JP4097281B2 - 非接触ｉｄ識別装置用の巻線型コイルとｉｃチップとの接続構造及びこれを構成する接続方法 - Google Patents

非接触ｉｄ識別装置用の巻線型コイルとｉｃチップとの接続構造及びこれを構成する接続方法 Download PDF

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JP4097281B2
JP4097281B2 JP2006105177A JP2006105177A JP4097281B2 JP 4097281 B2 JP4097281 B2 JP 4097281B2 JP 2006105177 A JP2006105177 A JP 2006105177A JP 2006105177 A JP2006105177 A JP 2006105177A JP 4097281 B2 JP4097281 B2 JP 4097281B2
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chip
wound coil
contact
coil
identification device
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JP2007280015A5 (ja
JP2007280015A (ja
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勝治 星
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Star Engineering Co Ltd
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Star Engineering Co Ltd
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Priority to JP2006105177A priority Critical patent/JP4097281B2/ja
Priority to US12/225,293 priority patent/US20100230161A1/en
Priority to PCT/JP2007/056554 priority patent/WO2007116782A1/ja
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Description

本発明は、多くのサービス産業、物品販売業、製造業、物流業及び金融業等の種々の分野で、物品や人物に関する個体の自動認識の手段として用いられる非接触ＩＤ識別装置用の巻線型コイルとＩＣチップの接続端子とを接続する非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造、並びにこれを構成するための非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法に関するものである。
近年、個体の自動認識（自動ＩＤ識別）は、多くのサービス産業、物品販売業、流通業、製造業及び物流等の種々の産業分野で、取り扱う種々の物品やサービス、或いは関係する人物等の識別のために一般的に利用されるようになってきている。このような個体の自動認識の手段としてバーコード・ラベルが広く用いられてきたが、現在では、圧倒的に記憶容量が大きく、かつ再度プログラムが可能なＩＣカードが有力視され、これに移行しつつある。
前記ＩＣカードには、接触型と非接触型のそれがあるが、後者の非接触型のそれが、データキャリヤ装置への電力供給及びカード・リーダとデータキャリヤ装置との間のデータ交換に物理的接触を必要としないため、接触面の腐食の問題や汚れの問題が完全に回避可能となり極めて高い実用性が認められる。
前記非接触ＩＣカードに於いて、そのキャリヤ装置のアンテナコイルと対応するカード・リーダのアンテナとの最適電磁誘導結合を確保し、これによって確実な情報交換（電力供給）を行うためには、そのアンテナコイルの電気抵抗をできるだけ小さくすることが望まれる。そしてこのような観点からは、アンテナコイルの材料として、電気抵抗の大小の順に従って、銀、銅、金、アルミニウムがその順で相応しいことになるが、使用環境下での安定性及び経済的観点から銅が最も実用的なものとして選択されるべきものと考える。
