and pickup machine |
| CN111465210A (en) * | 2020-05-09 | 2020-07-28 | 宁波智能装备研究院有限公司 | L ED chip mounter pick-and-place path optimization method based on clustering |
| CN111465210B (en) * | 2020-05-09 | 2021-07-09 | 宁波智能装备研究院有限公司 | Clustering-based LED chip mounter pick-and-place path optimization method |
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| CN103732006B (en) | 2016-05-25 |
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Inventor after: Gao Huijun Inventor after: Yu Jinyong Inventor after: Qiu Jianbin Inventor after: Wang Nan Inventor after: Wang Guang Inventor after: Yao Bozhang Inventor after: Ning Zhaoke Inventor before: Gao Huijun Inventor before: Yu Jinyong Inventor before: Wang Nan Inventor before: Wang Guang Inventor before: Yao Bozhang Inventor before: Ning Zhaoke |
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Effective date of registration: 20190911 Address after: 150001 No. 434, postal street, Nangang District, Heilongjiang, Harbin Co-patentee after: Gao Hui Jun Patentee after: Harbin Institute of Technology Asset Investment Management Co., Ltd. Address before: 150001 Harbin, Nangang, West District, large straight street, No. 92 Patentee before: Harbin Institute of Technology |
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Effective date of registration: 20191022 Address after: 315200 No.189, Guangming Road, Zhuangshi street, Zhenhai District, Ningbo City, Zhejiang Province Patentee after: Ningbo Intelligent Equipment Research Institute Co., Ltd. Address before: 150001 No. 434, postal street, Nangang District, Heilongjiang, Harbin Co-patentee before: Gao Hui Jun Patentee before: Harbin Institute of Technology Asset Investment Management Co., Ltd. |