JP4132999B2 - Electronic component mounting apparatus, electronic component production method, and program for causing computer to execute the method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an apparatus for producing a printed wiring board by mounting components on the printed wiring board, and in particular, when performing multi-variable variable production, the tact balance between the mounting apparatuses and the overall productivity can be improved. The present invention relates to an electronic component mounting apparatus and an electronic component production system including the apparatus.
[0002]
[Prior art]
The process of manufacturing a printed wiring board includes a process of printing cream solder on the connection pattern of the printed wiring board (printing process), a process of mounting the electrode part of the component on the printed cream solder (mounting process), There are three processes: a process (reflow process) of collectively heating and soldering the mounted printed wiring board.
[0003]
Each process includes a cream solder printing device, a component mounting device, and a reflow device, and is connected as a continuous line by a conveyor or the like. As a configuration of the component mounting apparatus, a combination of a high-speed chip mounter and a deformed mounter is a typical one. Some high-speed chip mounters are capable of mounting square chip parts such as resistors and capacitors at 0.1 s / unit, and the pursuit of further higher speeds continues to be studied. Atypical mounters can mount components with various electrodes such as square chip components, semiconductor components, connectors, etc. with high accuracy, and the mounting speed is slower than high-speed chip mounters, but there are many types of components that can be mounted. It can be said that it is a feature.
[0004]
As represented by mobile phones and the like, when one type is produced in large quantities on one line, the component mounting apparatuses are combined and deployed so as to be optimal. In mass production, it is important how short one printed wiring board can be produced. It is necessary to consider the shortening of each tact time in the printing process, mounting process, reflow process, and improvement of tact balance, and to exert a large production capacity. After such examination, an NC (Numerical Control) program for operating the component mounting apparatus is also completed, so that the conditions of the high-speed chip mounter and the deformed mounter are optimized and managed for one type.
[0005]
[Problems to be solved by the invention]
However, in addition to mass production, it is also desired that, for example, in printed wiring board production, efficient production such as low-volume production, trial production, and so on, which is called multi-variable variable-volume production, where many production types are switched. . In multi-variety variable-volume production, the proportion of setup time for production preparation increases, and the ratio to the time required for production reverses, and the conventional mass production line configuration cannot fully demonstrate its capabilities. End up.
[0006]
For this reason, component mounting equipment manufacturers and the like have developed and provided component sorting and simulation software for operating mounting devices with different capacities in a balanced manner. However, in reality, it is necessary to review the parts allocation again based on the same production results as before and to re-adjust the tact balance, and an NC re-creation work occurs.
[0007]
In addition, the number of component mounting devices is determined based on the number of component stations required based on the number of component types of the printed wiring board, and is calculated from the number of owned stations of the component mounting device. In the case of production of one kind, as described above, settings specific to the kind can be made, including tact balance with the preceding and following processes. However, when handling a variety of products, if the number of devices is limited and the number of owned stations is limited, it is necessary to flow twice on the line when the number of stations is insufficient. On the other hand, if the number of stations is too large, a tact imbalance with the preceding and following processes occurs.
[0008]
For this reason, a method to divide the printing process, the mounting process, and the reflow process separately has been tried in consideration of multi-variety variable quantity production, but there is no ingenuity to complement the tact balance in each process, so the problem solution This will cause problems such as failure to read the completion time, an increase in the number of work in progress, extra equipment, and manpower. Proposals such as line rearrangement have been made according to the required number of component mounting devices, but it can be easily imagined that it is not suitable for multi-variable variable production due to the idea of mass production.
[0009]
In addition, various improvements have been proposed to improve the setup work of the component mounting device, such as replacement of operating parts by switching operation modes during production and batch replacement of component stations when the device is stopped. However, since the setup work related to all production preparations is not performed during production or outside the production line, there is work to stop production of the apparatus. Similarly, the maintenance work of the equipment must also be carried out with production stopped, and it is normal to systematically reserve maintenance time in units of days, weeks, months and years and stop production. is there.
[0010]
In addition, in order to switch production types, it is necessary to complete setup changes in the printing process, mounting process, and reflow process at the end of production. There is no choice but to do it sequentially without applying. Securing people and wasting time for setup changes.
[0011]
In multi-variety variable production, which requires production of the required quantity in a short delivery time, the equipment operation time is reduced due to a decrease in the number of production, frequent setup changes due to changes in production items, so-called setup time increases, and line balance deteriorates. This is a situation where efficient production is not possible with the component mounting device configuration based on the current mass production.
[0012]
The present invention provides a component mounting apparatus capable of improving the tact balance between mounting apparatuses and improving productivity in multi-variable variable production, and an electronic component production system including the apparatus, in order to solve the above-described problems caused by the prior art. For the purpose.
[0025]
[Means for Solving the Problems]
In order to solve the above-described problems and achieve the object, an electronic component mounting apparatus according to the present invention supplies different parts packaging in an electronic component mounting apparatus that mounts electronic components on a printed wiring board and produces printed wiring boards. Supply means for supplying various electronic parts such as chip parts, semiconductor parts, connectors, etc. supplied by mounting the body, and mounting the various electronic parts supplied from the supply means on the printed wiring board by moving the head Mounting means, transport means for transporting the printed wiring board along a transport rail for mounting processing of the electronic component, and a normal state in which the operation of each means is integrated to produce the printed wiring board, A control unit capable of switching between a single conveying state that operates only the conveying unit, and a plurality of the mounting devices are connected and arranged, and the arbitrary mounting is performed. Can be set to the normal state and the single conveyance state, and when the single conveyance state is set, the supply medium of the supply unit is replaced, the shape of the electronic component held by the mounting unit is recognized and mounted Production of the printed wiring board is continued with the mounting device in which the normal state is set, by making it possible to carry out setup work for performing preparations necessary for production preparation such as correction of direction and suction position and replacement of control programs. The setup operation is executed while the head of the mounting means passes through the transport rail in the setup operation. When the printed wiring board being transported is passing through the transport rail, the head is moved. It stops, and when not passing, the conveyance of the printed wiring board is stopped.
[0026]
According to the present invention, by switching between the production operation and the printed wiring board transfer operation, it becomes possible to perform setup work, maintenance work, etc. in parallel with production, especially in multi-variable variable-volume production. In addition, since it is possible to enable all operations related to setup work etc. in an apparatus that is controlling the transfer operation of printed wiring boards, all setup work etc. can be completed during production, improving tact time. You can plan. Also, there is no need to review the parts assignment, and it is possible to eliminate the need to re-create the NC. In particular, it is possible to reduce the setup work by using a mounting device necessary for multi-variety variable-volume production in advance setup work and maintenance work of the next production kind.