このようなアンテナコイルの製法には、銅電線を巻線する方法（特許文献１、２、３）、銅箔をエッチングして形成する方法、導電性ポリマー・インクを用いた印刷による方法等がある。これらの内、銅箔エッチングによる方法は、フォトリソグラフィー技術を用いるものであるため量産性に富み、かつ低い電気抵抗のコイルが得られるが、その電気抵抗のばらつきが大きく、加えて製造工程で生じる廃水の処理の問題もある。また前記導電性ポリマー・インクを用いた印刷による方法も、エッチングによる方法と同様に、量産性には富むが、銀粉を用いるものは環境安定性に乏しく、金粉や金繊維を用いるものは経済的に競争力が乏しい上に、得られるコイルの電気抵抗が大きく実用性に乏しい。前記銅電線を用いて巻線する方法は、他の二者ほどの量産性はないが、得られるコイルの電気抵抗のばらつきが小さく、本発明者は、現時点では、安定して高性能の非接触ＩＣカードを提供する上で、最も優れたアンテナコイルの製造方法であると考えている。
他方、ＩＣチップの接続端子は、複数の金属を積層させたメタライゼーションによって構成されており、最下層から順に、チタン、タングステン及び金を積層させたＴｉ−Ｗ−Ａｕによる接続端子、Ｃｒ−Ｎｉ−Ａｇによる接続端子、Ｃｒ−Ｎｉ−Ａｕによる接続端子等を備えたＩＣチップが供給されている。それぞれＡｕやＡｇの最外層の金属の性質を考慮してコイルとの接続方法を選択すべきであるが、本発明者は、保管中の劣化の少ない最外層がＡｕであるメタライゼーションを備えた接続端子を採用することが好ましいと考えている。
前記のような銅電線を巻線する方法で製造された非接触ＩＣカード用巻線型コイルとＩＣチップの以上のような接続端子との接続方法には間接法と直接法とが知られている。この場合の間接法とは接続端子とコイルとの間に中間橋部材（インタポーザ）を介して接続する方法であり、直接法は、コイルと接続端子とを半田付けや導電性接着剤によって接続する方法である。
上記直接法の接続方法の内、半田付けによる接続方法には、レーザ（特許文献４）や抵抗溶接電源を用いたそれが知られているが、接続端子がＡｕ最外層のメタライゼーションを備えたものである場合には、半田とＡｕとの合金化による接合部の脆化の問題がある上に、半田の融点によって使用温度域が制限される。また前記熱圧着による接続方法には、コイルを構成する銅電線先端部にボールを安定して形成する技術が未完成であり、接合部の信頼性に不安がある。更にアルミニウム電線によく用いられる超音波溶接による接続方法には、コイルを構成する銅電線のアルミニウム電線に比べて大きな剛性によってチップ及び接続端子に損傷を与える虞があるという問題がある。
また前記間接法には、接続端子とコイルを構成する銅電線との間に別工程で製造される中間橋部材を用いることによるコストの上昇及び切断作業や接続個所の増加等の作業工数の増加の問題がある。更に中間橋部材は量産性が特に要求されるため、アンテナコイルの製造について述べた印刷法又はエッチング法を用いざるを得ず、既述のそれぞれに特有の欠点を有しており、使用条件が著しく制限される。
特開２００５−１８４４２７号公報 特開２００３−３０３７３１号公報 特開２００２−３５２２０３号公報 特開２００１−０４７２２１号公報
本発明は、以上の観点から、非接触ＩＤ識別装置用アンテナコイルとして、銅電線を巻線する方法で作成されたコイル抵抗のばらつきの少ない巻線型コイルを採用し、更にＩＣチップの接続端子として保管中の劣化の少ない最外層がＡｕであるメタライゼーションを備えたそれを用い、コストの低い直接法による相互の接続を選択し、かつこれを改良して電気的及び機械的に良好な接続を確保することのできる非接触ＩＤ識別装置用巻線型コイルとＩＣチップとの接続構造、並びにこれを容易かつ確実に作製することのできる非接触ＩＤ識別装置用巻線型コイルとＩＣチップとの接続方法を提供することを解決の課題とする。
本発明の１は、銅（Ｃｕ）製の巻線型コイルとＩＣチップの最外層が金（Ａｕ）で構成された接続端子とを、両者の界面付近に加熱加圧によって形成したＡｕ／Ｃｕ全率固溶体を介して、接合した非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造である。
本発明の２は、銅（Ｃｕ）製の巻線型コイルをＩＣチップの最外層が金（Ａｕ）で構成された接続端子に、前者を後者上に載せ、かつ前者の上から加熱しながら加圧し、両者の界面付近にＡｕ／Ｃｕ全率固溶体を形成させることにより、直接接合して、請求項１の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造を構成することとした、非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法である。
