CN105984180A - Copper foil base plate for high frequency printed circuit board and use thereof - Google Patents
Copper foil base plate for high frequency printed circuit board and use thereof Download PDFInfo
- Publication number
- CN105984180A CN105984180A CN201510071715.0A CN201510071715A CN105984180A CN 105984180 A CN105984180 A CN 105984180A CN 201510071715 A CN201510071715 A CN 201510071715A CN 105984180 A CN105984180 A CN 105984180A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- copper clad
- clad laminate
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a copper foil base plate for a high frequency printed circuit board. The copper foil base plate comprises a copper foil base plate with surface roughness less than or equal to 0.5 microns and a laminated body. The laminated body comprises a thermosetting type polyimide layer and an insulating layer. The thermosetting type polyimide layer is used for connecting the copper foil base plate and the insulating layer, and a ratio of thickness of the thermosetting type polyimide layer to thickness of the laminated body is 0.145 to 0.2. The dielectric constant of the thermosetting type polyimide layer is greater than or equal to 3.0. The dielectric constant of the insulating layer is less than 3.0. Through the thermosetting type polyimide layer, the copper foil base plate and the insulating layer have good adherence. Under the signal transmission condition of 1-10GHz, the dielectric constant of the laminated body is 3.0 or less and satisfies the industry and market demands.
Description
Technical field
The present invention relates to a kind of copper clad laminate material for high frequency printed circuit board, particularly relate to
A kind of copper clad laminate comprising low surface roughness and the copper clad laminate material of laminate, and this is long-pending
Layer body includes heat curing-type polyimide layer and insulating barrier.
Background technology
Along with new design of electronic products from generation to generation tends to light, thin, short, little, and many merits need to be met
Can require and quick and transmission in a large number the characteristic of information, therefore, the distribution trend of printed circuit board (PCB)
Densification, information load mode develops towards high frequency so that the material selection of printed circuit board (PCB)
Move towards more rigorous demand.The signal velocity of the substrate used due to printed circuit board (PCB) with
The square root of the dielectric constant (Dk) of substrate is inversely proportional to, so the dielectric constant of substrate is the least
The best, and dielectric dissipation factor (Df) is the least, the loss of representation signal transmission is the fewest, so being situated between
The transmission quality that the material that electricity dissipation factor is less can be provided by is the most excellent.So in order to tie up
Holding high-frequency transmission speed and keep transmission signal integrity, the substrate of printed circuit board (PCB) must have concurrently
Relatively low dielectric constant and dielectric dissipation factor.
General printed circuit board (PCB) includes a copper clad laminate and an insulating barrier, for improve copper clad laminate with
The adherence of insulating barrier, typically can carry out copper clad laminate roughening and make its surface roughness improve,
But this printed circuit board (PCB) is under the signal transmission conditions of 1GHz to 10GHz, can be because of kelvin effect
The impact of (skin effect), causes signal energy to produce because of high surface roughness copper clad laminate
Raw conductor damages (conductor loss), causes signal energy to lose distortion so that high-frequency transmission
Characteristic and reliability reduce.
The copper clad laminate material being currently used for high frequency/densification printed circuit board (PCB) comprises a low surface
The copper clad laminate of roughness, and one connect and be arranged on the insulating barrier on this copper clad laminate, wherein,
The dielectric constant range of this insulating barrier is more than 3.0.But along with copper clad laminate material tends to slimming
Design, under the signal transmission conditions of 1GHz to 10GHz so that this copper clad laminate material
Parasitic capacitance (stray capacitance) value and dielectric consume (dissipation loss) value
Gradually step up, cause the signal transmission quality of copper clad laminate material to reduce, and then affect follow-up printing
Circuit board desirable characteristics.
Because it is above-mentioned, for avoiding parasitic capacitance value and dielectric loss value to be gradually increased to not allow suddenly
Depending on situation, the slim copper clad laminate material with low-k and dielectric loss need to be developed,
And take into account copper clad laminate and the adherence of the interlayer that insulate, and it is applied to high frequency/height simultaneously
In densification printed circuit board (PCB), it is that present stage printed circuit board material supplier desires most ardently solution
Problem.
Summary of the invention
The first object of the present invention is to provide a kind of Copper Foil base for high frequency printed circuit board
Sheet material.Make this copper clad laminate by this heat curing-type polyimide layer in this copper clad laminate material and be somebody's turn to do
Insulation interlayer has good adherence, and under the signal transmission conditions of 1GHz to 10GHz,
The dielectric constant of this laminate is positively retained at less than 3.0, does not have parasitic capacitance value and dielectric consumption
The problem that damage value improves, and then improve the signal transmission quality of copper clad laminate material.