[0079]
DETAILED DESCRIPTION OF THE INVENTION
Exemplary embodiments of an electronic component mounting apparatus and an electronic component production system including the apparatus according to the present invention will be explained below in detail with reference to the accompanying drawings.
[0080]
FIG. 1 is a diagram showing a typical device configuration example of a component mounting device in a mass production line that is the basis of a line configuration. Since this is the premise of the device configuration example of the present invention, this configuration example will be described first.
[0081]
The mass production line includes a loader lifter 101 that supplies a printed wiring board, a printing machine 103 that prints cream solder on the printed wiring board, a high-speed chip mounter 104 that can mainly mount electronic components called square chip components at high speed, Shape mounter 105 capable of mounting electronic shapes having different shapes and supply forms according to the shape, cream solder and electronic components supplied to the printed wiring board are heated, cooled, and soldered together, printed wiring A reflow device 106 serving as a board and an unloader lifter 107 housing a printed wiring board are provided in combination. The apparatuses are connected by an intermediate conveyor 102 and configured as a single line.
[0082]
Parts supply units 513 and 514 of a modified mounter 105 (see FIG. 5), which will be described later, are connected to the tape feeder 401 (see FIG. 4), the stick feeder 601 (see FIG. 6), the tray feeder 701 (see FIG. 7), and the parts packaging. The correspondence is wide. Since the mountable component supply package at the high-speed chip mounter 104 (see FIG. 3) is limited, it is necessary to connect the deformed mounter 105 to form the printed wiring board.
[0083]
FIG. 2 is a diagram showing an apparatus configuration example of a multi-variable variable production line according to the present invention. This configuration is a configuration in which a plurality of variant mounters 105 (three in the present embodiment) are connected to the component mounting apparatus as compared to the configuration example of the mass production line shown in FIG.
[0084]
FIG. 3 is a diagram showing a high-speed chip mounter 104 used in a mass production line. 3A is an overall perspective view, and FIG. 3B is a rotary head. In the rotary head 310, a plurality of suction mounting heads 309 are evenly arranged on the circumference, and a plurality of high-speed nozzles 311 are arranged in accordance with the component size. As a result, high-speed and highly stable component mounting and dismounting is possible.
[0085]
Depending on the size of the part, it is necessary to reduce the rotational speed of the rotary head 310. However, the tape feeder 401 (see FIG. 4) set in the part supply unit 308 is arranged in the order of the size of the rotary head 310. The rotation speed can be sequentially shifted from high speed to low speed, and the tact required for component mounting can be calculated almost without any error even if it is not actually produced.
[0086]
FIG. 4 is a view showing the tape feeder 401. FIG. 4A is an overall perspective view, FIG. 4B is a diagram showing a tape component 416 to be set, and FIG. 4C is a diagram showing a component packaging of electronic components supplied by the tape feeder 401. The tape component 416 includes a top tape 417, a carrier tape 418, and a component storage unit 419. Examples of electronic components stored in the component storage unit 419 include a square chip 420, a tantalum 421, and an SOP 422.
[0087]
FIG. 5 is a perspective view showing the modified mounter 105. The deformed mounter 105 can handle various parts, and has a structure in which a tape feeder 401, a stick feeder 601 (see FIG. 6), and a tray feeder 701 (see FIG. 7) can be arranged on the front and back sides of the apparatus. Yes.
[0088]
FIG. 6 is a diagram showing the stick feeder 601. FIG. 6A is an overall perspective view, FIG. 6B is a partially enlarged view, and FIG. 6C is a view showing a part packing state of electronic parts supplied by the stick feeder 601. A stick 625 containing an electronic component 626 is attached to the stick portion 624. As electronic components 626 to be housed, there are SOP 627 and PLCC 628.
[0089]
FIG. 7 is a view showing the tray feeder 701. FIG. 7A is an overall perspective view, and FIG. 7B is a diagram showing a component packaging of electronic components supplied by the tray feeder 701. A component storage portion 730 is formed on a tray 729 for storing electronic components. The tray 729 is stacked and stored in a tray storage magazine 732 via a tray receiving plate 731 and mounted in the tray feeder 701. After the mounting, the electronic component is sucked and held by the odd-shaped suction nozzle 712 of the mounting head portion 709. Electronic components to be housed include a QFP 733, a BGA 734, and a connector 735.
[0090]
For this reason, the odd-shaped mounter 105 is a one-by-one method in which a suction mounting head 509 (see FIG. 5) to which a variant nozzle 512 for sucking and mounting components is attached moves to the front and back sides of the apparatus. . In this method, the moving distance of the suction mounting head 509 is large, and it is a problem to suppress an increase in production tact.
[0091]
In this embodiment, the control means (not shown) performs continuous suction with a plurality of irregular shape nozzles 512 attached to the suction mounting head 509 or during operation of sucking parts from the tape feeder 401. Control of moving the suction mounting head 509 and control of supplying parts in parallel, such as moving the tray 729 and waiting the parts at the supply position, is performed to reduce production tact.
[0092]
Such an operation is automatically calculated inside the apparatus and processed so as to obtain an optimum combination, and therefore, there is no need to consider in particular on the user side. In general, it is almost impossible to adjust the result of production tact by combining parts, even if it is examined in advance. To achieve tact balance with the high-speed chip mounter 104 After assigning parts that seem to be appropriate, the actual operation of the mounting equipment, collecting the results, and re-assigning the parts are repeated, and the production tact balance between the two equipments is repeated. I will take it.
[0093]
The deformed mounter 105 has a production tact unbalanced structure due to structural differences from the high-speed chip mounter 104. In this embodiment, as shown in FIG. 2, the deformed mounter 105 is connected to the deformed mounter 105 having the same function. The configuration is such that multiple units are used. A general control means (not shown) controls the movement of the suction mounting head 509 and the component supply control in parallel by supervising the whole of the plurality of deformed mounters 105, and the component supply units 513 and 514 are each equal. To occupy. As a result, the apparatus can be operated in the same manner, so that the production tact can be evenly balanced and the production tact can be easily balanced. As a result, it is possible to achieve production tact balance while maintaining the high part handling capability, which is a characteristic of the deformed mounter 105, and to improve production efficiency.