本発明の３は、本発明の２の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法に於いて、前記加熱しながら加圧する操作を傍熱型抵抗溶接によって行うこととしたものである。
本発明の４は、本発明の２又は３の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法に於いて、前記加熱しながら加圧する操作に於ける加熱温度及び加圧力を、それぞれ、前記巻線型コイルと前記ＩＣチップの接続端子との相互の界面付近にＡｕ／Ｃｕ全率固溶体を形成させ得るように実験的に決定することとしたものである。
本発明の５は、本発明の２又は３の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法に於いて、前記加圧を、塑性変形後の巻線型コイルの該当部位の厚さｔと変形前の線径Ｄとの比率ｔ／Ｄが、０．１を越え、かつ０．８以下となるように設定したものである。
本発明の１の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造によれば、巻線型コイルとＩＣチップの接続端子とを、前者と後者の最外層のＡｕ膜との界面付近に形成したＡｕ／Ｃｕ全率固溶体を介して接続するものであるため、その高い機械的強度の接続を確保し、かつ良好な電気的接続を確保することができる。先に述べた半田付けその他を用いた接合の場合の諸問題の発生の余地がないのは云うまでもない。
本発明の２の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法によれば、巻線型コイルとＩＣチップの接続端子の最外層のＡｕ膜との界面付近に容易かつ確実にＡｕ／Ｃｕ全率固溶体を形成することが可能であり、これによって低コストで良好に本発明の１の非接触ＩＣカード用巻線型コイルとＩＣチップとの接続構造を作製することができる。
本発明の３の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法によれば、加熱しながら加圧する操作を傍熱型抵抗溶接によって行うこととしたため、電極を高抵抗で耐熱性の良い金属で適切に構成することにより、実用レベルの電流を流すことで、所望の高温度を容易に発生し得、ＩＣチップの接続端子上に配した巻線型コイルに必要な熱量及び加圧力を容易に加えることができる。
本発明の４の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法によれば、ＩＣチップの接続端子上に配した巻線型コイルに加える温度及び加圧力を容易かつ適切に設定することができる。
本発明の５の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法によれば、ＩＣチップの接続端子と巻線型コイルとの安定した接合強度が得られる。
本発明は、図３及び図４に示すように、銅製の巻線型コイル１とＩＣチップ２の最外層がＡｕ膜（金膜）３ａで構成された接続端子３とを、両者の界面付近に加熱加圧によって形成したＡｕ／Ｃｕ全率固溶体の合金層５を介して、接合した非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造、並びに、図１に示すように、銅製の巻線型コイル１をＩＣチップ２の最外層がＡｕ膜３ａで構成された接続端子３に直接接合して該接属構造を作製する非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法である。
なお、該接続方法に於ける接続は、図１に示すように、巻線型コイル１を接続端子３上に載せた上で、前者の上から加熱しながら加圧する操作で行うものであり、これによって両者の界面付近にＡｕ／Ｃｕ全率固溶体の合金層５を形成させることにより、前記接続構造を作製し、巻線型コイル１と接続端子３との確実な接続を確保するものである。
前記非接触ＩＤ識別装置は、マイクロプロセッサを含むＩＣチップを内蔵するカード型又はタグ型ＩＤ識別装置であって、該ＩＣチップと外部のカードリーダとの間の電力の授受及び情報の交換を前記巻線型コイルを介して行う装置を云うものとする。