The present invention is for the copper clad laminate material of high frequency printed circuit board, and this is used for high frequency printed circuit
The copper clad laminate material of plate comprises:
One range of surface roughness is the copper clad laminate of below 0.5 μm；And
One laminate, the heat curing-type polyimides being arranged on this copper clad laminate including a connection
Layer, and one connect be arranged on the insulating barrier on this heat curing-type polyimide layer；
Wherein, this heat curing-type polyimide layer is used to make this copper clad laminate be connected with this insulating barrier
Together, and the thickness of this heat curing-type polyimide layer with the thickness ratio range of this laminate is
0.145 to 0.2；The dielectric constant range of this heat curing-type polyimide layer is more than 3.0；Should
The dielectric constant range of insulating barrier is less than 3.0.
The second object of the present invention is that providing a kind of amasss for the compound of high frequency printed circuit board
Layer body.
The present invention is for the compound laminate of high frequency printed circuit board, and this is used for high frequency printed circuit
The compound laminate of plate comprises: two above-mentioned copper clad laminate materials for high frequency printed circuit board,
And a following layer, wherein, this following layer is used to make the described copper for high frequency printed circuit board
Insulating barrier in foil substrate material links together.
The third object of the present invention is to provide a kind of composite bed for high frequency printed circuit board
Fit.
The present invention is for the composite laminated body of high frequency printed circuit board, and this is used for high frequency printed circuit
The composite laminated body of plate comprises: two above-mentioned copper clad laminate materials for high frequency printed circuit board,
And two connect respectively to be arranged on and described insulate in the copper clad laminate material of high frequency printed circuit board
Following layer on layer, wherein, described connecing in the copper clad laminate material of high frequency printed circuit board
Layer connected to each other.
The beneficial effects of the present invention is: copper clad laminate material of the present invention is sub-by this heat curing-type polyamides
Amine layer makes this copper clad laminate and this insulating barrier have good adherence, and by controlling this heat curing-type
The thickness of polyimide layer and the thickness ratio of this laminate and heat curing-type polyimide layer are with exhausted
The dielectric constant range of edge layer so that this copper clad laminate material is placed in the signal of 1GHz to 10GHz
Under transmission conditions, the dielectric constant of this laminate is positively retained at less than 3.0, with meet industry and
The market demand.
Hereinafter will be described in detail with regard to present invention:
It is preferred that the adhesion scope between this laminate and this copper clad laminate be 0.7Kg/cm extremely
1Kg/cm。
It is preferred that the present invention also comprises a connection for the copper clad laminate material of high frequency printed circuit board
Following layer on which insulating layer is set.
The present invention for the preparation method of copper clad laminate material of high frequency printed circuit board, can use with
Method toward the copper clad laminate material of preparation high frequency printed circuit board.Specifically, this
The bright preparation method for the copper clad laminate material of high frequency printed circuit board comprises the steps of offer
One range of surface roughness is the copper clad laminate of below 0.5 μm；Formed on this copper clad laminate
One heat curing-type polyamide acid layer；Then, in this heat curing-type polyamide acid layer, an insulating barrier is formed；
Then, carry out a heat treated so that this heat curing-type polyamide acid layer carries out imidization reaction,
Form a heat curing-type polyimide layer, the present invention copper for high frequency printed circuit board can be obtained
Foil substrate material.Further, after this heat curing-type polyimide layer is formed, on this insulating barrier
Form a following layer.
This heat curing-type polyamide acid layer is formed at the mode of this copper clad laminate such as but not limited to inciting somebody to action
One heat curing-type polyamic acid component is with slot coated method, rolling method, spin-coating method, or dip coating
It is formed on this copper clad laminate etc. mode.
As long as it is sub-that the operation temperature of this heat treated can make this heat curing-type polyamide acid layer carry out acyl
Aminating reaction.
The present invention for the preparation method of compound laminate of high frequency printed circuit board, can use with
Method toward the compound laminate of preparation use in printed circuit board.For example, the present invention uses
Preparation method in the compound laminate of high frequency printed circuit board comprises the steps of offer two
Above-mentioned copper clad laminate material, forms a following layer on the insulating barrier of a wherein copper clad laminate material, connects
, the insulating barrier of another copper clad laminate material is connected to this following layer.
The insulating barrier of this copper clad laminate material is connected to the mode of this following layer such as but not limited to pressure
Legal.
