JP4084393B2 - 部品実装装置および部品実装方法 - Google Patents

部品実装装置および部品実装方法 Download PDF

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Publication number
JP4084393B2
JP4084393B2 JP2006149488A JP2006149488A JP4084393B2 JP 4084393 B2 JP4084393 B2 JP 4084393B2 JP 2006149488 A JP2006149488 A JP 2006149488A JP 2006149488 A JP2006149488 A JP 2006149488A JP 4084393 B2 JP4084393 B2 JP 4084393B2
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Japan
Prior art keywords
substrate
suction
glass substrate
edge
suction pad
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Expired - Fee Related
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JP2006149488A
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English (en)
Japanese (ja)
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JP2006319345A5 (enExample
JP2006319345A (ja
Inventor
本 眞 一 荻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2006149488A priority Critical patent/JP4084393B2/ja
Publication of JP2006319345A publication Critical patent/JP2006319345A/ja
Publication of JP2006319345A5 publication Critical patent/JP2006319345A5/ja
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Publication of JP4084393B2 publication Critical patent/JP4084393B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2006149488A 2000-01-31 2006-05-30 部品実装装置および部品実装方法 Expired - Fee Related JP4084393B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006149488A JP4084393B2 (ja) 2000-01-31 2006-05-30 部品実装装置および部品実装方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000021491 2000-01-31
JP2006149488A JP4084393B2 (ja) 2000-01-31 2006-05-30 部品実装装置および部品実装方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001557351A Division JP3828808B2 (ja) 2000-01-31 2001-01-31 部品実装装置および部品実装方法

Publications (3)

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JP2006319345A JP2006319345A (ja) 2006-11-24
JP2006319345A5 JP2006319345A5 (enExample) 2007-12-06
JP4084393B2 true JP4084393B2 (ja) 2008-04-30

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ID=37539675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006149488A Expired - Fee Related JP4084393B2 (ja) 2000-01-31 2006-05-30 部品実装装置および部品実装方法

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JP (1) JP4084393B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008182111A (ja) * 2007-01-25 2008-08-07 Juki Corp 基板固定装置
JP5062204B2 (ja) * 2009-03-10 2012-10-31 パナソニック株式会社 部品実装基板の検査方法と装置及び部品実装装置
US8962084B2 (en) * 2012-05-31 2015-02-24 Corning Incorporated Methods of applying a layer of material to a non-planar glass sheet
JP6413078B2 (ja) * 2014-10-20 2018-10-31 パナソニックＩｐマネジメント株式会社 部品搭載装置
KR20180045666A (ko) * 2016-10-26 2018-05-04 삼성전자주식회사 기판 제조 장치
JP6461235B2 (ja) * 2017-05-22 2019-01-30 キヤノントッキ株式会社 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法
CN116403929A (zh) * 2021-12-28 2023-07-07 拓荆键科(海宁)半导体设备有限公司 调整卡盘形变的系统及装置

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Publication number Publication date
JP2006319345A (ja) 2006-11-24

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