JP4118089B2 - Adhesive polyimide resin composition and film adhesive using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive polyimide resin composition having a specific structure useful in the field of semiconductors, and a film adhesive suitable for adhering a semiconductor element to a support comprising the resin composition.
[0002]
TECHNICAL BACKGROUND OF THE INVENTION
In recent years, a film-like adhesive called a die attach film has been used to bond a semiconductor element to a support. This film adhesive has superior controllability of thickness and protrusion compared to conventional paste adhesives, so it has a small mounting area (high density mounting) such as chip size package, stack package, and system in package. Is widely used.
[0003]
In these high-density packaging, the chip is becoming thinner, and the process of attaching a die attach film to a wafer with a thickness of 100 μm or less is performed with a surface protection tape applied during thinning to prevent wafer damage. Is done. However, the wafer surface protection layer (such as polyimide buffer coating film) and the surface protection tape during thinning are altered by heating during this bonding process, causing the wafer to warp, and storing and transporting the wafer into the cartridge. There was a problem with such as. Therefore, a die attach film that can be bonded at a lower temperature has been demanded.
[0004]
[Problems to be solved by the invention]
The present invention provides an adhesive polyimide resin composition excellent in low-temperature adhesiveness, heat resistance, and low hygroscopicity, and a film adhesive suitable for adhering a semiconductor element comprising the resin composition to a support. With the goal.
[0005]
[Means for Solving the Problems]
The present invention includes the contents described in the following (I) to (IV).
[0006]
(I) a tetracarboxylic acid dianhydride, obtained by reacting a diamine component containing diamines represented by the diamine and the following general formula represented by the following formula (1) (2) as an essential component Adhesive polyimide resin .
[Formula 4]
[0007]
[Chemical formula 5]
(In the formula (2), R 1 and R 6 are a divalent aliphatic group or aromatic group having 1 to 4 carbon atoms, R 2 to R 5 are a monovalent aliphatic group or aromatic group, and n is 0 to 20 Represents an integer.)
[0008]
(II) The adhesive polyimide resin according to (I), wherein the diamine of the formula (1) is a diamine represented by the following formula (3).
[Chemical 6]
[0009]
(III) The tetracarboxylic dianhydride is 4,4′-oxydiphthalic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4 ′. -Selected from the group consisting of benzophenone tetracarboxylic dianhydride, ethylene glycol bistrimellitic dianhydride, pyromellitic dianhydride, 3,3 ', 4,4'-diphenylsulfone tetracarboxylic dianhydride The adhesive polyimide resin according to any one of (I) to (II), which is one or more types of tetracarboxylic dianhydrides.
[0010]
(IV) A mol of tetracarboxylic dianhydride is used as an acid component, and b mol of diamine represented by formula (1), c mol of diamine represented by formula (2), and d mol of other diamine are amines. The molar ratio of a, b, c, d is 0.9 ≦ a / (b + c + d) ≦ 1.1 and 0.01 ≦ b / (b + c + d) ≦ 0.99, 0.01 ≦ c / The adhesive polyimide resin according to any one of (I) to (III), obtained by reacting both components at a ratio such that (b + c + d) ≦ 0.99.
[0011]
(V) The adhesive polyimide resin according to any one of (I) to (IV), wherein the adhesive polyimide resin is almost completely imidized.
(VI) A polyimide resin obtained by reacting a tetracarboxylic dianhydride with a diamine represented by the formula (1) and a diamine component containing the diamine represented by the general formula (2) as essential components. An adhesive polyimide resin composition to be contained.
( VII ) A film-like adhesive comprising the adhesive polyimide resin according to any one of (I) to ( V ) as a main component.
(VIII) A film adhesive using the adhesive polyimide resin composition described in (VI).
(IX) The film adhesive according to (VIII), wherein the adhesive polyimide resin is almost completely imidized.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a tetracarboxylic dianhydride is obtained by reacting the above formula (1) represented by the diamine and the general formula (2) a diamine containing diamines represented by the essential components in component adhesive The conductive polyimide resin will be described in detail.
[0013]
The bonding position of the aromatic diamine represented by the formula (1) to each aromatic ring is not particularly limited, but the glass transition temperature (Tg) of the synthesized polyimide can be lowered, and the low-temperature adhesiveness can be improved. The diamine represented by said Formula (3) is preferable at a point.