[0094]
As described above, the mountable component supply package of the high-speed chip mounter 104 is limited, and therefore, when the printed wiring board is formed, it is necessary to connect the deformed mounter 105. Furthermore, as described above, there is a limitation on component sorting due to the difference in whether or not the high-speed chip mounter 104 and the deformed mounter 105 are capable of handling the parts.
[0095]
FIG. 8 is a chart showing availability of each facility and an example of mounting tact / setup time. It shows the feeders that can be set for each device according to the supply package, the average tact for each component, and the average setup time required when switching the product type. Although differences occur depending on the component type, in the explanation of the present embodiment, the average value is used (determined that the value is not significantly different from the actual value).
[0096]
FIG. 9 is a chart showing examples of multi-variety variable-volume production varieties. The structure of the high-speed chip mounter 104 and deformed mounter 105, which is based on the image of a normal mass production line (see Fig. 1). The figure shows the required number of component supply units in the case of assuming the connection with the deformed mounter 105, that is, the response with only the deformed mounter 105.
[0097]
As shown in FIG. 2, the multi-variety variable production line described below includes three units of the deformed mounter 105, and for each unit, the tape feeder 401 and the stick feeder 601 are combined for 50 parts, and the tray feeder. Reference numeral 701 denotes a configuration in which 40 trays 729 are set. This settable number is set with a sufficient margin as the specification of the variant mounter 105.
[0098]
FIG. 10 is a chart for explaining production functions in a mass production line. As shown in the figure, in the case of a mass production line (see FIG. 1), in the type D, the high-speed chip mounter 104 has a 50-second tact, and the deformed mounter 105 has a 150-second tact. The line production tact results in 150 seconds. Such a phenomenon means that the tact balance between the devices is lost as the unloadable packaging increases in the high-speed chip mounter 104 such as the stick feeder 601 and the tray feeder 701, and efficient production cannot be performed. It becomes a state.
[0099]
Therefore, by connecting a plurality of deformed mounters 105 having the same function, it is possible to easily distribute parts and take into account tact balance (part supply control and suction mounting head 509 tact balance described above) as well as setup time. To optimize. This optimized operation control is executed by a control means (not shown).
[0100]
In FIG. 9, the number of parts for each production type and the number of parts for each package and the number of parts are broken down into parts, and the deformed shape is based on the configuration of the mass production line (see FIG. 1, high-speed chip mounter 104 and deformed mounter 105). It shows how the connection configuration of the mounter 105 changes. The supply package of the high-speed chip mounter 104 is a form in which the numerical value of the tape is added.
[0101]
In the multi-variety variable quantity production line by connecting the deformed mounter 105, the required number of equipment of the deformed mounter 105 is calculated from the number of supplied supply units of the deformed mounter 105 based on the number of parts.
[0102]
11 to 15 are tables for explaining the production functions in the multi-variable variable production line. In each figure, the required number of variant mounters 105 is shown as the number of facilities. In the case of a mass production line, the high-speed chip mounter 104 and the deformed mounter 105 are each one, so the number of facilities is two. The average loading tact (Fig. 8) is added to the number of parts to be mounted by packing form (Fig. 9: number of parts), and divided by the calculated required number, the supplied packing form in Figs. Another profile mounter (seconds / sheet) value is obtained, and this total is a production tact per profile mounter 105. The production time is obtained by adding the number of produced sheets, and the total time is obtained by adding the setup time.
[0103]
When the varieties A to D are implemented on the mass production line, the total time is 390 minutes as shown in FIG. FIG. 16 is a time chart of the setup and production status showing an operation example of the mass production line.
[0104]
In the case of carrying out similarly in connection with the deformed mounter 105 described in this embodiment, the total time is 387 minutes as shown in FIG. 11, and the production can be performed in substantially the same time as the mass production line shown in FIG. It has been shown. FIG. 17 is a time chart of the setup and production status showing an operation example of the multi-variable variable production line. It can be seen from this figure that although there are varieties whose production time increases, the set-up time can be reduced by reducing the number of necessary equipment, so that almost no difference can be seen in total. Thus, in multi-variable variable production, it shows how important it is to reduce the setup time, which will be described in more detail below.
[0105]
A description will be given of a case in which the setup of the next product type is executed in parallel with the production in apparatuses other than the number required for production with the same product type configuration. FIG. 18 is a diagram illustrating an example of setup and production status of each device. FIG. 19 is a chart for explaining the production function as a result of the same calculation based on this result. As shown in the figure, it can be read that the total time is reduced to 352 minutes. FIG. 20 is a time chart of the setup and production status.
[0106]
It is possible to reduce the total time by performing setup in advance on equipment that is not used for production. However, since the production time of product type B is as short as 15 minutes, the setup time is 20 minutes. Thus, there is a state where the setup of all the next varieties is not completed. The total time can be further shortened by efficiently combining setup with production.
[0107]
FIG. 21 shows another combination example of the setup and production status of each apparatus. FIG. 12 shows the result of similar calculation based on the result. In FIG. 12, the number of facilities (large and small) is sequentially combined to examine a combination that can be set up for the next production during production, and the total time is reduced to 332 minutes. . FIG. 22 is a time chart of the setup and production status.
[0108]
In this case, the total production time is reduced by as much as 58 minutes as compared with the mass production line shown in FIG. For these types of products, if the number of devices is sufficient, the total time can be shortened by turning to production.
[0109]
In FIG. 13, in order to shorten the production tact of the product type D, two units are used, and the combination of production and setup is reviewed again. It can be seen that the total time is reduced to 301 minutes. FIG. 23 is a time chart of the setup and production status.
[0110]
The above explanation is based on the assumption that the setup time is based on the types with production results. FIG. 14 is a chart showing an operation example of a mass production line including editing work (FIG. 24 is a time chart of this configuration example). The work of editing the shape recognition, mounting direction, suction position, etc. of electronic parts that frequently occur in trial production was set to 60 minutes / model. By adding this editing work, the total required time becomes 630 minutes, and it can be seen that the proportion of the apparatus stop state due to the setup / editing work greatly increases from the production time.
[0111]
FIG. 15 is a chart showing an operation example of the multi-variable variable production line including editing work. As an embodiment, a case is shown in which the editing work time is calculated in such a way that 60 minutes are allocated to the number of equipment used (FIG. 25 is a time chart of this configuration example). Setup 57 minutes during production / edit 30 minutes during production can be performed, and the total production time is 519 minutes, which is a reduction effect of 111 minutes. In the case of four models, it is possible to increase the productivity by 30% or more, and it can be said that the line configuration becomes more effective as the variety of various types such as small-scale production / prototype production increases.
