JP4079151B2 - 研磨方法 - Google Patents

研磨方法 Download PDF

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Publication number
JP4079151B2
JP4079151B2 JP2005015113A JP2005015113A JP4079151B2 JP 4079151 B2 JP4079151 B2 JP 4079151B2 JP 2005015113 A JP2005015113 A JP 2005015113A JP 2005015113 A JP2005015113 A JP 2005015113A JP 4079151 B2 JP4079151 B2 JP 4079151B2
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JP
Japan
Prior art keywords
polishing
wafer
dressing
tool
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2005015113A
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English (en)
Japanese (ja)
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JP2005153141A (ja
JP2005153141A5 (enrdf_load_stackoverflow
Inventor
克典 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
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Yamaha Corp
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Priority to JP2005015113A priority Critical patent/JP4079151B2/ja
Publication of JP2005153141A publication Critical patent/JP2005153141A/ja
Publication of JP2005153141A5 publication Critical patent/JP2005153141A5/ja
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Publication of JP4079151B2 publication Critical patent/JP4079151B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2005015113A 2005-01-24 2005-01-24 研磨方法 Expired - Fee Related JP4079151B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005015113A JP4079151B2 (ja) 2005-01-24 2005-01-24 研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005015113A JP4079151B2 (ja) 2005-01-24 2005-01-24 研磨方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9054096A Division JP3697775B2 (ja) 1996-03-19 1996-03-19 研磨装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007318981A Division JP4803167B2 (ja) 2007-12-10 2007-12-10 研磨装置

Publications (3)

Publication Number Publication Date
JP2005153141A JP2005153141A (ja) 2005-06-16
JP2005153141A5 JP2005153141A5 (enrdf_load_stackoverflow) 2005-09-08
JP4079151B2 true JP4079151B2 (ja) 2008-04-23

Family

ID=34737565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005015113A Expired - Fee Related JP4079151B2 (ja) 2005-01-24 2005-01-24 研磨方法

Country Status (1)

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JP (1) JP4079151B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009248282A (ja) * 2008-04-10 2009-10-29 Showa Denko Kk 研磨装置及び研磨補助装置、ならびに、研磨方法
US9238293B2 (en) * 2008-10-16 2016-01-19 Applied Materials, Inc. Polishing pad edge extension
CN106737129A (zh) * 2016-12-16 2017-05-31 中国科学院长春光学精密机械与物理研究所 可调转速比的平面研磨装置
CN110549242B (zh) * 2018-05-31 2020-10-23 许栋梁 全向整合式调节装置
JP2024085517A (ja) * 2022-12-15 2024-06-27 株式会社荏原製作所 研磨装置

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Publication number Publication date
JP2005153141A (ja) 2005-06-16

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