JP4057311B2 - 光スポットの電子制御 - Google Patents

光スポットの電子制御 Download PDF

Info

Publication number
JP4057311B2
JP4057311B2 JP2002047783A JP2002047783A JP4057311B2 JP 4057311 B2 JP4057311 B2 JP 4057311B2 JP 2002047783 A JP2002047783 A JP 2002047783A JP 2002047783 A JP2002047783 A JP 2002047783A JP 4057311 B2 JP4057311 B2 JP 4057311B2
Authority
JP
Japan
Prior art keywords
optical system
light beam
lens
actuator
spot size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002047783A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002357781A (ja
JP2002357781A5 (enExample
Inventor
ピー パータネン ジューニ
タン ナンシェン
ウ シンクン
Original Assignee
スリーディー システムズ インコーポレーテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スリーディー システムズ インコーポレーテッド filed Critical スリーディー システムズ インコーポレーテッド
Publication of JP2002357781A publication Critical patent/JP2002357781A/ja
Publication of JP2002357781A5 publication Critical patent/JP2002357781A5/ja
Application granted granted Critical
Publication of JP4057311B2 publication Critical patent/JP4057311B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/40—Optical focusing aids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B23K26/0617—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis and with spots spaced along the common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
    • B29C64/273—Arrangements for irradiation using laser beams; using electron beams [EB] pulsed; frequency modulated
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/127—Adaptive control of the scanning light beam, e.g. using the feedback from one or more detectors
    • G02B26/128—Focus control
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/10—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
    • G02B7/102—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens controlled by a microcomputer

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Focusing (AREA)
  • Automatic Focus Adjustment (AREA)
JP2002047783A 2001-02-23 2002-02-25 光スポットの電子制御 Expired - Lifetime JP4057311B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/791,346 2001-02-23
US09/791,346 US6426840B1 (en) 2001-02-23 2001-02-23 Electronic spot light control

Publications (3)

Publication Number Publication Date
JP2002357781A JP2002357781A (ja) 2002-12-13
JP2002357781A5 JP2002357781A5 (enExample) 2005-07-28
JP4057311B2 true JP4057311B2 (ja) 2008-03-05

Family

ID=25153430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002047783A Expired - Lifetime JP4057311B2 (ja) 2001-02-23 2002-02-25 光スポットの電子制御

Country Status (5)

Country Link
US (1) US6426840B1 (enExample)
EP (2) EP1659438B1 (enExample)
JP (1) JP4057311B2 (enExample)
AT (2) ATE331235T1 (enExample)
DE (2) DE60138052D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220118550A1 (en) * 2020-10-16 2022-04-21 Amo Development, Llc Laser focal spot size measurement using a built-in camera for an ophthalmic laser system

