JP4129627B2 - Laminated film for build-up wiring board and build-up wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laminated film used for manufacturing a build-up wiring board and a method for manufacturing the build-up wiring board .
[0002]
[Prior art]
In recent years, with the progress of miniaturization, high performance, and high functionality of electronic devices, printed wiring boards that can support high-density mounting are required. Therefore, techniques such as multilayering of printed wiring boards, thinning of insulating layers, adoption of inner via holes in place of conventional through holes, reducing the diameter of via holes, and reducing the pitch of circuits have been studied. In order to realize these, production of a multilayer printed wiring board (hereinafter referred to as a build-up wiring board) by a build-up method has been studied.
[0003]
As a manufacturing method of a build-up wiring board, since handling of raw materials is easy and the process can be shortened, a method using a so-called resin-coated copper foil in which a copper foil and an insulating resin are bonded together is being widely adopted. . The insulating resin is required to have high adhesion to the copper foil from room temperature to high temperature, particularly from the viewpoint of electrical reliability. In recent years, as the signal processing speed of computers and the frequency of radio waves for mobile communications have increased, printed wiring boards using insulating resin with low dielectric constant and low dielectric loss tangent have been developed. It has been demanded.
[0004]
Conventionally, as an insulating resin, a thermosetting epoxy resin has been used because of its excellent heat resistance, dimensional stability, adhesiveness, and the like, but an epoxy resin essentially has a high dielectric constant and dielectric loss tangent. There was a problem. In this respect, the fluororesin is suitable as an insulating resin for printed wiring boards because it has a low dielectric constant and dielectric loss tangent and is excellent in heat resistance and chemical resistance.
[0005]
For example, as a printed wiring board having a low dielectric constant and a low dielectric loss tangent, a glass fiber reinforced fluororesin plate is known, but a high temperature of 350 ° C. or higher is required for adhesion to a metal layer, and the fluororesin The board was thick and could not cope with miniaturization and weight reduction. Also known are fluororesin laminates made of fluororesin fiber woven fabrics and porous fluororesin films, thermosetting fluororesin laminates made by baking fluororesin on glass fiber woven fabrics, etc. The adhesion to the foil was low.
[0006]
Patent Document 1 discloses a build-up wiring board in which circuit wiring (metal layer) and an insulating layer are sequentially laminated on the surface of a core substrate. By forming the metal layer directly on the surface of the insulating layer having a surface roughness of 0.1 to 10 μm, the adhesion between the metal layer and the insulating layer is improved.
[0007]
Patent Document 2 discloses a method for producing a printed circuit board material in which a fluororesin film and a conductor foil are directly bonded, but the adhesion between the fluororesin film and the conductor foil is not sufficient.
[0008]
[Patent Document 1]
JP 2000-31642 A [Patent Document 2]
Japanese Patent Laid-Open No. 2002-43720
[Problems to be solved by the invention]
An object of the present invention is to provide a laminated film for a buildup wiring board having excellent heat resistance, low dielectric constant and dielectric loss tangent, and excellent adhesion to a conductor layer, and a method for producing a buildup wiring board using the same. Is to provide.
[0010]
[Means for Solving the Problems]
In the present invention, a fluororesin (A) layer having a fluorine content of 35 to 76% by mass and a conductor layer are laminated via a resin (B) layer having a fluorine content of 25% by mass or less. a film, has a thickness of 10~50μm layer of fluorocarbon resin (a), the to provide a laminated film which need use to be adhered to the substrate to produce a build-up wiring board.
Also, the present invention is characterized in that the substrate having circuit wiring formed on the surface and the laminated film with the conductor layer outside are bonded by hot press molding using an adhesive resin. A method for manufacturing an up-wiring board is provided.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Although it does not specifically limit as a fluororesin (A) (henceforth a fluororesin (A)) whose fluorine content is 40-76 mass% in this invention, It is called tetrafluoroethylene (henceforth TFE). )) (Polytetrafluoroethylene) or a copolymer of TFE and a comonomer is preferred. Examples of the comonomer include fluoroethylenes other than TFE such as CF ₂ = CFCl, CF ₂ = CH ₂ (hereinafter referred to as VdF), CF ₂ = CFCF ₃ (hereinafter referred to as HFP), CF ₂ = CHCF _{3 and the} like. Carbon number of perfluoroalkyl groups such as fluoropropylenes, CH ₂ = CHCF ₂ CF ₂ CF ₂ CF ₃ , CH ₂ = CFCF ₂ CF ₂ CF ₂ H, CH ₂ = CFCF ₂ CF ₂ CF ₂ CF ₂ H, etc. (perfluoroalkyl) ethylenes such _{12, R f (OCFXCF 2)} m OCF = CF 2 ( formula in _{the R f} perfluoroalkyl group having 1 to 6 carbon atoms, X is a fluorine atom or a trifluoromethyl group, m is 0 Perfluoro (vinyl ether) s such as 5), and olefins such as ethylene, propylene, and isobutylene. Etc. The. These comonomers may be used alone or in combination of two or more.