前記巻線型コイル１は、先に述べたように、銅製の電線で作製するものであるが、この銅製電線は、通常、銅芯線１ｂを絶縁膜１ａで被覆したものであり、それ故、該銅製電線は、その銅芯線１ｂが、云うまでもなく、実質的に銅製である電線を称するものとする。従って、意図の有無を問わず導電率が純銅のそれの±１０％以内となる少量の不純物を含む銅芯線１ｂを備えた銅製電線も当然この範疇に属する。なお前記絶縁膜１ａは、種々の熱可塑性樹脂によって構成されている。
前記ＩＣチップ２の接続端子３は、前記したように、その最外層がＡｕ膜３ａで構成されている必要があるが、中間層３ｂ及び最下層３ｃの金属の種類は限定されない。この技術分野でよく知られているように、概ね、最下層３ｃはチップ２とのオーミック接合を確保する趣旨で、中間層３ｂはＡｕ膜３ａと最下層３ｃとの相互拡散を阻止する趣旨で素材が選択される。この種の接続端子３を構成するメタライゼーションは、前記したように、最下層からＴｉ−Ｗ−Ａｕの順で、Ｃｒ−Ｎｉ−Ａｇの順で、或いはＣｒ−Ｎｉ−Ａｕの順で、それぞれ積層被覆したもの等が供給されているが、これらの内では、Ｔｉ−Ｗ−Ａｕの順で積層被覆したもの又はＣｒ−Ｎｉ−Ａｕの順で積層被覆したものが採用可能である。
なお最外層の金（Ａｕ）は、通常、カラット法で云う２４金が採用されるが、その純度は９９．９９％以上である。もっともここで云う金は、このような純度のものに限定されるわけではなく、実質的に金と称することができる純度のそれの全てを指すものである。
前記加熱しながら加圧する操作は、前記巻線型コイル１の所定部位を接続端子３上に載せた上で、図１に示すように、前者の上から行うものであり、これによって、図３及び図４に示すように、両者の界面付近にＡｕ／Ｃｕ全率固溶体の合金層５を形成させることができる手段を自由に採用することができる。
例えば、この手段として、図１に示すように、傍熱型抵抗溶接を採用し、その電極４で、これに、矢印ａ１に示すように電流を流して発熱させ、その熱を矢印ａ２に示すように該電極４から巻線型コイル１及びこれを介した接続端子３に伝えながら、矢印ａ３に示すように、該電極４で該巻線型コイル１を加圧する方法を採用することができる。これを採用した場合は、電極４を高抵抗で耐熱性の良い、例えば、タングステン（Ｗ）やモリブデン（Ｍｏ）等の金属で適切に構成すれば、実用レベルの電流で、所望の高温度を容易に発生し得、ＩＣチップ２の接続端子３上に配した巻線型コイル１に必要な加熱及び加圧を行うことができる。
なお、前記したように、通常、前記巻線型コイル１は銅芯線１ｂを絶縁膜１ａで被覆した銅製電線で構成されているため、以上の場合に、前記電極４による加熱で該絶縁膜１ａが溶融して接続端子３のＡｕ膜と銅芯線１ｂとの界面から排除され、該界面付近にＡｕ／Ｃｕ全率固溶体の合金層５が形成され得ることになる。
なお、このような加熱・加圧操作として、直熱型パラレルギャップ抵抗溶接を用いるのは不適当である。それは、巻線型コイル１の所定部位の絶縁膜１ａを予め除去して電気的接続を確保するという厄介な作業の必要性がある上に、該巻線型コイルの銅芯線１ｂとこれを載置する接続端子３との接触面間の電気抵抗が極めて小さいため、これらの間にその発熱のために供給し得る実用的な電流で、該接触面に十分な発熱量を得ることができないからである。また、二つの電極の内の一方は巻線型コイル１の銅芯線１ｂに当接接触させるものであるが、他方は、当然、接続端子３に接触させなければならず、それ故、接続端子３にそのための接触エリアを確保する必要があり、接続端子３が大型化するからである。以上のような理由から、前記したように、このような場合に直熱型パラレルギャップ抵抗溶接は実用性を認めることができない。
また前記Ａｕ／Ｃｕ全率固溶体の合金層５を形成させる「界面付近」は、銅製の巻線型コイル１の所定部位と接続端子３との当接面の範囲の観点からは、その全面積の内の少なくとも１／２以上の面積を占めるエリアであり、このエリアはできるだけ広いことが望ましい。該当接面の両側の範囲の観点からは、当接界面から数原子層から数十原子層の厚さの範囲であり、この範囲で前記Ａｕ／Ｃｕ全率固溶体の合金層５が形成されれば実用上十分な接着強度が得られる。
