JP4320150B2 - Substrate connecting tape and etching method using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for etching a substrate used for a printed circuit board, a lead frame, and the like and a substrate connecting tape used therefor, and more particularly, a method capable of uniformly etching the upper surface side of a plurality of substrates conveyed by a conveying means. The present invention also relates to a substrate connecting tape used therefor.
[0002]
[Prior art]
As a method for etching a large number of printed circuit boards continuously and efficiently, the printed circuit board is transported horizontally by a transport means such as a roller conveyor, and an etching solution is sprayed on the surface by a two-dimensionally arranged spray tube group. The method is adopted. When etching one side of the printed circuit board, an etching solution spray tube group is arranged either above or below the printed circuit board being conveyed. When etching both surfaces simultaneously, spray tube groups are arranged two-dimensionally both above and below.
[0003]
In such an etching method, the etchant sprayed from each nozzle of the spray tube group above the horizontally conveyed printed circuit board flows on the upper surface of the printed circuit board and flows downward from the peripheral portion. Since the central portion of the upper surface of the printed board is more likely to retain the etchant than the peripheral portion, the sprayed etchant hardly acts on the reaction surface. Therefore, the etching rate in the central part of the printed circuit board is lower than that in the peripheral part, making it difficult to perform uniform etching, which is a major cause of hindering the fineness of the printed circuit board.
[0004]
In order to solve this problem, the pressure of the etchant that collides with the printed circuit board is not made uniform, but the pressure of the etchant that collides with the intermediate part is higher than the peripheral part perpendicular to the transport direction. A method of smoothing the flow of the etching solution from the intermediate portion to the peripheral portion of the printed board is known. As an example of an apparatus for realizing this, the nozzle lengths of the sprays arranged in the direction perpendicular to the conveyance direction of the printed circuit board are configured so that the middle portion is larger than the both end sides of the row. A method has been proposed in which the nozzle is brought closer to the upper surface of the printed circuit board, and the contact pressure of the etching solution colliding with the intermediate part of the printed circuit board is made higher than that in the peripheral area.
[0005]
However, if the contact pressure of the etchant impinging on the middle part in the direction perpendicular to the printed board transport method is set higher than that in the peripheral part, the non-uniform etching phenomenon in the direction perpendicular to the printed board transport direction is Although it can be controlled considerably, it does not lead to solving an etching phenomenon that is not uniform in the direction of conveyance of the printed circuit board.
[0006]
In order to solve this problem, Japanese Patent No. 3108750 proposes that both edges in the transport direction are more easily etched than the center. In this method, the spray amount of the spray pipe in the transport direction is changed in synchronization with the transport of the printed circuit board, and the spray pressure at the central portion of the printed circuit board is always controlled to be larger than both ends in the transport direction. However, such control has the disadvantages that the apparatus becomes complicated and that it is liable to cause a failure.
[0007]
Further, Japanese Patent Application No. 2001-019596 discloses an etching method in which edges of substrates are connected to each other using a strip-shaped connecting film that is not dissolved in an etching solution but dissolved in a resist removal solution, and etching and resist removal are performed. Has been proposed. According to this method, since the etching solution on the upper surface of the printed circuit board flows only in the direction perpendicular to the transport direction, the difference in etching force is only in the width direction, and the etching phenomenon that is not uniform in the transport direction of the printed circuit board can be clearly suppressed. However, since the strip-shaped connection film described above is dissolved in an alkali developer, it is necessary to connect the substrate between the alkali development step and the etching step, and the connection film is applied to such a wet substrate. It was difficult. Further, when an etching apparatus having a high tensile stress during conveyance is used, separation may occur in the middle of the process.
[0008]
[Problems to be solved by the invention]
The present invention provides a substrate connecting tape that enables an alkali development process and does not cause separation of a substrate until entering a resist removal process when etching while connecting and transporting a plurality of printed boards. An object is to eliminate the etching non-uniformity phenomenon.
[0009]
[Means for Solving the Problems]
The substrate connecting tape of the present invention that solves the above-described problems is formed by laminating at least a layer that dissolves in a resist removing solution and has etching resistance and a layer that dissolves in the resist removing solution and has adhesiveness. In addition, the layer that is dissolved in the resist removing solution and has etching resistance does not dissolve in the alkaline developer, so that the substrates can be connected in a step prior to the alkaline development. As a layer which dissolves in such a resist removing solution and has etching resistance, a cured resist film can be suitably used.