[0012]
Specific examples of the fluororesin (A) include polytetrafluoroethylene (hereinafter referred to as PTFE), TFE / ethylene copolymer (hereinafter referred to as ETFE), and TFE / perfluoro (alkyl vinyl ether) copolymer (referred to as PTFE). Hereinafter, it is referred to as PFA), TFE / HFP copolymer (hereinafter referred to as FEP), TFE / HFP / VdF copolymer, chlorotrifluoroethylene / ethylene copolymer, and the like. These fluororesins (A) are preferable because of their low dielectric constant and dielectric loss tangent. In particular, PTFE, ETFE, PFA or FEP is preferable, and ETFE, PFA or FEP is more preferable. ETFE, PFA and FEP are excellent in moldability.
[0013]
The fluorine content of the fluororesin (A) in the present invention is 40 to 76% by mass. Preferably it is 50-76 mass%, More preferably, it is 55-76 mass%. Within this range, the fluororesin (A) is preferable because of its low dielectric constant and dielectric loss tangent.
[0014]
The thickness of the layer of the fluororesin (A) is 10 to a 50 [mu] m, in particular. 20 to 5 0 .mu.m preferred. If the thickness is less than the above range, the laminated film is likely to be deformed or bent, and the circuit wiring is likely to be disconnected. On the other hand, if the thickness is larger than the above range, the thickness of the build-up wiring board increases, so that it is not possible to cope with the reduction in size and weight. Within this range, the laminated film is less likely to be deformed or bent, has excellent flexibility, and the printed wiring board can be reduced in size and weight.
[0015]
The fluororesin (A) preferably contains 1 to 50% by mass of fluororubber such as TFE / propylene copolymer and VdF / HFP copolymer. The content of fluororubber is more preferably 1 to 30% by mass, and most preferably 1 to 20% by mass. It is preferable that the fluororesin (A) contains fluororubber because adhesion with the conductor layer is improved. The fluorine content of the fluororubber is preferably 35 to 74 mass%, more preferably 50 to 74 mass%, and most preferably 55 to 74 mass%.
[0016]
Moreover, it is also preferable that a fluororesin (A) contains 0.1-2 mass% of the antistatic agent which provides antistatic property. As the antistatic agent, surfactants such as nonionic surfactants, anionic surfactants, cationic surfactants, and zwitterionic surfactants are preferable.
[0017]
The fluororesin (A) also preferably contains an inorganic filler that lowers the dielectric constant and dielectric loss tangent. Inorganic fillers include silica, clay, talc, calcium carbonate, mica, diatomaceous earth, alumina, zinc oxide, titanium oxide, calcium oxide, magnesium oxide, iron oxide, tin oxide, antimony oxide, calcium hydroxide, magnesium hydroxide, water Aluminum oxide, basic magnesium carbonate, magnesium carbonate, zinc carbonate, barium carbonate, dosonite, hydrotalcite, calcium sulfate, barium sulfate, calcium silicate, montmorillonite, bentonite, activated clay, sepiolite, imogolite, sericite, glass fiber, glass Examples include beads, silica-based balloons, carbon black, graphite, carbon fibers, carbon balloons, wood powder, and zinc borate.
[0018]
The inorganic filler may be used alone or in combination of two or more. As for content of an inorganic filler, 1-100 mass% is preferable with respect to a fluororesin (A). Further, it is preferable that these inorganic fillers are porous because the dielectric constant and dielectric loss tangent are further reduced.
