JP4111596B2 - Flexible metal laminate - Google Patents
Flexible metal laminate Download PDFInfo
- Publication number
- JP4111596B2 JP4111596B2 JP22735298A JP22735298A JP4111596B2 JP 4111596 B2 JP4111596 B2 JP 4111596B2 JP 22735298 A JP22735298 A JP 22735298A JP 22735298 A JP22735298 A JP 22735298A JP 4111596 B2 JP4111596 B2 JP 4111596B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- thermal expansion
- thickness
- expansion coefficient
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【０００１】
【発明の属する技術分野】
本発明は、電子工業分野において普及しつつある金属箔積層板の内、金属と金属とを接着シートを用いて加熱圧着してなるフレキシブル金属積層板に関する。
【０００２】
【従来の技術】
プリント基板等に用いられるフレキシブル金属積層板において、金属部分と高分子材料からなる絶縁層では熱膨張係数が著しく異なる。
【０００３】
ところが、この様な金属積層板を配線等の加工時に問題とされる、寸法安定性について金属と絶縁層の熱膨張係数の差に比例して、０から外れていくという問題があった。
【０００４】
【発明が解決しようとする課題】
本発明の目的は、上記した問題点を解決して、寸法安定性に優れたフレキシブル金属積層板を提供することにある。
【０００５】
【課題を解決するための手段】
本発明者らは鋭意検討した結果、絶縁層を形成する接着シートのベースフィルムと接着剤層の熱膨張係数と厚みの制御により、絶縁層の熱膨張係数が金属の熱膨張係数と等しくなることを見出し、本発明を完成した。すなわち、本発明は金属積層板の温度変化に対し、各層の熱膨張係数をそろえることにより寸法安定性が向上する金属積層板を提供するものであって、金属と金属の間の絶縁層として、被接着体である金属より熱膨張係数の小さい非熱可塑性ポリイミド樹脂からなるベースフィルムを用い、該ベースフィルムの両側に被接着体である金属より熱膨張係数の大きい熱可塑性ポリイミド樹脂からなる接着層を、接着シート全体の熱膨張係数が被接着体である金属と同じになるような厚さに制御され形成された接着シートを用いることを特徴とする。
【０００６】
本発明によれば、製品全体の熱膨張係数も、各層を構成する材質の熱膨張係数も等しい金属積層板が得られるので、例えばプリント配線板、ＴＡＢ基材等の何らかのパターンが金属層に形成された加工品に用いれば、接着層が本来有する接着特性を損なうことなく優れた寸法安定性を発現する。
【０００７】
【発明の実施の形態】
以下に本発明を詳しく説明する。本発明にいう金属積層板は絶縁層に接着シートを有することが基本となり、その両側に接着される金属は熱膨張係数が同じであれば材質は問わず、これは多層積層板を形成する場合でも同様である。該金属箔層の種類として、銅、鉄、ニッケル、クロム、モリブデン、アルミニウムおよびこれらを主体とする合金から成る金属箔等がある。特に合金としてはステンレス鋼、ベリリウム銅合金、銅ニッケル合金等が代表的である。
【０００８】
接着シートに用いられる、ベースフィルムとしては市販されている非熱可塑性樹脂フィルムを使用しても、流延法、射出法、延伸法等で形成したものを使用しても良い。但し、ベースフィルムの選定は被接着体の金属の種類に依存する。ベースフィルムとして用いられる非熱可塑性樹脂としてはポリイミドである。
【０００９】
更に具体的には非熱可塑性宇部興産社製ポリイミドフィルムＵｐｉｌｅｘシリーズ、鐘ヶ淵化学社製ポリイミドフィルムＡｐｉｃａｌシリーズ、デュポン社製ポリイミドフィルムＫａｐｔｏｎシリーズ等があげられる。
【００１０】
接着シートの熱膨張係数の制御としては、基本的には、使用する金属の熱膨張係数より低い熱膨張係数のベースフィルムを選定した後、ベースフィルムと接着層を形成する熱可塑性ポリイミドの熱膨張係数を以下の経験式を用いて、接着層の厚みを概算する。
【００１１】