[0010]
In addition, as a material of the layer that is dissolved in the resist removing solution and has adhesiveness, for example, an acrylic resin can be suitably used because it is easy to design and synthesize, and if it is an uncured resist film, the adhesive and Since it has resist removability, it can be easily applied.
[0011]
The method of etching using such a substrate connecting tape is the method of etching a plurality of substrates that are transported horizontally by the transport means. Are connected to each other, and alkali development and etching are performed while each substrate in the connected state is conveyed by a conveying means, and then the substrate connecting tape is removed by removing the resist to separate each substrate. Uniform etching was achieved.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Hereinafter, a layer that dissolves in the resist removing solution and has etching resistance is abbreviated as “etching resistant layer”, and a layer that dissolves in the resist removing solution and has tackiness is abbreviated as “adhesive layer”.
[0013]
FIG. 1 is a cross-sectional view of a substrate connecting tape 1 of the present invention. FIG. 2 is a cross-sectional view of the state in which the substrate connecting tape 1 is attached to the edge of the substrate and the substrate 4 is connected. As shown in FIG. 1, the substrate connecting tape 1 is formed by laminating at least an etching resistant layer 2 and an adhesive layer 3. It is necessary to be able to connect the substrates and to have strength that can withstand tensile stresses during transportation. As shown in FIG. 2, the substrate connecting tape 1 is attached so that the adhesive layer 3 is in contact with the edge of the substrate, and the substrates 4 are connected to each other.
[0014]
The etching resistant layer 2 in the substrate connecting tape 1 of the present invention has a property that it does not dissolve or swell in an alkali developer and an etching solution, and has a strength that can withstand their spray pressure, and a resist removing solution. It has the property of dissolving or swelling. Examples thereof include a resist film obtained by curing a photosensitive layer from which a mylar film and a protective film of a resist film are peeled off by heat or ultraviolet irradiation, a film obtained by applying and drying a liquid photoresist, and then hardening by heat or ultraviolet irradiation. In addition, films and polyvinyls having a carboxylic acid group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, and a phosphonic acid group, which are soluble in a strong alkali made of acrylic resin, epoxy resin, urethane resin, phenol resin, etc. Alcohol etc. are mentioned. These serve to maintain the connected state even when the substrate 4 connected with the substrate connecting tape 1 is subjected to an alkali development or etching load, and the resist is removed when etching is no longer necessary. Therefore, it is dissolved or swollen in the resist removing solution, and is quickly removed from the substrate 4. Further, when there is a substrate connecting part in the process after etching after alkali development and before etching, the substrate connecting tape 1 itself is not subjected to alkali development treatment, and therefore does not have the property of not dissolving or swelling in the alkali developer. However, it is easy to design the etching resistant layer 2. If the thickness of the etching resistant layer 2 is too thin, the strength is inferior and if it is too thick, it becomes a weir for the flow of the etching solution. As described above, by using a cured resist film, it is preferable that the substrate connecting tape 1 can be easily produced.
[0015]
The adhesive layer 3 in the substrate connecting tape 1 of the present invention has an adhesive property that allows the etching resistant layer 2 and the substrate 4 to adhere to each other, and dissolves or swells in a resist removing solution. It suffices if it can be quickly removed from the substrate 4. If necessary, the adhesiveness may be increased by heating. In the alkali developing portion, since the etching resistant layer 2 is a resist for the developing solution, only a very small area from the edge portion is immersed in the alkaline developing solution, and it is not necessary to consider the solubility in the alkaline developing solution. For example, the adhesive resin which has an acrylic resin, an epoxy resin, a urethane resin, a phenol resin etc. as a main component is mentioned. These adhesive resins contain a monomer having a carboxylic acid group, a phenolic hydroxyl group, a sulfonic acid group, a sulfonamide group, a sulfonimide group, or a phosphonic acid group because they need to be dissolved or swelled in the resist removing solution. Specific examples of the adhesive resin include styrene / maleic acid monoalkyl ester copolymer, methacrylic acid / methacrylic acid ester copolymer, styrene / methacrylic acid / methacrylic acid ester copolymer, acrylic acid / methacrylic acid ester copolymer. , Methacrylic acid / methacrylic acid ester / acrylic acid ester copolymer, styrene / methacrylic acid / acrylic acid ester copolymer, styrene / acrylic acid / methacrylic acid ester copolymer, vinyl acetate / crotonic acid copolymer, vinyl acetate Styrene, acrylic acid ester, methacrylic acid ester, vinyl acetate, vinyl benzoate, etc., and carboxylic acid-containing monomers such as / crotonic acid / methacrylic acid ester copolymer, vinyl benzoate / acrylic acid / methacrylic acid ester copolymer And a copolymer thereof. Moreover, in order to improve adhesiveness, low molecular weight polyethylene glycol, polypropylene glycol, diethyl phthalate, o-toluenesulfonic acid amide, p-toluenesulfonic acid amide, tributyl citrate, triethyl citrate, triethyl acetylcitrate, etc. A plasticizer may be contained. Moreover, in order to improve visibility, you may contain dye and a pigment.