[0019]
As the resin (B) having a fluorine content of 25% by mass or less in the present invention (hereinafter simply referred to as resin (B)), various resins can be selected according to the molding conditions of the build-up wiring board. Specific examples include polyimide, polyetherimide, polyether ketone, polyether ether ketone, polyether sulfone, polysulfone, polyether ether sulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenylene ether, liquid crystal polyester, polyethylene terephthalate, polybutylene terephthalate, Examples include polyethylene naphthalate, polybutylene naphthalate, polycarbonate, polyamide, polyamideimide, polyacetal, and epoxy resin. Resin (B) may be used individually by 1 type, and may use 2 or more types together.
[0020]
As the resin (B), a resin having a melting point higher than the molding temperature at the time of manufacturing the build-up wiring board is preferable. Polyimide, polyetherimide, polyetherketone, polyetheretherketone, polyethersulfone, polysulfone, polyethersulfone, One or more selected from the group consisting of polyphenylene sulfone, polyphenylene sulfide, polyphenylene ether, and liquid crystal polyester is more preferable, and polyimide, polyether imide, polyether sulfone, polyphenylene ether, or liquid crystal polyester is most preferable.
[0021]
The fluorine content of the resin (B) is preferably 20% by mass or less, and more preferably 15% by mass or less. Further, a resin substantially free of fluorine is most preferable. Within this range, the adhesiveness to the fluororesin (A) layer and the conductor layer is excellent.
[0022]
The thickness of the resin (B) layer is preferably 0.1 to 50 μm, more preferably 1 to 30 μm, and most preferably 3 to 10 μm. If the thickness is less than the above range, the adhesion between the fluororesin (A) layer and the conductor layer is not sufficient, and the followability to the wiring pattern on the substrate surface is not sufficient. When it is thicker than the above range, the dielectric constant and dielectric loss tangent of the layer comprising the fluororesin (A) layer and the resin (B) layer are increased. Hereinafter, the layer of the fluororesin (A) and the layer of the resin (B) are also referred to as an insulating resin layer. Within this range, the adhesion between the fluororesin (A) layer and the conductor layer is sufficient, the dielectric constant and dielectric loss tangent of the insulating resin layer are low, and the followability to the wiring pattern on the substrate surface is excellent. .
[0023]
As the conductor in the present invention, metals such as copper, silver, gold, and aluminum can be used. These metals are preferable because of their low electrical resistance. These metals may be used individually by 1 type, and may use 2 or more types together. As a combination method, it is also preferable to apply gold plating to the metal foil. In particular, a copper layer plated with gold is preferable. The conductor layer in the present invention is preferably a copper, silver, gold, aluminum layer, or a copper layer plated with gold. The thickness of the conductor layer is preferably 0.1 to 100 μm, more preferably 1 to 50 μm, and most preferably 5 to 30 μm.
[0024]
In the laminated film for a build-up wiring board of the present invention, the fluororesin (A) layer and the conductor layer are laminated via the resin (B) layer. The example of sectional drawing of the laminated film for buildup wiring boards of this invention is shown in FIG. It has a fluororesin (A) layer 1, a resin (B) layer 2, and a conductor layer 3.
[0025]
As a manufacturing method of the laminated film for buildup wiring boards of the present invention, various extrusion molding methods, laminate molding methods, coating molding methods and the like which are usually used can be mentioned. A method of laminating the obtained film and a conductor foil after obtaining a film by molding the fluororesin (A) and the resin (B) simultaneously or separately by a method such as extrusion molding, pressure molding, or cast molding. , A method of applying and drying a resin (B) dissolved in a solvent on a conductive foil, and then applying and drying a fluororesin (A) dissolved in a solvent; a resin dissolved in a solvent on a conductive foil ( Examples thereof include a method of applying and drying B) and then laminating a film of a fluororesin (A) on the surface of the resin (B). In particular, a method in which a resin (B) dissolved in a solvent is applied and dried on a conductive foil, and then a fluororesin (A) film is laminated on the application surface of the resin (B) at a high speed, and Since it can manufacture cheaply, it is more preferable.
[0026]
The example of the manufacturing process of the laminated film for buildup wiring boards is shown in FIG. The conductor foil is fed out from the feeding section 4, the resin (B) solution is applied in the coating section 5, then dried in the drying furnace 6, and then the fluororesin (A) film and metal fed out from the feeding section 7. A laminated film for a build-up wiring board is manufactured by heating and pressurizing with the roll 8 and the roll 9 made of silicone rubber, and winding with the winding unit 10.