金属の熱膨張係数＝接着シートの熱膨張係数＝（ベースフィルムの熱膨張係数×ベースフィルム厚み＋接着剤熱膨張係数×接着剤層総厚み）／接着シート総厚みここで、ベースフィルムの両側に形成される接着剤層としては、同一のものでも、異なる物を用いても良い。
【００１２】
このように概算された接着層厚みからなる接着シートを作成した後、熱膨張係数を実測して、接着層厚みを実際に金属と同じになるように厚みを再度調整し制御する。ここで言う金属と同じ熱膨張係数とは、金属の熱膨張係数に対して接着シートの熱膨張係数が±５ppm 以下の範囲であれば、本発明の目的は十分に達成されるが、望ましくは±２ppm 以下である。
【００１３】
接着剤層として使用される熱可塑性樹脂は、ポリイミドである。好ましくは、接着剤層としては１０μm以下の厚みで各種金属及び金属箔と良好な接着力を得る為に、熱可塑性ポリイミドが用いられる。金属との接着はプレス、ラミネーター等による加熱圧着で行われる。
【００１４】
【実施例】
以下の実施例および比較例によって本発明を更に詳細に説明する。
実施例１
ベースフィルムにポリイミドフィルム鐘淵化学工業製アピカルNPI （厚み12.5μｍ）を用い、その両側に熱可塑性ポリイミド三井化学製, ＰＩ−Ａ（厚み２μ）形成してなるオールポリイミド接着シートとＯＬＩＮ製圧延銅箔Ｃ7025（厚み18μｍ）、新日鉄製ステンレス箔SUS304H-TA（厚み20μｍ）を接着シートの両側に積層し、ホットプレスを用いて加熱圧着した。このようにして得られた接着シート熱膨張係数は22ｐｐｍ、金属積層板の寸法安定性は-0.04 ％であった。
【００１５】
比較例１
ベースフィルムにポリイミドフィルム鐘淵化学工業製アピカルNPI （厚み12.5μｍ）を用い、その両側に熱可塑性ポリイミド三井化学製, ＰＩ−Ａ（厚み10μ）形成してなるオールポリイミド接着シートとＯＬＩＮ製圧延銅箔Ｃ7025（厚み18μｍ）、新日鉄製ステンレス箔SUS304H-TA（厚み20μｍ）を接着シートの両側に積層し、ホットプレスを用いて加熱圧着した。このようにして得られた接着シートの熱膨張係数は40ppm 、金属積層板の寸法安定性は-0.15 ％であった。
【００１６】
実施例２
ベースフィルムにポリイミドフィルムデュポン製, Ｋａｐｔｏｎ−ＥＮＺＴ（厚み５０μｍ）を用い、その両側に熱可塑性ポリイミド三井化学製ＰＩ−ＡＵ（厚み４μ）形成してなるオールポリイミド接着シートと、その両側にジャパンエナジー製圧延銅箔BHY-02B-T （厚み 18 μｍ）。このようにして得られた接着シートの熱膨張係数は18ppm 、金属積層板の寸法安定性は-0.02 ％であった。
【００１７】
比較例２
ベースフィルムにポリイミドフィルムデュポン製, Ｋａｐｔｏｎ−ＥＮＺＴ（厚み５０μｍ）を用い、その両側に熱可塑性ポリイミド三井化学製ＰＩ−ＡＵ（厚み10μ）形成してなるオールポリイミド接着シートと、その両側にジャパンエナジー製圧延銅箔BHY-02B-T （厚み 18 μｍ）。このようにして得られた接着シートの熱膨張係数は27ｐｐｍ、金属積層板の寸法安定性は-0.12 ％であった。
【００１８】
実施例３
ベースフィルムにポリイミドフィルムデュポン製, Ｋａｐｔｏｎ−ＥＮＺＴ（厚み５０μｍ）を用い、その両側に熱可塑性ポリイミド三井化学製ＰＩ−ＡＵ（厚み４μ）形成してなるオールポリイミド接着シートと、その両側にジャパンエナジー製圧延銅箔BHY-02B-T （厚み12μｍ）このようにして得られた接着シートの熱膨張係数は18ppm 、金属積層板の寸法安定性は-0.01 ％であった。
【００１９】
【発明の効果】
以上説明したように、本発明によれば、非常に簡易な方法で寸法安定性に優れた金属積層板を製造することができる。このことにより、これまで課題とされてきた熱膨張係数が低減された新規接着剤の開発を行う必要はなく、すなわち材料開発のコストを削減することができる。さらに、多種多様な金属箔に対し、ベースフィルムと接着剤の熱膨張係数と厚みだけで寸法安定性が制御された金属箔積層板を製造することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention, among the metal foil laminate is spreading in the electronic industry, relates to a flexible metal laminate formed by heat bonding using an adhesive sheet and a metal and a metal.