[0016]
Further, as the adhesive layer 3, an uncured resist film may be used. As a general resist film, for example, Liston manufactured by DuPont MRC Dry Film Co., Ltd., Potex manufactured by Hitachi Chemical Co., Ltd., or the like can be used. In this case, the protective film is peeled off and attached to the etching resistant layer 2, and then the mylar film is peeled off to produce the substrate connecting tape 1.
[0017]
Next, the etching method of the present invention will be described in detail. 3 and 4 are process flow diagrams for carrying out the etching method of the present invention. In this example, a conductor pattern is formed on the front and back of a printed circuit board.
[0018]
In FIG. 3, 5 is a transport means for transporting the substrate 4 in the horizontal direction so as to perform a series of processes on the substrate 4, and 6 is a substrate connecting portion for connecting the transported substrates 4 to each other at their edges. After the exposure by the unit 7, the substrates 4 are connected to each other. After being connected by the substrate connecting portion 6, development processing is performed in the alkali developing portion 8, and after washing with water, etching processing is performed in the etching portion 9. After the washing with water, the resist is removed (peeled) by the resist removing portion 10. Is done.
[0019]
In FIG. 4, the substrates 4 are connected to each other after being exposed by the exposure unit 7 and developed by the alkali developing unit 8. After being connected by the substrate connecting part 6, an etching process is performed in the etching part 9, and after the water washing, the resist is removed (peeled) by the resist removing part 10.
[0020]
Conveying means 5 such as a roller conveyor configured endlessly conveys a plurality of substrates 4 continuously on the upper surface thereof in the direction of the arrows in FIGS. 3 and 4 at a constant speed. The substrate 4 is squeezed in order before or in the middle of the substrate coupling portion 6 covered with the casing, and is inserted into the substrate coupling portion 6 with the front and rear edges along the conveyance direction being in contact with each other. It has come to pass. And while passing the board | substrate connection part 6, in the conveyance direction of the board | substrate 4 which adjoins, it is mutually connected by the strip | belt-shaped board | substrate connecting tape 1 straddling between the front and back edge parts of the front-and-back edge parts which become abutting shape, An elongated continuous body as shown in Fig. 2 is formed. In other words, the pair of transfer rollers 11 arranged above and below are intermittently pressed against the boundary portion (between edges in the transport direction) of the adjacent substrates 4 before and after in the transport direction, thereby transferring the transfer rollers. 11 The substrate connection tape 1 mounted on the surface is transferred to the edge of the substrate 4 in the transport direction, so that the substrates 4 are connected to each other across the front and rear portions which are boundary portions.
[0021]
In addition, each board | substrate 4 before a connection is exposed by the exposure part 7, and is sprayed from the upper and lower sides with the weak alkali alkaline developing solution like 1-2 mass% sodium carbonate aqueous solution in the alkali image development part 8, for example, an unexposed part ( The resist in the uncured part) is removed, and a resist layer cured in a pattern is formed. The substrate connecting unit 6 is installed in either the pre-process or the post-process of the alkali developing unit 8 to connect the substrates. It is conveyed to the etching part 9 in the connected state, and the part where the resist layer does not exist is removed with an etching solution. The etching solution is sprayed on the front and back surfaces of the substrate 4 from the nozzles of the spray tube group 12 arranged two-dimensionally up and down, and the sprayed etching solution falls into the liquid reservoir, and the spray tube group is provided by a circulation pipe provided with a pump. 12 is circulated. It should be noted that the liquid reservoir is appropriately supplied with replenishing water from the replenishing water tank and etching liquid such as hydrochloric acid, ferric chloride, cupric chloride from the etching liquid tank, and drainage can be periodically extracted from the bottom. Yes. The temperature of the etching solution in the liquid reservoir is adjusted to a predetermined range by a heater and a cooling pipe.
