JP4110459B2 - Substrate connecting tape and substrate etching method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for etching a substrate used for a printed circuit board, a lead frame or the like, and more particularly to a method capable of uniformly etching the upper surface side of a plurality of substrates conveyed by a conveying means and a substrate connecting tape used therefor. .
[0002]
[Prior art]
As a method for etching a large number of printed circuit boards continuously and efficiently, for example, a printed circuit board is transported horizontally by transport means such as a roller conveyor, and an etching solution is sprayed on the surface with a group of spray tubes arranged in parallel. It has been adopted. When etching one side of the printed circuit board, an etching solution spray tube group is arranged either above or below the printed circuit board being conveyed. Further, when both surfaces are etched at the same time, a group of spray tubes are arranged both above and below.
[0003]
In such an etching method, the etchant sprayed from each nozzle of the spray tube group above the horizontally conveyed printed circuit board flows on the upper surface of the printed circuit board and flows downward from the peripheral portion. Since the central portion of the upper surface of the printed board is more likely to retain the etchant than the peripheral portion, the sprayed etchant hardly acts on the reaction surface. Therefore, the etching rate in the central part of the printed circuit board is lower than that in the peripheral part, making it difficult to perform uniform etching, which is a major cause of hindering the fineness of the printed circuit board.
[0004]
To solve this problem, the contact pressure of the etchant that collides with the printed circuit board is not made uniform, but the pressure of the etchant that collides with the intermediate part is higher than the peripheral part perpendicular to the transport direction. There is known a method for facilitating the flow of an etching solution from an intermediate portion to a peripheral portion of a printed board. As an example of an apparatus for realizing this, the nozzle lengths of the sprays arranged in the direction perpendicular to the conveyance direction of the printed circuit board are configured so that the middle portion is larger than the both end sides of the row. A method is known in which the nozzle is brought closer to the upper surface of the printed circuit board, and the contact pressure of the etching solution colliding with the intermediate part of the printed circuit board is made higher than that in the peripheral area.
[0005]
However, the non-uniform etching phenomenon in the direction perpendicular to the direction of conveyance of the printed circuit board can be controlled only by increasing the contact pressure of the etching solution colliding with the intermediate part in the direction perpendicular to the printed circuit board conveyance method. Although it is possible, the etching phenomenon that is not uniform in the conveyance direction of the printed circuit board is not solved.
[0006]
In order to solve this problem, Japanese Patent No. 3108750 proposes that both edges in the transport direction are more easily etched than the center. In this method, the spray amount of the spray pipe in the transport direction is changed in synchronization with the transport of the printed circuit board, and the spray pressure at the central portion of the printed circuit board is always controlled to be larger than both ends in the transport direction. However, such control has the disadvantages that the apparatus becomes complicated and that it is liable to cause a failure.
[0007]
Further, Japanese Patent Application No. 2001-019596 proposes an etching method in which the edges of the substrates are connected with a strip-shaped substrate connecting tape to perform etching and resist removal. According to this method, the etching solution on the upper surface of the printed circuit board flows down only in a direction perpendicular to the transport direction, so that an uneven etching phenomenon in the transport direction can be clearly suppressed, but is sufficient to withstand the tensile stress during transport. A substrate connecting tape having a sufficient strength was required. In order to solve this problem, the present inventor proposed a substrate connecting tape in Japanese Patent Application Nos. 2002-156023 and 2002-162416. However, the etching transport distance is long, and there are many contact portions between the transport roll and the substrate. If this happens, the tensile stress during transportation will become very large. In Elongation and cutting occurred, resulting in problems such as contamination of the transport roll and substrate jamming.
[0008]
[Problems to be solved by the invention]
The present invention provides a substrate connecting tape having a strength that does not cause separation of a substrate in an etching portion when etching while connecting and transporting a plurality of substrates, and etching in the transport direction on the upper surface side of the plurality of substrates. The problem is to eliminate the non-uniform phenomenon.
[0009]
[Means for Solving the Problems]
The substrate connecting tape of the present invention that solves the above-described problems includes at least (A) a layer that is dissolved in an etching solution, (B) a layer that is at least dissolved in a resist removing solution and has etching resistance, and (C) At least a layer that dissolves in the resist removal solution and has adhesiveness is laminated.