The present invention, for the preparation method of the composite laminated body of high frequency printed circuit board, can use such as
The preparation method of the above-mentioned compound laminate for high frequency printed circuit board, so repeating no more.
Wherein, described following layer in the copper clad laminate material of high frequency printed circuit board is connected to one another at
Mode together is such as but not limited to pressing method.
Below will one by one to this copper clad laminate, polyimide layer, heat curing-type polyamic acid component,
Insulating barrier, and following layer is described in detail.
" copper clad laminate "
This copper clad laminate is such as but not limited to electrolytic copper clad laminate or spreading formula copper clad laminate.
" heat curing-type polyimide layer "
The film thickness range of this heat curing-type polyimide layer is that 2.9 μm are to 4.4 μm.This heat curing-type
The material of polyimide layer is through imidization reaction by a heat curing-type polyamic acid component
The heat curing-type polyimides formed.This heat curing-type polyamic acid component is such as but not limited to China
The polyamic acid component etc. that Taiwan Patent I264444 is used.
It is preferred that the material of this heat curing-type polyimide layer is to be included being of tetracarboxylic dianhydride by one
The aggregated reaction of mixture of compound and two amine compounds and imidization reaction are formed
Heat curing-type polyimides, wherein, is in terms of 1 mole by the total amount of this tetracarboxylic dianhydride's based compound,
The usage amount scope of this two amine compound is that 1.0 moles are to 1.02 moles.This tetrabasic carboxylic acid two
Acid anhydride based compound can be used alone or as a mixture, and this tetracarboxylic dianhydride's based compound such as but does not limits
In hexichol tetracarboxylic dianhydride, (biphenyl tetracarboxylicdianhydride is called for short
BPDA), equal benzene tertacarbonic acid's dianhydride (pyromelliticdianhydride, be called for short PMDA), two
Benzophenonetetracarboxylic dianhydride (benzophenone tetracarboxylicdianhydride, letter
Claim BTDA), or 3,3 ' 4,4 '-sulfobenzide. tetracarboxylic dianhydride
(3,3 ' 4,4 '-diphenylsulfone tetracarboxylicdianhydride are called for short
DSDA) etc..This two amine compound can be used alone or as a mixture, and this two amine compounds example
Such as, but not limited to, p-phenylenediamine (p-phenylenediamine is called for short PDA), 4,4 '-two amidos
Diphenyl ether (4,4 '-oxydianil ine are called for short ODA), or 2,2 '-bis-[4-(4-amido benzene oxygen
Base) phenyl] { 2,2 '-bis [4-(4-aminophenoxy) phenyl] propane is called for short propane
BAPP} etc..
This tetracarboxylic dianhydride's based compound is divided into " rigidity tetracarboxylic dianhydride's based compound ", and
" flexible tetracarboxylic dianhydride's based compound ".The definition of this rigidity is only with phenyl ring person or a band
There are two and mutually with the phenyl ring person of a singly-bound bond, such as BPDA or PMDA.Determining of this flexibility
Justice is to bridge group connectionist with between two phenyl ring and two phenyl ring with one, such as in structural formula
BTDA or DSDA.This two amine compound divides into " rigidity two amine compound ", and " soft
Property two amine compounds ".The definition of this rigidity is only with a phenyl ring person or the most mutual with two
With the phenyl ring person of a singly-bound bond, such as PDA.The definition of this flexibility is with two in structural formula
With bridge joint a group connectionist, such as ODA or BAPP between individual phenyl ring and two phenyl ring.It is preferred that
Being in terms of 100 moles by the total amount of this mixture, this flexibility tetracarboxylic dianhydride's based compound is with flexible
The total amount of two amine compounds and no more than 10 moles.
" insulating barrier "
The material of this insulating barrier can be used alone or as a mixture, and the material of this insulating barrier is such as but not
It is limited to polyester resin, liquid crystal type polymer, or there is the polyimides etc. of fluorin radical.This liquid crystal
Type polymer is such as but not limited to thermotropic liquid crystal type polymer, the polymerization of aromatic polyester liquid crystal type
Thing, aromatic amides liquid crystal type polymer, aromatic liquid-crystal type polymer etc..It is preferred that should
The material of insulating barrier is to select from liquid crystal type polymer, the polyimides with fluorin radical, or it
A combination.
" following layer "
The material of this following layer can be used alone or as a mixture, and the material of this following layer is such as but not
It is limited to crylic acid resin, epoxy resin, thermoplastic polyimides's class, or polyester resin
Deng.It is preferred that the material of this following layer is to select from epoxy resin, thermoplastic polyimides
Class, or their combination.