[0014]
In the silicone-based diamine represented by the general formula (2), R1 and R6 are divalent aliphatic groups having 1 to 4 carbon atoms or aromatic groups, specifically, aliphatic groups having 3 carbon atoms. group and _{-Bz-O- (CH 2) 4} - (Bz is a benzene ring) include structures. Among these, an aliphatic group having 3 carbon atoms is preferable because it is commercially available and is easily available.
[0015]
Since the diamine represented by the formula (1) has a long inter-amine distance as an aromatic diamine, it can reduce the imide group density and is effective in low hygroscopicity. In addition, low Tg is a necessary requirement for enabling low-temperature bonding, but the formula (3) is particularly effective for lowering the Tg of polyimide resin due to its flexible molecular structure.
[0016]
The silicone-based diamine represented by the formula (2) is also effective for lowering the Tg of the polyimide resin. In particular, n = 0 to 10 are preferable from the viewpoint of adhesiveness. Further, as the partial structure, those in which R 1 and R 6 are aromatic groups are more preferable from the viewpoint of heat resistance and reactivity, but even those having a commercially available aliphatic group structure having 3 carbon atoms can exhibit heat resistance. R2 to R5 are monovalent aliphatic groups or aromatic groups, and specific examples include a methyl group and a phenyl group. Among these, a phenyl group is preferable in terms of compatibility with an aromatic thermosetting resin, but a general methyl group is preferable because there is a problem that has recently been pointed out in relation to environmental hormones.
[0017]
The ratio of the silicone diamine in the diamine component containing the aromatic diamine and the silicone diamine is preferably 1 to 90 mol% in the total diamine. In particular, 20 to 90 mol% is more preferable in terms of emphasizing low-temperature adhesiveness. The ratio of the aromatic diamine is preferably 99 to 10 mol%.
[0018]
The polyimide resin composition of the present invention is obtained by reacting a mixture of the diamine with tetracarboxylic dianhydride. The tetracarboxylic dianhydride used in the present invention is not particularly limited, and examples thereof include pyromellitic dianhydride, 3,3 ′, 4,4′-diphenyltetracarboxylic dianhydride, 2 , 2 ′, 3,3′-diphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) Propane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, bis (2,3-di Carboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 3,4,9,10-perylenetetracarboxylic acid Two anhydrous Bis (3,4-dicarboxyphenyl) ether dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3 ′, 4′-benzophenonetetracarboxylic dianhydride 2,3,2 ′, 3-benzophenone tetracarboxylic dianhydride, 2,3,3 ′, 4′-benzophenone tetracarboxylic dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride Anhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalene-tetracarboxylic dianhydride, 1,4,5,8-naphthalene-tetracarboxylic acid Anhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2 , 3,6,7-Tetrachlornaphth Len-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, pyrazine-2,3,5,6-tetracarboxylic dianhydride Thiophene-2,3,4,5-tetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,4,3 ′, 4′-biphenyltetracarboxylic acid Dianhydride, 2,3,2 ′, 3′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) dimethylsilane dianhydride, bis (3,4-dicarboxyphenyl) methylphenyl Silane dianhydride, bis (3,4-dicarboxyphenyl) diphenylsilane dianhydride, 1,4-bis (3,4-dicarboxyphenyldimethylsilyl) benzene dianhydride, 1,3-bis (3, 4-zical Boxyphenyl) -1,1,3,3-tetramethyldicyclohexane dianhydride, p-phenylbis (trimellitic acid monoester anhydride), ethylenetetracarboxylic dianhydride, 1,2,3,4 Butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,6,7-hexahydronaphthalene-1 , 2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine-2,3,4,5-tetracarboxylic dianhydride, 1 , 2,3,4-cyclobutanetetracarboxylic dianhydride, bis (exo-bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride) sulfone, bicyclo- (2,2,2)- Oct ( ) -Ene 2,3,5,6-tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 2,2-bis [4- (3 4-Dicarboxyphenoxy) phenyl] hexafluoropropane dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 1,4-bis (2-hydroxyhexafluoroisopropyl) ) Benzenebis (trimellitic anhydride), 1,3-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic anhydride), 5- (2,5-dioxotetrahydrofuryl) -3-methyl -3-Cyclohexene-1,2-dicarboxylic anhydride, tetrahydrofuran-2,3,4,5-tetracarboxylic dianhydride, ethylene glycol Bis trimellitate dianhydride, and the like. These may be used alone or in combination of two or more.