[0027]
Examples of the laminated film for a build-up wiring board of the present invention include a three-layer laminated film comprising a layer of fluororesin (A) / a layer of resin (B) / a layer of conductor, and a layer of conductor / resin (B). For example, a five-layer laminated film comprising a layer of fluororesin (A) / a layer of resin (B) / a conductor layer.
[0028]
The buildup wiring board manufactured using the laminated film for buildup wiring boards of the present invention is formed by laminating a laminated film for buildup wiring boards on a substrate. As a method for producing the build-up wiring board, a substrate having circuit wiring formed on the surface and a laminated film for a build-up wiring board with a conductor layer on the outside are formed using an adhesive resin such as a polyimide varnish. A method of bonding is preferred. The said board | substrate and the laminated film for buildup wiring boards are normally adhere | attached by hot press molding. A build-up wiring board is manufactured by repeating the adhesion of the laminated film for the build-up wiring board.
[0029]
The substrate in the build-up wiring board of the present invention is not particularly limited, and examples include substrates using epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, fluororesin, polyphenylene ether, liquid crystal polyester, and the like. Among these, a substrate using a fluorine resin, a polyimide resin, polyphenylene ether, or liquid crystal polyester is more preferable. Moreover, the board | substrate using the thermosetting resin composition which mix | blended the inorganic filler etc. can also be used. In addition, cloth of inorganic fiber such as glass fiber, cloth of organic fiber such as polyester, polyamide, fluororesin, and cotton, laminated board obtained by bonding multiple sheets of paper etc. with thermosetting resin, wiring circuit on the surface The formed laminated substrate or the like can be used. Among these, a substrate made of a glass fiber woven fabric baked with a fluororesin is more preferable.
[0030]
As a method of forming a wiring circuit on the surface of the multilayer substrate, a method of forming a wiring circuit by etching a conductor layer bonded to one or both surfaces of the multilayer substrate, or a circuit wiring by plating the surface of the multilayer substrate. The method of forming etc. are mentioned.
[0031]
As conditions for bonding the laminated film for a build-up wiring board to the substrate by press molding, the temperature is preferably 100 to 240 ° C, more preferably 120 to 220 ° C, and most preferably 150 to 200 ° C. The pressure is preferably 0.3 to 5 MPa, more preferably 0.4 to 3 MPa, and most preferably 3 to 5 MPa. The time is preferably 30 to 240 minutes, more preferably 40 to 120 minutes, and most preferably 60 to 80 minutes. As a press plate used for press molding, a stainless steel plate is preferable.
[0032]
At the time of press molding, the insulating resin layer deforms following the shape of the circuit wiring on the substrate surface, so that air between the build-up wiring board laminated film and the circuit wiring on the substrate surface is extruded, and the laminated film Bubbles are unlikely to form between the substrate and the substrate. Therefore, the build-up wiring board of the present invention is excellent in insulation reliability. In the build-up wiring board, the conductive layer on the surface can be etched to form circuit wiring, and further, through holes or via holes can be formed in the insulating resin layer as necessary. Moreover, a multilayer build-up wiring board can be manufactured by repeating this process.
[0033]
The build-up wiring board manufactured using the laminated film for build-up wiring boards of the present invention has a low dielectric constant and dielectric loss tangent and is excellent in high frequency characteristics. Further, since the resin (B) layer exists between the fluororesin (A) film and the conductor layer, the fluororesin (A) film and the conductor layer are excellent in adhesiveness.
[0034]
【Example】
The present invention will be described in detail below with reference to examples, but the present invention is not limited thereto. Examples 1-4, 6 is an example, Example 5 is a comparative example. The following methods were used for measurement of dielectric constant and dielectric loss tangent, and evaluation of adhesiveness.
[0035]
[Measurement of dielectric constant and dissipation factor]
A fluororesin (A) film having a thickness of 3 mm was cut into a size of 200 mm × 120 mm to prepare a test film. Conductive paste was applied to both sides of the test film and wired, and the dielectric constant and dielectric loss tangent at 1 MHz were measured.