[0010]
Hereinafter, (A) the layer dissolved in the etching solution is abbreviated as “(A) etching dissolved layer”. (A) The etching dissolution layer has a very high tensile strength and is unlikely to be stretched or cut, and plays a role of reliably connecting the substrate from the connection of the substrate to the middle of the etching portion. Then, all of the (A) etching dissolved layer is removed in the middle of the etching portion.
[0011]
As such an (A) etching dissolution layer, since the etching solution is generally an acidic solution, a metal layer can be suitably used, and if it is a printed circuit board for forming a copper wiring circuit, Since it is simpler to have the same solubility as the metal to be used, copper can be preferably used. For example, if the lead frame is etched, a lead frame alloy can be preferably used for the same reason.
[0012]
Hereinafter, (B) a layer that is at least dissolved in the resist removing solution and has etching resistance is abbreviated as “(B) etching resistant layer”. (B) The etching resistant layer has at least the property of not dissolving or swelling with respect to the etching solution, and has a strength capable of withstanding the spray pressure. (A) After the etching dissolution layer is dissolved and removed in the middle of the etching portion, the substrate removal tape is completely removed by the resist removal portion and the substrate is securely connected.
[0013]
As such an (B) etching resistant layer, for example, a cured resist film can be suitably used. Moreover, a strong alkali-soluble film having a carboxylic acid group or a hydroxyl group can be suitably used.
[0014]
Hereinafter, (C) a layer that is at least dissolved in the resist removing solution and has adhesiveness is abbreviated as “(C)) an adhesive layer”. (C) The adhesive layer plays a role of adhering the substrate connecting tape and the substrate, and is quickly removed at the resist removal portion when etching is no longer necessary after the etching is completed.
[0015]
As such (C) adhesive layer, for example, if it is an acrylic resin, molecular design and synthesis can be facilitated and used suitably, and if it is an uncured resist film, it has adhesiveness and resist removability. It can be used suitably.
[0016]
The method of etching using the substrate connecting tape is the method of etching a plurality of substrates transported horizontally by a transport means, wherein the edges in the transport direction of adjacent substrates are connected to each other with the substrate connecting tape. At least etching and resist removal are performed while transporting the substrates in the coupled state by the transport means, and the substrate connecting tape is removed by resist removal to separate the substrates. Uniform etching can be achieved.
[0017]
Edges in the transport direction of adjacent substrates are connected to each other with the above-mentioned substrate connecting tape, and development is performed while transporting the connected substrates by transport means, and then etching and resist removal In this way, uniform etching can also be achieved by separating the substrates by removing the substrate connecting tape by removing the resist.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Below, the board | substrate connection tape of this invention and the etching method of a board | substrate are demonstrated in detail.
[0019]
FIG. 1 is a cross-sectional view of a substrate connecting tape 1 of the present invention. As shown in FIG. 1, the substrate connecting tape 1 is formed by laminating (A) an etching dissolution layer, (B) an etching resistant layer, and (C) an adhesive layer. The board connecting tape 1 must be strong enough to connect the boards and withstand tensile stresses during transportation.
[0020]
FIG. 2 and FIG. 3 are sectional views showing a state in which the substrate connecting tape 1 of the present invention is attached to the edge of the substrate and the substrates are connected. For example, as shown in FIG. 2, the board connection is made so that the edge of each adjacent board 4 is straddled by the board connecting tape 1 from both sides of the board 4 and the adhesive layer is in contact with the board 4 (C). The substrate tape 1 is affixed to connect the substrates 4. Moreover, as shown in FIG. 3, you may connect a board | substrate by sticking only from the one side of the board | substrate 4. As shown in FIG. The length (L1 and L2) in the transport direction in which the edge of the substrate 4 and the substrate connecting tape 1 are in contact with each other is shortened so that the substrate connecting tape 1 does not overlap the area of the circuit pattern drawn on the substrate 4. The substrates 4 need to be long enough to withstand the etching solution ejection pressure and the tensile stress during conveyance. The distance between L1 and L2 may not be the same. Also, the distance between the substrates L3 is such that the substrates 4 can withstand the etchant jet pressure and the tensile stress during transportation, and the substrates 4 But It is necessary to make the distance simple when attaching the substrate 4 without separation in the etching portion, jamming in the etching portion and the resist removal portion. Here, two examples are shown to show the state where the substrate connecting tape 1 is attached to the substrate 4, but the substrate is connected to withstand the spray pressure and tensile stress of etching, and in the circuit pattern region. It may be pasted in any state as long as it does not cause defects.
