JP4119475B2 - 堅牢な基板内に絶縁部分を備えた構造の製造方法 - Google Patents
堅牢な基板内に絶縁部分を備えた構造の製造方法 Download PDFInfo
- Publication number
- JP4119475B2 JP4119475B2 JP2007206638A JP2007206638A JP4119475B2 JP 4119475 B2 JP4119475 B2 JP 4119475B2 JP 2007206638 A JP2007206638 A JP 2007206638A JP 2007206638 A JP2007206638 A JP 2007206638A JP 4119475 B2 JP4119475 B2 JP 4119475B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- notch
- insulating
- joint
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Structure Of Printed Boards (AREA)
Description
a)基板ウェハのカットの際に第1部分と第2部分とを連結しておくためのものであって保持部と称される少なくとも1つの部分を第1部分および第2部分内に形成するようにして、基板ウェハをカットし、
b)実質的に第1部分および第2部分の厚さ全体にわたって第1部分および第2部分の少なくとも一部を連結する絶縁性保持ジョイントによって、基板の第1部分および第2部分を連結している前記保持部を置換する。
12c 孔
14 第1部分
15 第2部分
22 側壁
28 絶縁性保持ジョイント
Claims (5)
- 構造を製造するための方法であって、
a)シリコンからなる基板ウェハ(10)に対して、側壁(22)によって互いに隔離された複数の隣接孔(12c)を孔開けし、これにより、前記ウェハ内に、第1部分(14)と、第2部分(16)と、前記第1部分と前記第2部分とを接続するよう機能する保持部と、を形成し、
b)厚さ方向の全体にわたって前記側壁(22)を酸化することにより、前記保持部を、絶縁性保持ジョイント(28,28a,28b)へと転換する、
ことを特徴とする方法。 - 請求項1記載の方法において、
前記複数の隣接孔(12c)を、前記ウェハを貫通したものとすることを特徴とする方法。 - 請求項1記載の方法において、
前記複数の隣接孔(12c)を、孔の底部を有したものとすることを特徴とする方法。 - 請求項3記載の方法において、
前記保持部を前記絶縁性保持ジョイントへと転換するに際しては、前記孔の底部を酸化することを特徴とする方法。 - 請求項1〜4のいずれか1項に記載の方法において、
前記酸化を、熱酸化によって行うことを特徴とする方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9612061A FR2754386B1 (fr) | 1996-10-03 | 1996-10-03 | Structure comprenant une partie isolee dans un substrat massif et procede de realisation d'une telle structure |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51628798A Division JP4044141B2 (ja) | 1996-10-03 | 1997-10-01 | 堅牢な基板内に絶縁部分を備えた構造の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007307706A JP2007307706A (ja) | 2007-11-29 |
JP4119475B2 true JP4119475B2 (ja) | 2008-07-16 |
Family
ID=9496328
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51628798A Expired - Lifetime JP4044141B2 (ja) | 1996-10-03 | 1997-10-01 | 堅牢な基板内に絶縁部分を備えた構造の製造方法 |
JP2007206638A Expired - Lifetime JP4119475B2 (ja) | 1996-10-03 | 2007-08-08 | 堅牢な基板内に絶縁部分を備えた構造の製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51628798A Expired - Lifetime JP4044141B2 (ja) | 1996-10-03 | 1997-10-01 | 堅牢な基板内に絶縁部分を備えた構造の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6833570B1 (ja) |
EP (1) | EP0864094B1 (ja) |
JP (2) | JP4044141B2 (ja) |
DE (1) | DE69721216T2 (ja) |
FR (1) | FR2754386B1 (ja) |
WO (1) | WO1998014787A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2830125B1 (fr) | 2001-09-24 | 2006-11-17 | Commissariat Energie Atomique | Procede de realisation d'une prise de contact en face arriere d'un composant a substrats empiles et composant equipe d'une telle prise de contact |
US20080139915A1 (en) * | 2006-12-07 | 2008-06-12 | Medtronic Vascular, Inc. | Vascular Position Locating and/or Mapping Apparatus and Methods |
DE102008055651A1 (de) | 2008-10-29 | 2010-05-06 | Siemens Aktiengesellschaft | Weichendiagnosesystem |
CN110568518B (zh) * | 2019-06-14 | 2021-03-19 | 中国科学院电子学研究所 | 单片集成敏感电极、制备方法及其应用 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3254276A (en) * | 1961-11-29 | 1966-05-31 | Philco Corp | Solid-state translating device with barrier-layers formed by thin metal and semiconductor material |
US3634787A (en) * | 1968-01-23 | 1972-01-11 | Westinghouse Electric Corp | Electromechanical tuning apparatus particularly for microelectronic components |
FR2252638B1 (ja) * | 1973-11-23 | 1978-08-04 | Commissariat Energie Atomique | |
DE3741036A1 (de) | 1987-12-03 | 1989-06-15 | Fraunhofer Ges Forschung | Mikromechanischer beschleunigungsmesser |
CN1027011C (zh) * | 1990-07-12 | 1994-12-14 | 涂相征 | 一种硅梁压阻加速度传感器及其制造方法 |
FR2700065B1 (fr) | 1992-12-28 | 1995-02-10 | Commissariat Energie Atomique | Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant. |
US5545594A (en) * | 1993-10-26 | 1996-08-13 | Yazaki Meter Co., Ltd. | Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented |
US5413955A (en) * | 1993-12-21 | 1995-05-09 | Delco Electronics Corporation | Method of bonding silicon wafers at temperatures below 500 degrees centigrade for sensor applications |
JPH07326663A (ja) * | 1994-05-31 | 1995-12-12 | Fuji Electric Co Ltd | ウエハの誘電体分離方法 |
US5581035A (en) * | 1994-08-29 | 1996-12-03 | The Charles Stark Draper Laboratory, Inc. | Micromechanical sensor with a guard band electrode |
JP3433871B2 (ja) * | 1996-01-26 | 2003-08-04 | 株式会社デンソー | 集積化半導体歪みセンサ及びその製造方法 |
-
1996
- 1996-10-03 FR FR9612061A patent/FR2754386B1/fr not_active Expired - Lifetime
-
1997
- 1997-10-01 US US09/068,999 patent/US6833570B1/en not_active Expired - Lifetime
- 1997-10-01 EP EP97943038A patent/EP0864094B1/fr not_active Expired - Lifetime
- 1997-10-01 DE DE69721216T patent/DE69721216T2/de not_active Expired - Lifetime
- 1997-10-01 WO PCT/FR1997/001734 patent/WO1998014787A1/fr active IP Right Grant
- 1997-10-01 JP JP51628798A patent/JP4044141B2/ja not_active Expired - Lifetime
-
2007
- 2007-08-08 JP JP2007206638A patent/JP4119475B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2000516544A (ja) | 2000-12-12 |
WO1998014787A1 (fr) | 1998-04-09 |
DE69721216D1 (de) | 2003-05-28 |
EP0864094B1 (fr) | 2003-04-23 |
EP0864094A1 (fr) | 1998-09-16 |
FR2754386B1 (fr) | 1998-10-30 |
DE69721216T2 (de) | 2004-02-19 |
FR2754386A1 (fr) | 1998-04-10 |
JP2007307706A (ja) | 2007-11-29 |
JP4044141B2 (ja) | 2008-02-06 |
US6833570B1 (en) | 2004-12-21 |
WO1998014787A8 (fr) | 1999-05-06 |
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