JP4076092B2 - Barrel plating barrel, barrel plating apparatus, and electronic component manufacturing method using the same - Google Patents

Description

  The present invention relates to a barrel plating barrel, a barrel plating apparatus, and an electronic component manufacturing method using the barrel plating apparatus.

  2. Description of the Related Art Conventionally, there is a barrel plating apparatus as an apparatus for performing plating on small electronic components such as plating formation of external electrodes in ceramic electronic components (see Patent Document 1). Such a barrel plating apparatus includes a polygonal cylindrical barrel that is rotatably supported, and an object to be plated is placed in the barrel plating apparatus so that the barrel is immersed in a plating solution. And while rotating a barrel in plating solution, it supplies with electricity to a to-be-plated object, and it plates on the surface.

In general, as shown in FIG. 6, the conventional barrel typically has a polygonal cylindrical barrel 121, a mesh member 131 that is retrofitted thereto, and both sides of the barrel in the rotational axis direction. And a pair of side wall portions (not shown) provided. Plating flow holes suitable for the flow of the plating solution are formed in the polygonal configuration surface of the body 121. Further, the mesh member 131 allows the plating solution to flow and restricts the passage of the object to be plated. The mesh member 131 is prepared in such a form as to cover the polygonal construction surface for each polygonal construction surface, and each mesh material 131 is placed inside the corresponding polygonal construction surface by an adhesive from the inside of the body portion. It is pasted. Accordingly, the plating solution is allowed to flow between the inside and outside of the body portion, while the object to be plated accommodated in the body portion 121 is designed not to spill out of the body portion 121. Has been.
Japanese Patent Laid-Open No. 10-317198

  However, in the above-described conventional barrel, the mesh 131 is attached to the inner side of the body portion 121 with an adhesive. Therefore, the unevenness after the adhesive is solidified, the unevenness due to the distortion of the bonded mesh 131, and the mesh There is a problem in that an object to be plated is caught at a joint between 131 and the like, resulting in poor plating. As in recent years, when the object to be plated is a small part that is mass-produced, it is likely to be caught easily because it interferes with small irregularities.

  This invention is made | formed in view of such a problem, and it aims at providing the barrel plating apparatus etc. which can eliminate the catch of a to-be-plated object.

  In order to solve the above-described problems, a barrel plating barrel according to the present invention includes a barrel portion configured in a polygonal cylindrical shape, a pair of side wall portions provided on both sides in the rotation axis direction of the barrel portion, A plurality of panel parts attached to the body part, the body part having a frame part forming a polygonal corner part and a mesh part bridging between the corner parts, the mesh part being covered It has a porosity for distribution of the plated material, the panel portion has a porosity for distribution of the plating solution, the frame portion and the mesh portion are configured as an integrally molded product, and the panel portion The frame portion is separate from the frame portion and is attached so as to cover the mesh portion.

  At least one of the pair of side wall portions may be detachable from the body portion.

  It is preferable that a built-up portion for preventing the object to be plated is provided at a portion where the inner surface of the body portion and the inner surface of the side wall portion intersect.

  The frame part and the mesh part are preferably made of the same material.

  It is preferable that the panel portion is detachably attached.

  The present invention that achieves this object also provides a barrel plating apparatus. The barrel plating apparatus of the present invention includes a barrel plating barrel and support means for rotatably supporting the barrel, and the barrel is the barrel according to the present invention described above.

  The present invention that achieves the above object further provides a method of manufacturing an electronic component.

  The method for manufacturing an electronic component according to the present invention includes preparing the barrel plating barrel according to the present invention described above, housing an electronic component as an object to be plated in the barrel plating barrel, and plating the barrel plating barrel. It includes immersing in a liquid and plating an electronic component. Or the manufacturing method of the electronic component of this invention includes plating to the electronic component as a to-be-plated object using the barrel plating apparatus which concerns on this invention mentioned above.