[0021]
FIG. 4 shows a conceptual view of the state in which the substrate connecting tape 1 is attached to the edge of the substrate as shown in FIG. The edge portions of the adjacent substrates 4 are connected to each other in such a manner that the strip-shaped substrate connecting tape 1 is straddled. Since the substrate connecting tape 1 functions to connect the substrates 4 and hinder the flow of the etching solution in the transport direction, the inter-substrate gaps can be completely blocked as shown in FIG. Most preferably, the length (L4) of the board connecting tape 1 is preferably equal to or greater than the length (L5) in the direction perpendicular to the conveying direction of the board 4. Further, even if L4 is made slightly shorter than L5 as shown in FIG. 4, etching can be performed satisfactorily if almost no flow down in the substrate transport direction occurs.
[0022]
Any method and apparatus may be used as the method for attaching the substrate connecting tape 1 to the substrate 4 as long as the substrates 4 can be securely connected to each other. For example, the substrate connecting portion described in Japanese Patent Application No. 2001-019596 Etc. can be used.
[0023]
Before etching, for example, as shown in FIGS. 2 to 4, the substrate connecting film 1 is attached to the edge of the substrate 4, and the etching solution on the upper surface of the substrate 4 is allowed to flow only in the direction perpendicular to the conveying direction. Etching phenomenon that is not uniform in the direction can be suppressed. Then, the substrate connection film 1 that has become unnecessary after the etching is completed is removed by the resist removing portion and the substrate 4 is separated, so that it can be processed by an apparatus that handles a normal single wafer substrate.
[0024]
Next, (A) the etching dissolved layer, (B) the etching resistant layer, and (C) the adhesive layer relating to the substrate connecting tape 1 of the present invention will be described in detail.
[0025]
(A) The etching dissolution layer has sufficient tensile strength, has a property of quickly dissolving or swelling in the etching solution, and can be dissolved and removed before passing through the etching portion. Good. Examples thereof include metal materials such as copper, silver, aluminum, stainless steel, nichrome, iron, and tungsten, and alloys made of copper, iron, chromium, zinc, tin, and the like. (A) As for the thickness of an etching melt | dissolution layer, 1-200 micrometers is preferable, and in order to etch more favorably, it is desirable to set a material and thickness by the board | substrate to etch. For example, when a copper-clad laminate of 18 μm copper foil is used, a copper foil having a thickness of 18 μm or less can be suitably used. If the substrate 4 to be used is a lead frame, it is preferable to use a lead frame alloy.
[0026]
(B) The etching-resistant layer has a property that does not dissolve or swell in the etching solution, has a strength that can withstand the spray pressure, and has a property that dissolves or swells in the resist removing solution. Examples thereof include a resist film obtained by curing a photosensitive layer from which a mylar film and a protective film of a resist film are peeled off by heat or ultraviolet irradiation, a film obtained by applying and drying a liquid photoresist, and then hardening by heat or ultraviolet irradiation. In addition, films and polyvinyls having a carboxylic acid group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, and a phosphonic acid group, which are soluble in a strong alkali made of acrylic resin, epoxy resin, urethane resin, phenol resin, etc. Alcohol etc. are mentioned. These serve to maintain the connected state even when the etching load is applied to the substrate 4 connected by the substrate connecting tape 1. When the etching is no longer necessary after the etching is completed, the resist 4 is used as a resist removing solution. It has a property of dissolving or swelling and is quickly removed from the substrate 4. If the thickness of the etching resistant layer 2 is too thin, the strength is inferior and if it is too thick, it becomes a weir for the flow of the etching solution. As described above, by using a cured resist film, it is preferable that the substrate connecting tape 1 can be easily produced.