[0036]
[Evaluation of adhesion]
A test film having a length of 150 mm and a width of 10 mm obtained by cutting the laminated film for a build-up wiring board was prepared. The fluororesin (A) layer and the conductor layer were peeled from the end in the length direction of the test film to a position of 50 mm. Then, with the position at the center, peeling was performed 180 degrees at a pulling speed of 50 mm using a tensile tester, and the maximum load was defined as peel strength (N / 10 mm). It shows that it is excellent in adhesiveness, so that peeling strength is large.
[0037]
[Example 1]
As the fluororesin (A), ETFE (Fullon ETFE / C-88AXP manufactured by Asahi Glass Co., Ltd.) was extruded to obtain an ETFE film having a thickness of 50 μm. The dielectric constant of ETFE was 2.7, and the dielectric loss tangent was 0.005.
[0038]
Using the apparatus shown in FIG. 2, an electrolytic copper foil having a thickness of 18 μm and a width of 380 mm as a conductor (Fukuda Metal Foil Powder Co., Ltd./CF-T9B-THE) and a polyimide as a resin (B) (UPA made by Ube Industries) AH) 30% by mass tetrahydrofuran solution was applied to a thickness of 5 μm when dried, and dried in a drying furnace 6 divided into three regions of 100 ° C., 110 ° C. and 120 ° C. at a speed of 1 m / min. Guided dry. The obtained electrolytic copper foil / polyimide laminate was bonded to the polyimide surface side and the ETFE film through a metal roll 8 heated to 180 ° C. and a silicone rubber roll 9, and an electrolytic copper foil layer having a thickness of 73 μm. A three-layer laminated film consisting of / polyimide layer / ETFE film layer was obtained. The peel strength between the ETFE film layer and the electrolytic copper foil layer of the laminated film was 10.3 N / 10 mm width, indicating sufficient adhesive strength.
[0039]
[Example 2]
From the electrolytic copper foil layer / polyimide layer / ETFE film layer having a thickness of 73 μm in the same manner as in Example 1 except that a 20% by mass tetrahydrofuran solution of polyimide (UPA-111C manufactured by Ube Industries, Ltd.) is used as the resin (B). A three-layer laminated film was prepared. The peel strength between the ETFE film layer and the electrolytic copper foil layer of the obtained laminated film was 11.1 N / 10 mm width, indicating a sufficient adhesive force.
[0040]
[Example 3]
Three layers consisting of electrolytic copper foil layer / polyimide layer / PFA film layer with a thickness of 73 μm in the same manner as in Example 1 except that PFA (Fullon PFA / P-65P manufactured by Asahi Glass Co., Ltd.) is used as the fluororesin (A). A laminated film was created. The dielectric constant of PFA was 2.1 and the dielectric loss tangent was 0.0003. The peel strength between the PFA film layer and the electrolytic copper foil layer of the obtained laminated film was 9.5 N / 10 mm width, indicating a sufficient adhesive force.
[0041]
[Example 4]
From the electrolytic copper foil layer / polyimide layer / PFA film layer having a thickness of 73 μm in the same manner as in Example 3, except that a 20 mass% tetrahydrofuran solution of polyimide (UPA-111C manufactured by Ube Industries, Ltd.) is used as the resin (B). A three-layer laminated film was prepared. The peel strength between the PFA film layer and the electrolytic copper foil layer of the obtained laminated film was 7.6 N / 10 mm width, indicating a sufficient adhesive force.
[0042]
[Example 5 (comparative example)]
A two-layer laminated film composed of an electrolytic copper foil layer / ETFE film layer having a thickness of 68 μm was bonded by passing the electrolytic copper foil and ETFE film of Example 1 through a metal roll heated to 180 ° C. and a silicone rubber roll. Created. The resulting laminated film had a peel strength between the ETFE film layer and the electrolytic copper layer of 0.03 N / 10 mm width, and was easily peeled by hand, resulting in insufficient adhesion.
[0043]
EXAMPLE 6 (Example)]
A manufacturing process of the six-layer build-up wiring board 26 shown in FIG. 4 is shown in FIG.
[0044]
A glass fiber reinforced fluororesin plate having a thickness of 1 mm, having a through hole 13 and an electroless copper-plated conductor layer 12, and having a wiring pattern formed on the conductor layer 12, shown in FIG. 11 was prepared.