  According to the above-described present invention, since no adhesive is used and no irregularities or seams are generated in the barrel, it is possible to reliably prevent the object to be plated from being caught.

  In addition, when at least one of the side wall portions is detachable from the body portion, it is possible to have an entrance / exit for the object to be plated on one side in the rotation axis direction, not on one side of the polygonal configuration surface, Easy to put in and take out the object to be plated. Further, such a position of the entrance / exit is suitable for integral molding of the body portion.

  Moreover, when the above-mentioned build-up part is provided, it is avoided that a right-angled corner part arises in a barrel, and the catch prevention effect of a to-be-plated thing is further improved.

  When the frame portion and the mesh portion are made of the same material, the mesh portion can be transferred to recycling without being separated from the frame portion.

  When the panel part is detachably attached, it is possible to prepare a barrel having optimized pores for circulating the plating solution only by replacing the panel part without recreating the whole barrel.

  The other features of the present invention and the operational effects thereof will be described in more detail with reference to the accompanying drawings.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings. In the drawings, the same reference numerals indicate the same or corresponding parts.

  FIG. 1 is a cross-sectional view of a main part of the barrel plating apparatus according to the present embodiment. The barrel plating apparatus 1 includes at least a barrel 3 and support means 5. The barrel 3 is a member configured in a polygonal cylindrical shape as will be described later.

  The support means 5 supports this barrel 3 rotatably. First, the support means 5 has a bearing 7 that rotatably supports the end portion of the barrel 3 on one side of the barrel 3 in the rotation axis direction (right side in FIG. 1). Further, the support means 5 has a support shaft portion 9 on the other side (left side in FIG. 1) of the barrel 3 in the rotation axis direction.

  A sprocket 11 is fitted on the outer periphery of the support shaft portion 9, and the support shaft portion 9 supports the barrel 3 via the sprocket 11 so as to be rotatable. A bearing 13 is disposed between the support shaft portion 9 and the sprocket 11. The sprocket 11 is engaged with known power transmission means (not shown), and the barrel 3 is rotated by the driving force input to the sprocket 11.

  Further, a cathode terminal 15 is inserted through the support shaft portion 9. The cathode terminal 15 extends into the barrel 3. The cathode terminal 15 has a shape that is gently curved in the barrel 3 so that the tip side is located below the root side.

  Next, the structure of the barrel will be described with reference to FIGS. 2, 3 and 4. FIG. 2 is a perspective view of the barrel. 3 is a side view of the barrel, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 3 shows the barrel in a state in which a mesh portion can be visually recognized without a panel portion to be described later attached.

  The barrel 3 includes a body portion 21, a pair of side wall portions 23 and 25, and a plurality of panel portions 27. First, the trunk | drum 21 is an octagonal cylindrical member as a whole. In other words, the body portion 21 is a cylindrical member having the rotation axis CL as an axis, and has an octagonal annular cross section as a cross-sectional shape orthogonal to the rotation axis CL. The trunk portion 21 is not a so-called tapered shape, but is a linear cylindrical member having an octagonal annular cross section that is the same over the rotation axis CL.

  A pair of side wall portions 23 and 25 are disposed on both sides of the body portion 21 in the rotation axis direction. More specifically, the barrel 3 can be seen as a cylindrical container having a bottom on one side in the rotation axis direction and an opening on the other side, that is, the side wall portion 23 is integrally formed with the barrel portion 21 and Make up the bottom. The other side wall 25 is detachably engaged with the body 21 and functions as a lid that opens and closes the opening of the barrel 3.

  In addition, annular portions 23a and 25a (see FIG. 1) are formed at portions where the inner surfaces of the side wall portions 23 and 25 and the inner surface of the body portion 21 intersect to prevent the object to be plated from being caught. Yes. This avoids the formation of right-angled corners between the side wall parts 23 and 25 and the body part 21 in the barrel 3. As will be described later, in this embodiment, since the side wall portion 25 and the body portion 21 are separate bodies, the built-up portion 25 a is formed on the inner surface side of the side wall portion 25.

