JP4069936B2 - 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置 - Google Patents

窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置 Download PDF

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Publication number
JP4069936B2
JP4069936B2 JP2005201917A JP2005201917A JP4069936B2 JP 4069936 B2 JP4069936 B2 JP 4069936B2 JP 2005201917 A JP2005201917 A JP 2005201917A JP 2005201917 A JP2005201917 A JP 2005201917A JP 4069936 B2 JP4069936 B2 JP 4069936B2
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Japan
Prior art keywords
electrode
light
light emitting
layer
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2005201917A
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English (en)
Japanese (ja)
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JP2005328080A (ja
JP2005328080A5 (enExample
Inventor
健 楠瀬
大輔 三賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2005201917A priority Critical patent/JP4069936B2/ja
Publication of JP2005328080A publication Critical patent/JP2005328080A/ja
Publication of JP2005328080A5 publication Critical patent/JP2005328080A5/ja
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Publication of JP4069936B2 publication Critical patent/JP4069936B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Luminescent Compositions (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2005201917A 2002-05-27 2005-07-11 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置 Expired - Fee Related JP4069936B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005201917A JP4069936B2 (ja) 2002-05-27 2005-07-11 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002152322 2002-05-27
JP2005201917A JP4069936B2 (ja) 2002-05-27 2005-07-11 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003149138A Division JP4053926B2 (ja) 2002-05-27 2003-05-27 窒化物半導体発光素子とそれを用いた発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007179135A Division JP2007300134A (ja) 2002-05-27 2007-07-07 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2005328080A JP2005328080A (ja) 2005-11-24
JP2005328080A5 JP2005328080A5 (enExample) 2006-06-29
JP4069936B2 true JP4069936B2 (ja) 2008-04-02

Family

ID=35474117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005201917A Expired - Fee Related JP4069936B2 (ja) 2002-05-27 2005-07-11 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置

Country Status (1)

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JP (1) JP4069936B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091414A (ja) * 2005-11-30 2011-05-06 Sharp Corp 発光装置
JP5176273B2 (ja) * 2005-12-28 2013-04-03 日亜化学工業株式会社 発光装置及びその製造方法
WO2007094476A1 (en) * 2006-02-14 2007-08-23 Showa Denko K.K. Light-emitting diode
JP5470673B2 (ja) * 2006-03-27 2014-04-16 日亜化学工業株式会社 半導体発光装置及び半導体発光素子
US8076688B2 (en) * 2006-09-25 2011-12-13 Seoul Opto Device Co., Ltd. Light emitting diode having extensions of electrodes for current spreading
JP5731731B2 (ja) * 2007-04-18 2015-06-10 日亜化学工業株式会社 発光装置
KR101354981B1 (ko) 2007-11-14 2014-01-27 삼성전자주식회사 질화물 반도체 발광 다이오드
JP5713650B2 (ja) 2009-12-08 2015-05-07 Ｄｏｗａエレクトロニクス株式会社 発光素子およびその製造方法
JP5549629B2 (ja) * 2011-03-30 2014-07-16 サンケン電気株式会社 発光素子
CN114038916A (zh) * 2021-10-08 2022-02-11 华南理工大学 绝缘薄膜及其薄膜晶体管以及用途

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Publication number Publication date
JP2005328080A (ja) 2005-11-24

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