[0019]
Among these, 4,4′-oxydiphthalic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride , Ethylene glycol bistrimellitate dianhydride, pyromellitic dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride Anhydrides are preferred.
[0020]
In particular, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride is effective for constructing a heat-resistant crosslinked structure, and desirably 10 to 100 mol% in the acid anhydride. Good. In order to enable low-temperature adhesion, it is necessary to make Tg sufficiently lower than the bonding temperature, and 4,4′-oxydiphthalic dianhydride, ethylene glycol bistrimellitic dianhydride and the like are excellent in this respect.
[0021]
In the present invention, in addition to the diamine, if necessary, other diamines may be added as long as the object of the present invention is not impaired.
Examples of other diamines include, but are not limited to, for example, 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5-diaminopentane, 1,6-diamino. Aliphatic diamines such as hexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane;
[0022]
o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenylmethane, 3,4 '-Diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenyldifluoromethane, 3,4'-diaminodiphenyldifluoromethane, 4,4'-diaminodiphenyldifluoromethane, 3,3'-diaminodiphenyl Sulfone, 3,4′-diaminodiphenylsulfone, 4,4′-diaminodiphenylsulfone, 3,3′-diaminodiphenylsulfide, 3,4′-diaminodiphenylsulfide, 4,4′-diaminodiphenylsulfone Fluid, 3,3'-diaminodiph Phenyl ketone, 3,4'-diaminodiphenyl ketone, 4,4'-diaminodiphenyl ketone, 2,2-bis (3-aminophenyl) propane, 2,2 '-(3,4'-diaminodiphenyl) propane, 2 , 2-bis (4-aminophenyl) propane, 2,2-bis (3-aminophenyl) hexafluoropropane, 2,2- (3,4'-diaminodiphenyl) hexafluoropropane, 2,2-bis ( 4-aminophenyl) hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 3, 3 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 3,4 ′-(1,4-phenylenebis (1-methylethylidene) ) Bisaniline, 4,4 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 2,2-bis (4- (3-aminophenoxy) phenyl) propane, 2,2-bis (4- (4-aminophenoxy) phenyl) propane, 2,2-bis (4- (3-aminophenoxy) phenyl) hexafluoropropane, 2,2-bis (4- (4-aminophenoxy) phenyl) hexafluoropropane, bis (4- (3-aminophenoxy) phenyl) sulfide, bis (4- (4-aminophenoxy) phenyl) sulfide, bis (4- (3-aminophenoxy) phenyl) sulfone, bis (4- (4-aminophenoxy) ) Phenyl) sulfone, 3,3′-dimethoxy-4,4′-diaminobiphenyl, 4,4′-methylene-bis (2,6- Diethylaniline), o-tolidine sulfone, 1,4-bis (4-aminophenoxy) benzene, 4,4-methylene-bis (2,6-diisopropylaniline), 4,4′-bis (4-aminophenoxy) Examples thereof include aromatic diamines such as biphenyl and 1,1-bis (4- (4-aminophenoxy) phenyl) cyclohexane.
[0023]
The equivalent ratio of the acid component to the amine component in the polycondensation reaction is an important factor that determines the molecular weight of the resulting polyamic acid. It is well known that there is a correlation between the molecular weight and physical properties of polymers, especially the number average molecular weight and mechanical properties. The higher the number average molecular weight, the better the mechanical properties. Therefore, in order to obtain a practically excellent strength, it is necessary to have a certain high molecular weight. In the present invention, a mole of tetracarboxylic dianhydride is used as an acid component, b mole of diamine represented by formula (1), c mole of diamine represented by formula (2), and d mole of other diamine. As the amine component, the molar ratio of a, b, c, d is in the range of 0.9 ≦ a / (b + c + d) ≦ 1.1, more preferably 0.975 ≦ a / (b + c + d) ≦ 1.06. (A / (b + c + d) is sometimes referred to as an equivalent ratio). If the equivalence ratio is less than 0.9, the molecular weight tends to be low and brittle, so the adhesive strength may be weakened. On the other hand, if the equivalent ratio exceeds 1.1, unreacted carboxylic acid tends to be decarboxylated during heating to generate gas, which may cause foaming and may be unfavorable.