[0022]
Each substrate 4 etched by the etching unit 9 is transported to the next resist removing unit 10 in a state where a continuous body is formed, and there is a strong alkali resist removing solution such as a 2 to 3 mass% sodium hydroxide aqueous solution. The resist layer in the form of a pattern sprayed from above and below with (cleaning liquid) is removed, and the substrate connecting tape 1 is removed. That is, the spray tube group 13 is two-dimensionally arranged above and below the resist removing unit 10, and the resist removing liquid is sprayed on the front and back surfaces of the substrate 4 from these nozzles. The sprayed resist removal liquid falls into a liquid reservoir provided below, and is circulated to the spray tube group 13 through a circulation pipe provided with a pump.
[0023]
Next, the board | substrate connection part 6 is demonstrated. First, the plurality of substrates 4 are horizontally transported by an acceleration driving roller (feed roller) (not shown) of the transport means 5 and supplied to the inside from the opening portion of the casing of the substrate connecting portion 6. Since the speed of the acceleration driving roller on the upstream side is higher than the speed of transport of the roller of the transport means 5 located after the board connecting portion 6, each board 4 is pushed by the subsequent board 4 and before and after them. The edges are transported in a butted state in contact with each other in the transport direction. The transfer roller 11 in the standby position with the substrate connecting tape 1 mounted on the outer peripheral surface is moved up and down and rotated by a drive unit that receives a control command from a control unit (not shown). That is, when the substrates 4 in contact with each other pass through the substrate connecting portion 6 at a constant speed by the transport means 5, the boundary portions of the substrates 4 (edge portions in the transport direction of the adjacent substrates 4) are boundary detectors such as optical sensors. In response to the detection signal (synchronization signal), the control unit outputs a control signal to the drive unit to control the transfer roller 11 to move up and down and rotate.
[0024]
For example, a heating unit such as a heater is disposed inside the transfer roller 11 so that the outer peripheral surface is controlled within a predetermined temperature range. Temperature control is performed by the control unit in response to a signal from a temperature sensor provided inside the transfer roller 11. In addition, the outer peripheral surface temperature of the transfer roller 11 can be heated to a range in which the adhesiveness of the adhesive layer 3 of the substrate connecting tape 1 is increased and can be adhered to the edge of the substrate 4 by the adhesiveness. It sets suitably by the softening temperature of the adhesive layer 3 to be used. If the adhesive layer 3 has sufficient adhesiveness to stick to the substrate even at room temperature, there is no need to arrange a heater or the like inside the transfer roller 11. When the outer peripheral surface of the transfer roller 11 is pressed against the boundary portion of the substrate 4, the substrate connecting tape 1 is transferred to the boundary portion of the substrate 4. They are cross-linked by the substrate connecting tape 1 and connected to each other. Further, after the substrate connecting tape 1 is affixed, the substrate may be securely connected by applying a treatment such as pressurization or heating with a rubber roller.
[0025]
When the transfer of the substrate connecting tape 1 is completed in this way, a control signal is output again from the control unit to the drive unit, and the transfer roller 11 moves away from the substrate 4 and returns to the standby position. Thereafter, the above operation is repeated each time a detection signal is output from the detector.
[0026]
On the other hand, the substrate connecting tape 1 is mounted on the transfer roller 11 within a short time when the transfer roller 11 is at the standby position. At this timing, the position detector detects that the transfer roller 11 has returned to the standby position, and the etching resistant layer 2 side of the substrate connecting tape 1 is mounted on the outer peripheral surface of the transfer roller. Therefore, it is desired that the etching resistant layer 2 of the substrate connecting tape 1 and the transfer roll 11 be bonded. Specifically, a cylindrical roller having a large number of fine through holes dispersed on the outer peripheral surface of the transfer roll 11 may be used, and the inside may be decompressed with a vacuum pump or the like. It can also be achieved by providing an adhesion layer on the surface of the etching resistant layer 2 or the transfer roll 11.