[0027]
(C) The adhesive layer only needs to have adhesiveness capable of bonding the substrate connecting tape 1 and the substrate 4, dissolve or swell in the resist removing solution, and can be quickly removed from the substrate 4 at the time of resist removal. If necessary, the adhesiveness may be increased by heating. For example, the adhesive resin which has an acrylic resin, an epoxy resin, a urethane resin, a phenol resin etc. as a main component is mentioned. These adhesive resins contain a monomer having a carboxylic acid group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, or a phosphonic acid group because they need to be dissolved or swelled in the resist removing solution. Specific examples of the adhesive resin include styrene / maleic acid monoalkyl ester copolymer, methacrylic acid / methacrylic acid ester copolymer, styrene / methacrylic acid / methacrylic acid ester copolymer, acrylic acid / methacrylic acid ester copolymer. , Methacrylic acid / methacrylic acid ester / acrylic acid ester copolymer, styrene / methacrylic acid / acrylic acid ester copolymer, styrene / acrylic acid / methacrylic acid ester copolymer, vinyl acetate / crotonic acid copolymer, vinyl acetate Styrene, acrylic acid ester, methacrylic acid ester, vinyl acetate, vinyl benzoate, etc., and carboxylic acid-containing monomers such as / crotonic acid / methacrylic acid ester copolymer, vinyl benzoate / acrylic acid / methacrylic acid ester copolymer And a copolymer thereof. Moreover, plasticizers such as polyethylene glycol, polypropylene glycol, diethyl phthalate, o-toluenesulfonic acid amide, p-toluenesulfonic acid amide, tributyl citrate, triethyl citrate, and triethyl acetylcitrate may be contained. Moreover, in order to improve visibility, you may contain dye and a pigment.
[0028]
Moreover, you may use the resist film which consists of an uncured photosensitive layer which peeled the mylar film and protective film of a resist film as (C) adhesive layer. As a general resist film, for example, Liston from DuPont MRC Dry Film Co., Ltd., Fotec from Hitachi Chemical Co., Ltd., Sunfort from Asahi Kasei Co., Ltd. can be used.
[0029]
Next, the etching method of the present invention will be described in detail. FIG. 5 is a process flow diagram for carrying out the etching method of the present invention. In this example, a conductor pattern is formed on the front and back of the printed circuit board 5.
[0030]
In FIG. 5, 5 is a transport means for transporting the substrate 4 in the horizontal direction to perform a series of processes on the substrate 4, and 6 is a substrate connecting portion 6 for connecting the transported substrates 4 to each other at their edges. The substrates 4 are connected to each other after being developed by the developing unit 8. After being connected by the substrate connecting part 6, an etching process is performed in the etching part 9, and after the water washing, the resist removal is performed by the resist removing part 10. Although not shown in the drawing, even if the substrate connecting portion 6 is a step before the developing portion 8, the substrate connection tape 1 is not dissolved in the developing solution, so that the substrate transport speed is etched with the developing portion 8. There is no particular problem except that the portions 9 are the same.
[0031]
Conveying means 5 such as a roller conveyor configured endlessly conveys a plurality of substrates 4 continuously on the upper surface thereof in the direction of the arrow. Each substrate 4 before connection is exposed by the exposure unit 7, and a resist pattern is formed on the substrate 4 by the developing unit 8. Next, the substrate 4 is squeezed in order at an interval of a length of approximately L3 before or in the middle of being transported into the substrate connecting portion 6, and both of the adjacent substrates 4 in the transport direction are passed through the substrate connecting portion 6. The substrate connecting tape 1 is applied between the edges (as shown in FIGS. 2 to 4), and the substrates 4 are connected to form an elongated continuous body.
[0032]
Each of the substrates 4 thus connected is transported to the etching unit 9 in a connected state, where a portion where the resist pattern does not exist is removed with an etching solution, and (A) the etching dissolved layer of the substrate connecting tape 1 Is removed. The etching solution is sprayed on the front and back surfaces of the substrate 4 from the nozzles of the spray tube group 12 arranged in parallel vertically, and the sprayed etching solution falls into the liquid reservoir and is circulated to the spray tube group 12 by a pump. Etching solutions such as ferric chloride and cupric chloride are generally used.