前記加熱しながら加圧する操作に於ける加熱温度及び加圧力は、それぞれ、前記巻線型コイル１と前記ＩＣチップ２の接続端子３との相互の界面付近にＡｕ／Ｃｕ全率固溶体の合金層５を形成させ得るように、実験的に決定する。より具体的には、前記加熱温度は、前記傍熱型抵抗溶接に於ける電極４を含む加熱加圧手段を接続端子３上の巻線型コイル１に当接し、その熱を該巻線型コイル１→接合面→Ａｕ膜３ａと伝達した場合に、加圧された該巻線型コイル１の銅芯線１ｂをＡｕ膜３ａに対して相対的に塑性流動させ得る温度とすべきものであり、絶縁膜１ａを溶融させてＡｕ膜３ａと銅芯線１ｂとの界面で金と銅との原子を直接接触させ得る温度とすべきものである。一方、銅芯線１ｂの表面を酸化させたり、ＩＣチップ２に損傷を与えることのない温度とすべきでもある。また前記加圧力は、同様の場合に、十分に塑性流動させ得ると共に、ＩＣチップ２に損傷を与えることのないそれとすべきである。
前記加熱温度は、以上のように制御すべきものであるが、前記のように、傍熱型抵抗溶接法を用いる場合は、これに供給する電流及び供給時間を制御し、これによって発生する熱量を制御し、それによって得られた接合結果からより適切な電流値及び供給時間を決定するというやり方が適当である。またこのような電流の制御は通常電圧を制御することによって行うことになる。それ故、加熱温度の制御は、多くの場合、直接的には、電極４に加える電圧及び印加時間を適切な加熱温度に対応する電圧及び印加時間に制御することで行うことになる。
電線の元の線径φＤに対する塑性変形後の厚さｔの割合は、接合部の信頼性を左右する重要なパラメータであることが知られている。Ａｕ膜３ａ及び銅芯線１ｂの融点より著しく低い温度で接続が行われる本発明の接続方法では特に重要である。これは、材料の種類、組み合わせ、材料の性質に左右されるが、本件の最外層がＡｕ膜３ａである接続端子３と銅製の巻線型コイル１との組み合わせについては、図５に示すように、ｔ／Ｄ（電線の元の線径φＤに対する塑性変形後の厚さｔの比率）は０．１を越え、かつ０．８以下の広い範囲で安定した接合強度が得られている。
前記加圧力は、各々の融点以下の比較的低い温度（実験結果からは５００℃以下の界面温度と推定される）での金と銅の原子の相互拡散をその界面近傍に於ける塑性流動によって助長・促進させるためには、前記のような塑性変形の範囲内になるように設定すべきものである。もっともｔ／Ｄが０．１に近づくと接続端子３を介してＩＣチップ２にストレスがかかり、チップ不良率が若干高くなる傾向があるので、近づきすぎないようにするのが好ましい。
従って本発明の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造、並びに、非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法によれば、巻線型コイル１とＩＣチップ２の接続端子３とについて、前者の銅芯線１ｂと後者の最外層のＡｕ膜３ａとの界面付近にＡｕ／Ｃｕ全率固溶体の合金層５を形成することにより、低コストで高い接着強度の機械的接続を確保し、かつ電気的にも良好な接続を確保することができる。より具体的に述べれば、巻線型コイル１とＩＣチップ２の接続端子３との接合部の融点が、その界面付近に形成したＡｕ−Ｃｕ全率固溶体の合金層５により、１０００℃を越え、該接合部の半田を介した接続の欠点である、低い使用可能温度域の問題や脆い化合物層形成の問題も回避されるので、その信頼性は著しく高いものとなる。
図１に示すように、巻線型コイル１として銅芯線１ｂに絶縁膜１ａを施した銅電線で作製したそれを採用し、該巻線型コイル１の所定部位をＩＣチップ２の接続端子３の最外層のＡｕ膜３ａ上に載置した上で、その巻線型コイル１の上から電極４を当接させ、該電極４に電流を流して発熱させつつ加圧した。
＜接合対象＞
巻線型コイル１の線径：φ７０μｍ±３μｍ（絶縁膜１ａ：ポリウレタン皮膜）
ＩＣチップ２：□１０００μｍ、Ｔｉ−Ｗ−Ａｕ（接続端子３、Ａｕ膜３ａの厚さ１０ μｍ）
＜加熱・加圧手段＞
電極４：Ｗ（タングステン）製、傍熱型
＜溶接条件＞
溶接電圧：１．８Ｖ
通電時間：０．５秒
加圧力 ：８０ｇ
以下の表１に示すように、この実施例１によって接合したＩＣチップ２の接続端子３と巻線型コイル１との接合には、従来の半田付け、熱圧着及び超音波溶接によって接合した場合と比較して、いずれにも劣らない十分に強力な接着強度が得られ、かつ温度サイクル不良率も極めて低く、これによって本発明の有効性が理解される。
Figure 0004097281
以上の表１に示した半田付け、熱圧着及び超音波溶接の接合部に対する測定結果は、いずれも実施例１と同様の巻線型コイルをＩＣチップの接続端子に、それぞれそれらの標準的な方法で接合操作を行って得た接合部に対するものである。
＜表１及び以下の表２に示した接着強度の測定方法＞