Accompanying drawing explanation
Fig. 1 is a schematic diagram, and the embodiment of the present invention 1 copper for high frequency printed circuit board is described
The structure of foil substrate material；
Fig. 2 is a schematic diagram, and the application examples 1 of the present invention copper for high frequency printed circuit board is described
The structure of foil substrate material；
Fig. 3 is a schematic diagram, and application examples 2 answering for high frequency printed circuit board of the present invention is described
Close the structure of laminate；And
Fig. 4 is a schematic diagram, and application examples 3 answering for high frequency printed circuit board of the present invention is described
Close the structure of lamilated body.
Detailed description of the invention
" synthesis example 1 "
By the p-phenylenediamine (Chriskev company of U.S. system) of 0.6 mole, the hexichol of 0.4 mole
Ketone tetracarboxylic dianhydride (Chriskev company of U.S. system), and two benzene tertacarbonic acids of 0.2 mole
Dianhydride (Chriskev company of U.S. system) is dissolved in nitrogen-N-methyl 2-pyrrolidone N-(Tedia company of the U.S.
System) in, then, at 5 DEG C, carry out polyreaction, (solid content is to form one first mixed liquor
20wt%).By the 4 of 0.4 mole, 4 '-diaminodiphenyl ether (Chriskev company of U.S. system)
And 0.4 equal benzene tertacarbonic acid's dianhydride of mole be dissolved in nitrogen-N-methyl 2-pyrrolidone N-, then, 5
Carry out polyreaction at DEG C, form one second mixed liquor (solid content is 20wt%).By this first
Mixed liquor and the mixing of the second mixed liquor, forming a solid content is 20wt% and k value is
3rd mixed liquor of 21, more than 000cps, then, is at 5 DEG C that the continuously stirred 3rd mixes
Close liquid, a heat curing-type polyamic acid component can be obtained.
" synthesis example 2 "
By the p-phenylenediamine of 0.8 mole, the benzophenone tetracarboxylic dianhydride of 0.4 mole, 0.2
The hexichol tetracarboxylic dianhydride of mole, and equal benzene tertacarbonic acid's dianhydride of 0.2 mole is dissolved in nitrogen-first
In base pyrrolidone, then, at 5 DEG C, carry out polyreaction, form one first mixed liquor (admittedly contain
Amount is 20wt%).By the 4 of 0.2 mole, 4 '-diaminodiphenyl ether and the equal benzene four of 0.2 mole
Carboxylic acid dianhydride is dissolved in nitrogen-N-methyl 2-pyrrolidone N-, then, carries out polyreaction, shape at 5 DEG C
Become one second mixed liquor (solid content is 20wt%).This first mixed liquor and the second mixed liquor are mixed
Closing, forming a solid content is 20wt% and k value is 31, the 3rd mixed liquor of more than 000cps,
Then, it is continuously stirred 3rd mixed liquor at 5 DEG C, a heat curing-type polyamide can be obtained
Acid constituent.
" synthesis example 3 "
By the p-phenylenediamine of 0.9 mole, the benzophenone tetracarboxylic dianhydride of 0.3 mole, 0.2
The hexichol tetracarboxylic dianhydride of mole, and equal benzene tertacarbonic acid's dianhydride of 0.4 mole is dissolved in nitrogen-first
In base pyrrolidone, then, at 5 DEG C, carry out polyreaction, form one first mixed liquor (admittedly contain
Amount is 20wt%).By the 4 of 0.1 mole, the hexichol first of 4 '-diaminodiphenyl ether and 0.1 mole
Ketone tetracarboxylic dianhydride is dissolved in nitrogen-N-methyl 2-pyrrolidone N-, then, carries out polyreaction at 5 DEG C,
Form one second mixed liquor (solid content is 20wt%).By this first mixed liquor and the second mixed liquor
Mixing, forming a solid content is 20wt% and k value is 41, the 3rd mixing of more than 000cps
Liquid, then, is continuously stirred 3rd mixed liquor at 5 DEG C, can obtain a heat curing-type and gather
Amic acid constituent.