[0027]
The substrate 4 according to the present invention includes a printed circuit board or a lead frame substrate. If it is a printed circuit board, it will be classified into a flexible circuit board and a rigid circuit board. Polyester and polyimide are usually used as an insulating material for the flexible circuit board, and aramid and polyester-epoxy base are also used. The thickness of the insulating layer of the flexible substrate is about 13 μm to 125 μm, and copper foil of about 12 to 35 μm is provided on both sides or one side, and since it is very flexible, there is a lot of deflection during etching. The inventive etching method is preferably used. Also, if it is a rigid substrate, the necessary number of insulating substrates dipped in epoxy resin or phenolic resin on a paper base material or glass base material are stacked, and metal foil is placed on one or both sides, and heated and pressed to laminate The thing which was done is mentioned. In addition, a multilayer shield plate produced by laminating a prepreg, a metal foil, etc. after the inner layer wiring pattern is processed, and a multilayer plate having through holes and via holes are also included. The thickness is about 60 μm to 3.2 mm, and the material and thickness are selected according to the final use form as a printed circuit board. These printed circuit boards include, for example, “Printed Circuit Technology Handbook-Second Edition” (edited by the Printed Circuit Society of Japan, published by Nikkan Kogyo Shimbun) and “Multilayer Printed Circuit Handbook” (JA Scarlet, edited by Co., Ltd.). What is described in Modern Chemical Co., Ltd.) can be used.
[0028]
【Example】
Hereinafter, the present invention will be described in detail with reference to examples. However, the present invention is not limited to the following examples unless the gist of the present invention is exceeded.
[0029]
Example 1
The protective film of the resist film which was cured by irradiating the entire surface with ultraviolet rays on the resist film (Asahi Kasei Sunfort, 25 μm thickness) was peeled off. On the other hand, the protective film of the uncured resist film that was not irradiated with ultraviolet rays or the like was peeled off. A cured resist film and an uncured resist film are pasted so that the surfaces from which the protective film is peeled off are in contact with each other, cut into 15 mm × 510 mm strips, and then the mylar films on both sides are peeled off to produce a tape for substrate connection did.
[0030]
Next, a resist film was laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 18 μm, substrate thickness 0.2 mm), and an image having a line and space of 75 μm was 3 × 4 12 Exposure was carried out using a mask film having an imposition structure. Next, after peeling off the mylar film, each substrate is adjacent so that the 510 mm side is adjacent, and the substrate connecting tape is attached to the edge so that the uncured resist film is in contact, and the edges are connected to each other. It was.
[0031]
Next, the resist pattern was formed by spraying a 1.0% by weight sodium carbonate aqueous solution (liquid temperature 30 ° C.) by spraying a 1.0% by weight sodium carbonate aqueous solution (liquid temperature 30 ° C.) with the 510 mm side facing the conveyance direction. Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Even after the etching process was completed, the substrate connecting tape was not cut and the substrate jammed. Next, resist removal (40 ° C., 3 mass% sodium hydroxide aqueous solution) was performed.
[0032]
The remaining substrate connection tape was not confirmed on each substrate after the resist removal was completed, and all the substrate connection tape was removed, and all the separated substrates reached the receiving part without jamming.
[0033]
As a result of measuring the line width of the image line corresponding to 75 μm on the mask at 12 locations on each surface of the substrate, the line width error (maximum line width−minimum line width) was measured. The maximum was 7.0 μm.
[0034]
Example 2
The protective film of the resist film which was cured by irradiating the entire surface with ultraviolet rays on the resist film (Asahi Kasei Sunfort, 25 μm thickness) was peeled off. On the other hand, 2-ethylhexyl acrylate / methacrylic acid copolymer (mass ratio: 8/2, propylene glycol monomethyl ether solvent, solid content 35% by mass) was applied on a PET film and dried to produce an adhesive layer. did. Paste the protective film of the cured resist film so that the peeled surface is in contact with the adhesive layer, cut it into a 15 mm x 510 mm strip, and then peel off the PET film and Mylar film on both sides to produce a tape for substrate connection did.
[0035]
Next, a resist film was laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 18 μm, substrate thickness 0.2 mm), and an image having a line and space of 75 μm was 3 × 4 12 Exposure was carried out using a mask film having an imposition structure. Next, after peeling off the mylar film, the substrates were adjacent so that the 510 mm sides were adjacent to each other, and the substrate connecting tape was attached to the edge so that the adhesive layer was in contact with each other, and the edges were connected to each other.
[0036]
Next, the resist pattern was formed by spraying a 1.0% by weight sodium carbonate aqueous solution (liquid temperature 30 ° C.) by spraying a 1.0% by weight sodium carbonate aqueous solution (liquid temperature 30 ° C.) with the 510 mm side facing the conveyance direction. Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Even after the etching process was completed, the substrate connecting tape was not cut and the substrate jammed. Next, resist removal (40 ° C., 3 mass% sodium hydroxide aqueous solution) was performed.
[0037]
The remaining substrate connection tape was not confirmed on each substrate after the resist removal was completed, and all the substrate connection tape was removed, and all the separated substrates reached the receiving part without jamming.