  The trunk | drum 21 has the frame part 29 and the some mesh part 31, as FIG.3 and FIG.4 shows especially. The frame part 29 has a flange part 33 located on the opposite side to the side wall part 23 in the rotation axis direction, and eight corner parts 35 that are prepared due to the octagon.

  The flange portion 33 is an annular portion and is a portion that engages with the side wall portion 25. The eight corner portions 35 are portions constituting the corner portions related to the octagon, each having one end connected to the side wall portion 23 and the other end connected to the flange portion 33. Further, all the eight corner portions 35 extend in parallel with the rotation axis direction and are spaced apart from each other at equal intervals.

  Eight mesh portions 31 are formed due to the octagon and are provided so as to be bridged to a corresponding pair of corner portions 35. Each mesh portion 31 also extends in parallel with the rotation axis direction, like the corner portion 35, and has one end connected to the side wall portion 23 and the other end connected to the flange portion 33.

  In particular, as shown in FIG. 4, the thickness of each mesh portion 31 is thinner than the thickness of the corner portion 35, and the position of each mesh portion 31 is biased toward the inside of the trunk portion 21. That is, as a result, the outer surface of the mesh portion 31 is at a position deeper than the outer surface of the corner portion 35, and eight concave portions 37 are formed on the outer periphery of the trunk portion 21 due to the difference in the outer surface position. On the other hand, the inner side of the body portion 21 has only eight flat octagonal constituent surfaces.

  Each mesh part 31 is a flat part. The mesh portion 31 is provided with a large number of through holes that open on the front and back surfaces thereof. Each of the pores has an outer shape through which the plating solution can flow and the object to be plated cannot flow. Thereby, between the inside and the outside of the mesh portion 31, the entry and exit of the object to be plated is restricted, and the distribution of the plating solution is allowed. Moreover, it is suppressed that a to-be-plated object adheres to the inner surface of the mesh part 31 as a porous effect.

  Note that the mesh portion 31 is not limited to the mesh as well as the net-like one generally called a mesh, but the plating solution can be circulated as described above, and the object to be plated cannot be circulated. The thing which has the hole for the distribution | circulation regulation of to-be-plated thing which has such an external shape shall also be included.

  The panel unit will be described with reference to FIGS. FIG. 5 is an overall view of the panel unit alone, (a) is a plan view seen from the outer surface, and (b) is a side view seen from the arrow V. FIG.

  In the present embodiment, eight panel portions 27 are prepared corresponding to the mesh portions in other words due to the octagon. Each panel portion 27 is a plate-like member having a rectangular front and back surface. Each panel portion 27 is provided with a large number of through-holes opened on the front and back surfaces. Each of the pores 39 (see FIG. 5) is formed so that the plating solution can flow therethrough.

  Aspects such as the form, the aperture ratio, the formation position, the number of formations, and the like relating to the porous 39 for circulating the plating solution are not particularly limited. FIG. 5A is merely an example, and a suitable one can be appropriately selected according to the characteristics of the plating solution and the intended distribution mode (how the solution enters and exits and how to cut).

  The panel part 27 is separate from the body part 21 such as the frame part 29 and is attached from the outside of the body part 21 so as to cover the corresponding mesh part 31 as shown in FIG. As an attachment mode, each panel part 27 is attached to the trunk | drum 21 so that attachment or detachment is possible. As a specific example, it is attached by ultrasonic welding.

  The thickness of each panel portion 27 is set to be substantially the same as the depth of the concave portion 37 formed on the outer surface of the trunk portion 21, and thus the panel portion 27 is attached in the concave portion 37 so as to cover the mesh portion 31. In the state, the outer surfaces of the panel portion 27 and the frame portion 29 are aligned, and the barrel 3 has a cylindrical portion having a constant thickness.