[0024]
In addition, the diamine component has a molar ratio of b, c, d, where b mole is the diamine represented by formula (1), c mole is the diamine represented by formula (2), and d mole is the other diamine. However, it is preferable to make it react by the ratio which becomes 0.01 <= b / (b + c + d) <= 0.99 and 0.01 <= c / (b + c + d) <= 0.99.
[0025]
Reaction of tetracarboxylic dianhydride and diamine is performed by a well-known method in an aprotic polar solvent. Examples of aprotic polar solvents include N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAC), N-methyl-2-pyrrolidone (NMP), tetrahydrofuran (THF), diglyme, triglyme, cyclohexanone, 1,4-dioxane and the like. Only one type of aprotic polar solvent may be used, or two or more types may be used as a mixture.
[0026]
At this time, a nonpolar solvent compatible with the aprotic polar solvent may be mixed and used. As the nonpolar solvent, aromatic hydrocarbons such as toluene, xylene and solvent naphtha are often used. The ratio of the nonpolar solvent in the mixed solvent is preferably 30% by mass or less. This is because when the nonpolar solvent exceeds 30% by weight, the dissolving power of the solvent is lowered and polyamic acid may be precipitated. The reaction between the tetracarboxylic dianhydride and the diamine is performed by dissolving the well-dried diamine component in the reaction solvent obtained by dehydration and purification, and then adding the well-dried tetracarboxylic acid dihydrate having a ring closure rate of 98%, more preferably 99% or more. Add anhydride to drive reaction.
[0027]
The cast reaction of the polyamic acid varnish obtained by advancing the reaction can be performed using an apparatus in which a coating equipment such as a flow coater or a roll coater and a hot air drying furnace are combined. After the polyamic acid varnish is coated on the support, it is led to a hot air drying furnace to evaporate the solvent of the varnish, and is dried at a temperature and an air volume sufficient to advance imidization. When it is used as a single film, it is peeled off from the support, and when the support is used as a single body, it is used while attached to one or both sides of the support. The method of using the film adhesive of the present invention is not particularly limited, but it is roll-bonded to the back surface of the heated semiconductor wafer, and a chip with an adhesive is obtained through a dicing process, which is used as a chip support (lead frame, rigid). In the case of laminating a substrate, a flexible substrate, and a chip, it can be used as a film-like adhesive such as bonding to a chip or a spacer.
[0028]
The film adhesive of the present invention is characterized in that a main component is an almost completely imidized polyimide resin having a specific structure.
Moreover, it is excellent in low temperature adhesiveness, low water absorption and heat resistance. By processing it into a film, it is possible to improve the bonding workability and the dimensional accuracy of the bonded portion. EXAMPLES Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.
[0029]
【Example】
(Synthesis Example 1)
In a 300 ml four-necked flask equipped with a thermometer and a stirrer, 10.86 g of APB5 (diamine of formula (3)), silicone-based diamine (α, ω-bis (3-aminopropyl) polydimethylsiloxane (APPS) , 30.97 g of average molecular weight 906), 84 g of N-methyl-2-pyrrolidone (NMP) and 56 g of tetrahydrofuran (THF) were taken and heated with warm water and stirred under a nitrogen flow to dissolve the diamine. While cooling the flask in an ice bath, 18.17 g of 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride (BTDA) was added in small portions. Reaction was performed at ice water temperature for 4 hours to obtain a polyamic acid varnish.
[0030]
(Synthesis Example 2)
A polyamic acid varnish was obtained in the same manner as in Synthesis Example 1 except that the formulation was changed to the formulation shown in Table 1.
The numbers of acid anhydrides and diamines in Table 1 represent the molar ratio of each. BTDA represents 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, and APB represents 1,3-bis (3-aminophenoxy) benzene.
[0031]
[Table 1]
[0032]
The polyamic acid varnish thus obtained was applied onto a Kapton film coated with Teflon (registered trademark) so as to have a dry film thickness of 25 μm, and heated at 80 ° C. for 10 minutes and then at 180 ° C. for 15 minutes. It dried and obtained the film adhesive. The film adhesive could be easily peeled off from the Teflon (registered trademark) coated Kapton film and handled as a single layer film. The physical properties of this film were measured, and the film obtained in Synthesis Example 1 was designated as Example 1, and the film obtained in Synthesis Example 2 was designated as Comparative Example 1.