[0033]
Each substrate 4 etched by the etching unit 9 proceeds to the next resist removal unit 10 while a continuous body is formed only by (B) the etching resistant layer and (C) the adhesive layer. The substrate 4 which has proceeded to the resist removing unit 10 is sprayed from above and below with a resist removing liquid, so that the resist pattern which has become unnecessary is removed and the substrate connecting tape 1 is removed. That is, spray tube groups 13 are arranged in parallel above and below the resist removing unit 10, and the resist removing liquid is sprayed on the front and back surfaces of the substrate 4 from these nozzles. The sprayed resist removal liquid falls into a liquid reservoir provided below, and is circulated to the spray tube group 13 through a circulation pipe provided with a pump. As the resist removing solution, a commercially available resist removing solution is used, or a 2-3% by mass sodium hydroxide aqueous solution or potassium hydroxide aqueous solution is heated to 30 to 60 ° C. and used. If necessary, aqueous solutions of inorganic basic compounds such as alkali metal silicates, alkali metal hydroxides, phosphoric acid and alkali metal carbonates, phosphoric acid and ammonium carbonate, ethanolamines, ethylenediamine, propanediamine , Organic basic solvents such as triethylenetetramine, morpholine, etc. can be used after being heated to a required temperature. Moreover, organic solvents, such as methyl ethyl ketone, dioxane, methanol, ethanol, propanol, and methylpyrrolidone, can also be used.
[0034]
The substrate 4 according to the present invention includes a printed circuit board or a lead frame substrate. If it is a printed circuit board, it will be classified into a flexible circuit board and a rigid circuit board. Polyester and polyimide are usually used as an insulating material for the flexible circuit board, and aramid and polyester-epoxy base are also used. The thickness of the insulating layer of the flexible substrate is about 13 μm to 125 μm, and copper foil of about 1 to 35 μm is provided on both sides or one side, and since it is very flexible, there is a lot of deflection during etching. The inventive etching method is preferably used. Also, if it is a rigid substrate, the necessary number of insulating substrates dipped in epoxy resin or phenolic resin on a paper base material or glass base material are stacked, and metal foil is placed on one or both sides, and heated and pressed to laminate The thing which was done is mentioned. In addition, a multilayer shield plate produced by laminating a prepreg, a metal foil, etc. after the inner layer wiring pattern is processed, and a multilayer plate having through holes and via holes are also included. The thickness is about 60 μm to 3.2 mm, and the material and thickness are selected according to the final use form as a printed circuit board. These printed circuit boards include, for example, “Printed Circuit Technology Handbook-Second Edition” (edited by the Printed Circuit Society of Japan, published by Nikkan Kogyo Shimbun) and “Multilayer Printed Circuit Handbook” (JA Scarlet, edited by Co., Ltd.). What is described in Modern Chemical Co., Ltd.) can be used. In the case of a lead frame substrate, an alloy plate made of copper, iron, chromium, zinc, tin or the like can be used.
[0035]
【Example】
Hereinafter, the present invention will be described in detail with reference to examples. However, the present invention is not limited to the following examples unless the gist of the present invention is exceeded.
[0036]
Example 1
A resist film (manufactured by Hitachi Chemical Co., Ltd., 38 μm thickness) is attached to 18 μm copper foil (manufactured by Nikko Materials Co., Ltd.), cut into a strip of 30 mm × 510 mm, and then irradiated with ultraviolet rays. The resist film was cured and the mylar film was peeled off. Next, the resist film from which the protective film was peeled again (manufactured by Hitachi Chemical Co., Ltd., 38 μm thickness) was attached to the cured resist film layer to produce a substrate connecting tape.
[0037]
On the other hand, a dry film for circuit formation is laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 35 μm, substrate thickness 0.2 mm), and an image having a line and space of 100 μm is 3 ×. Exposure was carried out using a mask film having a configuration of 4 12-sided. Next, after peeling off the mylar film, alkali development was performed to form a resist pattern.
[0038]
By pressing the heated roll heated to 50 ° C. between the substrate edges of the substrate after resist pattern formation so that the 510 mm side is adjacent to each other, and the Mylar film peeled substrate connecting tape prepared above is heated between the substrate edges. Affixed to both sides, and 10 substrates were connected by a substrate connecting tape as shown in FIG.