  Moreover, the frame part 29 and the mesh part 31 which were mentioned above are comprised by the same material, and are comprised by the polypropylene or polyethylene as a specific example.

  Furthermore, the frame part 29 and the mesh part 31 are not integrally joined separately, but are constituent parts of the barrel 3 formed by integral molding from the beginning. Specifically, it is integrally formed by injection molding (mesh insert molding).

  Next, the barrel plating apparatus having the above-described configuration, the operation of the barrel, and a method for manufacturing an electronic component using the barrel will be described. In addition, as an example of the manufacturing method of the electronic component, a method including a plating forming step of the external electrode in the ceramic electronic component can be mentioned. In this case, the steps other than the plating step may be well known. Therefore, the description thereof is omitted, and a detailed description will be given from the plating step described later.

  First, an object to be plated such as a ceramic electronic component (and, if necessary, a dummy ball) is placed in the barrel 3 through an opening formed by separating the side wall 25 from the body 21. Then, the barrel 3 is immersed in the plating solution. While rotating the barrel 3 in the plating solution, the surface of the object to be plated is energized through the cathode terminal 15 to perform plating.

  When plating is completed, the barrel 3 is lifted from the plating solution. Thus, the plating solution that has entered the barrel 3 flows out of the barrel 3 through the pores 39 for restricting the distribution of the plating object in the mesh portion 31 and further through the pores 39 for distributing the plating solution in the panel portion 27. It falls due to its own weight. Here, in order to promote the outflow of the plating solution, air may be blown to the barrel 3 to positively create an air passage.

  In this way, when one or more times of plating is completed and the discharge of the plating solution in the barrel 3 is completed, the side wall portion 25 is removed from the barrel portion 21, and the barrel portion 21 is covered from one end side in the rotation axis direction. Remove the plating.

  Here, in the conventional barrel shown in FIG. 6, since the mesh 131 is attached to the inner side of the body 121 with an adhesive, there is a possibility that the object to be plated may be caught on the unevenness of each part or the joint between the meshes 131. there were. On the other hand, in the present invention, since the mesh portion 31 is formed by mesh insert molding together with the frame portion 29, the object to be plated can be prevented from being caught.

  That is, first, no adhesive is used when the mesh portion 31 is provided on the trunk portion 21. In the first place, since the mesh portion 31 is integrally formed with the frame portion 29, there is no joint between the mesh portions 31 or between the mesh portion 31 and the frame portion 29. Thus, what is considered to be a cause of the catch of the object to be plated does not exist inside the body portion 21 of the present invention, so that the object to be plated is caught in the barrel 3 during the plating process or when the object to be plated is taken in or out. Can be prevented.

  Further, a panel portion 27 is attached to the body portion 21 so as to cover the mesh portion 31. Therefore, even if the mesh portion 31 forms a part of the integrally formed portion constituting the trunk portion 21, sufficient strength is ensured for the trunk portion 21. In addition, since these panel portions 27 cover the mesh portion 31 from the outside, the inside of the barrel 3 does not cause irregularities or joints, and the object to be plated is not caught.

  Furthermore, since the panel part 27 is detachable, it is possible to prepare a barrel having optimized pores for circulating a plating solution by simply replacing the panel part without recreating the entire barrel.

  In addition, annular build-up portions 23a and 25a are formed at portions where the inner surfaces of the side wall portions 23 and 25 and the inner surface of the body portion 21 intersect to prevent the object to be plated from being caught. Therefore, the occurrence of a right-angled corner in the barrel 3 is avoided, and the effect of preventing the object to be plated from being caught is further enhanced.

  In addition, since the outlet for the object to be plated is provided on one side in the direction of the rotation axis instead of one side of the polygonal configuration surface like the barrel disclosed in Patent Document 1, it is easy to take in and out the object to be plated. It has become. In addition, this has combined with the fact that the trunk portion 21 has a straight cylindrical shape instead of a tapered shape, thereby realizing better loading and unloading. Furthermore, such a position of the entrance / exit is also suitable for mesh insert molding of the body portion 21.