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW584736B (en) * 2001-12-07 2004-04-21 Ind Tech Res Inst Shape measurement device of dual-axial anamorphic image magnification
US20050172894A1 (en) * 2004-02-10 2005-08-11 Farnworth Warren M. Selective deposition system and method for initiating deposition at a defined starting surface
US7261542B2 (en) 2004-03-18 2007-08-28 Desktop Factory, Inc. Apparatus for three dimensional printing using image layers
WO2007041460A2 (en) * 2005-10-03 2007-04-12 Aradigm Corporation Method and system for laser machining
US7352789B2 (en) * 2006-01-12 2008-04-01 Semiconductor Energy Laboratory Co., Ltd. Laser light irradiation apparatus and laser light irradiation method
JP5007090B2 (ja) * 2006-09-11 2012-08-22 株式会社ディスコ レーザー加工方法
US7706078B2 (en) * 2006-09-14 2010-04-27 Semiconductor Energy Laboratory Co., Ltd. Laser light irradiation apparatus and laser light irradiation method
WO2012074986A1 (en) * 2010-11-29 2012-06-07 3D Systems, Inc. Stereolithography systems and methods using internal laser modulation
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
WO2013085997A1 (en) 2011-12-05 2013-06-13 Bioptigen, Inc. Optical imaging systems having input beam shape control and path length control
US8777412B2 (en) 2012-04-05 2014-07-15 Bioptigen, Inc. Surgical microscopes using optical coherence tomography and related methods
US9400391B2 (en) 2012-09-27 2016-07-26 Coherent, Inc. Uniformity adjustment method for a diode-laser line-projector
US9842665B2 (en) 2013-02-21 2017-12-12 Nlight, Inc. Optimization of high resolution digitally encoded laser scanners for fine feature marking
US9537042B2 (en) 2013-02-21 2017-01-03 Nlight, Inc. Non-ablative laser patterning
US10464172B2 (en) 2013-02-21 2019-11-05 Nlight, Inc. Patterning conductive films using variable focal plane to control feature size
CN105144346B (zh) 2013-02-21 2017-12-15 恩耐公司 多层结构的激光刻图
TWI611854B (zh) * 2013-05-02 2018-01-21 ｎ萊特股份有限公司 光學處理系統和用於光學處理的方法
WO2014197553A2 (en) 2013-06-04 2014-12-11 Bioptigen, Inc. Hybrid telescope for optical beam delivery and related systems and methods
JP6415553B2 (ja) 2013-07-29 2018-10-31 バイオプティジェン, インコーポレイテッドBioptigen, Inc. 外科手術用手技光干渉断層計及び関連するシステム及びその方法
EP3039474A1 (en) 2013-08-28 2016-07-06 Bioptigen, Inc. Heads up displays for optical coherence tomography integrated surgical microscopes
RU2661824C2 (ru) * 2014-02-28 2018-07-19 Этторе Маурицио КОСТАБЕБЕР Усовершенствованная стереолитографическая машина
US10069271B2 (en) 2014-06-02 2018-09-04 Nlight, Inc. Scalable high power fiber laser
US10618131B2 (en) 2014-06-05 2020-04-14 Nlight, Inc. Laser patterning skew correction
US10310201B2 (en) 2014-08-01 2019-06-04 Nlight, Inc. Back-reflection protection and monitoring in fiber and fiber-delivered lasers
US9837783B2 (en) 2015-01-26 2017-12-05 Nlight, Inc. High-power, single-mode fiber sources
DE102015202347A1 (de) 2015-02-10 2016-08-11 Trumpf Laser- Und Systemtechnik Gmbh Bestrahlungseinrichtung, Bearbeitungsmaschine und Verfahren zum Herstellen einer Schicht eines dreidimensionalen Bauteils
JP6519860B2 (ja) * 2015-03-30 2019-05-29 株式会社東京精密 非接触形状測定装置及び走査レンズ収差補正方法
US10520671B2 (en) 2015-07-08 2019-12-31 Nlight, Inc. Fiber with depressed central index for increased beam parameter product
US11179807B2 (en) 2015-11-23 2021-11-23 Nlight, Inc. Fine-scale temporal control for laser material processing
US10434600B2 (en) 2015-11-23 2019-10-08 Nlight, Inc. Fine-scale temporal control for laser material processing
WO2017091606A1 (en) 2015-11-23 2017-06-01 Nlight, Inc. Predictive modification of laser diode drive current waveform in high power laser systems
EP3389915B1 (en) 2016-01-19 2021-05-05 NLIGHT, Inc. Method of processing calibration data in 3d laser scanner systems
DE102016015785B4 (de) * 2016-06-29 2021-06-17 Trumpf Laser Gmbh Strahladaptionsvorrichtung, Frequenzkonversionseinheit, optisches System und Vefahren zur Frequenzkonversion
DE102016111932B4 (de) 2016-06-29 2018-02-08 Trumpf Laser Gmbh Frequenzkonversionseinheit und Verfahren zur Frequenzkonversion
US10730785B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Optical fiber bending mechanisms
US10732439B2 (en) 2016-09-29 2020-08-04 Nlight, Inc. Fiber-coupled device for varying beam characteristics
US10423015B2 (en) 2016-09-29 2019-09-24 Nlight, Inc. Adjustable beam characteristics
US11173548B2 (en) 2017-04-04 2021-11-16 Nlight, Inc. Optical fiducial generation for galvanometric scanner calibration
CN107336440A (zh) * 2017-08-09 2017-11-10 英诺激光科技股份有限公司 一种具有矫形功能的激光3d打印方法及其系统
CN107718541A (zh) * 2017-09-14 2018-02-23 佛山科学技术学院 一种三维打印机及其实现方法
EP3521028B1 (en) * 2018-02-01 2020-11-25 CL Schutzrechtsverwaltungs GmbH Apparatus for additively manufacturing three-dimensional objects
DE102019201474A1 (de) * 2019-02-06 2020-08-06 MTU Aero Engines AG Vorrichtung zum generativen aufbauen eines bauteils
CN113276409A (zh) * 2020-02-18 2021-08-20 空客(北京)工程技术中心有限公司 增材制造方法、增材制造设备和计算机可读介质
KR102468802B1 (ko) * 2020-05-04 2022-11-18 한국기계연구원 광학식 리소그래피 장치 및 방법
CN118059394B (zh) * 2024-02-20 2024-08-02 浙江深月医疗技术有限公司 激光光斑的调节与识别装置
CN120370561A (zh) * 2025-06-26 2025-07-25 北京精亦光电科技有限公司 一种微调激光椭圆度的方法及系统