感度１Ｎのデジタル・テンション・ゲージを用い、ＩＣチップを固定した状態で、室温に於いて、コイルを接続端子面に垂直な方向に引っ張って、該コイルと該接続端子の接続部が剥がれるか又はコイルが切れた時のゲージの読みをその接続部の接着強度とした。
＜表１及び以下の表２に示した温度サイクルの測定方法＞
温度サイクル恒温槽にＩＤ識別装置を配置し、−５５℃と１５０℃の間を往復する温度サイクルを２時間に１回の割合で１００サイクル繰り返し、試験終了後にＩＤ識別装置の感度特性を測定して合否を判定した。不合格品の内、接続端子とコイルの接続部の不良であることが確認されたものを不良品とした。
巻線型コイル１として銅芯線１ｂに絶縁膜１ａを施した銅電線で作製したそれを採用し、該巻線型コイル１の所定部位とＩＣチップ２の接続端子３との接合を、実施例１と同様の操作で行った。
＜接合対象＞
巻線型コイル１の線径：φ６０μｍ±３μｍ（絶縁膜１ａ：ポリウレタン被膜）
ＩＣチップ２：□９００μｍ、Ｃｒ−Ｎｉ−Ａｕ（接続端子３、Ａｕ膜３ａの厚さ１５ μｍ）
＜加熱・加圧手段＞
電極４：Ｍｏ（モリブデン）製、傍熱型
＜溶接条件＞
溶接電圧：１．１Ｖ
通電時間：０．９秒
加圧力 ：７０ｇ
以下の表２に示すように、この実施例２によって接合したＩＣチップ２の接続端子３と巻線型コイル１との接合には、実施例１のそれと同様に、十分な接着強度が得られ、かつ温度サイクル不良率も極めて低い。これによって更に本発明の有効性が理解される。
Figure 0004097281
以上の表２に示した中間橋部材法による接合部は、ＩＣチップの接続端子と巻線型コイルとを錫メッキを施した銅製のリードフレームを介して接続したものであり、ＩＣチップの接続端子とリードフレームの一端とは導電性接着剤で接着し、リードフレームの他端と巻線型コイルとは半田付けによって接合したものである。この半田付けは標準的な操作で行ったものである。また以上の表２に示した中間橋部材法の接合部についての測定結果は、以上のようにして作製した接合部に対するものである。
本発明の実施の態様を示す断面説明図。 本発明を実施して得た接合部の平面側から見た概略斜視説明図。 図２のＡ−Ａ線概略断面説明図。 図２のＢ−Ｂ線概略断面説明図。 接合部の接合強度及びチップ不良率とｔ／Ｄとの関係を示す表図。
符号の説明
１ 巻線型コイル
１ａ 絶縁膜
１ｂ 銅芯線
２ ＩＣチップ
３ 接続端子
３ａ Ａｕ膜（金膜）
３ｂ 中間層
３ｃ 最下層
４ 電極
５ Ａｕ／Ｃｕ全率固溶体の合金層
ａ１ 電流の流れる方向を示す矢印
ａ２ 熱の伝達方向を示す矢印
ａ３ 加圧方向を示す矢印

Claims (5)

  1. 銅（Ｃｕ）製の巻線型コイルとＩＣチップの最外層が金（Ａｕ）で構成された接続端子とを、両者の界面付近に加熱加圧によって形成したＡｕ／Ｃｕ全率固溶体を介して、接合した非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造。
  2. 銅（Ｃｕ）製の巻線型コイルをＩＣチップの最外層が金（Ａｕ）で構成された接続端子に、前者を後者上に載せ、かつ前者の上から加熱しながら加圧し、両者の界面付近にＡｕ／Ｃｕ全率固溶体を形成させることにより、直接接合して、請求項１の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続構造を構成することとした、非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法。
  3. 前記加熱しながら加圧する操作を傍熱型抵抗溶接によって行うこととした請求項２の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法。
  4. 前記加熱しながら加圧する操作に於ける加熱温度及び加圧力を、それぞれ、前記巻線型コイルと前記ＩＣチップの接続端子との相互の界面付近にＡｕ／Ｃｕ全率固溶体を形成させ得るように実験的に決定する請求項２又は３の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法。
  5. 前記加圧を、塑性変形後の巻線型コイルの該当部位の厚さｔと変形前の線径Ｄとの比率ｔ／Ｄが、０．１を越え、かつ０．８以下となるように設定した請求項２又は３の非接触ＩＤ識別装置用の巻線型コイルとＩＣチップとの接続方法。
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