JP2008057032A5 - - Google Patents
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- JP2008057032A5 JP2008057032A5 JP2007034405A JP2007034405A JP2008057032A5 JP 2008057032 A5 JP2008057032 A5 JP 2008057032A5 JP 2007034405 A JP2007034405 A JP 2007034405A JP 2007034405 A JP2007034405 A JP 2007034405A JP 2008057032 A5 JP2008057032 A5 JP 2008057032A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007034405A JP4138844B2 (ja) | 2006-02-15 | 2007-02-15 | Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006038054 | 2006-02-15 | ||
| JP2006211605 | 2006-08-03 | ||
| JP2007034405A JP4138844B2 (ja) | 2006-02-15 | 2007-02-15 | Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008057032A JP2008057032A (ja) | 2008-03-13 |
| JP2008057032A5 true JP2008057032A5 (https=) | 2008-05-01 |
| JP4138844B2 JP4138844B2 (ja) | 2008-08-27 |
Family
ID=39240128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007034405A Active JP4138844B2 (ja) | 2006-02-15 | 2007-02-15 | Ｃｒ−Ｃｕ合金およびその製造方法ならびに半導体用放熱板と半導体用放熱部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4138844B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2485257B1 (en) | 2009-10-01 | 2016-06-22 | JFE Precision Corporation | Heat sink for electronic device, and process for production thereof |
| JP6233677B1 (ja) * | 2016-08-31 | 2017-11-22 | Jfe精密株式会社 | 放熱板及びその製造方法 |
| JP6455896B1 (ja) * | 2017-11-18 | 2019-01-23 | Jfe精密株式会社 | 放熱板及びその製造方法 |
| JP6462172B1 (ja) * | 2018-08-02 | 2019-01-30 | Jfe精密株式会社 | 放熱板及びその製造方法 |
| CN113084166B (zh) * | 2021-03-30 | 2023-06-02 | 西安理工大学 | 一种制备钨铜梯度复合材料的方法 |
-
2007
- 2007-02-15 JP JP2007034405A patent/JP4138844B2/ja active Active
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