" embodiment 1 "
The heat curing-type polyamic acid component of synthesis example 1 is coated a Copper Foil with slot coated method
1 (label: Kuang Metallgesellschaft AG；Model: GHY5-93DF 1/3oz) surface, and
It is placed in the baking oven of 200 DEG C, carries out the dried of 3 minutes, formed in this Copper Foil 1 surface
One heat curing-type polyamide acid layer.Then, this had the polyamic acid of fluorin radical with slot coated
Method is coated in this heat curing-type polyamide acid layer, is placed in the baking oven of 200 DEG C, carries out 3 points
The dried of clock, forms a polyamide with fluorin radical in this heat curing-type polyamide acid layer
Acid layer.Then, insert in the baking oven with nitrogen, and at 400 DEG C, make this heat curing-type polyamides
Amino acid layer and this polyamide acid layer with fluorin radical carry out imidization reaction, and last 30
Minute, form heat curing-type polyimide layer 2 and there is the polyimide layer 3 of fluorin radical,
Obtain copper clad laminate material of the present invention, refering to Fig. 1.
" embodiment 2 and comparative example 1 and 3 "
Embodiment 2 and comparative example 1 and 3 are to prepare this copper with step same as in Example 1
Foil substrate material, different places is: change this heat curing-type polyimide layer 2 and this has fluorine
The thickness of the polyimide layer 3 of group, as shown in table 1,2.
" comparative example 2 "
The polyamic acid component of synthesis example 1 is coated a Copper Foil 1 (factory with slot coated method
Board: South Asia plastics industry limited company；Model: NPVE 1/3oz) surface, it is placed in
In the baking oven of 200 DEG C, carry out the dried of 3 minutes, form a heat in this Copper Foil 1 surface
Curable type polyamide acid layer.Then, the polyamic acid with fluorin radical is coated with slot coated method
In this heat curing-type polyamide acid layer, it is placed in the baking oven of 200 DEG C, carries out 3 minutes dry
Dry process, forms a polyamide acid layer with fluorin radical in this heat curing-type polyamide acid layer.
Then, insert in the baking oven with nitrogen, and at 400 DEG C, make this heat curing-type polyamide acid layer
And this polyamide acid layer with fluorin radical carries out imidization reaction, and last 30 minutes,
Form heat curing-type polyimide layer 2 and there is the polyimide layer 3 of fluorin radical, can be obtained this
Invention copper clad laminate material.
" comparative example 4 to 7 "
Comparative example 4 to 7 is to prepare this copper clad laminate material with the step identical with comparative example 2,
Different places is: change this heat curing-type polyimide layer 2 and this has the polyamides of fluorin radical
The thickness of imine layer 3, as shown in table 2.
" comparative example 8 "
The polyamic acid with fluorin radical is coated a Copper Foil (label: day with slot coated method
Ore deposit Metallgesellschaft AG；Model: GHY5-93DF 1/3oz) surface, it is placed in 200 DEG C
Baking oven in, carry out the dried of 3 minutes, form one in this Copper Foil and there is the poly-of fluorin radical
Amide acid layer.Then, insert in the baking oven with nitrogen, and make this have fluorine at 400 DEG C
The polyamide acid layer of group carries out imidization reaction, and lasts 30 minutes, is formed and has fluorine
The polyimide layer of group.
" application examples 1 "
Refering to Fig. 2, it is provided that the copper clad laminate material obtained by an embodiment 1, including a Copper Foil
1, a connection is arranged on the heat curing-type polyimide layer 2 on this Copper Foil 1, and a connection is arranged on
The polyimide layer 3 with fluorin radical on this heat curing-type polyimide layer 2.Then, in this
Have on the polyimide layer 3 of fluorin radical and form thermoplastic polyimides's layer 4, can obtain
The enforcement aspect of another copper clad laminate material of the present invention.
" application examples 2 "
Refering to Fig. 3, it is provided that the copper clad laminate material obtained by two embodiments 1, include one respectively
Copper Foil 1, one connection is arranged on the heat curing-type polyimide layer 2 on this Copper Foil 1, and one connects
The polyimide layer 3 with fluorin radical being arranged on this heat curing-type polyimide layer 2.Then,
On the polyimide layer 3 with fluorin radical of a wherein copper clad laminate material, form a thermoplastics type gather
Imide layer 4.Then, by the polyimide layer 3 with fluorin radical of another copper clad laminate material
It is pressed on this thermoplastic polyimides's layer 4, the present invention can be obtained for high frequency printed circuit
The compound laminate of plate.
" application examples 3 "
Refering to Fig. 4, it is provided that the copper clad laminate material obtained by two embodiments 1, include one respectively
Copper Foil 1, one connection is arranged on the heat curing-type polyimide layer 2 on this Copper Foil 1, and one connects
The polyimide layer 3 with fluorin radical being arranged on this heat curing-type polyimide layer 2.Then,
A thermoplastics type is formed on the polyimide layer 3 with fluorin radical of described copper clad laminate material
Polyimide layer 4.Then, by thermoplastic polyimides's layer 4 pressing of described copper clad laminate material
Together, the present invention composite laminated body for high frequency printed circuit board can be obtained.