[0038]
As a result of measuring the line width of the image line corresponding to 75 μm on the mask at 12 locations on each surface of the substrate, the line width error (maximum line width−minimum line width) was measured. The maximum was 7.0 μm.
[0039]
Comparative Example 1
A dry film is laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 18 μm, substrate thickness 0.2 mm), and an image having a line and space of 75 μm is a 3 × 4 12-sided image. Exposure was carried out using the mask film having the structure. Next, after peeling off the mylar film, it was made to flow with the 510 mm side facing the conveyance direction and the image surface facing upward, and sprayed with a 1.0 wt% aqueous sodium carbonate solution (liquid temperature 30 ° C.) to perform alkali development processing. A resist pattern was formed. Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. Next, resist removal (40 ° C., 3 mass% sodium hydroxide aqueous solution) was performed. In addition, the board connection tape was not used.
[0040]
As a result of measuring the line width of the image line corresponding to 75 μm on the mask at 12 locations on each surface of the substrate, the line width error (maximum line width−minimum line width) was measured. The maximum was 15.0 μm.
[0041]
Comparative Example 2
A resist film (Asahi Kasei Sunfort, 25 μm thick) was cut into a 15 mm × 510 mm strip, the protective film and the Mylar film were peeled off, and a connection film was prepared using only the uncured resist film.
[0042]
Next, a resist film was laminated on 10 double-sided copper-clad laminates (area 340 mm × 510 mm, copper foil thickness 18 μm, substrate thickness 0.2 mm), and an image having a line and space of 75 μm was 3 × 4 12 Exposure was carried out using a mask film having an imposition structure. Next, after peeling off the mylar film, it was made to flow with the 510 mm side facing the conveyance direction and the image surface facing upward, and sprayed with a 1.0 wt% aqueous sodium carbonate solution (liquid temperature 30 ° C.) to perform alkali development processing. A resist pattern was formed.
[0043]
After the resist pattern was formed, the substrate was sufficiently dried, and the substrates were adjacent so that the edges on the 510 mm side were adjacent to each other, and the connecting film was attached to the edges to connect the edges together. Next, ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² The etching process was performed. When the etching process was completed, the connection film was partially cut, the substrate was separated, and a substrate jam occurred. As a result, a good printed wiring board was not obtained.
[0044]
【The invention's effect】
As described above, when etching while connecting and transporting a plurality of printed circuit boards by the substrate connecting tape of the present invention and the etching method using the same, an alkali development process is possible, and the substrate can be separated in the etching process. We could provide highly accurate etching without happening.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a substrate connecting tape 1 of the present invention.
FIG. 2 is a cross-sectional view showing a state in which a substrate connecting tape is attached to a substrate edge portion and the substrates are connected.
FIG. 3 is a process flow diagram for carrying out the etching method of the present invention.
FIG. 4 is a process flow diagram for carrying out the etching method of the present invention.
[Explanation of symbols]
1 Board connection tape
2 Layer that dissolves in resist removal solution and has etching resistance (etching resistant layer)
3 Layer that is dissolved in the resist removal solution and has adhesiveness (adhesive layer)
4 Substrate
5 Transport means
6 Board connection part
7 Exposure section
8 Alkali development section
9 Etching part
10 resist removal section
11 Transfer roller
12, 13 Spray tube group

Claims (6)

A tape for connecting a substrate, comprising at least a layer which is dissolved in a resist removing solution and has etching resistance and a layer which is dissolved in a resist removing solution and has adhesiveness. 2. The substrate connecting tape according to claim 1, wherein the layer that dissolves in the resist removing solution and has etching resistance does not dissolve in the alkali developer. 3. The substrate connecting tape according to claim 1, wherein the layer dissolved in the resist removing solution and having etching resistance is a cured resist film. The tape for board | substrate connection in any one of Claims 1-3 whose layer which melt | dissolves in the said resist removal liquid and has adhesiveness is an uncured resist film. 4. The substrate connecting tape according to claim 1, wherein the layer that is dissolved in the resist removing solution and has adhesiveness is made of an acrylic resin. In the method of etching a plurality of substrates that are transported horizontally by the transport means, the edges in the transport direction of the adjacent substrates are connected to each other with the substrate connecting tape according to claim 1, An etching method characterized by performing alkali development and etching while transporting each connected substrate by a transport means, and then removing the resist by removing the resist so as to separate the substrates.

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