JP4138844B2 - Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 - Google Patents

Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 Download PDF

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JP4138844B2
JP4138844B2 JP2007034405A JP2007034405A JP4138844B2 JP 4138844 B2 JP4138844 B2 JP 4138844B2 JP 2007034405 A JP2007034405 A JP 2007034405A JP 2007034405 A JP2007034405 A JP 2007034405A JP 4138844 B2 JP4138844 B2 JP 4138844B2
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mass
alloy
powder
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JP2008057032A (ja
JP2008057032A5 (https=
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星明 寺尾
裕樹 太田
英明 小日置
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JFE Steel Corp
JFE Precision Corp
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JFE Steel Corp
JFE Precision Corp
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JP2007034405A 2006-02-15 2007-02-15 Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 Active JP4138844B2 (ja)

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JP2007034405A JP4138844B2 (ja) 2006-02-15 2007-02-15 Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品

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JP2006038054 2006-02-15
JP2006211605 2006-08-03
JP2007034405A JP4138844B2 (ja) 2006-02-15 2007-02-15 Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品

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JP2008057032A JP2008057032A (ja) 2008-03-13
JP2008057032A5 JP2008057032A5 (https=) 2008-05-01
JP4138844B2 true JP4138844B2 (ja) 2008-08-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040044A1 (ja) 2009-10-01 2011-04-07 Jfe精密株式会社 電子機器用放熱板およびその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6233677B1 (ja) * 2016-08-31 2017-11-22 Jfe精密株式会社 放熱板及びその製造方法
JP6455896B1 (ja) * 2017-11-18 2019-01-23 Jfe精密株式会社 放熱板及びその製造方法
JP6462172B1 (ja) * 2018-08-02 2019-01-30 Jfe精密株式会社 放熱板及びその製造方法
CN113084166B (zh) * 2021-03-30 2023-06-02 西安理工大学 一种制备钨铜梯度复合材料的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011040044A1 (ja) 2009-10-01 2011-04-07 Jfe精密株式会社 電子機器用放熱板およびその製造方法
JP2011129880A (ja) * 2009-10-01 2011-06-30 Jfe Seimitsu Kk 電子機器用放熱板およびその製造方法
US9299636B2 (en) 2009-10-01 2016-03-29 Jfe Precision Corporation Heat sink for electronic device and process for production thereof

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JP2008057032A (ja) 2008-03-13

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