" assessment item "
180 degree of peel strengths measure: use puller system (label: LLOYD INSTRUMENTS；
Model: LRX) and use IPC-TM-650-2.4.9 standard method to measure, test condition:
Pull speed is 50mm/min, and pulls a length of 20mm.
Dielectric constant (dielectric constant is called for short Dk) measures: use measurement instrument (factory
Board: Agilent；Model: HP4291), and use IPC-TM-650-2.5.5.9 standard side
Method measures, and measures under conditions of 1GHz and 10GHz.
Dielectric dissipation factor (dissipation factor is called for short Df) measures: use measurement instrument
(label: Agilent；Model: HP4291), and use IPC-TM-650-2.5.5.9 standard
Method measures, and measures under conditions of 1GHz and 10GHz.
From comparative example 8 experimental data of table 2, though in the letter of 1GHz and 10GHz
Under number transmission conditions, dielectric constant is positively retained at less than 3.0, but the Copper Foil that surface roughness is little
Adherence between substrate and low dielectric insulating layer is the best.
From embodiment 1 to 2 experimental data of table 1, the present invention is by this heat curing-type
Polyimide layer makes this copper clad laminate and this insulating barrier have good adherence (peel strength
More than 0.7Kg/cm), and by controlling thickness and this laminate of this heat curing-type polyimide layer
Thickness ratio and the dielectric constant range of heat curing-type polyimide layer and insulating barrier so that this copper
Foil substrate material is placed under the signal transmission conditions of 1GHz and 10GHz, and the dielectric of this laminate is normal
Number is positively retained at less than 3.0.
From the experimental data of comparative example 1 and 2, the film of this heat curing-type polyimide layer
The thickness ratio of thickness and this laminate is respectively 0.105 and 0.069, though this copper clad laminate material is put
Under the signal transmission conditions of 1GHz and 10GHz, the dielectric constant of this laminate is positively retained at
Less than 3.0, but this copper clad laminate is the best with the adherence of this insulating barrier, and (peel strength is respectively
0.62 and 0.60Kg/cm).
From the experimental data of comparative example 3,5 and 6, this heat curing-type polyimide layer
The thickness ratio of thickness and this laminate respectively 0.31,0.235 and 0.265.Though this copper
Foil substrate is good with the adherence of this insulating barrier, but this copper clad laminate material is placed in 1GHz and 10GHz
Signal transmission conditions under, the dielectric constant of its laminate, all more than 3.0, can produce higher
Parasitic capacitance effect, affects signal propagation delay and mutual signal in multi-layer conductive line and does
Disturbing effect (cross-talk) and then affect high-frequency transmission speed, another considers that point is owing to being situated between
Electrical loss causes the integrity of transmission signal.
From the experimental data of comparative example 4, the thickness of this heat curing-type polyimide layer with
The thickness ratio of this laminate is 0.1, though this copper clad laminate is good with the adherence of this insulating barrier,
But this copper clad laminate material is placed under the signal transmission conditions of 10GHz, the dielectric constant of this laminate
More than 3.0.
From the experimental data of comparative example 7, though the connecing of this copper clad laminate and this insulating barrier
The property is good, but because its copper clad laminate surface roughness is big so that this copper clad laminate material is placed in 10GHz
Signal transmission conditions under, the dielectric constant of this laminate be more than 3.0.
In sum, copper clad laminate material of the present invention makes this Copper Foil by this heat curing-type polyimide layer
Substrate and this insulating barrier have good adherence, and by controlling this heat curing-type polyimide layer
Thickness is normal with the dielectric of insulating barrier with the thickness ratio of this laminate and heat curing-type polyimide layer
Number scope so that this copper clad laminate material is placed under the signal transmission conditions of 1GHz to 10GHz,
The dielectric constant of this laminate is positively retained at less than 3.0, to meet industry and the market demand, and institute
So that the purpose of the present invention really can be reached.