[0033]
The adhesive strength of the obtained film adhesive was tested. The film adhesive was cut into a size of 5 × 5 mm, and this was adhered to a mirror surface of a 5 × 5 mm silicon chip at 110 ° C. so as not to entrain air, and heated at 180 ° C. for 1 minute. A chip with an adhesive was placed on a silicon mirror surface, applied with a load of 10 kg, and subjected to pressure bonding at 200 ° C. for 30 seconds, and then heated at 180 ° C. for 3 hours with no load to obtain a shear test piece. The shear adhesive force was measured using a push-pull gauge at room temperature and when heated at 260 ° C. for 30 seconds. The results are shown in Table 2.
[0034]
In addition, 25 film-like adhesives (25 μm thick) are stacked on a 50 mm × 50 mm × 0.5 mm frame, pressed with a 6 cm diameter cylinder press at 20-40 kgf / cm ² and 100 ° C., 50 mm A test piece of × 50 mm × 0.5 mm was prepared. After drying this test piece at 125 ° C. for 5 hours, the dry weight was measured, moisture was absorbed for one week at 85 ° C. and 85% RH, and immediately after taking out from the thermostatic chamber, the sample was poured into distilled water and cooled. The moisture absorption was measured by wiping and measuring the moisture absorption weight. The results are shown in Table 2.
Moreover, the glass transition temperature (Tg) of the film adhesive was measured using a TMA apparatus. The results are summarized in Table 2.
[0035]
[Table 2]
[0036]
In addition, a film adhesive was thermocompression bonded to a polyimide film having a thickness of 50 μm at 130 ° C., and this was cut into 5 mm strips, which were bonded to a silicon mirror surface under various bonding conditions, and a 90 ° peel strength (kgf / cm ) Was measured. The results of adhesion conditions and peel strength are summarized in Table 3.
[0037]
[Table 3]
[0038]
Compared to the prescription using the known APB from the above examples, the film adhesive using the polyimide resin composition of the present invention is more excellent in low-temperature adhesiveness (peel strength) and low hygroscopicity (moisture absorption), It was shown that heat resistance (260 ° C shear strength) was also maintained.
[0039]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the film adhesive which has low temperature adhesiveness, low hygroscopicity, heat resistance, and adhesive workability | operativity can be provided. This is very useful industrially as a microelectronic material and a semiconductor packaging material.

Claims (9)

A tetracarboxylic acid dianhydride, adhesive polyimide obtained by reacting a diamine component containing diamines represented by the diamine and the following general formula represented by the following formula (1) (2) as an essential component Resin .
(In Formula (2), R1 and R6 are divalent C1-C4 aliphatic groups or aromatic groups, R2-R5 are monovalent aliphatic groups or aromatic groups, and n is 0-20. Represents an integer.) The adhesive polyimide resin according to claim 1, wherein the diamine of the formula (1) is a diamine represented by the following formula (3).
The tetracarboxylic dianhydride is 4,4′-oxydiphthalic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenone tetra One or more selected from the group consisting of carboxylic dianhydride, ethylene glycol bistrimellitic dianhydride, pyromellitic dianhydride, 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride The adhesive polyimide resin according to claim 1, which is a tetracarboxylic dianhydride. Tetracarboxylic dianhydride a mol as an acid component, diamine b mol represented by formula (1), diamine c mol represented by formula (2), and other diamine d mol as amine components, The molar ratio of a, b, c, d is 0.9 ≦ a / (b + c + d) ≦ 1.1, 0.01 ≦ b / (b + c + d) ≦ 0.99, 0.01 ≦ c / (b + c + d) The adhesive polyimide resin according to any one of claims 1 to 3, obtained by reacting both components at a ratio such that ≤0.99. The adhesive polyimide resin according to claim 1, wherein the adhesive polyimide resin is almost completely imidized. Adhesion containing a polyimide resin obtained by reacting tetracarboxylic dianhydride with a diamine represented by the following formula (1) and a diamine component containing the diamine represented by the following general formula (2) as essential components Conductive polyimide resin composition.
(In Formula (2), R1 and R6 are divalent C1-C4 aliphatic groups or aromatic groups, R2-R5 are monovalent aliphatic groups or aromatic groups, and n is 0-20. Represents an integer.) The film adhesive which uses the adhesive polyimide resin in any one of Claims 1-5 as a main component. A film adhesive using the adhesive polyimide resin composition according to claim 6. The film adhesive according to claim 8, wherein the adhesive polyimide resin is almost completely imidized.