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575330A (en) 1984-08-08 1986-03-11 Uvp, Inc. Apparatus for production of three-dimensional objects by stereolithography
KR0178873B1 (ko) 1988-04-18 1999-05-15 찰스 윌리엄 헐 스테레오리소그래픽 커얼 감소
US5184307A (en) 1988-04-18 1993-02-02 3D Systems, Inc. Method and apparatus for production of high resolution three-dimensional objects by stereolithography
US5182056A (en) 1988-04-18 1993-01-26 3D Systems, Inc. Stereolithography method and apparatus employing various penetration depths
US5059359A (en) 1988-04-18 1991-10-22 3 D Systems, Inc. Methods and apparatus for production of three-dimensional objects by stereolithography
EP0354637B1 (en) 1988-04-18 1997-06-25 3D Systems, Inc. CAD/CAM stereolithographic data conversion
US5965079A (en) 1995-04-25 1999-10-12 3D Systems, Inc. Method and apparatus for making a three-dimensional object by stereolithography
JPH033127A (ja) * 1989-05-31 1991-01-09 Hitachi Ltd 光学ヘッド
US5133987A (en) 1989-10-27 1992-07-28 3D Systems, Inc. Stereolithographic apparatus and method
US4997250A (en) * 1989-11-17 1991-03-05 General Electric Company Fiber output coupler with beam shaping optics for laser materials processing system
US5999184A (en) 1990-10-30 1999-12-07 3D Systems, Inc. Simultaneous multiple layer curing in stereolithography
US5193024A (en) * 1990-10-31 1993-03-09 E. I. Du Pont De Nemours And Company Liquid/vapor optical modulator
JP3170023B2 (ja) * 1992-02-27 2001-05-28 ホーヤ株式会社 レーザ加工装置
JPH05291659A (ja) * 1992-04-14 1993-11-05 Toshiba Corp レーザービーム補正機構
EP0578499B1 (en) * 1992-07-10 1999-12-01 Fujitsu Limited Laser diode module
US5615200A (en) * 1992-09-10 1997-03-25 Kabushiki Kaisha Toshiba Light beam shaping device to change an anisotropic beam to an isotropic beam for reducing the size of an optical head
US5777961A (en) * 1994-06-27 1998-07-07 Nec Corporation Astigmatic difference correcting method for optical head and apparatus therefor
US5991102A (en) * 1994-11-25 1999-11-23 Asahi Kogaku Kogyo Kabushiki Kaisha Beam protecting device
ES2149449T3 (es) * 1995-03-15 2000-11-01 Koninkl Philips Electronics Nv Dispositivo para explorar opticamente un medio de registro.
US5745296A (en) * 1995-05-17 1998-04-28 Asahi Kogaku Kogyo Kabushiki Kaisha Multibeam recording device
JPH09122942A (ja) * 1995-08-25 1997-05-13 Asahi Optical Co Ltd レーザ描画装置
DE19780476T1 (de) * 1996-05-13 1998-10-15 Seagate Technology Formstrahl-Lasertexturierung von magnetischen Medien
US5840239A (en) 1997-01-31 1998-11-24 3D Systems, Inc. Apparatus and method for forming three-dimensional objects in stereolithography utilizing a laser exposure system having a diode pumped frequency quadrupled solid state laser
US5923473A (en) * 1997-05-06 1999-07-13 Agfa Corporation Multi-size spot beam imaging system and method
US6129884A (en) 1999-02-08 2000-10-10 3D Systems, Inc. Stereolithographic method and apparatus with enhanced control of prescribed stimulation production and application
US6325961B1 (en) * 1999-02-08 2001-12-04 3D Systems, Inc. Stereolithographic method and apparatus with enhanced control of prescribed stimulation and application
US6222679B1 (en) * 1999-08-31 2001-04-24 Agilent Technologies Mechanically simplified, high resolution, optical focusing and steering apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220118550A1 (en) * 2020-10-16 2022-04-21 Amo Development, Llc Laser focal spot size measurement using a built-in camera for an ophthalmic laser system
US12128497B2 (en) * 2020-10-16 2024-10-29 Amo Development, Llc Laser focal spot size measurement using a built-in camera for an ophthalmic laser system