Claims (9)
1. the copper clad laminate material for high frequency printed circuit board, it is characterised in that this use
Copper clad laminate material in high frequency printed circuit board comprises:
One range of surface roughness is the copper clad laminate of below 0.5 μm；And
One laminate, the heat curing-type polyamides being arranged on described copper clad laminate including a connection
Imine layer, and one connect be arranged on the insulating barrier on described heat curing-type polyimide layer；
Described heat curing-type polyimide layer is used to make described copper clad laminate and described insulating barrier
Link together, and the thickness of the thickness of described heat curing-type polyimide layer and described laminate
Ratio range is 0.145 to 0.2；The dielectric constant range of described heat curing-type polyimide layer is
More than 3.0；The dielectric constant range of described insulating barrier is less than 3.0.
Copper clad laminate material for high frequency printed circuit board the most according to claim 1,
It is characterized in that: the film thickness range of described heat curing-type polyimide layer is that 2.9 μm are to 4.4 μm.
Copper clad laminate material for high frequency printed circuit board the most according to claim 1,
It is characterized in that: the material of described heat curing-type polyimide layer is to be included tetracarboxylic dianhydride by one
The aggregated reaction of mixture of based compound and two amine compounds and imidization reaction institute shape
The heat curing-type polyimides become, wherein, with the total amount of described tetracarboxylic dianhydride's based compound for 1
Mole meter, the usage amount scope of described two amine compounds is that 1.0 moles are to 1.02 moles.
Copper clad laminate material for high frequency printed circuit board the most according to claim 1,
It is characterized in that: the material of described insulating barrier is selected certainly in liquid crystal type polymer, had fluorin radical
Polyimides, or their combination.
Copper clad laminate material for high frequency printed circuit board the most according to claim 1,
It is characterized in that: this copper clad laminate material being used for high frequency printed circuit board also comprises a connection and sets
Put the following layer on described insulating barrier.
Copper clad laminate material for high frequency printed circuit board the most according to claim 5,
It is characterized in that: the material of described following layer is to select from epoxy resin, thermoplastics type's polyamides
Imines, or their combination.
7. the compound laminate for high frequency printed circuit board, it is characterised in that this use
Compound laminate in high frequency printed circuit board comprises: being used for described in two claim 1 is high
Frequently the copper clad laminate material of printed circuit board (PCB), an and following layer；Described following layer is used to make institute
The insulating barrier stated in the copper clad laminate material of high frequency printed circuit board links together.
Compound laminate for high frequency printed circuit board the most according to claim 7,
It is characterized in that: the material of described following layer is to select from epoxy resin, thermoplastics type's polyamides
Imines, or these combinations.
9. the composite laminated body for high frequency printed circuit board, it is characterised in that this use
Composite laminated body in high frequency printed circuit board comprises: being used for described in two claim 1 is high
Frequently the copper clad laminate material of printed circuit board (PCB), and two connect respectively to be arranged on and described print for high frequency
Following layer on insulating barrier in the copper clad laminate material of printed circuit board；Described for high frequency printing electricity
Following layer in the copper clad laminate material of road plate is connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071715.0A CN105984180A (en) | 2015-02-11 | 2015-02-11 | Copper foil base plate for high frequency printed circuit board and use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510071715.0A CN105984180A (en) | 2015-02-11 | 2015-02-11 | Copper foil base plate for high frequency printed circuit board and use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105984180A true CN105984180A (en) | 2016-10-05 |
Family
ID=57041793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510071715.0A Pending CN105984180A (en) | 2015-02-11 | 2015-02-11 | Copper foil base plate for high frequency printed circuit board and use thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105984180A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110105757A (en) * | 2018-02-01 | 2019-08-09 | 东京应化工业株式会社 | Porous polyimide film base film, its manufacturing method and composition |