[0002]
[Prior art]
In a flexible metal laminate used for a printed circuit board or the like, the thermal expansion coefficient is significantly different between an insulating layer made of a metal portion and a polymer material.
[0003]
However, there has been a problem that the dimensional stability deviates from 0 in proportion to the difference between the thermal expansion coefficients of the metal and the insulating layer, which is a problem when processing such a metal laminate plate.
[0004]
[Problems to be solved by the invention]
An object of the present invention is to solve the above-described problems and provide a flexible metal laminate having excellent dimensional stability.
[0005]
[Means for Solving the Problems]
As a result of intensive studies, the inventors have found that the thermal expansion coefficient of the insulating layer becomes equal to the thermal expansion coefficient of the metal by controlling the thermal expansion coefficient and thickness of the base film and adhesive layer of the adhesive sheet forming the insulating layer. The present invention has been completed. That is, the present invention provides a metal laminate that improves the dimensional stability by aligning the thermal expansion coefficient of each layer with respect to the temperature change of the metal laminate, and as an insulating layer between metals, using a base film made of small non-thermoplastic polyimide resin having thermal expansion coefficient than the metal is an adherend, the adhesive layer made of large thermoplastic polyimide resin of the thermal expansion coefficient of metal is adherend to the opposite sides of the base film The adhesive sheet is formed by controlling the thickness so that the thermal expansion coefficient of the entire adhesive sheet is the same as that of the metal as the adherend.
[0006]
According to the present invention, a metal laminated board having the same thermal expansion coefficient as the entire product and the thermal expansion coefficient of the material constituting each layer can be obtained, so that some pattern such as a printed wiring board or TAB substrate is formed on the metal layer. When used in a processed product, excellent dimensional stability is exhibited without impairing the inherent adhesive properties of the adhesive layer.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is described in detail below. The metal laminate referred to in the present invention basically has an adhesive sheet on the insulating layer, and the metal bonded to both sides thereof is not limited to any material as long as it has the same thermal expansion coefficient. But the same is true. Examples of the metal foil layer include copper, iron, nickel, chromium, molybdenum, aluminum, and a metal foil made of an alloy mainly composed of these. In particular, typical alloys include stainless steel, beryllium copper alloy, copper nickel alloy, and the like.
[0008]
As a base film used for the adhesive sheet, a commercially available non-thermoplastic resin film may be used, or a film formed by a casting method, an injection method, a stretching method, or the like may be used. However, the selection of the base film depends on the metal type of the adherend. The non-thermoplastic resin used as the base film is polyimide.
[0009]
More specifically, non-thermoplastic polyimide film Upilex series manufactured by Ube Industries, Ltd., polyimide film Apical series manufactured by Kanegafuchi Chemical Co., Ltd., and polyimide film Kapton series manufactured by DuPont.
[0010]
For controlling the thermal expansion coefficient of the adhesive sheet, basically, after selecting a base film with a thermal expansion coefficient lower than that of the metal used, the thermal expansion of the thermoplastic polyimide that forms the adhesive layer with the base film The thickness of the adhesive layer is estimated using the following empirical formula.
[0011]
Metal thermal expansion coefficient = Adhesive sheet thermal expansion coefficient = (Base film thermal expansion coefficient × Base film thickness + Adhesive thermal expansion coefficient × Adhesive layer total thickness) / Adhesive sheet total thickness Here, on both sides of the base film As the adhesive layer to be formed, the same or different ones may be used.
[0012]
After preparing the adhesive sheet having the estimated adhesive layer thickness in this way, the thermal expansion coefficient is measured, and the thickness is adjusted again and controlled so that the adhesive layer thickness is actually the same as that of the metal. The same thermal expansion coefficient as that of the metal here means that the object of the present invention can be sufficiently achieved if the thermal expansion coefficient of the adhesive sheet is within ± 5 ppm or less with respect to the thermal expansion coefficient of the metal. ± 2ppm or less.
[0013]
Thermoplastic resins used as an adhesive layer is polyimide. Preferably, a thermoplastic polyimide is used as the adhesive layer in order to obtain a good adhesive force with various metals and metal foils with a thickness of 10 μm or less. Adhesion with metal is performed by thermocompression bonding using a press, a laminator or the like.