[0112]
As described above, it is possible to greatly improve the production efficiency by combining the production time and the setup time and performing simulation across a plurality of varieties, but in order to realize this, the deformed mounter 105 In addition to the production operation control that is normally held, it is necessary to have a substrate transfer operation as a line, and during the substrate transfer operation, it is necessary to add a control that enables the entire setup operation. .
[0113]
FIG. 26 is a schematic diagram illustrating a printed wiring board conveyance control switching function in the variant mounter 105. As shown in the figure, a control switching function is added, and the printed wiring board conveyance single control 2602 in the printed wiring board conveyance section is operated independently by switching to a normal operation (normal production operation function) 2601. With the substrate transfer operation enabled, the main operation by the suction mounting head 509 is to replace the deformed nozzle 512 with the nozzle change function (nozzle change unit) 2604, and to supply components with the component supply units 513 and 514. Control is performed separately from setup operations such as component recognition operation by the component recognition unit 538 such as operation and camera.
[0114]
FIG. 27 is a flowchart illustrating a work example of the setup work. The set-up work consists of component set (step S2701), nozzle set (step S2702), backup tweezers (step S2703), NC load (step S2704), component recognition (step S2705), component suction position correction (step S2706), component mounting. There is control such as an angle (step S2707).
[0115]
By separating the control related to setup work from the printed wiring board transport operation, it is possible to use setup during production, ideally minimizing setup losses caused by multi-variable production. Device can be obtained.
[0116]
FIG. 28 is a diagram illustrating the mounting head operation during the printed wiring board transport operation in the odd-shaped mounter 105. As shown in FIG. 28, when the printed wiring board conveyance control is independently operated by switching to the normal production operation function described with reference to FIGS. 26 and 27 and the setup (switching / editing, etc.) can be used together. In addition, when the setup is performed during the board transport operation, it can be predicted that the printed wiring board 2836 being transported and the track of the head holding the electronic component (suction mounting head 509 shown in FIG. 5) overlap.
[0117]
As a specific example of the setup operation, there is an operation of correcting the component recognition and component suction position 2837 by the component recognition unit 538 of the deformed mounter 105. This setup operation is often performed in parallel with the conveyance control of the printed wiring board 2836. The operations of recognizing the component and correcting the component suction position 2837 include selecting a variant nozzle according to the component size, changing the component center position of the component storage unit 419 (see FIG. 4) and the top surface height of the component to the variant nozzle 512. For example, the X, Y, and Z (vertical, horizontal, and height directions) data of the component suction position 2837 may be matched so that they can be properly aligned and stably attracted.
[0118]
If the suction position becomes incomplete and the subsequent operation to the component recognition unit 538 is performed as shown by the dotted arrow in FIG. 28, the suction mounting head 509 may not hold the component and may drop it. As a result, there is a high risk that the printed wiring board 2836 being assembled becomes defective due to component dropping. Therefore, it is necessary to prevent the printed wiring board 2836 and the operation track of the electronic component sucked by the odd-shaped nozzle 512 attached to the suction mounting head 509 from overlapping.
[0119]
The printed wiring board 2836 passes over the board conveyance rail 2839 at any time in the order of positions a → b → c during conveyance. Due to the structure of the apparatus, the board transport rail 2839 is much longer than the printed wiring board 2836. In order to reduce the production tact as much as possible, the printed wiring board 2836 is controlled so as not to lose the board transport time by waiting at the position a or the position c or both sides at the normal time. In many cases, the stop position of the printed wiring board 2836 when the production is performed is a well-balanced position from the operation area of the entire apparatus, that is, the position b which is almost the center of the board transport rail 2839. The fact that the printed wiring board 2836 exists at the positions a and c, which are the standby positions, is recognized as an apparatus, and in this standby position, it is usually difficult to consider interference on the track.
[0120]
If there is interference, the conveyance control is set so as not to have a standby position, and the suction mounting head 509 is not interfered with the substrate conveyance rail 2839 in response to a signal of movement of the printed wiring board 2836 from the previous process device. If the stand-by at the position or the suction mounting head 509 is in a position passing over the board transport rail 2839, the printed wiring board 2836 may not be transported, and an accident such as dropping of a component onto the board being produced. Can be prevented.
[0121]
FIG. 29 is a flowchart of control for preventing the position of the printed wiring board 2836 being conveyed from overlapping the trajectory of the suction mounting head 509 operation. When the suction mounting head 509 starts to move in the Y-axis direction (the direction in which the suction mounting head 509 passes over the substrate transport rail 2839) (step S2901), is the printed wiring board 2836 passing over the substrate transport rail 2839? Whether or not is detected (step S2902). If the printed wiring board 2836 has not passed on the board conveyance rail 2839 (step S2902: No), the conveyance operation of the printed wiring board 2836 is temporarily stopped (step S2903), and the suction mounting head 509 completes the Y-axis movement. After that (step S2904), the transport operation of the printed wiring board 2836 is enabled and the operation is restarted (step S2905), and the next work is controlled (step S2906).
[0122]
When the printed wiring board 2836 has already started the carrying operation and the printed wiring board 2836 is positioned on the board carrying rail 2839 (step S2902: Yes), the Y axis of the suction mounting head 509 is prioritized for carrying. The movement is temporarily stopped (step S2907), and after one printed wiring board 2836 has passed and conveyed on the board conveyance rail 2839 (step S2908), the Y-axis movement of the suction mounting head 509 is enabled and the operation is resumed (step S2908). In step S2909, the operation of the next work is controlled (step S2906).
[0123]
In addition, in multi-variety variable-volume production, it is predicted that the variety, quantity to be introduced, and the month, week and day will fluctuate rapidly. Systemization is important for adapting to such changes, and a system configuration suitable for multi-variable variable production will be described as one configuration example.
[0124]
First, FIG. 30 is a flowchart for determining the minimum number of devices used for a production type. Based on the number of device stations from the production schedule, the number of parts (step S3001) is compared with the number of devices (supply unit) (step S3002), and the number of minimum devices used is determined (step S3003).