[0045]
In step (b), after the polyimide varnish is applied to the glass fiber reinforced fluororesin plate 11, the laminated film 16 for build-up wiring board obtained in Example 1 is subjected to a pressure of 2 MPa, a temperature of 130 ° C. for 5 minutes, and then a pressure of 2 MPa. Then, press molding was performed at a temperature of 190 ° C. for 5 minutes, followed by pressure molding at a pressure of 0.5 MPa and a temperature of 185 ° C. for 5 minutes. 3 and 4, the polyimide layer / ETFE layer is shown together as an insulating resin layer 14. The wiring pattern is filled with polyimide varnish and is integrated with the insulating resin layer 14.
[0046]
In step (c), an opening 17 (not shown) is opened on the surface of the conductor layer 15 with a CO ₂ gas laser, and then electrolytic plating is performed to form an electrolytic copper plating film 19 having a thickness of 15 μm. Formed. The opening 17 was also covered with an electrolytic copper plating film, and a via hole 18 was formed.
[0047]
In step (d), the electrolytic copper plating film 19 and the conductor layer 15 were etched to form a wiring pattern on the laminated film for a build-up wiring board adhered to the glass fiber reinforced fluororesin board. Next, a polyimide varnish was applied, and the steps (b) to (d) were repeated to obtain a six-layer build-up wiring board 26 shown in FIG. In FIG. 4, 21 is a conductor layer, 20 is an insulating resin layer, 22 is a laminated film for a build-up wiring board, 24 is a via hole, and 25 is an electrolytic copper plating film. The via hole 18 is integrated with a polyimide varnish insulating resin layer 20.
[0048]
【The invention's effect】
The laminated film for buildup wiring boards of the present invention has a low dielectric constant and dielectric loss tangent. Further, since the resin (B) layer is provided between the fluororesin (A) layer and the conductor layer, the adhesion between the fluororesin (A) layer and the conductor layer is excellent. The laminated film for build-up wiring boards of the present invention is suitable for use in build-up wiring boards that are excellent in high-frequency characteristics.
[Brief description of the drawings]
FIG. 1 is an example of a cross-sectional view of a laminated film for a buildup wiring board according to the present invention.
FIG. 2 shows an example of a method for producing a laminated film for a buildup wiring board according to the present invention.
3 is a manufacturing process of the build-up wiring board of Example 6. FIG.
4 is a six-layer build-up wiring board of Example 6. FIG.
[Explanation of symbols]
1: Layer of fluorine resin (A) having a fluorine content of 35 to 76% by mass 2: Layer of resin (B) having a fluorine content of 25% by mass or less 3: Layer of conductor 4: Feeding portion 5: Coating part 6: Drying furnace 7: Feeding part 8: Metal roll 9: Silicone rubber roll 10: Winding part 11: Glass fiber reinforced fluororesin plates 12, 15, 21: Copper conductor layer 13: Through hole 14, 20: Insulating resin layers 16, 22: Laminated film for build-up wiring board 17: Opening 18, 24: Via hole 19, 25: Electrolytic copper plating film 26: Six-layer build-up wiring board

Claims (5)

A fluorine content of the layer and the conductor layer of 35 to 76 wt% at which the fluororesin (A) is fluorine content are laminated with a layer of resin (B) is not more than 25 wt% Film Te, the thickness of the layer of the fluororesin (a) is 10 to 50 [mu] m, laminated film is bonded to the substrate are needed use for producing a build-up wiring board. The fluororesin (A) having a fluorine content of 35 to 76% by mass is a tetrafluoroethylene / ethylene copolymer, a tetrafluoroethylene / perfluoro (alkyl vinyl ether) copolymer, or a tetrafluoroethylene / hexafluoropropylene. product layer film according to claim 1 is a system copolymer or polytetrafluoroethylene. The resin (B) having a fluorine content of 25% by mass or less is polyimide, polyetherimide, polyetherketone, polyetheretherketone, polyethersulfone, polysulfone, polyethersulfone, polyphenylenesulfone, polyphenylenesulfide, polyphenyleneether. product layer film according to claim 1 or 2 and at least one member selected from the group consisting of a liquid crystal polyester. It said layer of conductive material is copper, silver, product layer film according to claim 1, 2 or 3 layers of gold or aluminum, or a layer of copper plated with gold. The board | substrate with which circuit wiring was formed in the surface, and the laminated | multilayer film in any one of Claims 1-4 which made the conductor layer the outer side are adhere | attached by hot press molding using adhesive resin A method for manufacturing a build-up wiring board.

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