[0014]
【Example】
The following examples and comparative examples further illustrate the present invention.
Example 1
Polyimide film Kaneka Chemical Industry's Apical NPI (thickness 12.5μm) as the base film, thermoplastic polyimide Mitsui Chemicals, PI-A (thickness 2μ) formed on both sides, all-polyimide adhesive sheet and OLIN rolled copper Foil C7025 (thickness 18 μm) and Nippon Steel stainless steel foil SUS304H-TA (thickness 20 μm) were laminated on both sides of the adhesive sheet, and hot-pressed using a hot press. The adhesive sheet thus obtained had a thermal expansion coefficient of 22 ppm, and the dimensional stability of the metal laminate was -0.04%.
[0015]
Comparative Example 1
Polyimide film Kaneka chemical industry apical NPI (thickness 12.5μm) as the base film, thermoplastic polyimide Mitsui Chemicals, PI-A (thickness 10μ) formed on both sides, all polyimide adhesive sheet and OLIN rolled copper Foil C7025 (thickness 18 μm) and Nippon Steel stainless steel foil SUS304H-TA (thickness 20 μm) were laminated on both sides of the adhesive sheet, and hot-pressed using a hot press. The adhesive sheet thus obtained had a coefficient of thermal expansion of 40 ppm and the metal laminate had a dimensional stability of -0.15%.
[0016]
Example 2
Polyimide film made by DuPont as base film, Kapton-ENZT (thickness 50μm), thermoplastic polyimide Mitsui Chemicals PI-AU (thickness 4μ) formed on both sides, and both sides made by Japan Energy Rolled copper foil BHY-02B-T (thickness 18 μm). The adhesive sheet thus obtained had a coefficient of thermal expansion of 18 ppm and the metal laminate had a dimensional stability of -0.02%.
[0017]
Comparative Example 2
Polyimide film made by DuPont as base film, Kapton-ENZT (thickness 50μm), thermoplastic polyimide Mitsui Chemicals PI-AU (thickness 10μ) formed on both sides, and both sides made by Japan Energy Rolled copper foil BHY-02B-T (thickness 18 μm). The adhesive sheet thus obtained had a coefficient of thermal expansion of 27 ppm and the metal laminate had a dimensional stability of -0.12%.
[0018]
Example 3
Polyimide film made by DuPont as base film, Kapton-ENZT (thickness 50μm), thermoplastic polyimide Mitsui Chemicals PI-AU (thickness 4μ) formed on both sides, and both sides made by Japan Energy Rolled copper foil BHY-02B-T (thickness: 12 μm) The thermal expansion coefficient of the adhesive sheet thus obtained was 18 ppm, and the dimensional stability of the metal laminate was -0.01%.
[0019]
【The invention's effect】
As described above, according to the present invention, it is possible to produce a metal laminate having excellent dimensional stability in a very simple way. Thus, it is not necessary to develop a new adhesive having a reduced thermal expansion coefficient, which has been regarded as a problem so far, that is, the cost of material development can be reduced. Furthermore, it is possible to manufacture a metal foil laminate in which the dimensional stability is controlled only by the thermal expansion coefficient and thickness of the base film and the adhesive for a wide variety of metal foils.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22735298A JP4111596B2 (en) | 1998-08-11 | 1998-08-11 | Flexible metal laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22735298A JP4111596B2 (en) | 1998-08-11 | 1998-08-11 | Flexible metal laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000052480A JP2000052480A (en) | 2000-02-22 |
| JP4111596B2 true JP4111596B2 (en) | 2008-07-02 |
Family
ID=16859462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22735298A Expired - Fee Related JP4111596B2 (en) | 1998-08-11 | 1998-08-11 | Flexible metal laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4111596B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6452282B1 (en) * | 2001-05-17 | 2002-09-17 | Saehan Micronics Incorporation | Insulating adhesive tape for a semiconductor chip package having a copper lead frame |
| KR20090068256A (en) * | 2006-09-15 | 2009-06-25 | 미쓰이 긴조꾸 고교 가부시키가이샤 | Metal composite laminate for manufacturing flexible wiring board and flexible wiring board |
-
1998
- 1998-08-11 JP JP22735298A patent/JP4111596B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000052480A (en) | 2000-02-22 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| LAPS | Cancellation because of no payment of annual fees |