[0125]
FIG. 31 is a flowchart for obtaining a combination in production order. Combine production orders that allow the next production type to be set up within the production time. In particular,
Production time of this product type> Setup time of the next product type (step S3101),
Production time of this production type-setup time of next production type ≧ 0 (step S3102).
Based on the above, a combination is obtained (step S3103).
[0126]
FIG. 32 is a flowchart for optimizing the number of devices used. Determine the minimum number of devices used for this product type (step S3201: equivalent to steps S3001 to S3003),
Production time of this product type> Setup time of this product type (step S3202),
Production time-(number of devices used x setup time) ≥ 0 (step S3203),
Thus, the number of devices used is optimized (optimum number) (step S3204).
[0127]
FIG. 33 is a flowchart showing overall processing up to production instruction creation in the electronic component production system. The electronic component production system includes a production instruction system 3301, an NC creation system 3310, and a setup creation system 3320. The production instruction system 3301 calculates the minimum number of devices used for the production model (step S3302), combines the production order (step S3303), optimizes the number of devices used (step S3304), and outputs the production instruction list 3401 shown in FIG. (Step S3305).
[0128]
Step S3302 corresponds to the contents of Steps S3001 to S3003 shown in FIG. 30, Step S3303 corresponds to the contents of Steps S3101 to S3103 shown in FIG. 31, and Step S3304 shows the contents of Steps S3201 to S3204 shown in FIG. It corresponds to.
[0129]
The production instruction list output in step S3305 is input to the NC creation system 3310, parts are distributed among the devices (step S3311), and an NC program is created and output (step S3312).
[0130]
The NC program output in step S3312 is input to the setup creation system 3320, and setup for each apparatus is instructed (step S3321), and a setup instruction list 3501 shown in FIG. 35 is output (step S3322). This setup instruction list 3501 describes work instructions such as the set position of parts of the determined NC program for the device, and is output according to the product type.
[0131]
According to the electronic component production system, it is possible to create an NC program for a device in accordance with the determined number of devices to be used, and to optimize the component distribution and tact balance between the devices. Then, by combining the production instruction system 3301, NC creation system 3310, and setup creation system 3320 and using an apparatus that responds immediately to the production instruction, it is possible to efficiently operate the multi-variable production line configuration.
[0132]
In the above configuration, it has been described that the variant mounter 105 in the multi-variety variable production line shown in FIG. 2 is optimized to shorten the total time when a plurality of varieties are combined. However, even if the modified mounter 105 is connected to improve the efficiency, the printing machine 103 and the reflow device 106 are arranged before and after that, and when considering the entire production line, it is necessary to consider these tacts. is there.
[0133]
As described with reference to FIG. 13, the total time can be reduced by increasing the number of deformed mounters 105, but the production tact as a line is the most tact including the printing machine 103 and the reflow device 106. This process becomes a bottleneck process. Even if the tact of the deformed mounter 105 is increased beyond this neck process, the effect is not practically improved. Usually, since the printing machine 103 and the reflow device 106 are batch processing, the mounter process that sequentially mounts a large number of component types becomes a bottleneck process, but it is also important to systematize such a case. It is.
[0134]
In the above configuration, when the setup of the printing press 103 is finished and the deformed mounter 105 is switched, and the setup of the reflow device 106 is not finished, the product switching, that is, the start of production cannot be stopped. In this case, in order to reduce the total time for product changeover, it is necessary to place workers on each device and change the setup at the same time. However, with this method, efficient operation of multi-product variable-volume production is not possible. Absent.
[0135]
FIG. 36 is a diagram illustrating a configuration example for improving the tact of the entire electronic component production system. As shown in the figure, an intermediate buffer conveyor 3601 is provided in the post-process of the printing machine 103 and the post-process of the profile mounter 105. The intermediate conveyor 102 is for conveying the printed wiring board 2836 to each device, and waits for one or several printed wiring boards 2836. Similar to the loader lifter 101 and the unloader lifter 107, the intermediate buffer conveyor 3601 includes a rack 3602 and has a structure that can store the printed wiring boards 2836 in multiple stages. In brief, the loader lifter 101 and the unloader lifter 107 are structured inwardly.
[0136]
The intermediate buffer conveyor 3601 can wait for a substrate for a necessary time by increasing the number of racks 3602 accommodated. Further, by adding a function for setting the movement of the rack 3602, it is possible to send the printed wiring board 2836 to the next process even if the printed wiring board 2836 is not stored in the total accommodation number.
[0137]
Utilizing the time stored in the intermediate buffer conveyor 3601, production is started as soon as the setup of the printing press 103 is completed, and the printed wiring board 2836 from the intermediate buffer conveyor 3601 to the irregular mounter 105 is simultaneously with the completion of the product change of the irregular mounter 105. The delivery control to the reflow device 106 is started from the intermediate buffer conveyor 3601 in the subsequent process of the deformed mounter 105 when the reflow device 106 is completed.
[0138]
Then, as soon as the production of the printing press 103 is completed, the setup change is started, and as a multi-variety variable production buffer line, the setup and production type overlaps between the printing press 103, the profile mounter 105, and the reflow device 106. It becomes possible. As a result, the total time for the entire line can be shortened by one worker.
[0139]
(About parallel control of setup work during production)
In the configuration shown in FIG. 28, when the transport operation of the printed wiring board 2836 is controlled, the upper position of the printed wiring board 2836 transported on the board transport rail 2839 is set to the suction mounting head 509 holding the electronic components. Was controlled not to pass. According to this configuration, the suction mounting head 509 that holds the component during the transport operation of the printed wiring board 2836 in the setup operation does not pass over the printed wiring board 2836, so that the component falls or interferes with the mounted component. And the occurrence of soldering defects can be prevented, and productivity can be improved.
[0140]
However, with the above configuration, when the suction mounting head 509 moves in the Y-axis direction (the direction in which the mounting head passes over the board transport rail 2839), the printed wiring board 2836 passes over the board transport rail 2839. If so, the setup work is temporarily stopped (suspended) in order to temporarily stop the suction mounting head 509 based on the control processing shown in FIG. Furthermore, since the setup work is temporarily suspended, the worker who performs the setup continues to be restrained in the vicinity of the apparatus during the temporary suspension period, resulting in a prolonged response time for the entire setup work and a reduction in work efficiency. Will do.
[0141]
Further, when the suction mounting head 509 has already moved in the Y-axis direction, the transport operation of the printed wiring board 2836 is temporarily stopped, which affects the production tact and production is temporarily stopped. From the above points, in order to perform setup and production in parallel, it is required to perform setup and production operations without temporarily stopping the suction mounting head 509 and the conveyance.