[0039]
Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Even after the etching process was completed, the substrate connecting tape was not cut and the substrate jammed. Next, the resist was removed with a 3% by mass aqueous sodium hydroxide solution.
[0040]
The remaining substrate connection tape was not confirmed on each substrate after the resist removal was completed, and all the substrate connection tape was removed, and all the separated substrates reached the receiving part without jamming.
[0041]
For the substrate thus etched, the line width of the image line corresponding to 100 μm on the mask was measured at 12 points per substrate on the upper surface in the etching, and the line width error (maximum line width) for each substrate was measured. The maximum value of (minimum line width) was determined, and the average of the maximum values of 10 processed substrates was 7.0 μm.
[0042]
Example 2
A resist film (manufactured by Hitachi Chemical Co., Ltd., 38 μm thickness) is attached to 18 μm copper foil (manufactured by Nikko Materials Co., Ltd.), cut into a strip of 30 mm × 510 mm, and then irradiated with ultraviolet rays. The resist film was cured and the mylar film was peeled off. Next, 2-ethylhexyl acrylate / methacrylic acid copolymer (mass ratio: 8/2, propylene glycol monomethyl ether solvent, solid content 35 mass%) is applied and dried on the cured resist film layer. Then, a substrate connecting tape was prepared.
[0043]
On the other hand, a dry film for circuit formation is laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 35 μm, substrate thickness 0.2 mm), and an image having a line and space of 100 μm is 3 ×. Exposure was carried out using a mask film having a configuration of 4 12-sided. Next, after peeling off the mylar film, alkali development was performed to form a resist pattern.
[0044]
The substrate after resist pattern formation is adjacent so that the 510 mm side is adjacent, and the substrate connecting tape prepared above is attached to one side of the substrate edges by a pressure roll, as shown in FIG. Ten substrates were connected by a connecting tape.
[0045]
Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Even after the etching process was completed, the substrate connecting tape was not cut and the substrate jammed. Next, the resist was removed with a 3% by mass aqueous sodium hydroxide solution.
[0046]
The remaining substrate connection tape was not confirmed on each substrate after the resist removal was completed, and all the substrate connection tape was removed, and all the separated substrates reached the receiving part without jamming.
[0047]
For the substrate thus etched, the line width of the image line corresponding to 100 μm on the mask was measured at 12 points per substrate on the upper surface in the etching, and the line width error (maximum line width) for each substrate was measured. The maximum value of (minimum line width) was determined, and the average of the maximum values of 10 processed substrates was 7.0 μm.
[0048]
Comparative Example 1
A dry film for circuit formation is laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 35 μm, substrate thickness 0.2 mm), and an image having a line and space of 100 μm is 3 × 4. 12-face mask the film The exposure was carried out using Next, after peeling off the mylar film, an alkali development treatment was performed to remove the dry film in the uncured region, thereby forming a resist pattern. Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Next, resist removal (40 ° C., 3 mass% sodium hydroxide aqueous solution) was performed. In addition, the board | substrate connection tape was not used and the board | substrate was not connected.
[0049]
For the substrate thus etched, the line width of the image line corresponding to 100 μm on the mask was measured at 12 locations per substrate on the upper surface in the etching, and the error of the line width (maximum line width) for each substrate. The maximum value of (minimum line width) was determined, and the average of the maximum values of the 10 processed substrates was 17.0 μm. The error was larger than when the substrates were connected.
[0050]
Comparative Example 2
A resist film (manufactured by Hitachi Chemical Co., Ltd., 38 μm thickness) is pasted on 18 μm copper foil (manufactured by Nikko Materials Co., Ltd.) and cut into a 30 mm × 510 mm strip (B) etching resistance A substrate connecting tape having no layer was prepared.
[0051]
On the other hand, a dry film for circuit formation was laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 35 μm, substrate thickness 0.2 mm), the circuit pattern was exposed, and the mylar film was peeled off. Thereafter, alkali development was performed to form a resist pattern.