Also Published As

Publication number Publication date
EP1237034A2 (en) 2002-09-04
JP2002357781A (ja) 2002-12-13
ATE426185T1 (de) 2009-04-15
EP1659438B1 (en) 2009-03-18
EP1659438A1 (en) 2006-05-24
DE60120905T2 (de) 2007-02-15
DE60138052D1 (de) 2009-04-30
US6426840B1 (en) 2002-07-30
DE60120905D1 (de) 2006-08-03
ATE331235T1 (de) 2006-07-15
EP1237034A3 (en) 2002-10-16
EP1237034B1 (en) 2006-06-21

Similar Documents

Publication Publication Date Title
JP4057311B2 (ja) 光スポットの電子制御
JP2010510089A (ja) ポリマーオブジェクトオプティカル製造工程
US20120228802A1 (en) Device and method for focusing a beam of light with reduced focal plane distortion
CN102405122A (zh) 用于镭射加工的改良方法和设备
US20190255773A1 (en) Method for lithography-based generative production of three-dimensional components
JP6808349B2 (ja) 三次元の構造を製作する方法
US11079580B2 (en) Exposure optics and device for producing a three-dimensional object
KR20160127462A (ko) 레이저 가공장치 및 그 가공방법
CN112297422B (zh) 一种一次成型的3d打印装置
JP4477893B2 (ja) レーザ加工方法及び装置、並びに、レーザ加工方法を使用した構造体の製造方法
JP7221300B2 (ja) レーザ加工装置及び被加工物の加工方法
CN203091969U (zh) 激光烧结成型设备的激光光路引导系统
US8585390B2 (en) Mold making system and mold making method
KR20200063335A (ko) 3d 프린터의 광조사 장치
CN115379941A (zh) 用于对三维部件进行基于光刻的生成式制造的方法和设备
JP2003025453A (ja) 光造形装置及び方法
EP4512567A1 (en) A system for forming a three-dimensional cavity and a method for forming a three-dimensional cavity
CN112197712A (zh) 一种基于z扫描的光束束腰半径测量方法及系统
JP7576687B2 (ja) 光造形装置及び製造方法
KR100573927B1 (ko) 미세한 3차원 자유곡면 형성방법
Jiang Development of a novel two‐laser beam stereolithography system
KR102005632B1 (ko) 파면 제어기를 이용한 고속 3차원 광조형 방법 및 장치
Hirai et al. Characteristic of diffractive optical element for arbitrary pattern beam shaping
KR101389320B1 (ko) 직접레이저 노광법을 이용한 위상회절소자 제조장치, 위상회절소자 제조방법 및 직접레이저 노광법을 이용한 위상회절소자
Hirai et al. Characteristics of diffractive optical element for multispot beam homogenizing

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041221

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060221

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20060522

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20060525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060912

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20061208

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20061213

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070312

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070410

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070706

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20070926

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071120

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20071213

R150 Certificate of patent or registration of utility model

Ref document number: 4057311

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101221

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111221

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121221

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121221

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131221

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term