[0142]
FIG. 37 is a plan view of the variant mounter 105 shown in FIG. The modified mounter 105 includes a board transport rail 2839 along the transport direction of the printed wiring board 2836, a first component supply unit 513, a second component supply unit 514, a component recognition unit 538, and a nozzle change unit 2604. It is.
[0143]
In such a configuration, the first component supply unit 513 is disposed on the front side of the apparatus across the board conveyance rail 2839, the second component supply unit 514, the component recognition unit 538, the nozzle change on the back side of the apparatus. The part 2604 is arranged, and the operation trajectory of the suction mounting head 509 overlaps the substrate transport rail 2839. According to this configuration, the above-described problems occur during setup.
[0144]
(Another configuration example of a deformed mounter 1-single-sided deployment device)
Next, a configuration capable of controlling the operation of production and setup work in parallel will be described. FIG. 38 is a plan view showing a modified mounter 105a having another configuration. The deformed mounter 105a shown in the figure has a first component supply unit 513, a second component supply unit 514, a component recognition unit 538, on one side (front surface) side of the apparatus with respect to the board conveyance rail 2839 that conveys the printed wiring board 2836. This is a configuration in which a front deployment device (single-side deployment device) 3801 including a nozzle change unit 2604 is disposed.
[0145]
According to the above arrangement, the main operation of the suction mounting head 509 is the replacement operation of the irregular shape nozzle 512 at the nozzle change unit 2604 and the component supply (suction) operation at the first and second component supply units 513 and 514. Can be performed on one (front) side of the substrate transport rail 2839. In addition, an operation trajectory such as moving the suction mounting head 509 to the component recognition unit 538 at the time of setup work is also on the one (front) side of the board transport rail 2839.
[0146]
Thereby, the operation locus of the suction mounting head 509 during the setup operation does not overlap the conveyance locus of the printed wiring board 2836. Accordingly, it is possible to control the operation of the setup work in parallel during production in which the printed wiring board 2836 is moved on the board transport rail 2839. According to such a configuration, the setup operation during production can be performed only by performing control for switching between the normal operation shown in FIG. 26 and the operation at the time of setup (printed wiring board conveyance single control). At this time, the control for preventing the overlapping of the operation trajectories shown in FIG. 29 can be made unnecessary. As a result, the efficiency of the setup work can be improved while maintaining productivity without temporarily stopping (interrupting) both the production and the setup work.
[0147]
(Another configuration example of the odd-shaped mounter 2-double-sided deployment device)
FIG. 39 is a plan view showing a modified mounter 105b of still another configuration. The deformed mounter 105b shown in the figure is based on a board transport rail 2839 that transports the printed wiring board 2836, and a first component supply unit 513, a second component supply unit 514, a component recognition unit 538, and a nozzle change on the front side of the apparatus. A double-sided deployment device is formed by arranging a front-side deployment device 3801 comprising a portion 2604 and a rear-side deployment device 3901 comprising similar parts on the back side of the device. In the illustrated example, the front deployment device 3801 and the rear deployment device 3901 are arranged symmetrically with respect to the stop position when the printed wiring board 2836 is mounted on the board transport rail 2839.
[0148]
According to the deformed mounter 105a shown in FIG. 38, since the first and second component supply units 513 and 514 for setting components are arranged only on the front side of the apparatus, the number of component sets is limited. The first and second component supply units 513 and 514 shown in FIG. 38 generally have about 50 types of cassette feeders (8 mm equivalent) and about 20 types of trays. May cause trouble.
[0149]
On the other hand, according to the configuration including the double-side deployment device (front deployment device 3801 and back deployment device 3901) shown in FIG. 39, production and setup operations are assigned to the pair of front deployment device 3801 and back deployment device 3901, respectively. Thus, the operation can be controlled independently. Then, it goes without saying that the setup operation during production can be performed only by performing control for switching between the normal operation shown in FIG. 26 and the operation at the time of setup (printed wiring board conveyance single control).
[0150]
FIG. 40 is a chart showing an example of combined use of production and setup work using the double-sided deployment device. As shown in the figure, (1) operation control used for production of both the front deployment device 3801 and the rear deployment device 3901, (2) setup operation performed by the front deployment device 3801, and operation control produced by the rear deployment device 3901, (3) Four types of combinations are possible: production control by the front deployment device 3801 and operation control by the rear deployment device 3901, and (4) operation control by which both the front deployment device 3801 and the rear deployment device 3901 are prepared.
[0151]
According to the above configuration, the single variant mounter 105b has a function equivalent to the two variant mounters 105. As a result, the number of component supply units can be increased, so that it is possible to cope with multi-product production, and production and setup can be performed in parallel using this single variant mounter 105b. At this time, since the control for preventing the overlapping of the operation trajectories shown in FIG. 29 can be made unnecessary, neither the production nor the setup work is temporarily stopped (interrupted), and both the productivity and the setup work are performed. Efficiency can be improved.
[0152]
As shown in FIG. 2, each of the odd-shaped mounters 105a and 105b described with reference to FIGS. 38 and 39 has a structure in which a plurality of (for example, three) units are connected to improve productivity and efficiency of setup work. be able to. In particular, if a plurality of deformed mounters 105b including the double-side deployment devices (front deployment device 3801 and back deployment device 3901) shown in FIG. 39 are connected, the first component supply unit 513 and the second component supply are provided. Since the number of units 514 can be increased and the operation of each production and setup can be controlled in parallel, each of the plurality of deformed mounters 105b has the same production operation (production tact) regardless of the presence or absence of the setup work. You will be able to get This makes it possible to easily balance the production tact between the plurality of deformed mounters 105b.
[0153]
FIG. 41 is a chart showing an example of combined use of production and setup work when a plurality of deformed mounters 105b each having a double-sided deployment device are connected. The illustrated example has a configuration in which three odd-shaped mounters 105b are connected. (1) Operation control used for production of both the front deployment device 3801 and the rear deployment device 3901, and (2) one front deployment device. Operation control using only the 3801 setup and the other front deployment device 3801 and the rear deployment device 3901 for production, ..., (7) Operation control for setting up both the front deployment device 3801 and the rear deployment device 3901 Street combinations are possible. In this way, by connecting a plurality of deformed mounters 105b each having a double-sided deployment device, the degree of freedom in combining production and setup can be further improved. That is, while improving the productivity, it is possible to improve the degree of freedom for performing the setup necessary for the production of the next variety during the execution of the current production variety.