  In addition, the body of the present embodiment is very advantageous for recycling. That is, in the conventional mesh application mode shown in FIG. 6, it is necessary to peel off the mesh and adhesive applied at the time of recycling. However, in this embodiment, the mesh part 31 and the frame part 29 are made of the same material. Therefore, recycling can be started as it is.

  Thus, in the barrel plating apparatus and its barrel according to the present embodiment, there are many excellent effects, and in particular, no adhesive is used, and unevenness and seams are not generated in the barrel. Can be reliably prevented.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. It is self-explanatory.

  For example, the octagonal aspect shown in the embodiment is merely an example and is not particularly limited. Moreover, both of a pair of side wall parts may be removable with respect to a trunk | drum.

  Moreover, the structure of the support means of a barrel is an illustration to the last, and if it can support a barrel rotatably, it is not limited to the structure of illustration.

  Barrel plating as used in the present invention refers to an embodiment in which the above-described barrel is used regardless of electrolytic plating or electroless plating, and an object to be plated is accommodated therein and immersed in a plating solution for plating. To do. That is, the barrel plating barrel and barrel plating apparatus of the present invention are applied to such a plating mode. Therefore, the presence or absence of the cathode terminal and the configuration of the cathode terminal are not particularly limited.

  Moreover, although the aspect which forms the external electrode in a ceramic electronic component in the plating process was illustrated as a manufacturing method of an electronic component, this invention is not limited to this. That is, it does not matter whether the electronic component is a ceramic component, and the plating step may be a step of forming any portion as long as it is a conductive portion.

It is sectional drawing of the barrel plating apparatus principal part which concerns on embodiment of this invention. It is a perspective view of the barrel which concerns on this Embodiment. It is a side view of the barrel which concerns on this Embodiment. It is sectional drawing which follows the IV-IV line of FIG. It is a general view of the panel part single-piece | unit which concerns on this Embodiment, (a) is the top view seen from the outer surface, (b) is the side view seen from arrow V. It is an aspect of a conventional barrel configuration.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Barrel plating apparatus 3 Barrel 5 Support means 21 Trunk part 23, 25 Side wall part 23a, 25a Overlay part 27 Panel part 29 Frame part 31 Mesh part 35 Corner part (corner part)
39 Porous for plating solution distribution

Claims (6)

A barrel configured in a polygonal cylinder;
A pair of side wall portions provided on both sides of the barrel portion in the rotation axis direction;
A plurality of panel parts attached to the body part;
The body portion includes a frame portion that forms a polygonal corner portion, and a mesh portion that bridges between the corner portions,
The mesh portion has a porosity for regulating the flow of the object to be plated, and the panel portion has a porosity for the circulation of the plating solution,
The frame portion and the mesh portion are configured as an integrally molded product,
The panel part is separate from the frame part, and is attached so as to cover the mesh part ,
At least one of the pair of side wall portions can be attached to and detached from the body portion,
The barrel plating barrel is provided with an annular build-up portion for preventing the object to be plated from being caught at a portion where the inner surface of the body portion and the inner surface of the side wall portion intersect . The barrel for barrel plating according to claim 1, wherein the frame portion and the mesh portion are made of the same material. The barrel for barrel plating according to claim 1 or 2, wherein the panel portion is detachably attached. And barrel plating barrel according to any one of claims 1乃Itaru 3,
A barrel plating apparatus comprising support means for rotatably supporting the barrel. Providing a barrel plating barrel according to any one of claims 1乃Itaru 3,
In the barrel plating barrel, electronic components as objects to be plated are accommodated,
The barrel for barrel plating is immersed in a plating solution to plate the electronic component,
The manufacturing method of an electronic component including this. The manufacturing method of an electronic component including plating to the electronic component as a to-be-plated object using the barrel plating apparatus of Claim 4 .