| CN111844976A (en) * | 2019-04-12 | 2020-10-30 | 江苏泛亚微透科技股份有限公司 | Polyimide-fluoropolymer insulating composite material, preparation method and application thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63224940A (en) * | 1987-03-15 | 1988-09-20 | 松下電工株式会社 | Printed wiring board material |
| JPS63224934A (en) * | 1987-03-14 | 1988-09-20 | 松下電工株式会社 | Laminated board |
| JP2004195776A (en) * | 2002-12-18 | 2004-07-15 | Asahi Glass Co Ltd | Laminated film for built-up wiring board and built-up wiring board |
| US20060115670A1 (en) * | 2002-12-13 | 2006-06-01 | Shigeru Tanaka | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same |
| TWI284093B (en) * | 1999-09-28 | 2007-07-21 | Ube Industries | Aromatic polyimide laminate |
| TW200830947A (en) * | 2006-10-10 | 2008-07-16 | Shinetsu Polymer Co | Noise-suppressing wiring-member and printed wiring board |
| CN201976342U (en) * | 2011-04-03 | 2011-09-14 | 广东生益科技股份有限公司 | Double-face flexibility copper clad laminate by two-layer method |
| CN102806723A (en) * | 2012-08-09 | 2012-12-05 | 广东生益科技股份有限公司 | Double-sided flexible copper clad laminate and manufacturing method thereof |
-
2015
- 2015-02-11 CN CN201510071715.0A patent/CN105984180A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63224934A (en) * | 1987-03-14 | 1988-09-20 | 松下電工株式会社 | Laminated board |
| JPS63224940A (en) * | 1987-03-15 | 1988-09-20 | 松下電工株式会社 | Printed wiring board material |
| TWI284093B (en) * | 1999-09-28 | 2007-07-21 | Ube Industries | Aromatic polyimide laminate |
| US20060115670A1 (en) * | 2002-12-13 | 2006-06-01 | Shigeru Tanaka | Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same |
| JP2004195776A (en) * | 2002-12-18 | 2004-07-15 | Asahi Glass Co Ltd | Laminated film for built-up wiring board and built-up wiring board |
| TW200830947A (en) * | 2006-10-10 | 2008-07-16 | Shinetsu Polymer Co | Noise-suppressing wiring-member and printed wiring board |
| CN201976342U (en) * | 2011-04-03 | 2011-09-14 | 广东生益科技股份有限公司 | Double-face flexibility copper clad laminate by two-layer method |
| CN102806723A (en) * | 2012-08-09 | 2012-12-05 | 广东生益科技股份有限公司 | Double-sided flexible copper clad laminate and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110105757A (en) * | 2018-02-01 | 2019-08-09 | 东京应化工业株式会社 | Porous polyimide film base film, its manufacturing method and composition |
| CN110105757B (en) * | 2018-02-01 | 2023-04-25 | 东京应化工业株式会社 | Porous polyimide film blank film, method for producing same, and composition |
| CN111844976A (en) * | 2019-04-12 | 2020-10-30 | 江苏泛亚微透科技股份有限公司 | Polyimide-fluoropolymer insulating composite material, preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5648630B2 (en) | Multilayer polyimide film | |
| JP4634439B2 (en) | Metal laminate and manufacturing method thereof | |
| US8993108B2 (en) | Multilayer polyimide film, laminate, and metal-clad laminate | |
| US20050100719A1 (en) | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto | |
| JP2022118015A (en) | Double-sided metal-clad laminate and circuit board | |
| KR101740803B1 (en) | Metal laminate with polyimide resin and method for manufaturing thereof | |
| JP2011514266A (en) | High adhesion polyimide copper clad laminate and method for producing the same | |
| WO2008004496A1 (en) | Thermoplastic polyimide, and laminated polyimide film and metal foil-laminated polyimide film using the thermoplastic polyimide | |
| TWI595024B (en) | Polyamic acid, copper clad laminate and circuit board | |
| JP2017165909A (en) | Polyimide, resin film, and metal clad laminate | |
| TW202305036A (en) | Polyimide and application thereof in metal laminated plate | |
| CN112521603A (en) | Polyamide acid block copolymer and preparation method thereof, polyimide copper-clad plate and circuit board | |
| KR20070059168A (en) | Adhesive sheet and copper-clad laminate | |
| JP5468913B2 (en) | Multilayer polyimide film with resist and method for producing the same | |
| JP2010115797A (en) | Multilayer polyimide film | |
| JP2007281361A (en) | Polyimide printed circuit board and polyimide printed wiring board | |
| CN105984180A (en) | Copper foil base plate for high frequency printed circuit board and use thereof | |
| KR20220143009A (en) | Flexible metal clad laminate with microstrip line structure | |
| CN104884245B (en) | Layer flexible clad laminate and its manufacture method | |
| KR101195719B1 (en) | Adhesive film, flexible metal-clad laminate of enhanced dimensional stability obtained therefrom and process for producing the same | |
| CN111484616B (en) | Polyimide composition, polyimide, flexible copper clad laminate and manufacturing method thereof | |
| TWI488552B (en) | Copper foil substrate for high frequency printed circuit board and its application | |
| JP2010208322A (en) | Polyimide metal laminate, and printed wiring board using the same | |
| TW202112901A (en) | Polylysine block copolymer and preparation method thereof, polyimide coated copper plate and circuit board thereof | |
| KR20160088844A (en) | Polyimide heat resistance adhesive having low dielectric constant and flexible laminated plate using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161005 |
|
| WD01 | Invention patent application deemed withdrawn after publication |