[0154]
FIG. 42 is a diagram for explaining an installation space for the odd-shaped mounter having the above-described configuration. FIG. 42A shows an installation space for the deformed mounter 105a including the front deployment device 3801 shown in FIG. 38, and the width W and the depth D necessary for installing the deformed mounter 105a are shown as 1, respectively. FIG. 42B is an installation space of the deformed mounter 105b including the double-sided deployment device (front deployment device 3801 and rear deployment device 3901) illustrated in FIG. 39, with respect to the modified mounter 105a including the front deployment device 3801. The required width W is 1.25 times and the depth D is 1.5 times.
[0155]
According to the above configuration, when the installation space (area) of the variant mounter 105a provided with the front deployment device 3801 is 1.00, the installation space (area) of the variant mounter 105b provided with the duplex deployment devices 3801 and 3901 is 1. .875. Even if the odd-shaped mounter 105b includes the double-sided deployment devices 3801 and 3901 that are two single-sided deployment devices 3801, the installation space can be reduced.
[0156]
FIG. 43 is a diagram illustrating an installation space when a plurality of deformed mounters 105b including a double-sided deployment device are connected. In the configuration in which the front deployment device 3801 and the rear deployment device 3901 are arranged point-symmetrically with respect to the center of the substrate transport rail 2839, the front deployment device 3801 and the rear deployment device 3901 are configured even if the directions are different. The first component supplying unit 513, the second component supplying unit 514, the component recognizing unit 538, and the nozzle changing unit 2604 (see FIG. 39) can be configured by preparing only one pair of the same components, and the difference in orientation There is no need to prepare each part corresponding to.
[0157]
However, each of the second component supply units 514 included in the deformed mounter 105b protrudes in the width W direction. For this reason, as shown in FIG. 42 (b), when there is only one deformed mounter 105b, there are many margins (spaces) around the apparatus due to the protrusion of the second component supply unit 514. Therefore, the space occupied in the installation required frame 4201 becomes large, and it is difficult to reduce the installation space.
[0158]
As shown in FIG. 43, in the arrangement configuration in which a plurality of units are connected, each of the deformed mounters 105b shown in FIG. 42 is simply connected in the width W direction. In this connection configuration, the second component supply units 514 provided in the pair of opposed variant mounters 105b facing each other do not interfere with each other, and are disposed so as to intersect the front side and the back side around the board transport rail 2839. The overall width W can be reduced by the widths W1 and W2 of the intersecting second component supply portions 514, and the installation required frame 4301 can be efficiently reduced.
[0159]
When the three installations shown in the figure are compared with one deformed mounter 105b equipped with the double-sided deployment devices 3801 and 3901 shown in FIG. 42B, the depth D is 1.5 and the width W is the same. 3.25 (the comparison criterion is that the width W and the depth D of the deformed mounter 105a in FIG. 42A are each 1). As a result, the installation area of the installation required frame 4301 shown in FIG. 43 is 4.875, and it is possible to reduce the margin portion around the apparatus and efficiently arrange it. When the same function is formed using the deformed mounter 105a in FIG. 42 (a), 6 units need to be connected and the installation area is 6.000. Therefore, the installation area can be reduced by an area difference of 1.125. It is possible to save space.
[0160]
The printed wiring board 2836 produced by the electronic component production system including the deformed mounter 105 (105a, 105b) described above can be manufactured at a low cost and with a short delivery time. A device (product) in which 2836 is incorporated is also competitive in the market.
[0161]
The control in each part of the electronic component production system described in this embodiment can be realized by executing a program prepared in advance on a computer such as a personal computer or a workstation. This program is recorded on a computer-readable recording medium such as a hard disk, floppy (R) disk, CD-ROM, MO, and DVD, and is executed by being read from the recording medium by the computer. The program can be distributed via the recording medium and a network such as the Internet.
[0162]
【The invention's effect】
According to the present invention, it is possible to perform setup work, maintenance work, etc. in parallel with production in multi-variety variable quantity production. Since all operations related to setup work, etc., can be validated in a device that is controlling the operation of transporting printed wiring boards, all setup work can be completed during production, and tact time can be improved. Can do. Also, there is no need to review the parts assignment, and it is possible to eliminate the need to re-create the NC. In particular, there is an effect that it is possible to reduce the setup work by using a mounting apparatus necessary for multi-variable variable-volume production for the preliminary setup work and maintenance work of the next production kind.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a mass production line for explaining an embodiment of the present invention.
FIG. 2 is a diagram showing a configuration of a multi-variable variable production line which is a production line according to the embodiment of the present invention.
FIG. 3 is a diagram showing a component mounting apparatus (high-speed chip mounter) provided in a production line.
FIG. 4 is a diagram illustrating a supply unit (tape feeder) of the component mounting apparatus.
FIG. 5 is a diagram showing a component mounting device (an irregular mounter) provided in the production line of the present invention.
FIG. 6 is a diagram illustrating a supply unit (stick feeder) of the component mounting apparatus.
FIG. 7 is a view showing a supply unit (tray feeder) of the component mounting apparatus.
FIG. 8 is a chart showing availability of each facility on a production line and an example of mounting tact / setup time.
FIG. 9 is a chart showing an example of multi-variable variable production varieties.
FIG. 10 is a chart for explaining production functions in a mass production line.
FIG. 11 is a chart for explaining production functions in a multi-variable variable production line.
FIG. 12 is a chart for explaining production functions in a multi-variable variable production line.
FIG. 13 is a chart for explaining production functions in a multi-variable variable production line.
FIG. 14 is a chart for explaining production functions including editing work in a mass production line.
FIG. 15 is a chart for explaining a production function including editing work in a multi-variable variable production line.
FIG. 16 is a time chart of the setup and production status showing an operation example of a mass production line.
FIG. 17 is a time chart of setup and production status showing an operation example of a multi-variable variable production line.
FIG. 18 is a diagram illustrating an example of setup and production status of each apparatus.
FIG. 19 is a chart for explaining a production function considering setup in a multi-variety variable production line.
FIG. 20 is a time chart of the setup and production status in the multi-variable variable production line.
FIG. 21 is another combination example of the setup and production status of each apparatus.
FIG. 22 is a time chart (combination example) of the setup and production status of the multi-variable variable production line.