[0052]
The substrate after resist pattern formation is adjacent so that the 510 mm side is adjacent, and the Mylar film peeled off (B) prepared above is not bonded to the substrate connection tape between the substrate edges at 50 ° C. By applying a heated hot roll, it was attached to both surfaces, and as shown in FIG. 2, 10 substrates were connected by a substrate connecting tape.
[0053]
Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed at a setting that can process a 35 μm copper foil. When the etching process was completed, the substrate connecting tape was partially cut, the substrate was separated, and a substrate jam occurred. As a result, a good printed circuit board was not obtained.
[0054]
Comparative Example 3
A substrate connecting tape was prepared by cutting a resist film (manufactured by Hitachi Chemical Co., Ltd., 38 μm thickness) from which the protective film had been peeled into a 30 mm × 510 mm band.
[0055]
On the other hand, a dry film for circuit formation was laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 35 μm, substrate thickness 0.2 mm), the circuit pattern was exposed, and the mylar film was peeled off. Thereafter, alkali development was performed to form a resist pattern.
[0056]
Adjacent the substrate after resist pattern formation so that the 510 mm side is adjacent to each other, and pressurizing a heated roll heated to 50 ° C. between the substrate edges of the Mylar film peeled substrate connecting tape prepared above. Then, as shown in FIG. 2, 10 substrates were connected by a substrate connecting tape.
[0057]
Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed at a setting that can process a 35 μm copper foil. When the etching process was completed, the substrate connecting tape was partially cut, the substrate was separated, and a substrate jam occurred. As a result, a good printed circuit board was not obtained.
[0058]
【The invention's effect】
As described above, when connecting and transporting a plurality of substrates by the substrate connecting tape of the present invention and the etching method using the same, the substrate connection has a strength that does not cause separation of the substrates in the etching portion. An etching tape that eliminates the etching non-uniformity phenomenon in the transport direction on the upper surface side of a plurality of substrates can be provided.
[Brief description of the drawings]
FIG. 1 is a sectional view of a substrate connecting tape according to the present invention.
FIG. 2 is a cross-sectional view showing a state in which a substrate connecting tape is attached to a substrate edge portion and the substrates are connected.
FIG. 3 is a cross-sectional view of a state in which the substrate connecting tape is attached to the edge of the substrate and the substrates are connected.
FIG. 4 is a conceptual diagram of a state in which a substrate connecting tape is attached to a substrate edge portion and the substrates are connected as viewed from above.
FIG. 5 is a process flow diagram for carrying out the etching method of the present invention.
[Explanation of symbols]
1 Board connection tape
A Layer that dissolves in etchant
B Layer which is at least dissolved in the resist removing solution and has etching resistance
C Layer that is soluble in at least the resist removal solution and has adhesiveness
4 Substrate
5 Transport means
6 Board connection part
7 Exposure section
8 Development section
9 Etching part
10 resist removal section
11 Transfer roller
12, 13 Spray tube group

Claims (7)

At least (A) a layer that dissolves in an etching solution, (B) a layer that dissolves in at least a resist removal solution and has etching resistance, and (C) a layer that dissolves in at least a resist removal solution and has adhesiveness. Ri Na are stacked, (C) board connecting tape layers, characterized in that affixed to the substrate with the dissolved and tacky at least resist removal solution.   2. The substrate connecting tape according to claim 1, wherein the layer (A) dissolved in the etching solution is made of metal.   3. The substrate connecting tape according to claim 1, wherein the layer (A) dissolved in the etching solution is made of copper.   4. The substrate connecting tape according to claim 1, wherein the layer (B) at least dissolved in the resist removing solution and having etching resistance is a cured resist film.   5. The substrate connecting tape according to any one of claims 1 to 4, wherein the (C) at least a layer that dissolves in the resist removing solution and has adhesiveness is an uncured resist film.   5. The substrate connecting tape according to claim 1, wherein the (C) at least a layer that is dissolved in the resist removing solution and has adhesiveness is made of an acrylic resin.   In the method of etching a plurality of substrates transported horizontally by a transport means, the edges in the transport direction of the adjacent substrates are connected to each other with the substrate connecting tape according to claim 1, A substrate etching method, wherein at least etching and resist removal are performed while transporting each connected substrate by a transporting means, and the substrate connecting tape is removed by resist removal to separate each substrate.

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