FIG. 23 is a time chart (optimization example) of setup and production status of a multi-variable variable production line.
FIG. 24 is a time chart of production status including editing work in a mass production line.
FIG. 25 is a time chart (optimization example) of a production situation including editing work in a multi-variable variable production line.
FIG. 26 is a schematic diagram for explaining a printed wiring board conveyance control switching function in the odd-shaped mounter.
FIG. 27 is a flowchart illustrating an example of a setup operation.
FIG. 28 is a diagram showing the operation of the suction mounting head during the printed wiring board transport operation in the deformed mounter.
FIG. 29 is a flowchart of control for preventing an overlap between the position of the printed wiring board being conveyed in the deformed mounter and the trajectory of the operation of the sucking and mounting head.
FIG. 30 is a flowchart of determining the minimum number of devices used for a production type.
FIG. 31 is a flowchart for obtaining a combination in production order;
FIG. 32 is a flowchart of optimization of the number of devices used.
FIG. 33 is a flowchart showing overall processing up to production instruction creation in the electronic component production system.
FIG. 34 is a diagram showing a production instruction list.
FIG. 35 is a diagram showing a setup instruction list.
FIG. 36 is a diagram showing a configuration example for improving the tact of the entire electronic component production system.
37 is a plan view of the deformed mounter shown in FIG. 5. FIG.
FIG. 38 is a plan view showing a modified mounter having another configuration.
FIG. 39 is a plan view showing a modified mounter of still another configuration.
FIG. 40 is a chart showing an example of combined use of production and setup work using a double-sided deployment device.
FIG. 41 is a chart showing an example of combined use of production and setup work in the case where a plurality of variant mounters equipped with a double-sided deployment device are connected.
FIG. 42 is a diagram for explaining an installation space for the odd-shaped mounter having the above-described configuration.
FIG. 43 is a diagram showing an installation space when a plurality of deformed mounters equipped with a double-sided deployment device are connected.
[Explanation of symbols]
101 Loader Lifter
102 Intermediate conveyor
103 printing press
104 High-speed chip mounter
105, 105a, 105b Profile mounter
106 Reflow device
107 Unloader Lifter
308 Parts supply unit
309 Suction mounting head
310 Rotary head
311 Nozzle for high speed
401 Tape feeder
416 Tape parts
417 Top tape
418 Carrier tape
419 Parts storage
420 square tip
421 Tantalum
422 SOP
509 Suction mounting head
512 Nozzle for irregular shape
513,514 Parts supply unit
538 Parts recognition unit
601 Stick feeder
624 Stick part
625 stick
626 Electronic components
627 SOP
628 PLCC
701 Tray feeder
709 Wearing head
712 Absorption nozzle for irregular shape
729 tray
730 Parts storage
731 Tray receiving plate
732 Tray storage magazine
733 QFP
734 BGA
735 connector
2601 Normal operation (normal production operation function)
2602 Printed wiring board conveyance independent control
2604 Nozzle change function
2836 Printed wiring board
2837 Component recognition, component suction position
2839 Board transfer rail
3301 Production instruction system
3310 NC creation system
3320 Setup creation system
3401 Production Instruction List
3501 Setup instruction list
3601 Intermediate buffer conveyor
3801 Front deployment device
3901 Rear deployment device
4201, 4301 Required installation frame

Claims (6)

In electronic component mounting equipment that mounts electronic components on printed wiring boards and produces printed wiring boards,
Supply means for supplying various electronic parts such as chip parts, semiconductor parts, connectors, etc., which are supplied by attaching supply bodies of different parts packing forms,
Mounting means for mounting the various electronic components supplied from the supply means on the printed wiring board by moving a head;
Conveying means for controlling conveyance of the printed wiring board along a conveying rail for mounting processing of the electronic component;
A control unit capable of switching between a normal state in which the operation of each unit is integrated to produce the printed wiring board, and a conveyance single state in which only the conveyance unit is operated,
A plurality of the mounting devices are connected and arranged, and any of the mounting devices can be set in the normal state and the conveyance single state,
When the transport single state is set, production preparations such as replacement of the supply medium of the supply means, shape recognition of electronic parts held by the mounting means, correction of the mounting direction and suction position, and replacement of the control program, etc. It is possible to carry out a setup operation for performing the setup necessary for the above-mentioned, and the setup operation is executed while continuing the production of the printed wiring board in the mounting device in which the normal state is set ,
In the setup operation, when the head of the mounting means passes the transport rail, the movement of the head is stopped when the printed wiring board being transported is passing the transport rail, and when the head is not passing, An electronic component mounting apparatus characterized in that conveyance of a printed wiring board is stopped . The control means includes
The electronic component mounting apparatus according to claim 1, wherein, when the stop control is executed, if the printed wiring board is stopped, the head of the mounting unit is moved . The supply means includes
A tape feeder that supplies electronic components accommodated in a tape body, a stick feeder that supplies electronic components accommodated in a stick, and a tray feeder that supplies electronic components accommodated in a tray are selectively combined. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is disposed at the supply location. Various electronic parts such as chip parts, semiconductor parts, connectors, etc., which are supplied by mounting supply bodies with different parts loading states, are supplied from a plurality of supply points, and supplied from the plurality of supply points. Using the electronic component mounting apparatus comprising: mounting means for mounting the various electronic components on a printed wiring board by moving a head; and transporting means for transporting the printed wiring board for mounting the electronic components. In the electronic component production method for producing printed wiring boards,
A normal production process for producing the printed wiring board by controlling the operation of each means;
Including only the transport means and the transport single process that operates independently by separating from the control of other means, and can be switched to either the normal production process or the transport single process,
The single conveyance step includes replacement of a supply medium of the supply unit, shape recognition performed by moving an electronic component held by the mounting unit to a place where the recognition unit is disposed, correction of a mounting direction, a suction position, replacement of a control program, etc. It is executed at the time of setup work required for production preparation of
A restriction step of restricting an upper position of the printed wiring board being conveyed so that a head of the mounting means does not pass when the printed wiring board is conveyed by the conveying means, and the restriction step includes the conveying means A method for producing an electronic component, comprising: carrying out the printed wiring board according to the above and temporarily stopping the head of the mounting means. The regulation process includes
5. The electronic component production method according to claim 4, wherein when the printed wiring board is stopped, the head of the mounting means is moved. A computer executes the method according to claim 4 or 5. program.

Images